阅读说明：本技术 光源灯板 (Light source lamp panel ) 是由 黄恒仪 何信政 陈在宇 郑鸿川 于 2020-06-24 设计创作，主要内容包括：本发明关于一种光源灯板,其包括基板、金属反应层、金属导电层、金属合金层以及至少一光源。金属反应层设置于该基板上,该金属反应层为银浆层或铜浆层；金属导电层设置于该金属反应层上,该金属导电层为铜层、镍层或银层；金属合金层设置于该金属导电层上,该金属合金层为锡-铋型合金层或锡-银-铜型合金层；至少一光源设置在该金属合金层上。本发明的光源灯板,金属合金层是位于金属导电层与光源之间,故相较于金属导电层与光源之间不具有金属合金层的实施例而言,可增强200℃以下的光源的表面贴合强度,亦可提供更佳的抗氧化性。(The invention relates to a light source lamp panel, which comprises a substrate, a metal reaction layer, a metal conducting layer, a metal alloy layer and at least one light source. The metal reaction layer is arranged on the substrate and is a silver paste layer or a copper paste layer; the metal conducting layer is arranged on the metal reaction layer and is a copper layer, a nickel layer or a silver layer; the metal alloy layer is arranged on the metal conducting layer and is a tin-bismuth type alloy layer or a tin-silver-copper type alloy layer; at least one light source is disposed on the metal alloy layer. In the light source lamp panel, the metal alloy layer is positioned between the metal conductive layer and the light source, so that compared with an embodiment without the metal alloy layer between the metal conductive layer and the light source, the light source lamp panel can enhance the surface bonding strength of the light source below 200 ℃ and also can provide better oxidation resistance.)

1. The utility model provides a light source lamp plate, its characterized in that includes:

a substrate;

the metal reaction layer is arranged on the substrate and is a silver paste layer or a copper paste layer;

the metal conducting layer is arranged on the metal reaction layer and is a copper layer, a nickel layer or a silver layer;

a metal alloy layer arranged on the metal conducting layer, wherein the metal alloy layer is a tin-bismuth type alloy layer or a tin-silver-copper type alloy layer; and

at least one light source is arranged on the metal alloy layer.

2. The utility model provides a light source lamp plate, its characterized in that includes:

a substrate;

the metal reaction layer is arranged on the substrate and is a silver paste layer or a copper paste layer;

the metal conducting layer is arranged on the metal reaction layer and is a copper layer, a nickel layer or a silver layer;

the first metal protection layer is arranged on the metal conducting layer and is a gold layer or a nickel layer;

a metal alloy layer disposed on the first metal protective layer, the metal alloy layer being a tin-bismuth type alloy layer or a tin-silver-copper type alloy layer; and

at least one light source is arranged on the metal alloy layer.

3. The utility model provides a light source lamp plate, its characterized in that includes:

a substrate;

the metal reaction layer is arranged on the substrate and is a silver paste layer or a copper paste layer;

the metal conducting layer is arranged on the metal reaction layer and is a silver layer or a copper layer;

the first metal protective layer is arranged on the metal conductive layer and is a nickel layer;

the second metal protective layer is arranged on the first metal protective layer and is a gold layer;

a metal alloy layer disposed on the second metal protective layer, the metal alloy layer being a tin-bismuth type alloy layer or a tin-silver-copper type alloy layer; and

at least one light source is arranged on the metal alloy layer.

4. The light source lamp panel of claim 1, 2 or 3, wherein: the tin-bismuth type alloy layer is a tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) alloy layer or a tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N) alloy layer, and the tin-silver-copper type alloy is a tin-silver-copper (Sn-Ag-Cu) alloy layer.

5. The light source lamp panel of claim 1, 2 or 3, wherein: the light source lamp panel further comprises a first protective layer and a second protective layer, wherein the first protective layer is arranged on the metal conducting layer, and the second protective layer is arranged on the first protective layer, the metal alloy layer and the at least one light source.

6. The light source lamp panel of claim 1, 2 or 3, wherein: this light source lamp plate still includes:

the composite conductive circuit layer is arranged on the substrate and is provided with a wire part and a plurality of pad parts; the wire portion is at least composed of the metal reaction layer; the plurality of pad parts at least comprise the metal reaction layer and the metal conducting layer stacked on the metal reaction layer, the metal conducting layer is a conducting layer with the conductivity higher than that of the metal reaction layer, and the conducting wire part is electrically coupled with the plurality of pad parts; and

the first protective layer is arranged on the composite conducting circuit layer and exposes the plurality of pad parts;

the number of the at least one light source is multiple, and the multiple light sources are respectively arranged on the multiple pad parts.

7. The light source lamp panel of claim 6, wherein: this base plate has long avris, first short avris and the short avris of second, and this light source lamp plate still includes the flat cable afterbody, and this flat cable afterbody extends from this long avris, and wherein this compound conducting wire layer includes:

a plurality of high-potential first lead wires extending from the tail of the flat cable to the middle position of the first short side;

a plurality of high-potential second wires extending from the middle position of the first short side to the vicinity of the plurality of pad parts in a manner of being substantially parallel to the long side;

a plurality of low potential second wires extending from the vicinity of the plurality of pad parts to the middle position of the second short side in a manner of being substantially parallel to the long side; and

and the low-potential first lead wires extend to the tail part of the flat cable from the middle position of the second short side.

8. The light source lamp panel of claim 7, wherein: this light source lamp plate still has:

a plurality of high potential third conductive lines; and

a plurality of low-potential third wires, wherein each of the pad portions has a positive electrode and a negative electrode, the plurality of high-potential third wires and the plurality of low-potential third wires extend substantially parallel to the first short side, the plurality of high-potential third wires are electrically coupled to one of the plurality of high-potential second wires and the corresponding positive electrode of the pad portion, and the plurality of low-potential third wires are electrically coupled to one of the plurality of low-potential second wires and the corresponding negative electrode of the pad portion.

9. The light source lamp panel of claim 8, wherein: the high-potential second wires are respectively provided with a plurality of S-shaped paths at the middle positions adjacent to the first short side correspondingly, and the lengths of the S-shaped paths are different, so that the current values passing through the high-potential second wires are adjusted to be substantially equal.

10. The light source lamp panel of claim 1, 2 or 3, wherein: this light source lamp plate still includes:

the composite conductive circuit layer is arranged on the substrate and is provided with a wire part and a plurality of pad parts; the wire portion is at least composed of the metal reaction layer; the plurality of pad parts are at least composed of the metal reaction layer and the metal conducting layer stacked on the metal reaction layer, the metal conducting layer is a conducting layer with the conductivity higher than that of the metal reaction layer, the metal conducting layer is a conducting layer with the flexibility lower than that of the metal reaction layer, and the conducting wire part is electrically coupled with the plurality of pad parts;

the first protective layer is arranged on the composite conducting circuit layer and exposes the plurality of pad parts, wherein the number of the at least one light source is multiple, the plurality of light sources are respectively arranged on the plurality of pad parts, the substrate is provided with a long side, a first short side and a second short side, and the substrate is a flexible polymer film substrate; and

the flat cable tail part is provided with a plurality of extending conducting wires and a preset bending part, the substrate can be bent by external force at the position corresponding to the preset bending part, the flat cable tail part extends out from the long side, the plurality of extending conducting wires are only formed by the metal reaction layer in the preset bending part, and the metal conducting layer does not extend into the preset bending part.

