阅读说明：本技术 一种有机薄膜晶体管及其制备方法 (Organic thin film transistor and preparation method thereof ) 是由 聂国政 李德琼 陈智全 许辉 于 2021-09-17 设计创作，主要内容包括：本发明涉及一种有机薄膜晶体管,其包括混合层,其中,所述混合层从下至上依次包括半导体下层、氧化铜层和半导体上层；所述半导体下层和半导体上层为相同或不同的半导体材料。本发明所提出的含有氧化铜层的有机薄膜晶管,能够有效地调节有机薄膜晶体管阈值电压。这种调控方式无需依赖复杂的半导体掺杂和绝缘层表面修饰技术,是工艺简单,更适合商业应用的技术。(The invention relates to an organic thin film transistor, which comprises a mixed layer, wherein the mixed layer sequentially comprises a lower semiconductor layer, a copper oxide layer and an upper semiconductor layer from bottom to top; the semiconductor lower layer and the semiconductor upper layer are made of the same or different semiconductor materials. The organic thin film transistor containing the copper oxide layer can effectively adjust the threshold voltage of the organic thin film transistor. The regulation and control mode does not need to depend on complex semiconductor doping and insulating layer surface modification technology, and is simple in process and more suitable for commercial application.)

1. An organic thin film transistor comprising a mixed layer,

wherein the content of the first and second substances,

the mixed layer sequentially comprises a semiconductor lower layer, a copper oxide layer and a semiconductor upper layer from bottom to top;

the semiconductor lower layer and the semiconductor upper layer are made of the same or different semiconductor materials.

2. The organic thin film transistor according to claim 1, wherein the copper oxide layer has a thickness of 1 to 3 nm.

3. The organic thin film transistor according to claim 1, wherein the structure of the organic thin film transistor comprises, from bottom to top: the semiconductor device includes a gate electrode, an insulating layer, a mixed layer, and source and drain electrodes.

4. The organic thin film transistor according to claim 3, wherein the insulating layer is selected from a polymer-based insulating material or an inorganic-based insulating material.

5. The organic thin film transistor according to claim 4, wherein the upper and lower semiconductor layers are independently selected from p-type organic semiconductor materials.

6. The organic thin film transistor according to claim 4, wherein the polymer-based insulating material is an epoxy resin.

7. The organic thin film transistor according to claim 4, wherein the inorganic insulating material is selected from one or more of silicon dioxide, aluminum oxide, tantalum pentoxide.

8. The organic thin film transistor according to claim 5, wherein the p-type organic semiconductor material is selected from one or two of pentacene and copper phthalocyanine.

9. A method of manufacturing an organic thin film transistor according to any one of claims 1 to 8, comprising the steps of:

preparation of a mixed layer:

carrying out evaporation by using the semiconductor material to form a semiconductor lower layer; then, evaporating copper oxide on the lower semiconductor layer to form a copper oxide layer; and finally, continuing to perform evaporation on the copper oxide layer by using the semiconductor material to form a semiconductor upper layer so as to obtain a mixed layer.

Technical Field

The invention belongs to the field of organic semiconductors, and particularly relates to an organic thin film transistor and a preparation method thereof.

Background

The thin film transistor is an active thin film device which controls the conductivity of organic/inorganic semiconductor materials by changing an external electric field, and is also a component in a driving circuit. With the development of organic electroluminescent (OLED) and Liquid Crystal Display (LCD) technologies, in addition to the thin film transistor made of silicon materials, thin film transistors (OTFTs) made of organic materials have been developed, which have the main advantage that the organic materials have rich properties and their properties can be easily controlled by changing the chemical structure.

At present, the application of organic thin film transistors is mainly focused on the fields of flat panel displays, such as liquid crystal displays, organic light emitting displays, electronic paper, transaction cards, electronic identification tags, sensors, and the like. Compared with an inorganic thin film transistor, the organic thin film transistor has the unique advantages of low processing temperature, easy regulation and control of electrical properties, capability of preparing a thin film by adopting low-cost deposition procedures (such as spin coating, printing, vacuum evaporation and other technologies), suitability for large-area preparation, compatibility with a flexible substrate and the like.

In the prior art, many high performance organic thin film transistors have been developed, such as high on/off ratio (C:)>10⁷) Low threshold voltage (<5V), high mobility, and large current output (milliamp level), the organic thin film transistor still faces many challenges and constraints: as it is not yet mature in practical application in organic integrated circuits, transistor current control performance is to be improved; effective regulation of the threshold voltage is not well realized, and the current output requirement cannot be met.

