阅读说明：本技术 用于新能源汽车的电路板模块和电路板的接合方法 (Circuit board module for new energy automobile and connection method of circuit board ) 是由 杨晓锋 季文亮 唐文明 杜瑞 于 2021-11-12 设计创作，主要内容包括：本发明涉及电路板的技术领域,公开了一种用于新能源汽车的电路板模块和电路板的接合方法,所述电路板模块包括第一电路板、第二电路板、排针、环形框和粘胶层,所述排针的一端焊接于所述第一焊盘组,另一端焊接于所述第二焊盘组；所述环形框同时贴合固定于所述第一电路板和所述第二电路板上,并环绕所述排针、所述第一焊盘组和所述第二焊盘组设置；所述粘胶层涂覆于所述环形框内,并覆盖所述排针、所述第一焊盘组和所述第二焊盘组设置。结构紧凑,大幅降低所需的安装空间,耐高压,安全性高,并且成本较低。(The invention relates to the technical field of circuit boards, and discloses a circuit board module for a new energy automobile and a connection method of the circuit board, wherein the circuit board module comprises a first circuit board, a second circuit board, a pin header, an annular frame and an adhesive layer, one end of the pin header is welded on a first pad group, and the other end of the pin header is welded on a second pad group; the annular frame is simultaneously attached and fixed on the first circuit board and the second circuit board and arranged around the pin header, the first pad group and the second pad group; the viscose layer coats in the annular frame, and covers the row needle first pad group with the setting of second pad group. Compact structure, reduce required installation space by a wide margin, high pressure resistant, the security is high to the cost is lower.)

1. A circuit board module for a new energy automobile, characterized in that the circuit board module includes:

the edge of the first circuit board is provided with a first pad group, and the first pad group is electrically connected to an internal circuit of the first circuit board;

the edge of the second circuit board is provided with a second pad group which is electrically connected to an internal circuit of the second circuit board;

one end of the pin header is welded on the first bonding pad group, the other end of the pin header is welded on the second bonding pad group, and the surface where the bonding pad groups of the first circuit board and the second circuit board are located is defined as the front surface;

the annular frame is simultaneously attached and fixed to the first circuit board and the second circuit board and arranged around the pin header, the first pad group and the second pad group;

and the adhesive layer is coated in the annular frame and covers the pin header, the first pad group and the second pad group.

2. The circuit board module according to claim 1, wherein when the first circuit board is a flexible circuit board and the second circuit board is a rigid circuit board, the circuit board module further comprises a reinforcing plate, the reinforcing plate is attached to the back surface of the first circuit board and is located corresponding to the first bonding pad group.

3. The circuit board module according to claim 1, wherein when the first circuit board and the second circuit board are both flexible circuit boards, the circuit board module further comprises at least two reinforcing plates respectively attached to the back surface of the first circuit board and the back surface of the second circuit board at positions corresponding to the first pad group and the second pad group, respectively.

4. The circuit board module according to claim 1, wherein when the first circuit board and the second circuit board are both flexible circuit boards, the circuit board module further comprises a reinforcing plate, the reinforcing plate is attached to the back surface of the first circuit board and the back surface of the second circuit board at the same time, and the positions of the reinforcing plate correspond to the first pad group and the second pad group.

5. A circuit board module according to any of claims 2-4, characterised in that the thickness of the reinforcement plate is greater than or equal to 0.05 mm.

6. A circuit board module according to any one of claims 2-4, characterised in that the reinforcement plate is an insulating sheet material.

7. A method of joining circuit boards, the method comprising:

providing a first circuit board, a second circuit board and a pin header, and respectively welding two ends of the pin header on a first pad group of the first circuit board and a second pad group of the second circuit board;

providing an annular frame, and simultaneously bonding the annular frame on the first circuit board and the second circuit board, wherein the annular frame surrounds the pin header, the first bonding pad group and the second bonding pad group;

and spraying an adhesive into the annular frame, wherein the adhesive covers the pin header, the first pad group and the second pad group, and the adhesive is solidified to form an adhesive layer.

8. The method for connecting circuit boards according to claim 7, wherein the soldering surfaces of the first circuit board and the second circuit board are defined as front surfaces, and when the first circuit board is a flexible circuit board and the second circuit board is a rigid circuit board, the method further comprises:

and providing a reinforcing plate, and bonding the reinforcing plate to the position of the back surface of the first circuit board corresponding to the first bonding pad group.