11. The light source lamp panel of claim 1, 2 or 3, wherein: this light source lamp plate still includes:

the composite conductive circuit layer is arranged on the substrate and is provided with a wire part and a plurality of pad parts; the wire portion is at least composed of the metal reaction layer; the plurality of pad parts at least comprise the metal reaction layer and the metal conducting layer stacked on the metal reaction layer, the metal conducting layer is a conducting layer with the conductivity higher than that of the metal reaction layer, and the conducting wire part is electrically coupled with the plurality of pad parts; and

the first protective layer is arranged on the composite conducting circuit layer and exposes the plurality of pad parts, wherein the number of the at least one light source is multiple, the plurality of light sources are respectively arranged on the plurality of pad parts, and the substrate is provided with a long side, a first short side and a second short side;

wherein the composite conductive circuit layer further comprises a resistance-increasing portion, the resistance-increasing portion being formed without the metal conductive layer, increasing a length of the metal reaction layer at the resistance-increasing portion or decreasing a width of the metal reaction layer at the resistance-increasing portion, and/or providing a resistance device.

12. The light source lamp panel of claim 3, wherein: the second metal protection layer is a metal protection layer having oxidation resistance greater than that of the first metal protection layer.

Technical Field

The invention relates to a light source lamp panel, in particular to a light source lamp panel comprising a metal alloy layer.

Background

People often seek aesthetic feeling, comfort in use and other additional values for surrounding living tools besides the improvement of basic functions. For example, in the case of keyboards, besides basic typing applications, light-emitting keyboards are emerging because people sometimes use computer systems with insufficient light. After the keyboard is added with the function of light emission, the requirements of further improving the uniformity of light emission, increasing the diversity of light emission, thinning the keyboard and the like are correspondingly generated.

Disclosure of Invention

The invention relates to a light source lamp panel, which can increase the surface bonding strength of a light source below 200 ℃ and also can provide better oxidation resistance.

In order to achieve the above object, the present invention provides a light source lamp panel, which includes a substrate, a metal reaction layer, a metal conductive layer, a metal alloy layer, and at least one light source. The metal reaction layer is arranged on the substrate and is a silver paste layer or a copper paste layer; the metal conducting layer is arranged on the metal reaction layer and is a copper layer, a nickel layer or a silver layer; the metal alloy layer is arranged on the metal conducting layer and is a tin-bismuth type alloy layer or a tin-silver-copper type alloy layer; at least one light source is disposed on the metal alloy layer.

As an alternative, the tin-bismuth type alloy layer is a tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) alloy layer or a tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N) alloy layer, and the tin-silver-copper type alloy is a tin-silver-copper (Sn-Ag-Cu) alloy layer.

As an optional technical solution, the light source lamp panel further includes a first protection layer and a second protection layer, wherein the first protection layer is disposed on the metal conductive layer, and the second protection layer is disposed on the first protection layer, the metal alloy layer and the at least one light source.

In addition, the invention also provides a light source lamp panel, which comprises a substrate, a metal reaction layer, a metal conducting layer, a first metal protective layer, a metal alloy layer and at least one light source. The metal reaction layer is arranged on the substrate and is a silver paste layer or a copper paste layer; the metal conducting layer is arranged on the metal reaction layer and is a copper layer, a nickel layer or a silver layer; the first metal protection layer is arranged on the metal conducting layer and is a gold layer or a nickel layer; a metal alloy layer arranged on the first metal protective layer, wherein the metal alloy layer is a tin-bismuth type alloy layer or a tin-silver-copper type alloy layer; at least one light source is disposed on the metal alloy layer.

As an alternative, the tin-bismuth type alloy layer is a tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) alloy layer or a tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N) alloy layer, and the tin-silver-copper type alloy is a tin-silver-copper (Sn-Ag-Cu) alloy layer.

As an optional technical solution, the light source lamp panel further includes a first protection layer and a second protection layer, wherein the first protection layer is disposed on the metal conductive layer, and the second protection layer is disposed on the first protection layer, the metal alloy layer and the at least one light source.

In addition, the invention also provides a light source lamp panel, which comprises a substrate, a metal reaction layer, a metal conducting layer, a first metal protective layer, a second metal protective layer, a metal alloy layer and at least one light source. The metal reaction layer is arranged on the substrate and is a copper slurry layer or a silver slurry layer; the metal conducting layer is arranged on the metal reaction layer and is a silver layer or a copper layer; the first metal protection layer is arranged on the metal conductive layer and is a nickel layer; the second metal protection layer is arranged on the first metal protection layer and is a gold layer; a metal alloy layer is arranged on the second metal protective layer, and the metal alloy layer is a tin-bismuth type alloy layer or a tin-silver-copper type alloy layer; at least one light source is disposed on the metal alloy layer.

As an alternative, the tin-bismuth type alloy layer is a tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) alloy layer or a tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N) alloy layer, and the tin-silver-copper type alloy layer is a tin-silver-copper (Sn-Ag-Cu) layer.

As an optional technical solution, the light source lamp panel includes a first protective layer and a second protective layer, wherein the first protective layer is disposed on the metal conductive layer, and the second protective layer is disposed on the first protective layer, the metal alloy layer and the at least one light source.

As an optional technical solution, the second metal protection layer is a metal protection layer having oxidation resistance greater than that of the first metal protection layer.

As an optional technical solution, the light source lamp panel further includes a composite conductive circuit layer and a first protective layer, the composite conductive circuit layer is disposed on the substrate, and the composite conductive circuit layer has a wire portion and a plurality of pad portions; the wire portion is at least composed of the metal reaction layer; the plurality of pad parts at least comprise the metal reaction layer and the metal conducting layer stacked on the metal reaction layer, the metal conducting layer is a conducting layer with the conductivity higher than that of the metal reaction layer, and the conducting wire part is electrically coupled with the plurality of pad parts; the first protective layer is arranged on the composite conducting circuit layer and exposes the plurality of pad parts; the number of the at least one light source is multiple, and the multiple light sources are respectively arranged on the multiple pad parts.

As an optional technical solution, the substrate has a long side, a first short side and a second short side, and the light source lamp panel further includes a flat cable tail portion extending from the long side, wherein the composite conductive circuit layer includes a plurality of high-potential first wires, a plurality of high-potential second wires, a plurality of low-potential second wires and a plurality of low-potential first wires, and the plurality of high-potential first wires extend from the flat cable tail portion to a middle position of the first short side; the high-potential second wires extend from the middle position of the first short side to the vicinity of the pad parts in a manner of being substantially parallel to the long side; the plurality of low-potential second lead wires extend from the vicinity of the plurality of pad parts to the middle position of the second short side in a manner of being substantially parallel to the long side; the plurality of low-potential first lead wires extend from the middle position of the second short side to the tail part of the flat cable.

