阅读说明：本技术 电子设备 (Electronic device ) 是由 U·L·布洛克 D·K·科普兰 邵国成 V·维努戈帕尔 于 2020-11-26 设计创作，主要内容包括：本公开涉及电子设备。一种电子设备可包括外壳,该外壳包括光学透明部件。第一光发射器和第二光发射器可定位在由外壳限定的内部体积中。光检测器可定位在内部体积中,并且可与内部体积内的第一光发射器和第二光发射器光学隔离。不透明材料可设置在光学透明部件上,并且可定位成抑制从第二光发射器发射的光到达光检测器,并且允许从第一光发射器发射的光到达光检测器。(The present disclosure relates to electronic devices. An electronic device may include a housing including an optically transparent member. The first and second light emitters may be positioned in an interior volume defined by the housing. The light detector may be positioned in the interior volume and may be optically isolated from the first and second light emitters within the interior volume. The opaque material may be disposed on the optically transparent member and may be positioned to inhibit light emitted from the second light emitter from reaching the light detector and to allow light emitted from the first light emitter to reach the light detector.)

1. An electronic device, comprising:

a housing at least partially defining an interior volume, the housing including an optically transparent member at least partially defining an exterior surface of the electronic device;

a first light emitter positioned in the interior volume;

a second light emitter positioned in the interior volume;

a light detector positioned in the interior volume, the light detector being optically isolated from the first and second light emitters within the interior volume; and

an opaque material disposed on the optically transparent member, the opaque material positioned to:

suppressing light emitted from the second light emitter: along a path from the second emitter through a medium adjacent a portion of an outer surface defined by the optically transparent member to the light detector and through the optically transparent member onto the light detector; and

allowing light emitted from the first light emitter to: along a path from the first emitter through the medium to the light detector and through the optically transparent member onto the light detector.

2. The electronic device defined in claim 1 wherein the optically transparent member comprises glass.

3. The electronic device defined in claim 1 wherein the opaque material is opaque to green light.

4. The electronic device defined in claim 1 wherein the opaque material is transparent to infrared light.

5. The electronic device defined in claim 1 wherein the opaque material has a major dimension of 10mm or less.

6. The electronic device defined in claim 1 wherein the opaque material has a thickness of 10 microns or less.

7. The electronic device defined in claim 1 further comprising a lens positioned over the opaque material.

8. The electronic device defined in claim 1 wherein the optically transparent member comprises sapphire.

9. The electronic device of claim 8, wherein:

the optically transparent member comprises a silicon dioxide layer; and is

The opaque material is disposed on the silicon dioxide layer.

10. An electronic device, comprising:

a housing defining an interior volume, the housing including an optically transparent portion;

a light emitter disposed in the interior volume;

a first light detector disposed in the interior volume;

a second light detector disposed in the interior volume; and

a light blocking member disposed on an inner surface of the optically transparent portion, the light blocking member sized and positioned to:

preventing light emitted by the light emitter from exiting the electronic device through the optically transparent member in a direction oriented more toward the second light detector than the first light detector; and

allowing light emitted by the light emitter to exit the electronic device through the optically transparent member in a direction oriented more toward the first light detector than the second light detector.

11. The electronic device of claim 10, wherein the light blocking member has a substantially circular shape.

12. The electronic device according to claim 11, wherein the light blocking member has a diameter of 10mm or less.

13. The electronic device of claim 10, wherein the light blocking member comprises an ink layer.

14. The electronic device defined in claim 13 wherein the layer has a thickness of about 10 microns or less.

15. The electronic device defined in claim 10 wherein the light emitters comprise LEDs.

16. The electronic device of claim 10, wherein:

the light blocking member includes a first light blocking member; and is

The electronic device also includes a second light blocking member positioned in the interior volume between the light emitter and the first light detector.

17. A housing for an electronic device, comprising:

a cover defining an aperture;

an optically transparent member positioned in the aperture and secured to the cover, the optically transparent member at least partially defining an inner surface of the housing and an outer surface of the housing;

a lens overlying a portion of the optically transparent member defining the inner surface; and

an opaque material disposed on the portion of the optically transparent member defining the inner surface, the opaque material positioned between the optically transparent member and the lens.

18. The enclosure of claim 17, wherein the opaque material is opaque to visible light and at least partially transparent to infrared light.

19. The housing of claim 17, wherein the lens comprises a fresnel lens.

20. The housing of claim 17, wherein the optically transparent member comprises glass.

Technical Field

The embodiments relate generally to electronic devices. More particularly, the present embodiments relate to wearable electronic devices.

Background

In designing electronic devices, portability of the devices is increasingly being considered, for example, to allow users to use the devices in a variety of situations and environments. In the context of wearable devices, these devices may be designed to include many different functions and operate in many different locations and environments. Components of the electronic device, such as the processor, memory, antenna, display, and other components may determine, in part, the performance level of the electronic device. In addition, the placement of these components in the device relative to each other may also determine the performance level of the electronic device.

The continued progress in electronic devices and their components has resulted in considerable improvements in performance. However, existing components and structures of electronic devices may limit the performance level of such devices. For example, while some components may achieve high performance levels in some cases, including multiple components in a device sized to enhance portability may limit the performance of the components, thereby limiting the performance of the device. Accordingly, it may be desirable to further adjust the component arrangement of an electronic device to provide additional or enhanced functionality without introducing or adding undesirable device attributes.

Disclosure of Invention

According to some examples of the present disclosure, an electronic device may include a housing at least partially defining an interior volume, the housing including an electromagnetically transparent portion at least partially defining an exterior surface of the electronic device. The electronic device may also include an antenna disposed in the interior volume and positioned to transmit signals at a power level through the electromagnetically transparent portion, and sensing circuitry disposed in the interior volume and positioned to receive signals. The sensing circuit may be configured to measure a transmit power of the signal. A processor may also be disposed in the interior volume, the processor configured to compare the transmit power to the power level.

According to some examples of the disclosure, an electronic device may include: a housing at least partially defining an interior volume, the housing including an optically transparent member at least partially defining an exterior surface of the electronic device; a first light emitter positioned in the interior volume; a second light emitter positioned in the interior volume; a light detector positioned in the interior volume, the light detector being optically isolated from the first and second light emitters within the interior volume; and an opaque material disposed on the optically transparent member, the opaque material positioned to: inhibiting light emitted from the second light emitter from reaching the light detector along a path from the second emitter through a medium adjacent a portion of an outer surface defined by the optically transparent member and onto the light detector through the optically transparent member; and allowing light emitted from the first light emitter to pass through the medium along a path from the first emitter to the light detector and through the optically transparent member onto the light detector.

In some examples, the optically transparent member comprises glass. The opaque material may be opaque to visible light in general and/or green light in particular. The opaque material may be transparent to infrared light. The opaque material may have a major dimension of 10mm or less. The opaque material may have a thickness of 10 microns or less. The electronic device may also include a lens positioned over the opaque material. The optically transparent member may comprise sapphire. The optically transparent member may include a silicon dioxide layer, and the opaque material may be disposed on the silicon dioxide layer.