9. The method of joining circuit boards according to claim 7, wherein the soldering surfaces of the first circuit board and the second circuit board are defined as front surfaces, and when the first circuit board and the second circuit board are both flexible circuit boards, the method further comprises:

and providing two reinforcing plates, adhering one reinforcing plate to the position of the back surface of the first circuit board corresponding to the first bonding pad group, and adhering the other reinforcing plate to the position of the back surface of the second circuit board corresponding to the second bonding pad group.

10. The method according to claim 7, wherein the step of soldering the two ends of the pin header to the first land group of the first circuit board and the second land group of the second circuit board respectively comprises:

respectively installing the first circuit board and the second circuit into a fixed carrier, wherein the bonding pads of the first bonding pad group correspond to the bonding pads of the second bonding pad group in a one-to-one manner;

aligning and attaching pins on two sides of the pin header to a bonding pad of the first bonding pad group and a bonding pad of the second bonding pad group respectively;

and welding the pin header to the first pad group and the second pad group by soldering.

Technical Field

The invention relates to the technical field of circuit boards, in particular to a circuit board module for a new energy automobile and a connection method of the circuit board.

Background

In the conventional technique, the connection between two circuit boards is as follows: connectors are respectively arranged on the first circuit board and the second circuit board, and the two circuit boards are connected through the connectors; secondly, arranging a self-locking connector on one circuit board, and inserting the other circuit board into the self-locking connector for locking; and thirdly, the two circuit boards are directly fixed in a hot-press welding mode.

In the current connection mode, the required space is large, the high pressure is not endurable, and the cost is high.

Disclosure of Invention

The invention mainly aims to provide a circuit board module for a new energy automobile and a connection method of a circuit board, and aims to solve the technical problems of large required space, low high-voltage resistance and high cost in the existing connection mode.

In order to achieve the above object, the present invention provides a circuit board module for a new energy vehicle, the circuit board module including:

the edge of the first circuit board is provided with a first pad group, and the first pad group is electrically connected to an internal circuit of the first circuit board;

the edge of the second circuit board is provided with a second pad group which is electrically connected to an internal circuit of the second circuit board;

one end of the pin header is welded on the first bonding pad group, the other end of the pin header is welded on the second bonding pad group, and the surface where the bonding pad groups of the first circuit board and the second circuit board are located is defined as the front surface;

the annular frame is simultaneously attached and fixed to the first circuit board and the second circuit board and arranged around the pin header, the first pad group and the second pad group;

and the adhesive layer is coated in the annular frame and covers the pin header, the first pad group and the second pad group.

Optionally, in an embodiment, when the first circuit board is a flexible circuit board and the second circuit board is a rigid circuit board, the circuit board module further includes a reinforcing plate, the reinforcing plate is attached to the back surface of the first circuit board, and the position of the reinforcing plate corresponds to the position of the first bonding pad group.

Optionally, in an embodiment, when the first circuit board and the second circuit board are both flexible circuit boards, the circuit board module further includes at least two reinforcing plates respectively attached to the back surface of the first circuit board and the back surface of the second circuit board, and the positions of the reinforcing plates respectively correspond to the first pad group and the second pad group.

Optionally, in an embodiment, when the first circuit board and the second circuit board are both flexible circuit boards, the circuit board module further includes a reinforcing plate, the reinforcing plate is attached and fixed to the back surface of the first circuit board and the back surface of the second circuit board at the same time, and the positions of the reinforcing plate correspond to the first pad group and the second pad group.

Optionally, in an embodiment, the thickness of the reinforcing plate is greater than or equal to 0.05 mm.

Optionally, in an embodiment, the reinforcing plate is an insulating plate.

The invention also provides a circuit board jointing method, which comprises the following steps:

providing a first circuit board, a second circuit board and a pin header, and respectively welding two ends of the pin header on a first pad group of the first circuit board and a second pad group of the second circuit board;

providing an annular frame, and simultaneously bonding the annular frame on the first circuit board and the second circuit board, wherein the annular frame surrounds the pin header, the first bonding pad group and the second bonding pad group;

and spraying an adhesive into the annular frame, wherein the adhesive covers the pin header, the first pad group and the second pad group, and the adhesive is solidified to form an adhesive layer.

Optionally, in an embodiment, the soldering surfaces of the first circuit board and the second circuit board are defined as front surfaces, and when the first circuit board is a flexible circuit board and the second circuit board is a rigid circuit board, the bonding method further includes:

and providing a reinforcing plate, and bonding the reinforcing plate to the position of the back surface of the first circuit board corresponding to the first bonding pad group.