As an optional technical scheme, the light source lamp panel further has a plurality of high-potential third wires and a plurality of low-potential third wires. Each of the pad portions has a positive electrode and a negative electrode, the high-potential third wires and the low-potential third wires extend substantially parallel to the first short side, the high-potential third wires are electrically coupled to one of the high-potential second wires and the corresponding positive electrode of the pad portion, and the low-potential third wires are electrically coupled to one of the low-potential second wires and the corresponding negative electrode of the pad portion.

As an optional technical solution, the plurality of high-potential second wires respectively have a plurality of S-shaped paths corresponding to the middle positions adjacent to the first short side, and the lengths of the plurality of S-shaped paths are different, so as to adjust the current values passing through the plurality of high-potential second wires to be substantially equal.

As an optional technical scheme, the light source lamp panel further comprises a composite conductive circuit layer, a first protection layer and a flat cable tail portion. The composite conductive circuit layer is arranged on the substrate and is provided with a wire part and a plurality of pad parts; the wire portion is at least composed of the metal reaction layer; the plurality of pad parts are at least composed of the metal reaction layer and the metal conducting layer stacked on the metal reaction layer, the metal conducting layer is a conducting layer with the conductivity higher than that of the metal reaction layer, the metal conducting layer is a conducting layer with the flexibility lower than that of the metal reaction layer, and the conducting wire part is electrically coupled with the plurality of pad parts; the first protective layer is arranged on the composite conducting circuit layer and exposes the plurality of pad parts, wherein the number of the at least one light source is multiple, the plurality of light sources are respectively arranged on the plurality of pad parts, the substrate is provided with a long side, a first short side and a second short side, and the substrate is a flexible polymer film substrate; the flat cable tail part is provided with a plurality of extending conducting wires and a preset bending part, the substrate can be bent by external force at the position corresponding to the preset bending part, the flat cable tail part extends from the long side, the plurality of extending conducting wires are only formed by the metal reaction layer in the preset bending part, and the metal conducting layer does not extend into the preset bending part.

As an optional technical scheme, the light source lamp panel further comprises a composite conducting circuit layer and a first protection layer. The composite conductive circuit layer is arranged on the substrate and is provided with a wire part and a plurality of pad parts; the wire portion is at least composed of the metal reaction layer; the plurality of pad parts at least comprise the metal reaction layer and the metal conducting layer stacked on the metal reaction layer, the metal conducting layer is a conducting layer with the conductivity higher than that of the metal reaction layer, and the conducting wire part is electrically coupled with the plurality of pad parts; the first protective layer is arranged on the composite conducting circuit layer and exposes the plurality of pad parts, wherein the number of the at least one light source is multiple, the plurality of light sources are respectively arranged on the plurality of pad parts, and the substrate is provided with a long side, a first short side and a second short side; wherein the composite conductive circuit layer further comprises a resistance-increasing portion, the resistance-increasing portion being formed without the metal conductive layer, increasing a length of the metal reaction layer at the resistance-increasing portion or decreasing a width of the metal reaction layer at the resistance-increasing portion, and/or providing a resistance device.

In the light source lamp panel, the metal alloy layer is positioned between the metal conductive layer and the light source, so that compared with an embodiment without the metal alloy layer between the metal conductive layer and the light source, the light source lamp panel can enhance the surface bonding strength of the light source below 200 ℃ and also can provide better oxidation resistance. In addition, each layer (such as the metal reaction layer, the metal conductive layer, the first metal protection layer, the second metal protection layer or the metal alloy layer) of the light source lamp panel of the invention is made of a specific material, and by the fixed material configuration among the layers, the layers can have the best matching performance, and the light source lamp panel is beneficial to mass production.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1A to 1D are schematic views of a light source lamp panel and a composite conductive circuit layer therein according to some embodiments.

Fig. 2A to 2C are schematic diagrams of LED light sources having package structures according to various embodiments.

Fig. 3A to 3C are schematic diagrams of LED light sources with encapsulating glue layers according to various embodiments.

Fig. 4A to 4D are schematic views of a second protective layer of a light source lamp panel according to various embodiments.

Fig. 5 is a flowchart of a method for manufacturing the light source lamp panel shown in fig. 1A to 1D.

Fig. 6A to 6C are schematic views of a light source lamp panel and a composite conductive circuit layer therein according to other embodiments.

Fig. 7 is a flowchart of a method for manufacturing the light source lamp panel shown in fig. 6A to 6C.

Fig. 8A-8D are schematic diagrams of layers of a light emitting keyboard according to some embodiments.

Fig. 9 is a schematic top view of one of the keys of the light-emitting keyboard shown in fig. 8A-8D.

Fig. 10 is a side view of one of the keys of the light-emitting keyboard shown in fig. 8A-8D.

FIG. 11 is a side view schematic diagram of one of the keys of an illuminated keyboard according to further embodiments.

FIG. 12 is a side view schematic of one of the keys of an illuminated keyboard according to still further embodiments.

FIG. 13 is a side view schematic of one of the keys of an illuminated keyboard according to still other embodiments.

FIG. 14 is a side view schematic of one of the keys of the illuminated keyboard according to yet other embodiments.

Fig. 15 is a schematic view of a light source lamp panel according to still further embodiments.

Fig. 16 is a schematic view of a light source lamp panel according to still further embodiments.

Fig. 17 is a schematic view of a light source lamp panel according to still further embodiments.

Detailed Description

Please refer to fig. 1A to 1D to obtain a clearer understanding of the light source lamp panel. Fig. 1A to 1D illustrate a light source lamp panel 100 and a composite conductive circuit layer 120 therein. Fig. 1A illustrates the composite conductive circuit layer 120 of the light source lamp panel 100 in a top view, but most other components in the light source lamp panel 100 are omitted for clarity. Fig. 1B and 1C are cross-sectional views of the light source lamp panel 100 along the section lines 1B-1B 'and 1C-1C' in fig. 1A, respectively. As shown in fig. 1B and fig. 1C, the light source lamp panel 100 includes a substrate 110, a composite conductive circuit layer 120, a first protection layer 130 and a light source 140, wherein the bottom surface of the light source 140 has positive and negative electrode contacts electrically connected to the two composite conductive circuit layers 120 respectively, so as to form a loop for receiving electric energy from a power source.

Any suitable substrate may be used for the substrate 110. According to some embodiments, a substrate is used that is available for a printing process. In some embodiments, a flexible substrate is used. For example, the substrate 110 may be made of a flexible polymer film material, such as polyethylene terephthalate (PET) for the substrate 110.