According to some examples, an electronic device may include: a housing defining an interior volume, the housing including an optically transparent portion; a light emitter disposed in the interior volume; a first light detector disposed in the interior volume; a second light detector disposed in the interior volume; and a light blocking member disposed on an inner surface of the optically transparent portion, the light blocking member being sized and positioned to: preventing light emitted by the light emitter from exiting the electronic device through the optically transparent member in a direction oriented more toward the second light detector than the first light detector; and allowing light emitted by the light emitter to exit the electronic device through the optically transparent member in a direction that is directed more toward the first light detector than the second light detector.

In some examples, the light blocking member has a substantially circular shape. The light blocking member may have a diameter of 10mm or less. The light blocking member may include an ink layer. The layer may have a thickness of about 10 microns or less. The light emitter may comprise an LED. The light blocking member includes a first light blocking member, and the electronic device further includes a second light blocking member positioned in the interior volume between the light emitter and the first light detector.

According to some examples, a housing for an electronic device may include: a cover defining an aperture; an optically transparent member positioned in the aperture and secured to the cover, the optically transparent member at least partially defining an inner surface of the housing and an outer surface of the housing; a lens overlying a portion of the optically transparent member defining the inner surface; and an opaque material disposed on the portion of the optically transparent member defining the inner surface, the opaque material positioned between the optically transparent member and the lens. The opaque material may be opaque to visible light and at least partially transparent to infrared light. The lens may comprise a fresnel lens. The optically transparent member may comprise glass.

Drawings

The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:

FIG. 1A shows a perspective view of an electronic device.

FIG. 1B illustrates a bottom exploded view of the electronic device of FIG. 1A.

Fig. 2 shows an exploded view of the electronic device.

Fig. 3 shows an exploded view of a portion of an electronic device.

Fig. 4A shows a cross-sectional side view of a component of an electronic device.

Fig. 4B shows an exploded cross-sectional view of the components of fig. 4A.

Fig. 4C shows a close-up cross-sectional view of a portion of the component of fig. 4A.

Fig. 4D shows an exploded cross-sectional view of a portion of the components of fig. 4A.

Fig. 5A shows an exploded view of a portion of an electronic device.

Fig. 5B shows a cross-sectional view of the electronic device of fig. 5A.

Fig. 5C shows a cross-sectional view of a component of the electronic device.

Fig. 5D shows a cross-sectional view of a component of the electronic device.

Fig. 5E shows a cross-sectional view of a component of the electronic device.

Fig. 6A shows a bottom perspective view of an electronic device.

Fig. 6B shows an exploded view of a portion of an electronic device.

Fig. 6C shows an exploded view of components of the electronic device.

Fig. 6D shows an exploded view of components of the electronic device.

Fig. 6E shows an exploded view of components of the electronic device.

FIG. 7A illustrates a process flow diagram of a method for detecting the presence of a material in the vicinity of an electronic device.

FIG. 7B illustrates a process flow diagram of a method for detecting the presence of material in the vicinity of an electronic device.

Fig. 8A shows a cross-sectional view of a component of an electronic device.

Fig. 8B shows a cross-sectional view of a component of the electronic device proximate to the user.

Fig. 8C shows a cross-sectional view of a component of the electronic device proximate to the user.

Fig. 8D shows a cross-sectional view of a component of the electronic device proximate to the user.

Detailed Description

Reference will now be made in detail to the exemplary embodiments illustrated in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the embodiments as defined by the appended claims.

The architecture and components of the electronic devices described herein may allow for configurations and designs that may maximize the number of functions and capabilities of a portable or wearable electronic device, while also allowing for the use of relatively low cost or abundant materials, as well as reducing the complexity and cost of manufacturing and assembly. While high device performance and functionality levels may be achieved using high performance materials or highly complex components, these materials and components may also increase the cost of the device, thereby reducing the number of users who may be able to afford the device with reasonable burden. Accordingly, it would be desirable to provide a component design that may contain relatively low cost materials and have relatively low manufacturing complexity, yet still be capable of achieving performance and functional levels comparable or close enough to those achieved by devices that include high performance materials and components.

These and other embodiments are discussed below with reference to fig. 1A-7B. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting.

FIG. 1A shows an example of an electronic device 100. The electronic device shown in fig. 1A is a watch, such as a smart watch. The smart watch of fig. 1A is merely one representative example of a device that may be used in conjunction with the systems and methods disclosed herein. The electronic device 100 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet, computer, mobile communication device, GPS unit, remote control device, or other electronic device. The electronic device 100 may be referred to as an electronic device or a consumer device. In some examples, the electronic device 100 may include a body 101 that may carry operational components, for example, in an interior volume defined at least in part by a housing of the body. The electronic device 100 may also include straps 103 or other retention features that may secure the device 100 to the user's body as desired. Further details of the electronic device are provided below with reference to FIG. 1B.

Referring now to fig. 1B, the electronic device 100 may include a body 101 having a housing 102 and a cover 110 attached to the housing 102. The housing 102 may substantially define at least a portion of an exterior surface of the device 100. The cover 110 may comprise a ceramic material such as sapphire, glass, plastic, or any other substantially transparent material, component, or assembly. The cover 110 may cover or otherwise cover a display, a camera, a touch-sensitive surface such as a touch screen, or any component of the device 100. The cover 110 may define a front exterior surface of the device 100. Together, the housing 102 and the cover 110 may substantially define an exterior surface of the device 100.

In some examples, the housing 102 may include a member 130 that defines at least an exterior surface of the device 100. Component 130 may be referred to as a back shell or cover, and in some examples, may be attached to one or more other components, such as housing 102. The component 130 may be attached to the housing 102 by any method known in the art or developed in the future, such as adhesive bonding, brazing, welding, overmolding, interference fit, or other securing methods.

The rear cover 130 may define one or more apertures or through-holes. The transparent material 132 may be disposed in one or more apertures. In some examples, the transparent material 132 may be visually transparent and may include any transparent material, including ceramic materials such as sapphire. Transparent material 132 may provide visual and electromagnetic access to the external environment for one or more components of apparatus 100, as described herein.

The housing 102 may include one or more features to receive or couple to other components of the device 100. For example, the housing 102 may include features such as a recess 104 for receiving the strap 103 and an aperture 108 for receiving the button 148. The housing may also define one or more apertures for receiving additional input components, such as a dial or crown 146.

Device 100 is merely one example of an electronic device 100. Further electronic devices and designs thereof are explicitly contemplated. More details of example electronic devices and components are provided below with reference to fig. 2.

Fig. 2 illustrates an exploded view of a smart watch 200, which may be substantially similar to the devices described herein, such as electronic device 100, and may include some or all of the features of the devices described herein. The device 200 may include a housing 202, a display assembly 210, and a rear cover 230. Together, the housing 202, the display assembly 210, and the rear cover 230 may define an exterior surface and an interior volume of the device 200.

The housing 202 may be a substantially continuous or unitary component and may define one or more openings 204, 206, and 208 to receive components of the electronic device 200 and/or provide access to internal portions of the electronic device 200. In some examples, the device 200 may include input components, such as one or more buttons 248 and/or crowns 244 that may be disposed in the openings 206, 208. The microphone may be disposed in the interior volume such that it communicates with the exterior or ambient environment through the opening 204.