Optionally, in an embodiment, the soldering surfaces of the first circuit board and the second circuit board are defined as front surfaces, and when the first circuit board and the second circuit board are both flexible circuit boards, the bonding method further includes:

and providing two reinforcing plates, adhering one reinforcing plate to the position of the back surface of the first circuit board corresponding to the first bonding pad group, and adhering the other reinforcing plate to the position of the back surface of the second circuit board corresponding to the second bonding pad group.

Optionally, in an embodiment, the step of respectively soldering two ends of the pin header to the first pad group of the first circuit board and the second pad group of the second circuit board includes:

respectively installing the first circuit board and the second circuit into a fixed carrier, wherein the bonding pads of the first bonding pad group correspond to the bonding pads of the second bonding pad group in a one-to-one manner;

aligning and attaching pins on two sides of the pin header to a bonding pad of the first bonding pad group and a bonding pad of the second bonding pad group respectively;

and welding the pin header to the first pad group and the second pad group by soldering.

In the technical scheme provided by the invention, as the thickness of the pin header is thinner than that of the traditional connector, and the adhesive layer only needs to cover the pin header, the whole thickness of the joint of the first circuit board and the second circuit board is thinner than that of the traditional connector, so that the mounting space required by a circuit board module is greatly reduced, the pin header can be mounted in a more compact structure, and the pin header has lower cost compared with the traditional connector; secondly, the pins of the pin header are relatively large in space, so that the phenomenon of sparking among the pins under high voltage can be prevented, potential safety hazards (such as fire) can be prevented from being generated at the connecting part of the first circuit board and the second circuit board, and the circuit board module can still be kept stable and safe when used under the high-voltage environment; then, the adhesive layer coated on the pin header can form an insulating partition plate between adjacent pins of the pin header, so that the phenomenon of sparking among the pins during high voltage is further prevented, and the pin header, the first pad group and the second pad group are covered by the adhesive layer, so that the pin header, the first pad group and the second pad group can be well protected from being damaged, the service life is prolonged, and the use stability is ensured; finally, the annular frame can prevent the welding position from bending to cause welding separation, further prolong the service life and ensure the use stability.

Drawings

One or more embodiments are illustrated in drawings corresponding to, and not limiting to, the embodiments, in which elements having the same reference number designation may be represented as similar elements, unless specifically noted, the drawings in the figures are not to scale.

Fig. 1 is a schematic structural diagram of a circuit board module according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a "T" type circuit board module according to one embodiment of the present invention;

FIG. 3 is a schematic structural diagram of an "L" type circuit board module according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a conventional "T" type circuit board layout;

FIG. 5 is a schematic diagram of a conventional "L" type circuit board layout;

FIG. 6 is a schematic layout diagram of a first circuit board and a second circuit board according to an embodiment of the present invention;

FIG. 7 is a cross-sectional view of a circuit board module according to an embodiment of the invention;

fig. 8 is a schematic cross-sectional view of a circuit board module according to another embodiment of the invention;

fig. 9 is a schematic cross-sectional view of a circuit board module according to another embodiment of the invention;

fig. 10 is a flow chart illustrating a method of bonding circuit boards according to an embodiment of the present invention;

fig. 11 is a flowchart illustrating step S2 in fig. 10.

The method comprises the following steps of 1, a circuit board module; 11. a first circuit board; 12. a second circuit board; 13. a first pad group; 14. a second pad group; 15. arranging needles; 16. an annular frame; 17. an adhesive layer; 18. a reinforcing plate.

Detailed Description

In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like as used herein are for descriptive purposes only. In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.

Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

In the conventional design process, there are mainly the following ways:

connectors are respectively arranged on the first circuit board and the second circuit board, and the first circuit board and the second circuit board are connected through the cooperation of the connectors. This approach has the following disadvantages:

1. the board-to-board connector is designed to have a large height and space requirement, and the side plates, the end plates, the bottom plate and other space compact structures in the new energy battery pack module cannot be connected by the connection mode.

2. The voltage and temperature acquisition of the battery pack mainly comprises main materials such as an FPC, a PCB, a temperature sensor (0603 resistor), a nickel sheet, a connector and the like. This approach directly increases the material cost of a set of "board-to-board connectors" and the cost is higher.

And secondly, installing a self-locking connector on the rigid Circuit Board (PCB), inserting the Flexible Circuit Board (FPC) into the self-locking connector, and locking the self-locking connector, thereby connecting the rigid Circuit Board and the Flexible Circuit Board. This approach has the following disadvantages:

1. the environment application level is low, the self-locking connector in the market is mainly in the consumer class level, is applied to small signals and low-voltage acquisition connection, and cannot bear the requirements of the safety environment and the high-voltage performance of an automobile battery pack.