In addition, the regulation of the threshold voltage plays a key role in the design and manufacture of organic integrated circuits. There are many research works on how to effectively regulate and control the threshold voltage of the organic thin film transistor, mainly focusing on the doping of the organic semiconductor and the modification of the surface of the insulating layer; but the difficulties are that: doping and surface modification processes (such as surface monolayer coating) are complex, and doping and modification of the surface of the insulating layer are difficult to control effectively; the voltage regulation and control range is small, and accurate regulation and control cannot be realized. The above factors have the side effect of improperly changing the transistor performance during the threshold voltage regulation, so that the practical prospect is not ideal.

Therefore, in order to overcome the above-mentioned shortcomings, a technical solution is needed to solve the above-mentioned problems in voltage regulation.

Disclosure of Invention

In view of the above-mentioned shortcomings, the present invention discloses an organic thin film transistor for effectively adjusting the threshold voltage of the organic thin film transistor. The organic thin film transistor has the effect of systematically and widely adjusting and controlling the voltage threshold. Specifically, the organic semiconductor layer is divided into two portions which are not connected to each other by interposing a copper oxide (CuO) layer between the two organic semiconductor layers. It has been surprisingly found that the copper oxide layer can trap electrons, which in turn can induce holes in the semiconductor layer, which ultimately leads to a positive shift in the threshold voltage of the transistor.

In the technical scheme of the invention, the drift of the threshold voltage is artificially controlled and depends on the quantity of electrons captured by the copper oxide layer. At positive gate bias (V) of copper oxide layer_GS0) Charge separation under influence, positive gate bias V_GS0The number of electrons trapped by the copper oxide layer can be controlled, as can V_GS0The number of electrons trapped by the copper oxide layer increases, the larger the number of trapped electrons is, the larger the threshold voltage drift is, and conversely, the smaller the threshold voltage shift is. Thus, passing V_GS0So as to change the quantity of electrons captured by the copper oxide layer, and the threshold voltage of the organic thin film transistor can be effectively regulated and controlled. Furthermore, the above conclusion was demonstrated by deeply exploring the relevant mechanism.

The term "p-type organic semiconductor material" in the present invention refers to an organic semiconductor material suitable for hole injection conduction channel transport.

The term "CT blend" in the present invention refers to a charge rotator blend.

An object of the present invention is to provide an organic thin film transistor.

An organic thin film transistor includes a mixed layer,

wherein the content of the first and second substances,

the mixed layer sequentially comprises a semiconductor lower layer, a copper oxide layer and a semiconductor upper layer from bottom to top;

the semiconductor lower layer and the semiconductor upper layer are made of the same or different semiconductor materials.

Further, the thickness of the copper oxide layer is 1-3 nm.

Further, the structure of the organic thin film transistor sequentially comprises from bottom to top: the semiconductor device includes a gate electrode, an insulating layer, a mixed layer, and source and drain electrodes.

Further, the insulating layer is selected from a polymer-based insulating material or an inorganic-based insulating material.

Further, the semiconductor upper layer and the semiconductor lower layer are independently selected from p-type organic semiconductor materials.

Further, the polymer-based insulating material is an epoxy resin.

Further, the inorganic insulating material is selected from one or more of silicon dioxide, aluminum oxide, tantalum pentoxide.

Further, the p-type organic semiconductor material is selected from one or two of pentacene (pentacene) and copper phthalocyanine.

Another object of the present invention is to provide a method for manufacturing the organic thin film transistor, which comprises the following steps:

preparation of a mixed layer:

carrying out evaporation by using the semiconductor material to form a semiconductor lower layer; then, evaporating copper oxide on the lower semiconductor layer to form a copper oxide layer; and finally, continuing to perform evaporation on the copper oxide layer by using the semiconductor material to form a semiconductor upper layer so as to obtain a mixed layer.

The organic thin film transistor device of the present invention is prepared by vacuum evaporation and direct current magnetron sputtering methods well known to those skilled in the art.

The invention has the following beneficial effects: the organic thin film transistor containing the copper oxide layer can effectively adjust the threshold voltage of the organic thin film transistor. The regulation and control mode does not need to depend on complex semiconductor doping and insulating layer surface modification technology, and is technology which is simple in process and more suitable for commercial application.

Drawings

Fig. 1 shows a device structure diagram of an organic thin film transistor of examples 1-2.