The display assembly 210 may be received by and may be attached to the housing 202. The display assembly may include a cover 214 that includes a transparent material, such as plastic, glass, and/or ceramic. The display assembly 210 may also include a display stack 212, which may include a plurality of layers and components, each of which may perform one or more desired functions. For example, the display overlay 212 may include a display layer 212, which may include a touch-detecting layer or component, a force-sensitive layer or component, and one or more display layers or components that may include one or more pixels and/or light-emitting portions for displaying visual content and/or information to a user. In some examples, the display layer or component 212 may include a Liquid Crystal Display (LCD), a Light Emitting Diode (LED) display, an Organic Light Emitting Diode (OLED) display, and/or any other form of display. The display layer 212 may also include one or more electrical connectors to provide signals and/or power to the display layer 212 from other components of the device 200.

In some examples, the device 200 may include a gasket or seal 216 that may be disposed between the display assembly 210 and the housing 202 to define a barrier that prevents liquid or moisture from entering the interior volume from the external environment, generally at the location of the seal 216. As described herein, the seal 216 may include a polymer, metal, and/or ceramic material. The device 200 may also include a seal 234 that may be disposed between the housing 202 and the back cover 230 to define a barrier to liquid or moisture ingress into the interior volume from the external environment substantially at the location of the seal 234. The seal 234 may comprise a polymer, metal, and/or ceramic material, as described herein. The seal 234 may be substantially similar to the seal 216 and may include some or all of the features of the seal.

Device 200 may also include internal components such as haptic engine 224, battery 222, and logic board 240 (also referred to as main logic board 240), which may include System In Package (SiP)242 disposed thereon, including one or more integrated circuits such as processors, sensors, and memory. The SiP may also include a package.

In some examples, the internal components may be disposed below the main logic board 240 and may be at least partially disposed in a portion of the internal volume defined by the back cover 230. For example, the device 200 may include an electromagnetic shielding component, otherwise referred to as an electronic shield 252, that may shield other components in the device 200 from electromagnetic radiation from the surrounding environment and/or electromagnetic radiation emitted by other components in the device 200. The device 200 may also include a second logic board 250 that may communicate with one or more sensors or transmitters of the device 200, for example, to receive information or signals from the external environment. In some examples, the second logic board 250 may also include a SiP. In some examples, device 200 may include one or more wireless antennas, such as antenna 254, which may be in electrical communication with one or more other components of device 200. In some examples, the antenna 254 may receive and/or transmit wireless signals at one or more frequencies, and may be, for example, one or more of a cellular antenna such as an LTE antenna, a Wi-Fi antenna, a bluetooth antenna, a GPS antenna, a multi-frequency antenna, and so forth. The antenna 254 may be communicatively coupled to one or more additional components of the electronic device 200.

The internal components may be disposed within an internal volume defined at least in part by the housing 202, and may be affixed to the housing 202 via an adhesive, an internal surface, an attachment feature, a threaded connector, a stud, a post, or other feature formed into, defined by, or otherwise part of the housing 202 and/or cover 214 and/or back cover 330, the housing 202 and/or cover 214 and/or back cover 330.

Any number or variety of components in any of the configurations described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and concepts related to the use and operation of the components are applicable not only to the specific examples discussed herein, but in any combination to any number of embodiments. Various examples of electronic devices and electronic device components are described below with reference to fig. 3-4D, including components having various features in various arrangements.

Fig. 3 illustrates an exploded view of several components of an electronic device, which may be substantially similar to the electronic devices described herein, and which may include some or all of the features of the electronic devices described herein. As described with respect to the electronic device 200 of fig. 2, the electronic device can include a housing 302 that can at least partially define an interior volume and an input component such as a crown or dial 346 that can be positioned at and extend at least partially through the aperture 306 defined by the housing 302. The crown module 346 can be connected to one or more other components of the apparatus (not shown).

Fig. 4A shows a cross-sectional view of an input section 400 of an electronic device. The input member 400 may be a crown or a turntable of a crown module and may be substantially similar to the turntables 246, 346 described herein. In some examples, the crown 400 may be a component of a crown module that may be substantially similar to and may include some or all of the features of crown modules described in U.S. patent nos. 9627163 and 9753436, which are incorporated herein by reference in their entirety.

The input member 400 may include an outer portion or dial 402 coupled to a shaft 410, for example, with a lock ring 406. The turntable 402 can define the exterior surfaces of both a crown module and an electronic device that includes the crown module. Additionally, the dial 402 may be sized and shaped to be manipulated by a user, such as by a user rotating about an axis defined by the shaft 410. In some examples, the turntable 402 may include a cap or ring 404, which may comprise a different material than the turntable 402, and may provide a desired aesthetic appearance to the exterior of the turntable 402. For example, the cap 404 may be brightly colored so that it can be easily identified by the user.

In some examples, the shaft 410 may be attached to the locking ring 406 by any desired technique, such as one or more of adhesive, brazing, or welding. In some examples, the shaft 410 may also include a threaded portion that may be received by other components of the crown module (not shown) and that may transmit rotational forces exerted on the turntable 402 to the module. All or a portion of the shaft 410 may extend through a collar 420, which may define a hole or aperture through which the shaft 410 may pass. The collar 420 may receive the shaft 410 and may hold the shaft 410 in a desired position. In some examples, the shaft 410 may include a protruding portion that protrudes substantially perpendicularly from a central axis of the shaft 410, for example. In some examples, the protruding portion and the central portion of the shaft may define a channel. One or more gaskets or O-rings 432 may be disposed between the shaft 410 and the collar 420 to provide or define a seal therebetween, e.g., to prevent liquids or contaminants from entering the interior volume of the apparatus and/or crown module. An additional gasket or O-ring 434 may be provided on another surface of the collar 420 to provide or define a seal between the collar 420 and one or more other components of the crown module. In some examples, a bushing 422 may be mounted on an outer surface of collar 420 between collar 420 and shaft 410, such as a protruding portion defining a channel.

Fig. 4B shows an exploded cross-sectional view of the turntable 402 and the shaft 410. As described above, the lock ring 406 may engage or attach the turntable 402 to the shaft 410. In some examples, the lock ring 406 may comprise a metal or a metallic material, such as sheet metal, including stamped sheet metal. The shaft may also comprise a metallic material, and in some examples, the lock ring 406 may be welded or brazed to the shaft 410, such as to a flat surface thereof. In some examples, the lock ring 406 may have a substantially circular or annular shape, and may also include one or more protrusions extending from the ring (such as extending in a direction substantially perpendicular to the plane of the ring). These protrusions may be sized and shaped to correspond to the locking features defined by the dial 402 such that the protrusions may be received and/or retained by the locking features of the dial 402. In some examples, the locking ring 406 and/or the tabs may be attached to the turntable 402 by any technique (such as adhesive) as desired. However, in some examples, the lock ring 406 and/or the protrusion may be mechanically received and retained only by the dial 402, e.g., to prevent the dial 402 from moving relative to the shaft 410.

