阅读说明：本技术 一种5g线路板隔膜垫层纸的制造方法及5g线路板隔膜垫层纸 (Manufacturing method of 5G circuit board diaphragm cushion paper and 5G circuit board diaphragm cushion paper ) 是由 乐名菊 董超 史梦华 朱宏伟 何江林 周金涛 李丹 谭桂香 于 2021-10-18 设计创作，主要内容包括：本发明公开了一种5G线路板隔膜垫层纸的制造方法,包括以下步骤：选取原材料：选取50％～60％的针叶木片、20％～30％的阔叶木片和10％～20％的竹片；蒸煮制浆：将选取的原材料混合后进行蒸煮,得到浆料；打浆：将制好的浆料进行打浆；添加辅料：于浆料上浆系统冲浆泵入口添加阻燃剂体系,添加量为绝干浆量的15－20％；上网成型；压榨；干燥；压光；卷取。本发明提供的5G线路板隔膜垫层纸的制造方法,使用原材料易得且成本低,具耐280－320℃高温的耐热性能、良好的平整性、良好的透气性和吸收性。(The invention discloses a method for manufacturing 5G circuit board diaphragm cushion paper, which comprises the following steps: selecting raw materials: selecting 50-60% of softwood chips, 20-30% of broadleaf wood chips and 10-20% of bamboo chips; cooking for pulping: mixing the selected raw materials, and then cooking to obtain slurry; pulping: pulping the prepared pulp; adding auxiliary materials: adding a flame retardant system at the inlet of a pulp flushing pump of a pulp sizing system, wherein the addition amount is 15-20% of the absolute dry pulp amount; molding on the net; squeezing; drying; calendering; and (4) coiling. The manufacturing method of the 5G circuit board diaphragm cushion paper provided by the invention has the advantages of easily available raw materials, low cost, heat resistance for resisting high temperature of 280-320 ℃, good smoothness, good air permeability and good absorbability.)

1. A manufacturing method of 5G circuit board diaphragm cushion paper is characterized by comprising the following steps:

selecting raw materials: selecting 50-60% of softwood chips, 20-30% of broadleaf wood chips and 10-20% of bamboo chips;

cooking for pulping: mixing the selected raw materials, and then cooking to obtain slurry;

pulping: pulping the prepared pulp;

adding auxiliary materials: adding a flame retardant system at the inlet of a pulp flushing pump of a pulp sizing system, wherein the addition amount is 15-20% of the absolute dry pulp amount;

molding on the net; squeezing; drying; calendering; and (4) coiling.

2. The manufacturing method of the 5G circuit board diaphragm cushion paper, as claimed in claim 1, wherein in the cooking pulping step, a sulfate cooking method is used, and the ratio of cooking liquor is 1: 3.5 to 4.0 percent, the vulcanization degree is 22 percent, the alkali consumption is 20 to 22 percent, the addition amount of the cooking auxiliary agent is 0.015 percent of the absolute dry pulp amount, the cooking time is 220min, the highest cooking temperature is 180 ℃ at 166 ℃, the heat preservation time is 40 to 60min after the heating is stopped, and the cooking calorie value is 35 to 43.

3. The manufacturing method of the 5G circuit board separator backing paper as claimed in claim 1, wherein a resin control agent is further added in the cooking pulping step, and the dosage of the resin control agent is 0.03% of absolute dry pulp.

4. The manufacturing method of the 5G circuit board diaphragm cushion paper as claimed in claim 1, wherein in the cooking pulping step, a sulfate method is used for pulping, in the pulping process, the cooked material is bleached and cleaned by oxygen delignification hydrogen peroxide, and the pulping whiteness is 28-32% ISO and the kappa number is 35-43.

5. The manufacturing method of 5G circuit board diaphragm cushion paper as claimed in claim 1, wherein three mills are used in the beating step for beating in series, the power of the mill is 250-320 KKWH, the beating concentration is 3.5-4%, and the beating degree of the pulp is 16-20 SR.

6. The manufacturing method of the 5G circuit board diaphragm backing paper according to claim 1, wherein the flame retardant system added in the step of adding auxiliary materials is a melamine cyanurate and cationic polyacrylamide flame retardant system.