The composite conductive trace layer 120 is disposed on the substrate 110. As shown in fig. 1A, the composite conductive trace layer 120 has a trace portion 121 and a pad portion 122. The width of the pad part 122 can be adjusted according to the size of the light source 140; when the size of the light source 140 is larger, the width of the pad portion 122 may be larger than the width of the wire portion 121, so as to increase the welding area between the larger size light source 140 and the pad portion 122; when the size of the light source 140 is smaller, the width of the pad portion 122 may be smaller than the width of the wire portion 121, so as to sufficiently fix the light source 140 with the smaller size. The wire portion 121 is electrically coupled to the pad portion 122. For example, as shown in fig. 1A, the wire portion 121 is electrically coupled to the pad portion 122 by physically connecting the pad portion 122. Fig. 1B and 1C show a metal reaction layer 125 and a metal conductive layer 126 of the composite conductive line layer 120, the metal conductive layer 126 being stacked on the metal reaction layer 125, both of which are used to constitute the composite conductive line layer 120. The conductivity of the metal conductive layer 126 is higher than that of the metal reaction layer 125, and the flexibility of the metal conductive layer 126 is lower than that of the metal reaction layer 125. In some embodiments, the material of the metal reactive layer 125 may include silver paste, copper paste, or other suitable material, i.e., the metal reactive layer 125 may be a silver paste layer, a copper paste layer, or other suitable material layer, and the material of the metal conductive layer 126 may include copper, nickel, silver, or other suitable material, i.e., the metal conductive layer 126 may be a copper layer, a nickel layer, a silver layer, or other suitable material layer. The metal reaction layer 125 can be used to guide the metal to be effectively deposited on the ink on the surface of the circuit, and can effectively improve the reactivity of electrochemical deposition. The metal conductive layer 126 is a pure metal conductive layer, and has high hardness and high conductivity. In the light source lamp panel 100, the wire portion 121 is at least composed of the metal reaction layer 125, and optionally, a partial or entire metal conductive layer 126 is further included according to the size requirement of the resistor. When the conductive line 121 requires a lower resistance per unit length, the conductive line 121 may be composed of the metal reaction layer 125 and the metal conductive layer 126. When the conductive line 121 requires a higher resistance per unit length, the conductive line 121 may only have the metal reaction layer 125 and not cover the metal conductive layer 126. In some embodiments, in order to reduce the magnitude of the current flowing on the composite conductive circuit layer 120, the composite conductive circuit layer 120 may further include a resistance increasing portion 123. The resistance increasing portion may be, for example, but is not limited to, any one or combination of the resistance increasing portions 123A to 123C shown in fig. 1D. Referring to fig. 1D, (1) the resistance-increasing portion 123A only has the metal reaction layer 125, but is not provided with the metal conductive layer 126; (2) the resistance-enhancing portion 123B is formed with only the metal reaction layer 125, and is intentionally extended in an S-shape such that the metal reaction layer 125 has an increased length and/or a decreased width; (3) the resistance-enhancing portion 123C is a composite conductive trace layer 120 and has an open gap, and a resistance device 124 is disposed in series between two opposite open ends.

Referring to fig. 1B and fig. 1C again, the first passivation layer 130 is disposed on the composite conductive trace layer 120 and exposes the pad portion 122. The first protective layer 130 may be formed of PET, ultraviolet curing paste (UV paste), or the like.

The light sources 140 are respectively disposed on the pad portions 122. The light source 140 may be an LED light source. For example, an LED light source 140A having a Plastic Leaded Chip Carrier (PLCC) package structure as shown in FIG. 2A may be employed. An LED light source 140B with a wire bond package structure as shown in fig. 2B may be used. Alternatively, an LED light source 140C having a Chip Scale Package (CSP) structure as shown in fig. 2C may be employed. In some embodiments, the type of the packaging adhesive layer in the packaging structure can be changed to achieve a specific optical effect. For example, an LED light source in which the encapsulant layer has a light uniformizing structure, such as the LED light source 140D shown in fig. 3A, may be adopted, which is to form a diffusion microstructure (e.g., micro lens) on the surface of the encapsulant layer. An LED light source in which the packaging adhesive layer has a light-gathering structure, such as the LED light source 140E shown in fig. 3B, can be adopted, in which the surface of the packaging adhesive layer is formed to have a single spherical convex structure to achieve the light-gathering effect. Alternatively, an LED light source in which the encapsulant layer has a light scattering structure, such as the LED light source 140F shown in fig. 3C, can be used, in which the surface of the encapsulant layer is formed to have a single spherical concave structure to achieve the light scattering effect.

It will be appreciated that although the embodiments are examples of light sources with emphasis on light source panels, other electronic components may be provided on the pad portions in a similar manner. That is, in some embodiments, there may be portions of the pad portions that provide electrical coupling for other electronic components besides the light source.

In some embodiments, as shown in fig. 1B and 1C, the light source lamp panel 100 may further have a second protective layer 150. The second protective layer 150 is disposed on the first protective layer 130 and the light source 140. According to some embodiments, the second protective layer 150 may further have a light uniformizing structure, and/or a light condensing or dispersing structure. For example, as shown in fig. 4A, a diffusion microstructure (e.g., a microlens) may be formed on the surface of the second protection layer 150A to achieve a uniform light effect. Alternatively, as shown in fig. 4B, diffusion particles 151B are added to the second protective layer 150B to achieve a uniform light effect. The diffusion particles 151B may be titanium dioxide, silicon dioxide, phosphor, or the like. In addition, as shown in fig. 4C, the surface of the second passivation layer 150C may be formed to have a single spherical convex structure to achieve the light-gathering effect. Alternatively, as shown in fig. 4D, the surface of the second protection layer 150D may be formed to have a single spherical concave structure to achieve the light scattering effect. The second protective layer 150 may be formed of PET, uv curable glue, or the like. The material of the second protective layer 150 may be the same as or different from the material of the first protective layer 130.

Please refer to fig. 5, which is a flowchart illustrating a method for manufacturing the light source lamp panel 100. At step 210, a substrate 110 is provided. The substrate 110 may have a long side, a first short side and a second short side. In step 220, a metal reaction layer 125 of the composite conductive trace layer 120 is formed on the substrate 110. In step 230, a metal conductive layer 126 is formed on the metal reaction layer 125, wherein the conductivity of the metal conductive layer 126 is higher than the conductivity of the metal reaction layer 125, i.e. the metal conductive layer 126 is a conductive layer with a conductivity higher than the conductivity of the metal reaction layer 125. In some embodiments, forming the metal reactive layer 125 includes performing a printing process, and forming the metal conductive layer 126 includes performing a plating process. For example, the printing process for forming the metal reaction layer 125 may include coating a conductive paste or a conductive paste, which is a silver paste or a copper paste. The plating process for forming the metal conductive layer 126 may include plating or electroplating a metal, such as copper, nickel or silver. For example, in some embodiments, the metal reaction layer 125 may be formed by screen printing silver paste, and the metal conductive layer 126 may be formed by electroless copper plating. Since the metal forming the metal conductive layer 126 is formed by plating or electroplating, and the metal conductive layer 126 formed by plating or electroplating under the microscopic scale is a scale microstructure which is closely arranged and stacked, the scale microstructure is easily spread and separated when the light source lamp panel 100 is bent, so that the conductivity and flexibility of the metal conductive layer 126 are inferior to those of the metal reaction layer 125 formed by conductive colloid or conductive paste. The conductive trace portion 121 of the composite conductive trace layer 120 is at least composed of the metal reaction layer 125 and may further include a metal conductive layer 126, and the pad portion 122 is at least composed of the metal reaction layer 125 and the metal conductive layer 126. Thereafter, in step 240, a first protection layer 130 is formed on the composite conductive trace layer 120, and the first protection layer 130 exposes the pad portion 122. Since the formation of the first protection layer 130 is performed after the formation of the metal conductive layer 126, the first protection layer 130 covers the portion of the metal conductive layer 126 outside the pad portion 122, such as the wire portion 121. In step 250, the light source 140 is disposed on the pad portion 122. Step 260 may optionally be performed. In step 260, a second passivation layer 150 is formed on the first passivation layer 130 and the light source 140. The second protective layer 150 may have a light uniformizing structure, and/or a light condensing or dispersing structure.