In some examples, the turntable 402 may define a recess, cavity, groove, or channel that may receive and/or retain the cap 404 (e.g., an engagement portion 405 thereof). In some examples, the cap 404 may have a ring or annular shape, while in some other examples, the cap may have a substantially circular shape, as shown. In some examples, the engagement portion 405 may extend substantially perpendicularly from the plane of the circle or ring, as shown. The cap 404 may comprise any desired material, such as a polymer, metal, or ceramic material. In some examples, the cap 404 may comprise a polymeric material and may have any desired color, such as a bright or visually distinct color. Thus, in some examples, the cap 404 may provide a desired decorative or aesthetic appearance to the turntable 402 without requiring a multi-part or multi-segment turntable 402 architecture that may result in an undesirable increase in the turntable size or an undesirable increase in the distance the turntable protrudes from the housing and/or crown module. The cap 404 may be held in a desired position on the turntable 402 by any desired technique. In some examples, a layer of adhesive or glue 403 may be disposed in a groove defined by the turntable 402 to retain the cap 404. In some other examples, a mechanical interlock between the engagement portion of the cap and the corresponding engagement feature defined by the dial 402 may additionally or alternatively retain the cap 404 in a desired position on the dial 402.

Fig. 4C shows a close-up view of the engagement portion 405 of the cap 404 mated with the engagement feature 407 defined by the dial 402. As described above, the engagement features 407 may take the form of grooves or channels. In some examples, and as shown in fig. 4C, the channel may have an undercut geometry or may include an undercut region that may receive and retain a corresponding feature of the engagement portion 405. Thus, in some examples, the engagement portion 405 may interlock with an undercut feature in the channel defined by the dial 402. In some examples, such as where the cap 404 comprises a polymer or plastic material, the cap 404 may flex and/or bend during insertion of the engagement portion 405 into the channel to allow some or all of the engagement portion 405 to snap into and/or interlock with the undercut region of the channel 407. In some examples, the undercut region may have a width of about 10 microns to about 100 microns, or about 25 microns to about 75 microns, such as about 50 microns.

In some examples, an adhesive or glue material 403 may be disposed in the channel 407 and may additionally or alternatively be used to attach the cap 404 to the turntable 402. In some examples, in addition to attaching the cap 404 to the turntable 402, the adhesive 403 may also fill any empty volume in the channel 407 and ensure that the cap 404 is disposed at a desired depth in the channel 407 and thus relative to the outer surface of the turntable 402. In some examples, the outer surface of the cap 404 is substantially flush, parallel, and/or co-planar with the outer surface of the turntable 402.

Figure 4D shows an exploded cross-sectional view of collar 420 and bushing 422, such as described with respect to figure 4A. In use, the bushing 422 can substantially surround a portion of the collar 420, such as a portion protruding from the collar 420 above the edge 421. In some examples, bushing 422 may be press fit over collar 420 at a desired location. Collar 420 may define one or more ridges or retaining features that may retain liner 422 in a desired position on the collar, as shown. In some examples, the liner 422 may be retained on the collar 420 due, at least in part, to an interference fit between the components. In some examples, the inner dimension of the bushing 422 may have an interference fit with the outer dimension of the collar of between about 10 microns and about 100 microns, between about 25 microns and about 75 microns, or between about 30 microns and about 60 microns. In some examples, this architecture may allow the heights of the bushing 422 and collar 420 components to be significantly reduced, thereby resulting in a reduced protrusion distance of the turntable 402.

In some examples, the collar 420 may comprise a metal or metal alloy, such as steel or aluminum. In some examples, the bushing 422 may include a polymer and/or ceramic material, such as a plastic or resin. In some examples, the liner 422 may comprise an acetal resin, such as DELRIN brand resin. In some examples, the inner surface of the bushing 422 may have a chamfer to allow for a press-fit process. In some examples, the height of the bushing may be about 1mm or less, about 0.75mm or less, or even about 0.6mm or less. In some examples, the outer surface of the bushing 422 may define a groove or channel 423. The groove 423 may be located at or near the lower edge of the bushing 422, as shown. In some examples, components of the crown module that abut the bushing 422 (such as the shaft 410) may cause wear to the bushing material over time. If the grooves 423 were not present, such wear could result in the formation of channels that may subsequently have lips. Since the shaft will move back and forth over the lip, the lip may create an undesirable feel when the dial 402 is pressed into the device. By removing material from the bushing 422 in advance at the location of the groove 423, material that may define the lip is no longer present, thereby eliminating this problem in the event that bushing wear does occur. In some examples, the height of the groove 423 may be between about 0.01mm and 0.1mm, such as about 0.05 mm.

Any number or variety of components in any of the configurations described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and concepts used in relation thereto are applicable not only to the specific examples discussed herein, but in any combination to any number of embodiments. Various examples of electronic devices and electronic device components are described below with reference to fig. 5A-5C, including components having various features in various arrangements.

Fig. 5A illustrates an exploded view of several components of an electronic device 500, which may be substantially similar to the electronic devices described herein, and which may include some or all of the features of the electronic devices described herein. As described with respect to the electronic device 200 of fig. 2, the electronic device can include a housing 502 that can at least partially define an interior volume and a display assembly 510 that can be held by the housing. The display assembly 510 may be received by and may be attached to the housing 502, for example, at a feature defined by the housing 502, such as a boss, lip, or flange 503. The display assembly may include a cover 514 that includes a transparent material, such as plastic, glass, and/or ceramic. The display assembly 510 may also include a display stack 512, which may include a plurality of layers and components, each of which may perform one or more desired functions. In some examples, a gasket or seal 516 may be disposed between the display assembly 510 and the housing 502, e.g., at the flange 503, to generally define a barrier to liquid or moisture ingress into the interior volume from the external environment at the location of the seal 516.

Fig. 5B shows a cross-sectional view of the housing 502 with the transparent cover 514 and seal 516 attached thereto in an assembled configuration. It can be seen that the seal 516 may be in contact with the transparent cover 514 and the housing 502, and may secure or fasten these two components together. In some examples, the seal 516 may include multiple layers of material. The seal 516 may comprise a polymer, metal, and/or ceramic material, as described herein. In some examples, the seal 516 may substantially surround the perimeter of the aperture defined by the housing 502 and may have a shape that corresponds to the perimeter shape of one or more portions of the display assembly 510.

Fig. 5C shows a cross-sectional view of the seal 516, for example as shown in fig. 5A and 5B. In some examples, the seal 516 may include multiple layers of material bonded or joined together in a stacked configuration. In some examples, the seal 516 may include a silicone layer 520, such as a silicone rubber layer. The silicone layer 520 may be an intermediate layer or core of the seal 516 and may have a thickness of between about 50 microns and about 300 microns, or between about 100 microns and about 200 microns, such as about 150 microns. In some examples, silicone layer 520 may be substantially transparent. The silicone layer 520 may have a hardness of greater than about 5, greater than about 10, or greater than about 15 or greater on the shore a hardness scale.

In some examples, polymer layers 523 and 525 may be disposed on the top and bottom surfaces of silicone layer 520. These polymer layers 523, 525 may be the same or different materials, and in some examples, may include polyimide. In some examples, the polymer layers 523, 525 may be transparent or translucent. In some examples, the polymer layers 523, 525 may be a colored translucent material, such as a translucent amber material. In some examples, the polymer layers 523, 525 may have the same or different thicknesses. The polymer layers 523, 525 may have a thickness of between about 25 microns and about 150 microns, or between about 50 microns and about 100 microns, such as about 75 microns.