7. The method for manufacturing the 5G circuit board diaphragm cushion paper as claimed in claim 1, wherein in the step of forming the upper mesh, the concentration of the upper mesh slurry is 0.3% -0.6%, the pH value of the upper mesh is 7.5-9.0, the mesh speed is 350m/min, and the opening of the lip plate is 30-40 mm.

8. The manufacturing method of 5G circuit board diaphragm cushion paper, as claimed in claim 1, wherein in the pressing step, the first pressing line pressure is 40-60 KN/m, the second pressing line pressure is 45-55 kN/m, the third pressing line pressure is 35-55 kN/m, and the fourth pressing line pressure is 40-60 kN/m.

9. A5G circuit board diaphragm cushion paper, which is characterized by being manufactured by the manufacturing method of the 5G circuit board diaphragm cushion paper of any one of claims 1 to 8.

Technical Field

The invention relates to the technical field of papermaking, in particular to a manufacturing method of 5G circuit board diaphragm cushion paper and the 5G circuit board diaphragm cushion paper.

Background

With the 5G technology being widely used in the electronic field, higher requirements are placed on the production temperature of the electronic industrial circuit board, and higher requirements are placed on cushion layer materials used in the hot-press forming of the copper-clad plate and the insulating plate for the electronic industrial circuit board, so that the manufacturing and product quality of the circuit board are ensured. The temperature which the cushion layer diaphragm material used in the production of the 5G circuit board can endure is increased from the original high temperature of 190-320 ℃ to 280-320 ℃, and the performance is kept relatively stable in the 2-hour environment of 280-320 ℃; the appearance of the product needs to have better cleanliness, and the product does not corrode and pollute the circuit board in use. The cushion layer material used in the production of the electronic industry circuit board in the prior art can only be used in the environment of 190-250 ℃ and cannot meet the production requirement of the 5G circuit board at present. Therefore, the technical problem to be solved in the field is to find a high-temperature-resistant separator backing paper.

Disclosure of Invention

In order to solve the technical problems, the invention provides a manufacturing method of 5G circuit board diaphragm cushion paper and the 5G circuit board diaphragm cushion paper, which have the advantages of easily obtained raw materials, low cost, heat resistance for resisting high temperatures of 280 and 320 ℃, good smoothness, good air permeability and good absorptivity.

A manufacturing method of 5G circuit board diaphragm cushion paper is characterized by comprising the following steps:

selecting raw materials: selecting 50-60% of softwood chips, 20-30% of broadleaf wood chips and 10-20% of bamboo chips;

cooking for pulping: mixing the selected raw materials, and then cooking to obtain slurry;

pulping: pulping the prepared pulp;

adding auxiliary materials: adding a flame retardant system at the inlet of a pulp flushing pump of a pulp sizing system, wherein the addition amount is 15-20% of the absolute dry pulp amount;

molding on the net; squeezing; drying; calendering; and (4) coiling.

In the above manufacturing method of 5G circuit board diaphragm backing paper, preferably, in the cooking pulping step, a sulfate cooking method is used, and the ratio of cooking liquor is 1: 3.5 to 4.0 percent, the vulcanization degree is 22 percent, the alkali consumption is 20 to 22 percent, the addition amount of the cooking auxiliary agent is 0.015 percent of the absolute dry pulp amount, the cooking time is 220min, the highest cooking temperature is 180 ℃ at 166 ℃, the heat preservation time is 40 to 60min after the heating is stopped, and the cooking calorie value is 35 to 43.

In the above manufacturing method of 5G circuit board separator cushion paper, preferably, in the cooking pulping step, a resin control agent is further added, and the use amount of the resin control agent is 0.03% of oven-dry pulp amount.

Preferably, in the cooking pulping step, the pulp is prepared by a sulfate method, in the pulping process, the cooked material is bleached and cleaned by oxygen delignification hydrogen peroxide, the pulp whiteness is 28-32% ISO, and the kappa number is 35-43.

In the manufacturing method of the 5G circuit board diaphragm cushion paper, preferably, three mills are used in the beating step for beating in series, the power of the mill is 250-320 KKWH, the beating concentration is 3.5-4%, and the beating degree of the slurry is 16-20 SR.