And (III) the flexible circuit board is directly welded on the rigid circuit board in a hot-press welding mode. This approach has the following disadvantages:

1. the environment application level is low, and the hot press welding in the market is mainly applied to small signals and low-voltage acquisition. Because the pin interval of circuit board is less, can produce the phenomenon of striking sparks, lead to the junction blackened or damage, even directly strike sparks, so can't bear the safe environment of car battery package, high pressure performance requirement etc..

2. When the bonding pad is designed, the flexible circuit board needs to be fixed by soldering through double-sided copper foil, and in the mode, the flexible circuit board needs to adopt a double-sided board process, so that the material cost is high in floating.

The invention is further described below by taking the example of applying the circuit board module to the new energy battery pack module, however, the circuit board module is not limited to be applied to the new energy battery pack module, and is applicable to various scenes with small space or high voltage.

As shown in fig. 1, an embodiment of the present invention discloses a circuit board module 1, where the circuit board module 1 includes a first circuit board 11, a second circuit board 12, a pin header 15, an annular frame 16, and an adhesive layer 17, where a first pad group 13 is disposed on an edge of the first circuit board 11, and the first pad group 13 is electrically connected to an internal circuit of the first circuit board 11; a second pad set 14 is disposed at the edge of the second circuit board 12, and the second pad set 14 is electrically connected to the internal circuit of the second circuit board 12; one end of the pin header 15 is soldered to the first land group 13, and the other end is soldered to the second land group 14, defining the soldered surface of the first circuit board 11 and the second circuit board 12 as a front surface; the annular frame 16 is simultaneously attached and fixed to the first circuit board 11 and the second circuit board 12, and is arranged around the pin header 15, the first pad group 13 and the second pad group 14; the adhesive layer 17 is coated in the annular frame 16 and covers the pin header 15, the first pad group 13 and the second pad group 14.

In this embodiment, the defects existing in the conventional design process can be effectively overcome, specifically: because the thickness of the pin header 15 is thinner than that of the traditional connector, and the adhesive layer 17 only needs to cover the pin header 15, the whole thickness of the joint of the first circuit board 11 and the second circuit board 12 is thinner than that of the traditional connector and is only 2.5mm thick, so that the installation space required by the circuit board module 1 is greatly reduced, the pin header can be installed in a more compact structure, and the pin header 15 has lower cost compared with the traditional connector; secondly, because the pin pitch of the pin header 15 is large, the withstand voltage requirement meets 1000VAC, the leakage current is 1mA, and the sparking phenomenon between the pins at high voltage can be prevented, so that potential safety hazards (such as sparking) at the joint of the first circuit board 11 and the second circuit board 12 can be prevented, and the circuit board module 1 can still keep stable and safe when used in a high-voltage environment; then, the adhesive layer 17 coated on the pin header 15 can form an insulating partition plate between adjacent pins of the pin header 15, so that the ignition phenomenon among the pins at high voltage is further prevented, and the pin header 15, the first pad group 13 and the second pad group 14 are covered by the adhesive layer 17, so that the pin header 15, the first pad group 13 and the second pad group 14 can be well protected from being damaged, the service life is prolonged, and the use stability is ensured; finally, the annular frame 16 can prevent the welding part from bending to cause welding separation, further prolong the service life and ensure the use stability.

Specifically, the pins 15 are connected by soldering. The adhesive layer 17 is uv (ultraviolet rays) adhesive. The annular frame 16 is an epoxy plate which has strong adhesion, strong contractibility and excellent insulating property, and can well protect the joint of the first circuit board 11 and the second circuit board 12 and prevent electric leakage; the annular frame 16 is attached and fixed in an adhesive mode (hot pressing process); a gluing area is defined by gluing a circular frame 16 shaped like a Chinese character 'hui', then UV glue is directly sprayed on the gluing area, and a gluing layer 17 is formed after cooling.

The first circuit board 11 and the second circuit board 12 may be both hard circuit boards, may also be both flexible circuit boards, and may also be one hard circuit board and one flexible circuit board. The rigid circuit board and the flexible circuit board or the flexible circuit boards can be bent, so that the flexible circuit board is more suitable for signal transmission in different planes, occupies small space and can enable the structure to be more compact.