To secure the cover 514 to the housing 502, as shown in fig. 5B, in some examples, the top and bottom exterior surfaces of the seal may be defined by adhesive layers 522, 524. The adhesive layers may be of the same or different materials and may have the same or different thicknesses. In some examples, the adhesive layers 522, 524 may include a pressure sensitive adhesive material. The adhesive layers 522, 524 may have a thickness of between about 10 microns and about 100 microns, or between about 25 microns and about 75 microns, such as about 50 microns. The adhesive layers 522, 524 may have a hardness on the shore a hardness scale of greater than about 5, greater than about 10, greater than about 12, or greater than about 15 or greater.

Thus, in some examples, the entire seal 516 may have a thickness of between about 200 microns and about 600 microns, or between about 300 microns and about 600 microns, such as about 400 microns. Further, the seal may have a width of between about 500 microns and about 1500 microns, or between about 750 microns and about 550 microns, such as about 900 microns.

Referring again to fig. 5B, the width of the seal 516 and/or the width of the adhesive bond of the adhesive layers 522, 524 can be important to increase the chemical resistance of the seal 516 and to prevent corrosion of the seal 516 and/or the passage of liquids or contaminants therethrough into the interior volume. As shown, the housing 502 and the cover 514 may define a gap 505 therebetween. In some examples, the gap may provide an amount of rocking or movement of the cover 514 relative to the housing 502, such as during a brute force event or a fall event. Such rocking and/or squeezing of the seal 516 may reduce the risk of forces being transmitted directly to the cap 514 through the housing 502, thereby reducing the risk of damage to the cap 514.

However, in some examples, liquids, particles, contaminants, and/or corrosive materials may inadvertently enter gap 505 and may come into contact with seal 516. Accordingly, it may be desirable for seal 516 to be corrosion resistant and for the bond length between seal 516 and housing 502 and cover 514 to be relatively large.

Fig. 5D and 5E show cross-sectional views of alternative seal designs 616 and 716. In some examples, the seal 616 may include a relatively rigid core material 622 surrounded by a relatively soft or compliant material 620. In some examples, the core 622 may include one or more metals and/or polymers, such as stainless steel. The core 622 may then be overmolded with a polymeric material 620, such as a silicone material of any desired shape. In some examples, one or more adhesive layers 625 may be disposed on one or more surfaces of the silicone layer 620 to adhere the seal 616 to a component such as a housing or cover.

The seal 616 may also include a core 622, which may include one or more metals and/or polymers, such as stainless steel, and may be overmolded with a polymeric material 620 (e.g., silicone). As shown, the seal 616 may have a generally X-shaped cross-section, e.g., defining one or more lands or dimples that may extend partially or completely along one or more surfaces of the seal 616. In some examples, the shape of the seal 616 may allow for a desired level of compression or deformation of the seal 616 to effectively dissipate energy and provide a desired level of sealing between components.

Any number or variety of components in any of the configurations described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and concepts related to their function and use are applicable not only to the specific examples discussed herein, but in any combination to any number of embodiments. Various examples of electronic devices and electronic device sensor components are described below with reference to fig. 6A-7B, including components having various features in various arrangements.

Fig. 6A illustrates a bottom perspective view of an electronic device 800, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. The device 800 may include a back cover 830 that may be attached to the housing 802 opposite the display assembly 810, for example. The rear cover 830 may comprise ceramic, plastic, metal, or a combination thereof. In some examples, the back cover 830 may include an at least partially electromagnetically transparent member 832. The electromagnetically transparent component 832 may be transparent to any desired wavelength of electromagnetic radiation, such as visible light, infrared light, radio waves, or combinations thereof. In some examples, the electromagnetically transparent component 832 may allow sensors and/or emitters disposed in the housing 802 to communicate with the external environment. In some examples, electromagnetically transparent component 832 and/or rear cover 830 may allow one or more antennas disposed in the interior volume, such as antenna 840, to transmit and/or receive electromagnetic radiation, as further described herein. Together, the housing 802, the display assembly 810, and the rear cover 830 may substantially define an interior volume and exterior surfaces of the device 800.

Fig. 6B shows an exploded view of components of the electronic device 800. The electronic device 800 may include additional components as described herein, which have been omitted from fig. 6B for simplicity. In some examples, the back cover 830 may carry a plurality of components thereon, such as a first antenna element 836, a logic board 850, a sensing package and/or sensor module 852, and a light guide 854, a second antenna element 840, and connection components 853 for electrically connecting the second antenna element 840 to one or more components of the device 800, such as the logic board 850. In some examples, one or more of these components, such as the sensor module 852 and the second antenna 840, may be disposed above the electromagnetically transparent portion 832 of the back cover 830. In some examples, a seal 834 may be disposed between the back cover 830 and the housing 802 to provide or define a barrier between the interior volume and the ambient environment, as described herein. More details of the second antenna 840 (also referred to as the sensing antenna 840) are described with respect to fig. 6C.

Fig. 6C shows an exploded view of several components of an electronic device, such as the electronic device 800 described with respect to fig. 6A and 6B. In some examples, the device may include a back cover (omitted for simplicity) that includes an electromagnetically transparent portion 932, as described herein. The device may also include a logic board 950, which may include a substrate, such as a printed circuit board substrate, and may have one or more electronic and/or operational components thereon, such as one or more processors, memories, sensors, and/or integrated circuits. As described with respect to device 800, the electronic device may further include a sensor module 952, a sensing antenna 940 and a light guide 954 disposed in the interior volume, e.g., overlying the electromagnetically transparent portion 932. In some examples, the sensor module 952 may include one or more light emitting components and/or sensing components, as further described herein. The light guide 954 may guide light emitted by and/or to be received by the sensor module 952.

In some examples, sensing antenna 940 may be used to determine whether material is present at or near an exterior surface of an electronic device that includes the sensing antenna (e.g., at or near an exterior surface defined at least in part by electromagnetically transparent portion 932). In use, sensing antenna 940 may be in electrical communication with one or more other components of the device, and may be driven to emit and/or reflect electromagnetic radiation at one or more desired frequencies. In some examples, sensing antenna 940 may radiate energy at a frequency of about 2.4GHz, although substantially any frequency may be used. The device may also include, for example, an integrated circuit disposed on the logic board 950, on another logic board of the device (such as a main logic board), or at any desired location.

In use, the sensing antenna 940 is driven at a desired frequency, and an associated sensing integrated circuit in the device may measure the performance, efficiency, and/or resonance of the sensing antenna 940. In some examples, the sensing integrated circuit may measure a difference between the power used to drive the antenna and the transmit power at the location of the sensing integrated circuit. In some examples, the sensing integrated circuit may measure a reflected power level or a reflectivity level from the driven antenna based on the signal and/or power used to drive the antenna. In some examples, the sensing integrated circuit may be located near the back cover of the device, such as on the logic board 950. Thus, the sensing integrated circuit may measure antenna efficiency and/or performance in a direction extending from the back cover and/or the electromagnetically transparent member 932. In some examples, the device may include any number of desired sensing integrated circuits positioned at any number of locations within the interior volume of the device.