In the manufacturing method of the 5G circuit board diaphragm cushion paper, preferably, the flame retardant system added in the step of adding the auxiliary materials is a melamine cyanurate flame retardant system and a cationic polyacrylamide flame retardant system.

In the above manufacturing method of the 5G circuit board diaphragm cushion paper, preferably, in the step of forming the upper mesh, the concentration of the upper mesh slurry is 0.3% -0.6%, the pH value of the upper mesh is 7.5-9.0, the mesh speed is 250-350 m/min, and the opening of the lip plate is 30-40 mm.

In the manufacturing method of the 5G circuit board diaphragm cushion paper, preferably, in the pressing step, the first line pressing pressure is 40-60 KN/m, the second line pressing pressure is 45-55 kN/m, the third line pressing pressure is 35-55 kN/m, and the fourth line pressing pressure is 40-60 kN/m;

the 5G circuit board diaphragm cushion paper is characterized by being manufactured by any one of the manufacturing methods of the 5G circuit board diaphragm cushion paper.

The invention has the beneficial effects that: the invention provides a manufacturing method of 5G circuit board processing diaphragm cushion paper, wherein the strength of the used bamboo sheet fiber is between needle leaf pulp and straw pulp, the bamboo is annual plant, the material source is wide, the prepared sulfate chemical pulp has good high temperature resistance, the cost of production raw materials can be reduced after the pulp is used, and the high temperature resistance of the finished paper is improved. The raw materials are easy to obtain and low in cost, and the flame-retardant system is added, so that the manufactured 5G circuit board processing diaphragm cushion paper has the heat resistance of resisting the high temperature of 280 plus 320 ℃, good smoothness, good air permeability and good absorbability, and can completely meet the requirement of the cushion layer material of the heat insulation buffer of the existing 5G electronic industry printed circuit board. The 5G circuit board processing diaphragm cushion paper provided by the invention has the same functions and effects as the finished product manufactured by the manufacturing method of the 5G circuit board processing diaphragm cushion paper provided by the invention.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments.

All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the invention provides a method for manufacturing 5G circuit board diaphragm cushion paper, which comprises the following steps:

selecting raw materials: selecting 50-60% of softwood chips, 20-30% of broadleaf wood chips and 10-20% of bamboo chips;

cooking for pulping: mixing the selected raw materials, and then cooking to obtain slurry;

pulping: pulping the prepared pulp;

adding auxiliary materials: adding a flame retardant system at the inlet of a pulp flushing pump of a pulp sizing system, wherein the addition amount is 15-20% of the absolute dry pulp amount;

molding on the net; squeezing; drying; calendering; and (4) coiling.

According to the manufacturing method of the 5G circuit board processing diaphragm cushion paper, the strength of the used bamboo sheet fiber is between that of needle pulp and straw pulp, the bamboo is an annual plant and is wide in material source, the prepared sulfate chemical pulp has good high temperature resistance, the cost of production raw materials can be reduced after the sulfate chemical pulp is used, and the high temperature resistance of finished paper is improved. The raw materials are easy to obtain and low in cost, and the flame-retardant system is added, so that the manufactured 5G circuit board processing diaphragm cushion paper has the heat resistance of resisting the high temperature of 280 plus 320 ℃, good smoothness, good air permeability and good absorbability, and can completely meet the requirement of the cushion layer material of the heat insulation buffer of the existing 5G electronic industry printed circuit board.

According to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, in the step of cooking pulping, a sulfate cooking method is used, and the ratio of cooking liquor is 1: 3.5 to 4.0 percent, the vulcanization degree is 22 percent, the alkali consumption is 20 to 22 percent, the addition amount of the cooking auxiliary agent is 0.015 percent of the absolute dry pulp amount, the cooking time is 220min, the highest cooking temperature is 180 ℃ at 166 ℃, the heat preservation time is 40 to 60min after the heating is stopped, and the cooking calorie value is 35 to 43.