Referring now to fig. 6A to 6C, another light source lamp panel 300 and the composite conductive circuit layer 320 therein are shown, wherein fig. 6A illustrates the composite conductive circuit layer 320 of the light source lamp panel 300 in a top view, but most other components in the light source lamp panel 300 are omitted for clarity, and fig. 6B and 6C are cross-sectional views of the light source lamp panel 300 along section lines 6B-6B 'and 6C-6C' in fig. 6A, respectively. The light source lamp panel 300 includes a substrate 310, a composite conductive circuit layer 320, a first passivation layer 330, and a light source 340, and optionally includes a second passivation layer 350, wherein the substrate 310, the first passivation layer 330, the light source 340, and the second passivation layer 350 are similar to the corresponding components of the light source lamp panel 100, and further description thereof is omitted here for brevity, and only the composite conductive circuit layer 320 with differences in form is focused on.

As shown in fig. 6A to 6C, in the light source lamp panel 300, the metal conductive layer 326 of the composite conductive circuit layer 320 is only disposed on the pad portion 322. The lead portion 321 does not include the metal conductive layer 326 having low resistance and high conductivity. For example, the wire portion 321 may be formed by only the metal reaction layer 325. However, it is not excluded that the lead portion 321 is provided with another layer having the same or lower conductivity as the metal reaction layer 325. Similar to the composite conductive trace layer 120, the material of the metal reactive layer 325 may include a copper paste or a silver paste, i.e., the metal reactive layer 325 may be a copper paste layer or a silver paste layer, the material of the metal conductive layer 326 may include copper, nickel or silver, and the metal conductive layer 326 may be a copper layer, a nickel layer or a silver layer. In addition, the composite conductive trace layer 320 may also include a resistance-increasing portion, such as a resistance-increasing portion 123B similar to that shown in fig. 1D, which increases the length of the metal reaction layer 325 and/or decreases the width of the metal reaction layer 325, or a resistance-increasing portion 123C which is similar to that of the composite conductive trace layer 320 and which is provided with an open circuit and a resistance device connected in series between two opposite ends of the open circuit.

Fig. 7 is a flowchart illustrating a method for manufacturing the light source lamp panel 300. For the sake of brevity, details of the fabrication method similar in part to that described with reference to fig. 5 may be omitted herein. At step 410, a substrate 310 is provided. In step 420, a metal reaction layer 325 of the composite conductive trace layer 320 is formed on the substrate 310. Next, in step 430, a first passivation layer 330 is formed, and the first passivation layer 330 exposes the pad portion 322. Then, in step 440, the metal conductive layer 326 of the composite conductive trace layer 320 is formed by using the first protection layer 330 as a mask, and the metal conductive layer 326 is formed only on the pad portions 322. In step 450, the light source 340 is disposed on the pad portion 322. Step 460 may optionally be performed. In step 460, a second passivation layer 350 is formed on the first passivation layer 330 and the light source 340.

Embodiments of the light source lamp panel and the method for manufacturing the same of the present invention have been provided above. In another aspect of the present invention, a light-emitting keyboard is provided, which uses the light source lamp panel. This kind of luminous keyboard includes a plurality of key caps and light source lamp plate. The light source lamp plate sets up in these a plurality of key caps below. The light source lamp panel can be according to the light source lamp panel of any one of above-mentioned embodiments. Light emitted by the light source can travel upwards to reach the keycaps.

Reference is now made to fig. 8A-8D, 9 and 10 for a further understanding of the light-emitting keyboard described above. Fig. 8A-8D illustrate layers, respectively, of a light-emitting keyboard in a top-down configuration, according to some embodiments. Fig. 9 and 10 are schematic top and side views, respectively, of one of the keys of the illuminated keyboard.

Please refer to fig. 8A, which is a schematic diagram of a plurality of key caps 510 of a light-emitting keyboard. It will be appreciated that keycap 510 may be arranged in any suitable manner and/or may have any suitable combination of characters, not limited to those shown. The character portion of the key cap 510 of the illuminated keyboard, such as in fig. 9? And "" or "" can have a light-transmitting property. In some embodiments, the characters at different positions may have different colors, such as using different colored clear paints, thereby increasing the variety of lighting and the convenience of use.

Fig. 8B is a schematic diagram of a membrane switch layer 520 for selecting a light-emitting keyboard. The membrane switch layer 520 is disposed under the key cap 510. According to some embodiments, the thin film switching layer 520 may include a switching electrode layer 521 and a plurality of sets of support structures 522 as shown in fig. 10. The switch electrode layer 521 includes a plurality of switch electrodes (not shown, located below the rubber elastic body 521), and when one of the keycaps 510 is pressed, the corresponding switch electrode is triggered to be turned on. The supporting structure 522 is disposed on the switching electrode layer 521 and coupled to the corresponding keycap 510 and the bottom plate 530, respectively, and the supporting structure 522 can support the keycap 510 to move up and down. When the key cap 510 is pressed by an external force, the key cap 510 moves downward to abut against the trigger switch electrode; when the external force disappears, the key cap 510 can be pushed upward by a restoring force source (e.g., rubber dome, polarity-repelling magnet pair, metal spring/dome) after the pressing is finished and no longer abuts the trigger switch electrode. For example, as shown in fig. 10, each set of support structures 522 may include rubber elastomers 523, scissor-foot structures 524, and connecting structures 525 commonly used for keyboards. When the key cap 510 is pressed, the rubber elastic body 523 is flattened, so that the convex column on the bottom surface of the rubber elastic body 523 abuts against and triggers the switch electrode below the rubber elastic body to be conducted. The scissor structures 524 may help support the keycap 510, thereby providing an even feedback force and improved feel. The connecting structure 525 is used to couple the scissor leg structure 524 to the bottom plate 530 below. However, any other suitable structure may be used, and is not limited thereto. Membrane switch layer 520 may have a plurality of openings 526, with each keycap 510 corresponding to at least one of the plurality of openings 526.