When a material or object is brought into proximity with the device (e.g., proximate to the electromagnetically transparent component 932), the dielectric properties or permittivity of the material or object may affect the performance, efficiency, and/or resonance of the sensing antenna 940, because at least a portion of the material or object may be in the transmission path between the sensing antenna 940 and the sensing integrated circuit, and/or because a change in the dielectric properties of the area now including the material or object may shift the resonance or resonant frequency of the antenna. The presence of a material or object in the transmission path whose dielectric constant is different from air may cause tuning and/or detuning of the performance of the sensing antenna 940, which is then measured by the sensing integrated circuit, for example, by measuring changes in the emission efficiency and/or level or reflectivity from the antenna. The degree to which the performance, efficiency, tuning, and/or resonance of sensing antenna 940 is altered can be measured and used to determine, at least in part, the presence and/or proximity of objects or materials in the vicinity of the device. In some examples, the degree to which the performance, efficiency, tuning, and/or resonance of the sensing antenna 940 is altered may be used to determine, at least in part, the composition of the material and/or object.

In some examples, the proximity detection function may be used to help the device determine whether it is being actively worn by the user or whether the device has been removed from the user's wrist. That is, sensing antenna 940 and sensing integrated circuit may detect the presence and/or proximity of a body part at or near the device. In some examples, sensing antenna 940 and sensing integrated circuit may distinguish the presence of a body part at or near the device from the presence of other objects or materials (such as a table). In this way, the user may initially authenticate himself when the device (such as a smart watch) is worn, and the device may not need further authentication until the device determines that it has been removed from the user's wrist.

In some examples, the sensing antenna 940 may include a conductive material substantially surrounded and/or encapsulated by an insulating material. In some examples, the conductive material may include a metal or metal alloy, such as copper. In some examples, the insulating material may include a polymeric material. In some examples, the insulating material may include an adhesive material, such as a pressure sensitive adhesive material. The pressure sensitive adhesive material may help secure the sensing antenna 940 in a desired location and may also help secure other components in the device. In some examples, the sensing antenna 940 may have a substantially annular or ring shape, as shown. In some examples, the sensing antenna 940 may be a monopole antenna, a dipole antenna, or any desired antenna topology. Further, in some examples, the spring fingers or connection components may be in electrical communication with the conductive material of the sensing antenna 940 and one or more other components of the device, such as components that may provide power to the sensing antenna 940 and may drive the sensing antenna. In some examples, sensing antenna 940 may include a first pressure sensitive adhesive layer, a copper layer, and a second pressure sensitive adhesive layer overlying the copper and the first pressure sensitive adhesive layer.

In some examples, sensing antenna 940 may include any conductive material of any shape or configuration as desired. In some examples, the sensing antenna 940 may be a preformed component comprising a conductive material disposed in an interior volume of the electronic device. However, in some examples, the sensing antenna 940 may be deposited, plated, or otherwise formed on additional components of the electronic device. For example, the conductive material may be deposited onto the electromagnetically transparent portion 932 in a desired shape or configuration to form the sensing antenna 940. In some examples, the sensing antenna 940 may be formed by a vapor deposition and/or plating process (such as a physical vapor deposition and/or electroplating process). Further, in some examples, an existing antenna of the electronic device may be used or operable as the sensing antenna 940. That is, the electronic device may include one or more antennas, such as a cellular antenna, an NFC antenna, an LTE antenna, a Wi-Fi antenna, a bluetooth antenna, and/or a GPS antenna, and one or more of these antennas may additionally or alternatively be driven or used as a sensing antenna. In some examples, any antenna positioned adjacent or near the back cover and/or the electromagnetically transparent portion 930 of the device may be used as a sensing antenna.

Fig. 6D shows an exploded view of several components of an electronic device, such as the electronic device 800 described with respect to fig. 6A and 6B. As with the example shown in fig. 6C, the electronic device may include, for example, a logic board 1050 overlaid on an electromagnetically transparent portion 1032, a sensor module 1052, and a sensing antenna 1040. Sensing antenna 1040 may be substantially similar to the sensing antennas described herein, and may include some or all of the features of the sensing antennas described herein, and may function similar to the sensing antennas described herein. In some examples, the sensing antenna 1040 may include a polymer or plastic material, such as a thermoplastic material. In some examples, the sensing antenna 1040 may also include a conductive material integrated into the polymer material, e.g., in a desired design or configuration. In some examples, the sensing antenna 1040 may be formed by a Laser Direct Structuring (LDS) process. That is, the polymeric material comprising the non-conductive metallic inorganic compound may be exposed to a laser in a desired pattern to write antenna traces onto or into the polymeric material that has been previously molded into a desired shape. Thus, in some examples, the sensing antenna 1040 may be shaped to fit near and/or around one or more other components of the device (such as the sensor module 1052 and/or the logic board 1050). The entire enclosure, including the logic board 1050, sensor module 1052 and sensing antenna 1040, may then be affixed in place, for example to the electromagnetically transparent portion 1032.

Fig. 6E shows an exploded view of several components of an electronic device, such as the electronic device 800 described with respect to fig. 6A and 6B. As with the example shown in fig. 6C and 6D, the electronic device can include, for example, a logic board 1150, a sensor module 1152, and a sensing antenna 1140 overlaid on an electromagnetically transparent portion 1132. In this example, the sensing antenna 1140 has been integrated into an existing component of an electronic device that may provide one or more additional functions. For example, the sensing antenna 1140 may include a flexible electrical connector that may be in electrical communication with one or more components of the device. In some examples, the sensing antenna 1140 may include an electromagnetic shielding component or an electronic shield. In some examples, additional traces may be added to the components to form the antenna. For example, additional traces may be added at or near a portion of the component defining the central aperture or hole. Additional details regarding the process for detecting the presence and/or type of material at or near an electronic device are described with respect to fig. 7A and 7B.

FIG. 7A illustrates a process flow diagram of a method 1200 for detecting the presence of a material in the vicinity of an electronic device. In some examples, method 1200 may be performed by an electronic device including a sensing antenna and one or more sensing integrated circuits, as described with respect to fig. 6A-6D.

At block 1210, an antenna of an electronic device, such as sensing antennas 940, 1040, 1140, may be driven at one or more desired frequencies and with desired power. The antenna may be driven by one or more operational components of the device in communication with the antenna component.

At block 1220, the efficiency of the antenna, the performance level, the tuning or detuning level of the antenna, and/or the resonance or resonant frequency of the antenna may be measured at one or more locations on or in the electronic device, as described with respect to fig. 6A-6D. In some examples, the efficiency of an antenna may be measured at a location such that a transmission path of a signal transmitted by the antenna may pass through or near a desired portion of an exterior surface of an electronic device. In some examples, the portion of the outer surface may be defined by a portion of a rear cover and/or a transparent cover of the device. In some examples, the efficiency of an antenna may be measured by detecting the transmit power from the antenna and comparing the transmit power to the power used to drive the antenna. In some examples, the resonance or resonant frequency of the antenna may be measured by detecting reflected power from the antenna and comparing the reflected power to the power used to drive the antenna. As used herein, the term "transmit power" may be broadly applied to refer to the power of a signal transmitted or radiated from an antenna, as well as to the reflected power or signal.