According to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, in the step of cooking pulping, a resin control agent is further added, and the using amount of the resin control agent is 0.03% of the absolute dry pulp amount. Because the sizing agent contains a certain amount of stickies, the addition of the resin control agent in the stock tower can reduce the content of the stickies in the sizing agent,

according to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, in the cooking pulping step, a sulfate method is used for pulping, in the pulping process, the cooked material is bleached and cleaned by oxygen delignification hydrogen peroxide, the pulp whiteness is 28-32% ISO, and the kappa number is 35-43.

According to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, three mills are used in the beating step for beating in series, the power of the mills is 250-320 KWH, the beating concentration is 3.5-4.0%, and the beating degree of the pulp is 16-20 DEG SR. Beating is mainly based on fluffing and brooming, and the principle requires less cutting.

According to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, the flame retardant system added in the step of adding the auxiliary materials is a melamine cyanurate and cationic polyacrylamide flame retardant system. Except the flame-retardant system, no other auxiliary materials and no sizing agent are added. Wherein the cationic polyacrylamide can also ensure that the melamine cyanurate can be more and better retained in the system.

In the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, in the step of forming the upper mesh, the concentration of the upper mesh slurry is 0.3-0.6%, the pH value of the upper mesh is 7.5-9.0, the mesh speed is 250-350 m/min, and the opening of the lip plate is 30-40 mm.

According to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, in the pressing step, the first pressing line pressure is 40-60 KN/m, the second pressing line pressure is 45-55 KN/m, the third pressing line pressure is 35-55 KN/m, and the fourth pressing line pressure is 40-60 KN/m.

According to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, in the drying step, the drying steam inlet pressure is as follows: two groups of 220-250 KPa, three groups of 280-350 KPa, four groups of 350-400 KPa, five groups: 300 and 350 KPa.

According to the manufacturing method of the 5G circuit board diaphragm cushion paper provided by the embodiment of the invention, preferably, in the calendaring step, the calendaring machine does not pressurize.

The invention also provides 5G circuit board diaphragm cushion paper which is manufactured by the manufacturing method of the 5G circuit board diaphragm cushion paper.

According to the 5G circuit board processing diaphragm cushion paper provided by the embodiment of the invention, bamboo chips are used as raw materials, the fiber strength of the bamboo chips is between that of needle blade pulp and straw pulp, the bamboo is an annual plant and is wide in material source, the prepared sulfate chemical pulp has good high-temperature resistance, the cost of production raw materials can be reduced after the sulfate chemical pulp is used, and the high-temperature resistance of finished paper is improved. The raw materials are easy to obtain and low in cost, and the flame-retardant system is added, so that the heat-resistant performance of the heat-insulating buffer for the printed circuit board in the 5G electronic industry can be realized, the smoothness is good, the air permeability and the absorptivity are good, and the requirements of the cushion layer material for the heat-insulating buffer of the printed circuit board in the current 5G electronic industry can be completely met.

Specific examples are provided below.

Example 1

Firstly, 20 percent of bamboo chips, 30 percent of broad wood chips and 50 percent of coastal pine chips in percentage by weight are sent into a storage bin for mixing after dust removal, slag removal and cleaning, and are sent into a digester for pulping by a sulfate process after being mixed evenly. The pulping process comprises the following steps: the liquid ratio is 1: 3.7 percent of vulcanization degree, 22 percent of alkali consumption, 0.015 percent of cooking assistant and effective cooking time of 180min, wherein the hardness of the obtained pulp is 39 kappa number, and the pulp is subjected to oxygen delignification and H₂O₂The whiteness of the primary pulp prepared after bleaching and washing is 31 percent ISO, the pulp after being cleaned is diluted by clear water and sent to a pulp storage tower, and a resin control agent is added into the pulp storage tower according to the amount of 0.03 percent (absolute dry pulp amount). Diluting the pulp with clear water, delivering the diluted pulp to a pulp tank before beating of a paper machine at a concentration of 4.2%, serially pulping by 3 conical mills, wherein the pulping electric power is 252KWH, 258KWH and 300KWH respectively, the pulping concentration is 3.8%, the beating degree of the obtained pulp is 18 DEG SR, delivering the beaten pulp to a pulp tank after beating, delivering the diluted pulp to a pulp forming tank by using the paper sample white water, delivering the diluted pulp to a sizing system by a pulp flushing pump, and delivering the pulp to a sizing system by a sizing pumpAdding a Melamine Cyanurate (MCA) and a Cationic Polyacrylamide (CPAM) flame-retardant system by a metering pump according to 18 percent (absolute dry stock quantity) at the inlet of a fan pump; and (3) after the slurry is screened by a sizing system, making, forming, drying and reeling are carried out to obtain the 5G circuit board diaphragm cushion paper.