Reference numerals: 1-a gate electrode; 2-an insulating layer; 3-semiconductor lower layer; 4-a copper oxide layer; 3' -a semiconductor upper layer; 5-source drain electrode.

Fig. 2 shows an output characteristic curve of the organic thin film transistor of example 1.

Fig. 3 shows that in the transfer characteristic curve of the organic thin film transistor of example 1, the transfer characteristic curve of the device shows a regular shift toward the positive gate voltage direction.

Fig. 4(a) shows an output characteristic curve of the organic thin film transistor of example 2;

fig. 4(b) shows a transfer characteristic curve of the organic thin film transistor of example 2.

Fig. 5(a) shows an output characteristic curve of the organic thin film transistor of comparative example 1;

fig. 5(b) shows a transfer characteristic curve of the organic thin film transistor of comparative example 2.

Fig. 6 shows that in the transfer characteristic curve of the organic thin film transistor of example 2, the transfer characteristic curve of the device shows a regular shift toward the positive gate voltage direction.

FIG. 7(a) shows transfer characteristic curves of organic thin film transistor devices of different thickness of copper oxide layers in test example 3;

fig. 7(b) shows a graph of field effect mobility and threshold voltage for organic thin film transistor devices of different thickness of copper oxide layers in test example 3.

Fig. 8 shows a charge separation mechanism of a copper oxide layer in an organic thin film transistor of the copper oxide layer.

Detailed Description

In order to more clearly illustrate the technical solution of the present invention, the following examples are given. The starting materials, reactions and work-up procedures which are given in the examples are, unless otherwise stated, those which are customary on the market and are known to the person skilled in the art.

The p-type silicon of the embodiment of the invention is purchased from Hengma opto-electronic technology, Inc. of Thai.

The vacuum evaporation of the embodiment of the invention is completed in the vacuum evaporation cavity.

Example 1

An organic thin film transistor, the structure of which comprises from bottom to top in sequence: a gate electrode (1000nm), an insulating layer of silicon dioxide (about 300nm), a mixed layer (about 53nm), and a source-drain electrode (40 nm);

wherein the content of the first and second substances,

the mixed layer sequentially comprises a semiconductor lower layer, a copper oxide layer and a semiconductor upper layer from bottom to top;

the semiconductor lower layer and the semiconductor upper layer are made of the same semiconductor material and are both pentacene.

The preparation method of the organic thin film transistor is as follows:

s1. p-type silicon is given a specified thickness and used as a gate electrode.

S2, in the vacuum evaporation cavity, silicon dioxide is evaporated in vacuum (5 multiplied by 10)^-4Pa) to the gate electrode, and forming an insulating layer of a prescribed thickness. And ultrasonically cleaning the obtained gate electrode/insulating layer by using acetone, deionized water and isopropanol respectively for 10min, and drying.

S3, vacuum evaporation (5 multiplied by 10) is firstly carried out on the insulating layer^-4Pa) a layer of pentacene with the thickness of 30nm, and forming a lower semiconductor layer after drying; then, vacuum deposition (5X 10) was performed on the semiconductor lower layer^-4Pa) forming a layer of copper oxide with the thickness of 3nm after drying; finally, vacuum evaporation (5X 10) is carried out on the copper oxide layer^-4Pa) a layer of pentacene with a thickness of 20nm, and drying to form the semiconductor upper layer. Thereby preparing a mixed layer.

And S4, performing vacuum copper evaporation on the mixed layer, drying to form a source drain electrode with a specified thickness, and controlling the width and the length of a channel to be 100 micrometers and 10000 micrometers respectively by using a mask plate.

Example 2

An organic thin film transistor, the structure of which comprises from bottom to top in sequence: a gate electrode (300nm), an insulating layer of alumina (about 150nm), a mixed layer (about 53nm), and a source-drain electrode (40 nm);

wherein the content of the first and second substances,

the mixed layer sequentially comprises a semiconductor lower layer, a copper oxide layer and a semiconductor upper layer from bottom to top;

the semiconductor lower layer and the semiconductor upper layer are made of the same semiconductor material and are both pentacene.

The preparation method of the organic thin film transistor is as follows:

s1, preparing an aluminum film with a specified thickness by adopting a direct-current magnetron sputtering method and using the aluminum film as a gate electrode.