Please refer to fig. 8C, which is a diagram illustrating an optional bottom plate 530 of the light-emitting keyboard. The bottom plate 530 is disposed under the keycap 510. The bottom plate 530 has a plurality of openings 531, and each of the key caps 510 corresponds to at least one of the plurality of openings 531. Opening 531 may at least partially overlap opening 526 such that light emitted by light source lamp panel 540 travels upward without obstruction. As shown in the embodiment of fig. 10, the switching electrode layer 521 may be disposed on the bottom plate 530, and the light source lamp panel 540 (shown in fig. 8D) may be disposed under the bottom plate 530, which are separated from each other by the bottom plate 530. In addition, the connecting structure 525 may be a hook punched from the bottom plate 530 and folded upward and integrally formed with the bottom plate 530, as shown in fig. 10.

Please refer to fig. 8D, which is a diagram of a light source lamp panel 540 of the light-emitting keyboard. The light source lamp panel 540 may be a light source lamp panel according to any of the above embodiments, such as the light source lamp panel 100 or the light source lamp panel 300. The opening 531 and the opening 526 are partially overlapped, and the light source 560 on the light source lamp panel 540 is located below the overlapped portion of the opening 531 and the opening 526, so that light emitted by the light source can pass through the opening 531 (and the opening 526) and travel upwards to reach the keycap 510 without obstruction and with low loss. There may be one or more light sources 560 below corresponding to each keycap 510.

The substrate 541 of the light source lamp panel 540 has a long side 542, a first short side 543, and a second short side 544. As shown in fig. 8D, the light panel 540 may further have a flat cable tail 545. The flat cable tail 545 extends from the long side 542. The flat cable tail 545 has a plurality of extension wires 546 and a predetermined bending portion 547. The substrate 541 may be made of flexible material. The substrate 541 can be deflected by an external force at the position corresponding to the predetermined bending portion 547. The extension conductors 546 may be considered as extensions of the composite conductive trace layer 550 at the rear 545 of the flat cable. However, no matter the light source panel 100 or the light source panel 300 is used as the light source panel 540, the extension wires 546 are only formed of the metal reaction layer in the predetermined bending portion 547, and the metal conductive layer with low flexibility of the material itself does not extend into the predetermined bending portion 547. Thus, the metal conductive layer can be prevented from being broken by bending in the predetermined bending portion 547, which results in unstable current transmission quality of the extension wire 546.

As shown in fig. 8D, the composite conductive trace layer 550 may include a plurality of high-potential first conductive lines 551, a plurality of high-potential second conductive lines 552, a plurality of low-potential first conductive lines 556, and a plurality of low-potential second conductive lines 555. Herein, the high potential wire and the low potential wire may be understood as positive and negative electrode lines. According to some embodiments, the high potential first conductive wires 551 extend from the flat cable tail 545 to a position intermediate the first short side 543. The high-potential second wires 552 are connected to the high-potential first wires 551 at the middle of the first short side 543, and then the high-potential second wires 552 extend from the middle of the first short side 543 and extend to the vicinity of the pads 557 substantially parallel to the long side 542. The low potential second conductive lines 555 extend from the vicinity of the pad portions 557 substantially parallel to the long sides 542 to a position intermediate to the second short sides 544, and are connected to the low potential first conductive lines 556 at the position intermediate to the second short sides 544. The low potential first conductor 556 extends from a position intermediate the second short side 544 to the flat cable tail 545. The low-potential first conductive line 556 and the high-potential first conductive line 551 extend from opposite directions to the long side 542 and merge into at least a portion of the extension conductive line 546, that is, an extension of the composite conductive line layer 550 at the tail 545 of the flat cable. Referring to fig. 8D corresponding to fig. 8A, the rows of key caps 510 extend in a direction parallel to the long side 542, each row of key caps 510 is also parallel to the corresponding high-potential second conducting wire 552 and the corresponding low-potential second conducting wire 555, and in fig. 8A, the ends of the two sides of the rows of key caps 510 are flush with each other and are parallel to the first short side 543 and the second short side 544, respectively.

In some embodiments, as shown in fig. 8D, the high-voltage second conductive lines 552 have a plurality of S-shaped paths 552S respectively corresponding to the middle positions of the adjacent first short sides 543, and the lengths of the S-shaped paths 552S are different, so as to adjust the current passing through the high-voltage second conductive lines 552 to be substantially equal. In some embodiments, the low potential second conductive line 555 may also have a similar S-shaped path 555S. According to some embodiments, as shown in fig. 8D, the light source lamp panel 540 (specifically, the composite conductive circuit layer 550 thereof) may further have a plurality of high-potential third conductive lines 553 and a plurality of low-potential third conductive lines 554. Referring to fig. 9, each pad 557 has a positive electrode 558 and a negative electrode 559. The high potential third wire 553 and the low potential third wire 554 extend substantially parallel to the first short side 543. The high-voltage third wires 553 are electrically coupled to one of the high-voltage second wires 552 and the corresponding positive electrode 558 of the pad portion 557, respectively, and the low-voltage third wires 554 are electrically coupled to one of the low-voltage second wires 555 and the corresponding negative electrode 559 of the pad portion 557, respectively. It is understood that the configuration of the composite conductive circuit layer 550 is not limited thereto, and may be any configuration that is allowable for the light source lamp panel 540. For example, in a case where the space of the light source lamp panel 540 provides greater wiring flexibility, the second high-potential wires 552 and the second low-potential wires 555 may not extend substantially parallel to the long side 542. Compared with the conventional copper foil circuit substrate, because the resistance of the composite conductive circuit layer 550 disposed on the flexible polymer film substrate 541 is higher, the above-mentioned effect of several special circuit layouts in fig. 8D can avoid non-uniform current of the plurality of conductive lines (the plurality of high-potential first conductive lines 551, the plurality of high-potential second conductive lines 552, the plurality of low-potential first conductive lines 556, and the plurality of low-potential second conductive lines 555), and ensure that there is no obvious difference in current supplied to each light source 560.

Referring now to FIG. 9, in some embodiments, there are at least two light sources 560 below corresponding to each keycap 510. In order to provide electrical coupling for each light source 560, at least two of the high potential third wires 553, at least two of the low potential third wires 554, and at least two pad portions 557 may be disposed under each keycap 510. As shown in FIG. 9, at least two pad portions 557 are respectively disposed under two opposite sides of the center line 551M of the keycap 551, so that the bottom surfaces of the keycap 510 disposed on two opposite sides of the supporting structure 522 can receive illumination with appropriate intensity. Of course, the configuration of the light source and the corresponding composite conductive trace layer 550 is not limited thereto. For example, in some embodiments, the key caps 510 and support structures 522 are designed to keep the center area clear or transparent to light, which is sufficient to uniformly illuminate the entire key cap even if only one light source 560 is disposed under each key cap 510. The structural configuration of one type of light-emitting keyboard has been specifically understood by fig. 8A to 8D to 10. However, other types of illuminated keyboards may also be employed.