The 5G circuit board diaphragm cushion paper produced by the process has the main indexes that: a basis weight of 158g/m 2, a whiteness of 29% ISO, a moisture of 6.0%, and a firmness of 0.65g/cm³The surface is smooth, the smoothness is controlled to be 4-6S, and no paper wool exists; the air permeability is more than or equal to 6.0 mu m/Pa.s, the high temperature resistance is good, and the carbonization phenomenon is avoided after the treatment for 2 hours at the high temperature of 300 ℃; the water-soluble chloride content is 99mg/kg, the water-soluble sulfate content is 132mg/kg, and the requirements of the current 5G electronic industry printed circuit board cushion material are completely met.

Example 2

Firstly, 20 weight percent of bamboo chips, 25 weight percent of broad miscellaneous wood chips and 55 weight percent of coastal pine chips are subjected to dust removal, slag removal and cleaning, then are conveyed into a storage bin to be mixed, and after uniform mixing, are conveyed into a digester to be pulped by a sulfate method. The pulping process comprises the following steps: the liquid ratio is 1: 3.8 percent, 22 percent of vulcanization degree, 21.5 percent of alkali consumption, 0.015 percent of cooking aid and 160min of effective cooking time, the hardness of the obtained pulp is 41 kappa number, and the pulp is subjected to oxygen delignification and H delignification₂O₂The whiteness of the primary pulp prepared after bleaching and washing is 32 percent ISO, the pulp after being cleaned is diluted by clear water and sent to a pulp storage tower, and a resin control agent is added into the pulp storage tower according to the amount of 0.03 percent (absolute dry pulp amount). Diluting the pulp with clean water, conveying the pulp to a pulp tank before tapping of a paper machine at a concentration of 4.2%, serially pulping by 3 cone mills, wherein the pulping electric power is 254KWH, 254KWH and 295KWH respectively, the pulping concentration is 3.7%, the beating degree of the obtained pulp is 17 DEG SR, conveying the pulp after tapping to a pulp tank after tapping, conveying the diluted pulp with paper sample white water to a pulp forming tank, conveying the diluted pulp to a sizing system by a sizing pump, and adding a Melamine Cyanurate (MCA) and a Cationic Polyacrylamide (CPAM) flame-retardant system at the inlet of the sizing pump by a metering pump according to 20% (absolute dry pulp quantity); and (3) after the pulp is screened by a sizing system, making, forming, drying and reeling to obtain the 5G diaphragm cushion paper.

The obtained 5G circuit board diaphragm cushion paper produced by the processThe main indexes are as follows: quantitative determination of 156g/m ²Whiteness of 30% ISO, moisture of 6.0%, tightness of 0.64g/cm³The surface is smooth, the smoothness is controlled to be 4-6 s, and no paper wool exists; the air permeability is more than or equal to 6.4 mu m/Pa.s, the high temperature resistance is good, and the carbonization phenomenon is avoided after the treatment for 2 hours at the high temperature of 300 ℃; the water-soluble chloride content is 95mg/kg, the water-soluble sulfate content is 136mg/kg, and the requirements of the current 5G electronic industry printed circuit board cushion material are completely met.