Further, as shown in fig. 2 and 3, when the circuit board module 1 is "T" shaped or "L" shaped, the present embodiment can connect the first circuit board 11 and the second circuit board 12 in two directions perpendicular to each other to obtain the "T" shaped or "L" shaped circuit board module 1, and in the conventional process, the "T" shaped or "L" shaped circuit board is directly designed, compared with the two embodiments, in the design, in the same size of board, the conventional design layout is as shown in fig. 4 and 5, the remaining waste material is much, the material utilization rate is low, and the present embodiment can separately design the first circuit board 11 and the second circuit board 12, the layout can be more dense, as shown in fig. 6, the remaining waste material is little, and the material utilization rate is greatly improved.

As shown in fig. 7, in an embodiment, the first circuit board 11 is a flexible circuit board, the second circuit board 12 is a rigid circuit board, and a reinforcing plate 18 is attached and fixed to a position corresponding to the first bonding pad group 13 on the back surface of the first circuit board 11, where an attachment surface of the reinforcing plate 18 is to completely cover the first connection bonding pad. Because the flexible circuit board has a flexible characteristic, if the position where the first circuit board 11 and the pin header 15 are welded is always in a bent state, the welding point of the pin header 15 and the first circuit board 11 may be loosened, thereby causing poor or broken connection contact of one or more lines between the first circuit board 11 and the second circuit board 12, or because the flexible circuit board is softer, the welding point may be deformed to damage the circuit during welding, therefore, the position where the flexible circuit board is welded is fixed by arranging the reinforcing plate 18, the structural strength of the circuit board at the welding pad is enhanced, secondly, the welding point is prevented from being loosened due to the bending of the welding position, thereby ensuring the stability of the connection state between the first circuit board 11 and the second circuit board 12, and further improving the service life and the use stability of the circuit board module 1.

The reinforcing plate 18 is an insulating plate, and is preferably an FR-4 grade epoxy plate, so that the novel energy battery pack can be prevented from self-extinguishing in case of fire, further combustion is prevented, and the use safety of the novel energy battery pack is improved. The thickness of the reinforcing plate 18 is greater than or equal to 0.05mm, and the strength of the bonding pad is guaranteed.

Specifically, the reinforcing plate 18 is attached and fixed to the back surface of the first circuit board 11 by an adhesive method (a hot pressing process).

As shown in fig. 8, in an embodiment, the first circuit board 11 and the second circuit board 12 are both flexible circuit boards, and at this time, a reinforcing plate 18 is attached and fixed to the back surface of the first circuit board 11 and the back surface of the second circuit board 12 respectively, and the positions of the reinforcing plate 18 correspond to the first pad group 13 and the second pad group 14 respectively, the attachment surfaces of the reinforcing plates 18 on the two circuit boards are to completely cover the first connection pad and the second connection pad respectively, that is, the attachment surface of the reinforcing plate 18 on the first circuit board 11 is to completely cover the first connection pad, and the attachment surface of the reinforcing plate 18 on the second circuit board 12 is to completely cover the second connection pad. Because the flexible circuit board has a bendable characteristic, if the welding position of the first circuit board 11 and the pin header 15 is always in a bent state, the welding point of the pin header 15 and the first circuit board 11 may be loosened, thereby causing poor or broken connection contact of one or more lines between the first circuit board 11 and the second circuit board 12, or because the flexible circuit board is softer, the welding position may be deformed to damage the circuit during welding, therefore, the welding position of the flexible circuit board is fixed by arranging the reinforcing plate 18, the structural strength of the circuit board at the welding pad is enhanced, secondly, the welding point is prevented from being loosened due to the bending generated at the welding position of the flexible circuit board, thereby ensuring the stability of the connection state between the first circuit board 11 and the second circuit board 12, and further improving the service life and the use stability of the circuit board module 1.

Wherein, the thickness of the reinforcing plate 18 is greater than or equal to 0.05mm, and the strength of the bonding pad is ensured.

Specifically, the reinforcing plate 18 is attached and fixed to the back surface of the first circuit board 11 and the back surface of the second circuit board 12 by gluing (hot pressing).