For example, as shown in fig. 10, in the above-mentioned light-emitting keyboard, the key cap 510, the supporting structure 522 of the membrane switch layer 520, the switch electrode layer 521 of the membrane switch layer 520, the bottom plate 530 and the light source lamp panel 540 are sequentially arranged from top to bottom, and the connecting structure 525 of the supporting structure 522 is a hook extending from the bottom plate 530 and folded upward and integrally formed with the bottom plate 530.

In other embodiments, as shown in fig. 11, the key cap 610, the supporting structure 622, the light source lamp panel 640, the switch electrode layer 621 and the bottom plate 630 may be sequentially arranged from top to bottom, and the connecting structure 625 of the supporting structure 622 is also a hook extending from the bottom plate 630 and integrally formed with the bottom plate 630. The difference between the light-emitting keyboard and the light-emitting keyboard shown in fig. 10 is the position of the light source lamp panel 640, and the light source lamp panel 640 is located above the switch electrode layer 621.

In the light-emitting keyboard according to still other embodiments, as shown in fig. 12, the key cap 710, the supporting structure 722, the switch electrode layer 721, the base plate 730 and the light source lamp panel 740 are sequentially arranged from top to bottom, and the connecting structure 725 of the supporting structure 722 is a connecting plastic member coupled to the base plate 730. The difference between this illuminated keyboard and the illuminated keyboard of fig. 10 is the design of the connection structure.

In the light-emitting keyboard according to still other embodiments, as shown in fig. 13, the key cap 810, the supporting structure 822, the light source lamp panel 840, the switch electrode layer 821 and the base plate 830 are sequentially arranged from top to bottom, and the connection structure 825 of the supporting structure 822 is a connection plastic member bonded to the switch electrode layer 821. The difference between the light-emitting keyboard and the light-emitting keyboard of fig. 12 lies in the location of the light source lamp panel 840 and the configuration of the connection structure 825, the light source lamp panel 840 is located above the switch electrode layer 821, and the connection structure 825 is coupled to the switch electrode layer 821 instead of the base plate 830.

In the light-emitting keyboard according to still other embodiments, as shown in fig. 14, the key cap 910, the support structure 922, the switch electrode layer 921, the light source lamp panel 940 and the bottom plate 930 are sequentially arranged from top to bottom, and the connection structure 925 of the support structure 922 is a connection plastic member coupled to the switch electrode layer 921. The difference between the light-emitting keyboard and the light-emitting keyboard of fig. 13 is the position of the light source lamp panel 940, and the light source lamp panel 940 is located between the switch electrode layer 921 and the bottom plate 930.

In any case, in the light emitting keyboard according to the embodiment, a light source is disposed under each key cap, so that light emission uniformity can be ensured. In addition, because the light source lamp panel is used for emitting light, compared with a light-emitting keyboard using a backlight module with a light guide plate, the thickness of the keyboard can be further reduced, and the power consumption can be reduced.

According to some embodiments of the present invention, a single layer or multiple layers may be further disposed between the metal conductive layer 126 and the light source 140, as shown in fig. 15 to 17.

Fig. 15 is a schematic view of a light source lamp panel 400 according to another embodiment, which illustrates a light source lamp panel 400 similar to the light source lamp panel 100 of fig. 1A to 1C, and the difference between the two is that a metal alloy layer 427 is further disposed between the metal conductive layer 126 and the light source 140, and other parts that are the same or similar will not be described again.

Referring to fig. 15, the light source lamp panel 400 includes a substrate 110, a metal reaction layer 125, a metal conductive layer 126, a metal alloy layer 427, a light source 140, a first protection layer 130, and a second protection layer 150. The metal reaction layer 125, the metal conductive layer 126, the metal alloy layer 427, and the light source 140 are sequentially stacked on the substrate 110. The first protection layer 130 is disposed on the metal conductive layer 126. The second protective layer 150 is disposed on the first protective layer 130, the metal alloy layer 427, and the light source 140. The metal alloy layer 427 and the light source 140 are overlapped with each other in a direction perpendicular to the substrate 110. In one embodiment, the width W1 of the metal alloy layer 427 vertically projected on the substrate 110 may be greater than the width W2 of the light source 140 vertically projected on the substrate 110 and less than the width of the metal conductive layer 126 vertically projected on the substrate 110. The metal alloy layer 427 may be a tin-bismuth type alloy (Sn-Bi type alloy), a tin-silver-copper type alloy (Sn-Ag-Cu type alloy), or other suitable material, i.e., the metal alloy layer 427 may be a tin-bismuth type alloy (Sn-Bi type alloy) layer, a tin-silver-copper type alloy (Sn-Ag-Cu type alloy) layer, or other suitable material layer. The tin-bismuth type alloy is, for example, tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) or tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N), i.e., the tin-bismuth type alloy layer is, for example, a tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) alloy layer or a tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N) alloy layer. The tin-silver-copper type alloy layer is, for example, a tin-silver-copper (Sn-Ag-Cu) alloy layer.

Since the metal conductive layer 126 and the light source 140 are not in direct contact in this embodiment, the metal conductive layer 126 and the light source 140 are electrically connected by the metal alloy layer 427. Compared with the embodiment in which the metal conductive layer 126 is directly contacted with the light source 140, the metal alloy layer 427 has better surface bonding strength with the light source 140 at the process temperature below 200 ℃, and the metal alloy layer 427 has good oxidation capability, so that the surface of the metal alloy layer 427 is easily oxidized and atomized, thereby improving the overall oxidation resistance, and being most suitable for the outermost layer of each metal layer. Further, the light source lamp panel 400 of the present embodiment may include 12 different examples (examples 1-1 to 1-12) as shown in the following table i, wherein the metal reaction layer 125, the metal conductive layer 126 and the metal alloy layer 427 are respectively selected from specific materials. Since the metal reaction layer 125, the metal conductive layer 126 and the metal alloy layer 427 are respectively selected from specific materials in the following examples, the matching between the layers is optimized by the fixed material configuration between the layers, and the mass production is facilitated. Further, it should be understood that the present embodiments may be incorporated into any of the embodiments described herein.

Watch 1

Example	Metallic reaction layer	Metal conductive layer	Metal alloy layer
				1-1	Silver paste	Copper (Cu)	Tin-bismuth type alloy
1-2	Silver paste	Nickel (II)	Tin-bismuth type alloy
				1-3	Silver paste	Silver (Ag)	Tin-bismuth type alloy
1-4	Copper paste	Copper (Cu)	Tin-bismuth type alloy
				1-5	Copper paste	Nickel (II)	Tin-bismuth type alloy
1-6	Copper paste	Silver (Ag)	Tin-bismuth type alloy
				1-7	Silver paste	Copper (Cu)	Tin-silver-copper type alloy
1-8	Silver paste	Nickel (II)	Tin-silver-copper type alloy
				1-9	Silver paste	Silver (Ag)	Tin-silver-copper type alloy
1-10	Copper paste	Copper (Cu)	Tin-silver-copper type alloy
				1-11	Copper paste	Nickel (II)	Tin-silver-copper type alloy
1-12	Copper paste	Silver (Ag)	Tin-silver-copper type alloy

Fig. 16 is a schematic view of a light source lamp panel 500 according to still other embodiments, which illustrates a light source lamp panel 500 similar to the light source lamp panel 400 in fig. 15, except that a first metal protection layer 528 is further disposed between the metal conductive layer 126 and the metal alloy layer 527, and other parts that are the same or similar will not be described again.