Example 3

Firstly, 15 percent of bamboo chips, 20 percent of broad wood chips and 60 percent of coastal pine chips are dedusted, deslagged and cleaned, then are mixed in a storage bin, and are sent to a digester for pulping by a sulfate process after being uniformly mixed. The pulping process comprises the following steps: the liquid ratio is 1: 4.0 percent, 22 percent of vulcanization degree, 20.5 percent of alkali consumption, 0.015 percent of cooking aid and 170min of effective cooking time, and the hardness of the obtained slurry is 38 kappa number. Then delignified by oxygen₂O₂The whiteness of the primary pulp prepared after bleaching and washing is 31 percent ISO, the pulp after being cleaned is diluted by clear water and sent to a pulp storage tower, and a resin control agent is added into the pulp storage tower according to the amount of 0.03 percent (absolute dry pulp amount). Diluting the pulp with clear water, conveying the pulp to a pulp tank before tapping of a paper machine at a concentration of 4.3%, serially pulping by 3 cone mills, wherein the pulping electric power is 250KWH, 256KWH and 290KWH respectively, the pulping concentration is 3.8%, the beating degree of the obtained pulp is 18 DEG SR, conveying the pulp after tapping to a pulp tank after tapping, conveying the diluted pulp with paper sample white water to a pulp forming tank, conveying the diluted pulp to a sizing system by a sizing pump, and adding a Melamine Cyanurate (MCA) and a Cationic Polyacrylamide (CPAM) flame-retardant system at the inlet of the sizing pump by a metering pump according to 20% (absolute dry pulp quantity); and (3) after the pulp is screened by a sizing system, making, forming, drying and reeling to obtain the 5G diaphragm cushion paper.

The 5G circuit board diaphragm cushion paper produced by the process has the main indexes that: quantitative 158g/m²Whiteness of 29% ISO, moisture of 6.5%, tightness of 0.63g/cm³The surface is smooth, the smoothness is controlled to be 4-6 s, and no paper wool exists; the air permeability is more than or equal to 6.3 mu m/Pa.s, the high temperature resistance is good, and the carbonization phenomenon is avoided after the treatment for 2 hours at the high temperature of 300 ℃; the content of water-soluble chloride is 98mg/kg, the content of water-soluble sulfate is 130mg/kg, and the process is finishedThe material can meet the requirement of the current 5G electronic industry printed circuit board cushion material.

Comparative example 1

Firstly, 28 percent of broad miscellaneous wood chips and 72 percent of coastal pine wood chips are mixed to form mixed wood chips, the mixed wood chips are sent into a storage bin to be mixed after dust removal, deslagging and cleaning, and the mixed wood chips are sent into a digester to be pulped by a sulfate process after being uniformly mixed. The pulping process comprises the following steps: the liquid ratio is 1: 3.7, 22 percent of vulcanization degree, 22 percent of alkali consumption, 0.015 percent of cooking auxiliary agent and 178min of effective cooking time, the hardness of the obtained pulp is 38 kappa number, and the pulp is subjected to oxygen delignification and H₂O₂The whiteness of the primary pulp prepared after bleaching and washing is 30 percent ISO, the pulp after being cleaned is diluted by clear water and sent to a pulp storage tower, and a resin control agent is added into the pulp storage tower according to the amount of 0.03 percent (absolute dry pulp amount). Diluting the pulp with clear water, conveying the pulp to a pulp tank before beating of a paper machine at a concentration of 4.1%, carrying out serial beating by 3 conical mills, wherein the beating electric power is 250KWH, 252KWH and 298KWH respectively, the beating concentration is 3.6%, the beating degree of the obtained pulp is 17 DEG SR, conveying the beaten pulp to a pulp tank after beating, conveying the pulp diluted by paper machine white water to a pulp forming tank, and conveying the pulp to a sizing system by a pulp flushing pump; and (3) after the slurry is screened by a sizing system, making, forming, drying and reeling are carried out to obtain the 5G circuit board diaphragm cushion paper.

The 5G circuit board diaphragm cushion paper produced by the process has the main indexes that: quantitative 158g/m ²Whiteness of 29% ISO, moisture of 5.9%, tightness of 0.64g/cm³The surface is smooth, the smoothness is controlled to be 4-6S, and no paper wool exists; the air permeability is more than or equal to 6.2 mu m/Pa.s, but the high temperature resistance is poor, and the obvious carbonization phenomenon can occur when the glass is treated at the high temperature of 300 ℃ for 2 hours; can not meet the requirement of the prior 5G electronic industry printed circuit board cushion material.

The manufacturing method of the 5G circuit board diaphragm cushion paper and the 5G circuit board diaphragm cushion paper provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.