As shown in fig. 9, in an embodiment, the first circuit board 11 and the second circuit board 12 are both flexible circuit boards, a single reinforcing plate 18 is attached and fixed on the back surface of the joint of the two flexible circuit boards, the position of the reinforcing plate corresponds to the first pad group 13 and the second pad group 14, and the attachment surface of the single reinforcing plate 18 completely covers the first connection pad and the second connection pad. Through the reinforcing plate 18 of the fixed monoblock of junction laminating at first circuit board 11 and second circuit board 12, the structural strength of reinforcing circuit board in pad department, secondly, when preventing that the crooked welding point that leads to of the welding department of first circuit board 11 and second circuit board 12 from taking off, further prevent to take place to buckle between first circuit board 11 and the second circuit board 12 and lead to the welding point pine to take off, thereby guarantee the stability of connection status between first circuit board 11 and the second circuit board 12, and then improve circuit board module 1's life and stability in use.

Wherein, the thickness of the reinforcing plate 18 is greater than or equal to 0.05mm, and the strength of the bonding pad is ensured.

Specifically, the whole reinforcing plate 18 is attached and fixed to the back surface of the first circuit board 11 and the back surface of the second circuit board 12 by gluing (hot pressing).

As shown in fig. 10, an embodiment of the present invention further discloses a method for bonding a circuit board, where the method includes:

s1, providing a first circuit board, a second circuit board and a reinforcing plate, and bonding the reinforcing plate to the back surface of the first circuit board and/or the back surface of the second circuit board through gluing;

in this step, the reinforcing plate can strengthen the structural strength of circuit board in pad department, prevents that the circuit board from taking place to warp in welding process and damaging the circuit, can also prevent that flexible circuit board welding position from producing the bending and leading to the welding point pine to take off to guarantee the stability of connected state between first circuit board and the second circuit board, and then improve circuit board module's life and stability in use.

S2, providing a pin header, and respectively welding two ends of the pin header to the first bonding pad group of the first circuit board and the second bonding pad group of the second circuit board;

in this step, because the pin interval of row needle is great, withstand voltage requirement satisfies 1000VAC, and leakage current 1mA uses row needle as the phenomenon that produces the strike sparks between the pin when the connecting piece can prevent the high pressure to can prevent to produce the potential safety hazard (for example catch a fire) at the junction of first circuit board and second circuit board, make circuit board module use still can remain stable and safe under high-voltage environment.

S3, providing an annular frame, and simultaneously bonding the annular frame on the first circuit board and the second circuit board, wherein the annular frame surrounds the pin header, the first bonding pad group and the second bonding pad group;

in this step, the annular frame can prevent that the splice from producing to buckle and leading to the welding to break away from, improves the structural strength of first circuit board and second circuit board junction, further improves life and guarantees the stability of using, and secondly, the annular frame can be defined out a region of beating the glue earlier, makes things convenient for in subsequent operation of beating the glue.

S4, spraying an adhesive into the annular frame, wherein the adhesive covers the pin header, the first pad group and the second pad group, the adhesive is solidified to form an adhesive layer, wherein,

in this step, the viscose layer of coating on arranging the needle can form insulating barrier between the adjacent pin of row needle, produces the phenomenon of striking sparks between the pin when further preventing high pressure to the viscose layer will arrange needle, first pad group and second pad group and cover, and protection that can be fine prevents them from being damaged, thereby improve life and the stability of guaranteeing to use.

In this embodiment, because the thickness of row needle is thinner than the thickness of traditional connector, only 2.5mm is thick, the viscose layer as long as cover row needle just, consequently the whole thickness of first circuit board and second circuit board junction can be thinner than traditional connector to make the required installation space of circuit board module reduce by a wide margin, can install in more compact structure, for example in the new forms of energy battery package, and row needle is lower than traditional connector cost, saves cost. The circuit board jointing method in the embodiment can effectively overcome the defects in the traditional jointing method.

In an embodiment, when the first circuit board is a flexible circuit board and the second circuit board is a rigid circuit board, the step of S1 is: providing a first circuit board, a second circuit board and a reinforcing plate, and bonding the reinforcing plate to the back surface of the first circuit board through gluing.

When the first circuit board and the second circuit board are both flexible circuit boards, the step of S1 is: providing a first circuit board, a second circuit board and two reinforcing plates, and respectively bonding the two reinforcing plates to the back surface of the first circuit board and the back surface of the second circuit board through gluing.

As shown in fig. 11, in an embodiment, the specific steps of S2 are:

s21, mounting the first circuit board and the second circuit board into a fixed carrier respectively, wherein the pads of the first pad group correspond to the pads of the second pad group one by one;

s22, respectively printing solder pastes on the first pad group and the second pad group;

s23, aligning and attaching pins on two sides of the pin header to a pad of the first pad group and a pad of the second pad group respectively;

and S24, sending the fixed carrier into a reflow soldering furnace to solidify the solder paste.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.