Referring to fig. 16, the light source lamp panel 500 includes a substrate 110, a metal reaction layer 125, a metal conductive layer 126, a first metal protection layer 528, a metal alloy layer 527, a light source 140, a first protection layer 130, and a second protection layer 150. The metal reaction layer 125, the metal conductive layer 126, the first metal protection layer 528, the metal alloy layer 527, and the light source 140 are sequentially stacked on the substrate 110. The first protection layer 130 is disposed on the metal conductive layer 126. The second protective layer 150 is disposed on the first protective layer 130, the metal alloy layer 527, and the light source 140. The metal alloy layer 527 may be a tin-bismuth type alloy (Sn-Bi type alloy), a tin-silver-copper type alloy (Sn-Ag-Cu type alloy), or other suitable materials, that is, the metal alloy layer 527 may be a tin-bismuth type alloy (Sn-Bi type alloy), a tin-silver-copper type alloy (Sn-Ag-Cu type alloy), or other suitable material layer. The tin-bismuth type alloy layer is, for example, a tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) alloy layer or a tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N) alloy layer. The tin-silver-copper type alloy layer is, for example, a tin-silver-copper (Sn-Ag-Cu) alloy layer. The material of the first metal protection layer 528 may be gold, nickel or other suitable materials, i.e. the first metal protection layer 528 may be gold, nickel or other suitable materials, which can provide high hardness.

Compared to the embodiment of the light source lamp panel 400, since the first metal protection layer 528 is further disposed between the metal conductive layer 126 and the metal alloy layer 527 in the light source lamp panel 500 of the embodiment, better stability and chemical resistance can be provided, the structure below can be protected, and the reaction with the external air is less likely to occur. Further, the light source lamp panel 500 of the present embodiment may include 20 different examples (examples 2-1 to 2-20) as shown in the following table two, wherein the metal reaction layer 125, the metal conductive layer 126, the first metal protection layer 528 and the metal alloy layer 527 are respectively selected from specific materials. Since the metal reactive layer 125, the metal conductive layer 126, the first metal protection layer 528 and the metal alloy layer 527 are respectively selected from specific materials in the following examples, the matching between the layers is optimized by the fixed material configuration between the layers, and the mass production is facilitated. Further, it should be understood that the present embodiments may be incorporated into any of the embodiments described herein.

Watch two

Fig. 17 is a schematic view of a light source lamp panel 600 according to still other embodiments, which illustrates a light source lamp panel 600 similar to the light source lamp panel 500 in fig. 16, except that a second metal protection layer 629 is further disposed between the metal alloy layer 627 and the first metal protection layer 628, and other parts that are the same or similar will not be described again.

Referring to fig. 17, the light source lamp panel 600 includes a substrate 110, a metal reaction layer 125, a metal conductive layer 126, a first metal passivation layer 628, a second metal passivation layer 629, a metal alloy layer 627, a light source 140, a first passivation layer 130, and a second passivation layer 150. The metal reaction layer 125, the metal conductive layer 126, the first metal passivation layer 628, the second metal passivation layer 629, the metal alloy layer 627 and the light source 140 are sequentially stacked on the substrate 110. The first protection layer 130 is disposed on the metal conductive layer 126. The second protective layer 150 is disposed on the first protective layer 130, the metal alloy layer 627 and the light source 140. The metal alloy layer 627 may be a tin-bismuth type alloy (Sn-Bi type alloy), a tin-silver-copper type alloy (Sn-Ag-Cu type alloy), or another suitable material, that is, the metal alloy layer 627 may be a tin-bismuth type alloy (Sn-Bi type alloy), a tin-silver-copper type alloy (Sn-Ag-Cu type alloy), or another suitable material layer. The tin-bismuth type alloy layer is, for example, a tin-57 bismuth-1.0 silver (Sn-57Bi-1.0Ag) alloy layer or a tin-bismuth-antimony-nitrogen (Sn-Bi-Sb-N) alloy layer. The tin-silver-copper type alloy layer is, for example, a tin-silver-copper (Sn-Ag-Cu) alloy layer. The material of the first metal protection layer 628 may be nickel or other suitable materials, i.e., the first metal protection layer 628 may be a nickel layer or other suitable materials, which provides high hardness, stability and chemical resistance. The second metal passivation layer 629 may be made of gold or other suitable material, i.e., the second metal passivation layer 629 may be made of gold or other suitable material, which can increase corrosion resistance, oxidation resistance and chemical resistance. The second metal passivation layer 629 is closer to a light source and more easily contacts the outside air than the first metal passivation layer 628, so the oxidation resistance of the second metal passivation layer 629 may be higher than that of the first metal passivation layer 628.

Compared with the embodiment of the light source lamp panel 500, the light source lamp panel 600 of the embodiment has two metal protection layers (i.e., the first metal protection layer 628 and the second metal protection layer 629), which can provide better corrosion resistance, oxidation resistance and chemical resistance, protect the underlying structure, prevent the underlying structure from being corroded by chemical agents, and is less prone to reacting with the outside air. Further, the light source panel 600 of the present embodiment may include 8 different examples (examples 3-1 to 3-8) as shown in the following table three, wherein the metal reaction layer 125, the metal conductive layer 126, the first metal passivation layer 628, the second metal passivation layer 629, and the metal alloy layer 627 are respectively selected from specific materials. Since the metal reactive layer 125, the metal conductive layer 126, the first metal protection layer 528 and the metal alloy layer 527 are respectively selected from specific materials in the following examples, the matching between the layers is optimized by the fixed material configuration between the layers, and the mass production is facilitated. Further, it should be understood that the present embodiments may be incorporated into any of the embodiments described herein.

Watch III

In the light source lamp panel according to an embodiment of the invention, the metal alloy layer is located between the metal conductive layer and the light source, so that compared with an embodiment without the metal alloy layer between the metal conductive layer and the light source, the surface bonding strength of the light source below 200 ℃ can be enhanced, and better oxidation resistance can be provided. In addition, each layer (such as the metal reaction layer, the metal conductive layer, the first metal protection layer, the second metal protection layer or the metal alloy layer) of the light source lamp panel of the invention is made of a specific material, and by the fixed material configuration among the layers, the layers can have the best matching performance, and the light source lamp panel is beneficial to mass production.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims. The scope of the invention is therefore to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.