At block 1230, it may be determined whether material is present at or near an outer surface of the electronic device based at least in part on the measured efficiency and/or resonance. As described with respect to fig. 6A-6D, the presence of materials having a dielectric constant other than air may affect the transmit power, efficiency, and/or resonance of the antenna. Thus, the measured efficiency or resonance can be used to determine the dielectric constant of a space adjacent or near the outer surface of the device, and thus the presence of a material or object. In some examples, block 1230 may also include determining a type of material or object present at or near the electronic device. For example, block 1230 may also include determining whether the object is conductive or insulative, and a conductivity level. In some examples, block 1230 may include determining whether the object is a user, a metal, a ceramic, a plastic material, an organic substance, a liquid, or other type of material.

Fig. 7B illustrates a process flow diagram of a method 1300 for detecting the presence of material in the vicinity of an electronic device. In some examples, method 1300 may be performed by an electronic device including a sensing antenna and two or more sensing integrated circuits, as described with respect to fig. 6A-6D.

At block 1310, an antenna of an electronic device, such as sensing antennas 940, 1040, 1140, may be driven at one or more desired frequencies and with desired power. The antenna may be driven by one or more operational components of the device in communication with the antenna component.

At block 1320, the efficiency, performance level, tuning or detuning level of the antenna, and/or the resonant or resonant frequency of the antenna may be measured at a first location on or in the electronic device, as described with respect to fig. 6A-6D. In some examples, the efficiency of an antenna may be measured at a location such that a transmission path of a signal transmitted by the antenna may pass through or near a desired portion of an exterior surface of an electronic device. In some examples, the portion of the outer surface may be defined by a portion of a rear cover and/or a transparent cover of the device. In some examples, the efficiency of an antenna may be measured by detecting the transmit power from the antenna and comparing the transmit power to the power used to drive the antenna. In some examples, the resonance or resonant frequency of the antenna may be measured by detecting reflected power from the antenna and comparing the reflected power to the power used to drive the antenna. As used herein, the term "transmit power" may be broadly applied to refer to the power of a signal transmitted or radiated from an antenna, as well as to the reflected power or signal.

At block 1330, an efficiency, a performance level, a tuning or detuning level of the antenna, and/or a resonance or resonant frequency of the antenna may be measured at a second, different location on or in the electronic device, as described with respect to fig. 6A-6D. In some examples, the efficiency of an antenna may be measured at a location such that a transmission path of a signal transmitted by the antenna may pass through or near a desired portion of an exterior surface of an electronic device. In some examples, the portion of the outer surface may be defined by other portions of the rear cover and/or the transparent cover of the device as compared to the first position. In some examples, the efficiency of an antenna may be measured by detecting the transmit power from the antenna and comparing the transmit power to the power used to drive the antenna. In some examples, the first position may require a transmission path from the antenna through the back cover, while the second position may require a transmission path through the front cover.

At block 1340, a presence of a material at or near an exterior surface of the electronic device may be determined based at least in part on the efficiency measured at the first location and/or the efficiency measured at the second location. As described with respect to fig. 6A-6D, the presence of materials having a dielectric constant other than air may affect the transmit power and/or efficiency of the antenna. Thus, the efficiency measured at one or both of the first and second locations may be used to determine the dielectric constant of a space adjacent or near the outer surface of the device, and thus the presence of a material or object. In some examples, block 1340 may also include determining the type of material or object present at or near the electronic device. For example, block 1340 may also include determining whether the object is conductive or insulating, and a conductivity level. In some examples, block 1340 may include determining whether the object is a user, a metal, a ceramic, a plastic material, an organic substance, a liquid, or other type of material.

In some examples, one or more algorithms stored in a memory of the device may determine whether an object is present based on the measured efficiency at the first location, at the second location, and/or by using a weighted combination of the first location and the second location. In some examples using a weighted combination of efficiencies measured at the first and second locations, the algorithm may determine a weight to assign to the efficiency measured at the first and/or second locations. In some examples, the weight may be between 0% and 100%. In some examples, determining whether to use the efficiency measured at the first location, the second location, or a combination of the efficiencies measured at the first location and the second location may be based on factors other than measuring efficiency. These factors are not limited and may include date or time, geographic location, input or signals from one or more other sensors, user input, and the like. Additional sensing components and processes may be similarly included.

Fig. 8A shows a cross-sectional view of a portion of an electronic device described herein. This portion includes an electromagnetically transparent component 1432, which may be part of a back cover (omitted for simplicity) of the device as described herein. The device may also include a logic board 1450 mounted on the electromagnetically transparent member 1432. The device may include one or more sensors and/or transmitters as part of a sensor module as described herein, as part of logic board 1450, and/or as a stand-alone component. In some examples, the device can include a lens or light guide 1434 that can be mounted adjacent to the electromagnetically transparent component 1432. In some examples, the lens 1434 may be a fresnel lens 1434. In some examples, light blocking member 1470 may be positioned between lens 1434 and member 1432, as further described herein.

The device may include a light emitting member 1466, 1468. In some examples, the light emitting components 1466, 1468 may include Light Emitting Diodes (LEDs) that may emit light at one or more desired wavelengths. The device may further comprise a light detection component 1462, 1464 which may be designed and arranged to receive light which has been emitted by the LEDs 1466, 1468, has left the device through the lens 1434 and the electromagnetically transparent component 1432 and has returned into the device through the lens 1434 and the electromagnetically transparent component 1432. In some examples, a light blocking component such as component 1436 may substantially optically isolate the LEDs 1466, 1468 from the detectors 1462, 1464 except along a desired light path. In some examples, the device may include a light directing component or light controlling component 1463 disposed opposite one or both of the light detectors 1462, 1464. In some examples, the light control component 1463 can be used to allow only light incident on the light control component 1463 at a particular angle or range of angles to pass through, thereby acting as a filter.

Fig. 8B shows a device that includes components positioned adjacent to a medium 1500 (such as a limb of a user 1500) as described with respect to fig. 8A. As used herein, the term vehicle can refer to any material, substance, and/or object in any state or combination of states of matter. For example, air, water, and/or the human body may all be considered a medium as used herein.

The light path from the LED 1466, 1468 to the detector 1462, 1464 is shown. In some examples, light emitted from the LEDs 1466, 1468 and passed into the user's body and then reflected back to the detectors 1462, 1464 may be used to determine one or more physiological and/or biological characteristics of the user. However, in some examples, the determination of the physiological and/or biological characteristic may be based on receiving light that has passed through a desired tissue depth. For example, light emitted from LED 1468 and received by detector 1464 may penetrate to a certain depth, while light emitted from LED 1466 and received by detector 1464 may reach different depths. However, difficulties may arise when the two optical paths overlap within the user's tissue, potentially introducing noise and making it more difficult to distinguish whether light is emitted from detector 1466 or from detector 1468. Accordingly, it may be desirable to reduce the amount of overlap of the optical paths within the user tissue.

In the example shown in fig. 8B, the electromagnetically transparent component 1432 may comprise a ceramic material having a relatively high refractive index, such as sapphire. As shown, light emitted by LED 1468 may travel along light path 1481, enter the user's body along light path 1482, and return to detector 1464 along light path 1483. As shown, light emitted from the LED 1466 may travel along the light path 1484, enter the user's body along the light path 1485, and exit to the detector 1464. The relatively high index of refraction of the ceramic or sapphire member 1432 can mean that the overlap region 1486 of the optical path within the user's tissue is relatively small, e.g., less than about 5%, 4%, 3.5%, or even less than about 3% of the volume of the tissue being illuminated. This amount of overlap may be considered by an algorithm or other noise reduction technique, and may produce results having a desired level of accuracy.

Fig. 8C shows a cross-sectional view of the same components as shown in fig. 8C, however component 1432 now comprises a material having a relatively low index of refraction, such as glass. It can be seen that a lower index of refraction can result in a significant increase in the overlap region or overlap volume 1486. For example, the volume of overlap may be greater than 15% of the volume of the irradiated tissue, greater than 20% of the volume of the irradiated tissue, or even greater than 25% of the volume of the irradiated tissue. Thus, while components 1432 comprising glass may provide benefits to the device, such as reduced material costs, reduced manufacturing costs, increased durability, ease of component replacement, and other benefits, the use of glass may have an undesirable impact on determining one or more biological and/or physiological characteristics of the user.

Thus, as shown in fig. 8D, light blocking member 1470 may be positioned on an inner surface of member 1432 to block some or substantially all of the light emitted from LED 1466 that would otherwise reach detector 1464 and/or overlap with the light emitted from LED 1468. Thus, even with component 1432 comprising glass or some other relatively low index material, the volume of overlap may be less than about 5%, 4%, 3.5%, or even less than about 3% of the volume of the irradiated tissue. In some examples, the light blocking component 1470 can be positioned directly on the component 1432, e.g., between the component 1432 and the fresnel lens 1434. In some examples, light blocking member 1470 may be positioned substantially in the center of member 1432.

In some examples, light blocking member 1470 may take the form of dots or rounded portions of ink or other material that may be opaque to one or more desired wavelengths or wavelength ranges of light. In some examples, the light blocking member 1470 may be opaque to visible light (i.e., light having a wavelength between about 380nm and about 740 nm). In some examples, the light blocking member 1470 may be opaque to the wavelengths of light emitted by the LEDs 1466, 1468. In some examples, the LEDs 1466, 1468 may emit green light, and thus the light blocking member 1470 may be opaque to light of a wavelength range that includes green light. That is, in some examples, the light blocking member 1470 may be opaque to light including light having a wavelength between about 520nm and about 560 nm. In some examples, the light blocking member 1470 may be transparent to one or more other wavelengths of light in some examples so as not to affect the functionality of other sensors, emitters, and/or detectors of the device, such as those that may utilize infrared wavelengths or light having wavelengths between about 740nm and about 1 mm. In some examples, the ink or material of the light blocking member 1470 may have a thickness of about 15 microns or less, about 10 microns or less, about 7 microns or less, about 5 microns or less, or even about 2 microns or less. In some examples, light blocking member 1470 may have a diameter or major dimension of about 10mm or less, about 5mm or less, about 4mm or less, or even about 2mm or less.

In some examples, light blocking member 1470 may be deposited on member 1432 by any combination of printing and/or deposition processes (such as pad printing and/or one or more physical vapor deposition processes). In some examples, the surface of member 1432 may be treated prior to forming light blocking member 1470. For example, a silicon dioxide layer may be deposited on the surface prior to forming the light blocking member 1470.

Any features or aspects of the devices and components discussed herein may be combined or included in any varying combination. For example, the design and shape of the components or devices are not limited in any way and may be formed by any number of processes, including those discussed herein. As used herein, the terms exterior, outside, inside and inside are used for reference purposes only. The outer or exterior portion of the component may form a portion of the exterior surface of the component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior or inner portion of a component may form or define an interior or inner portion of a component, but may also form or define an outer or a portion of an outer surface of a component.

Various inventions have been described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that many variations are possible without departing from the scope and spirit of the invention disclosed herein, as those inventions set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. The terms "comprising" and "having," as used in the specification and claims, shall have the same meaning as the term "comprising.

Within the limits applicable to the present technology, the collection and use of data from a variety of sources may be used to improve the delivery of heuristic content or any other content to a user that may be of interest to the user. The present disclosure contemplates that, in some instances, such collected data may include personal information data that uniquely identifies or may be used to contact or locate a particular person. Such personal information data may include demographic data, location-based data, telephone numbers, email addresses, personal information, and/or personal information,ID. A home address, data or records relating to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), a date of birth, or any other identifying or personal information.

The present disclosure recognizes that the use of such personal information data in the present technology may be useful to benefit the user. For example, the personal information data may be used to deliver target content that is of greater interest to the user. Thus, using such personal information data enables the user to have planned control over the delivered content. In addition, the present disclosure also contemplates other uses for which personal information data is beneficial to a user. For example, health and fitness data may be used to provide insight into the overall health condition of a user, or may be used as positive feedback for individuals using technology to pursue health goals.

The present disclosure contemplates that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information data will comply with established privacy policies and/or privacy practices. In particular, such entities should enforce and adhere to the use of privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as data is collected and/or used. Personal information from the user should be collected for legitimate and legitimate uses by the entity and not shared or sold outside of these legitimate uses. Furthermore, such acquisition/sharing should be performed after receiving user informed consent. Furthermore, such entities should consider taking any necessary steps to defend and secure access to such personal information data, and to ensure that others who have access to the personal information data comply with their privacy policies and procedures. In addition, such entities may subject themselves to third party evaluations to prove compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to the particular type of personal information data collected and/or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the united states, the collection or acquisition of certain health data may be governed by federal and/or state laws, such as the health insurance association and accountability act (HIPAA); while other countries may have health data subject to other regulations and policies and should be treated accordingly. Therefore, different privacy practices should be maintained for different personal data types in each country.

Regardless of the foregoing, the present disclosure also contemplates embodiments in which a user selectively prevents use or access to personal information data. That is, the present disclosure contemplates that hardware elements and/or software elements may be provided to prevent or block access to such personal information data. For example, in the case of an ad delivery service, the present technology may be configured to allow a user to opt-in or opt-out of participating in the collection of personal information data at any time during or after registration service. In another example, the user may choose not to provide emotion-related data for the targeted content delivery service. In another example, the user may choose to limit the length of time that emotion-related data is kept, or to prohibit the development of the underlying emotional condition altogether. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to accessing or using personal information. For example, the user may be notified that their personal information data is to be accessed when the application is downloaded, and then be reminded again just before the personal information data is accessed by the application.

Further, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of inadvertent or unauthorized access or use. Once the data is no longer needed, the risk can be minimized by limiting data collection and deleting data. In addition, and when applicable, including in certain health-related applications, data de-identification may be used to protect the privacy of the user. De-identification may be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at a city level rather than at an address level), controlling how data is stored (e.g., aggregating data on a user), and/or other methods, as appropriate.

Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may be implemented without the need to access such personal information data. That is, various embodiments of the present technology do not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without the specific details. Thus, the foregoing descriptions of specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teaching.