S2, carrying out anodic oxidation on the gate electrode, wherein a power supply used in the anodic oxidation process is KEITHLEY 24001100V Source-Meter. The specific method comprises the following steps: soaking the gate electrode in ammonium oxalate glycol solution, connecting the gate electrode with the anode, connecting the platinum with the cathode, and introducing constant current of 0.2mA/cm²And keeping the voltage constant for 90min when the voltage reaches 100V, forming aluminum oxide with the specified thickness on the surface of the gate electrode, taking out the aluminum oxide, and blowing the aluminum oxide with nitrogen to dry the solvent, thereby forming an insulating layer on the surface of the gate electrode.

S3, vacuum evaporation (5 multiplied by 10) is firstly carried out on the insulating layer^-4Pa) a layer of pentacene with the thickness of 20nm, and forming a lower semiconductor layer after drying; then, vacuum deposition (5X 10) was performed on the semiconductor lower layer^-4Pa) forming a layer of copper oxide with the thickness of 3nm after drying; finally, vacuum evaporation (5X 10) is carried out on the copper oxide layer^-4Pa) a layer of pentacene with a thickness of 30nm, and drying to form the semiconductor upper layer. Thereby preparing a mixed layer.

And S4, performing vacuum copper evaporation on the mixed layer, drying to form a source drain electrode with a specified thickness, and controlling the width and the length of a channel to be 100 micrometers and 10000 micrometers respectively by using a mask plate.

Fig. 1 shows a device structure diagram of the organic thin film transistor of the above-described embodiments 1-2. As can be seen from the figure, the copper oxide layer is interposed between the lower semiconductor layer and the upper semiconductor layer so that the lower semiconductor layer and the upper semiconductor layer are completely separated.

Comparative example 1

Comparative example 1 has the same structure as the organic thin film crystal device of example 1, except that in the organic thin film crystal of comparative example 1, the mixed layer does not contain a copper oxide layer, but the lower semiconductor layer and the upper semiconductor layer are integrated, and are pentacene, each having a thickness of 53 nm.

Test example 1

The organic thin film transistor of example 1 was subjected to an output characteristic test, and the obtained results are shown in fig. 2. Fig. 2 shows that the organic thin film transistor device of example 1 has a typical saturation characteristic, and that the saturation current increases with an increase in the negative gate voltage, indicating that the device is a hole transport characteristic. When testing the transfer characteristic curve of such a device, the transfer characteristic curve starts from a positive value with a gate voltage (V)_GS0) Starts scanning to-80V and then scans from-80V back to the starting point V_GS0I.e. V_GS0The transfer characteristic curve of the device shows a regular shift towards the positive gate voltage when changing from 0V to 80V. The results are shown in FIG. 3. In FIG. 3, the threshold voltage V_TCan be extrapolated from the tangent to the function curve in FIG. 3 to V_GSThe shaft is obtained. The field effect mobility is calculated using the channel current formula for the OTFT in the saturation region:

wherein W and L represent the width and length of the channel, respectively, and C_iIs the capacitance per unit area of the gate insulating layer, V_TIs the threshold voltage, V_GSIs the gate bias voltage, μ_satIs the saturation region field effect mobility. As can be seen from FIG. 3, V_GS0When the threshold voltage is shifted from-9.5V to 32V in the range from 0V to 80V, the saturation region field effect mobility is kept at 0.18cm²Vs. Thus, effective control of the threshold voltage of such devices can be achieved by using different V_GS0The transfer characteristic of the device is tested, and the field effect mobility of the saturation region of the device is kept stable in the threshold voltage regulation process. This threshold voltage tuning method does not change device performance.

The organic thin film transistors of example 1 and comparative example 1 were subjected to output characteristics and transfer tests, and the results are shown in fig. 4(a) - (b), and fig. 5(a) - (b), respectively.

The output characteristic curves of FIGS. 4(a) and 5(a) show the output characteristic curves of a typical P-type transistor, i.e., when-V_DSWhen it increases to a certain extent, -I_DNo longer following-V_DSIncreases, but tends to a constant value, this region being called the Saturation region (Saturation region). In a section of the zone before the saturation zone, -I_Dwith-V_DSAnd linearly increases, called the Linear region (Linear region). Therefore, when the copper oxide layer thin film layer is inserted into the pentacene layer and the pentacene layer is divided into the lower semiconductor layer and the upper semiconductor layer, the field effect characteristics of the transistor device are not affected. As can be seen from FIGS. 4(a) and 5(a), at V_GS-50V and V_DSThe saturation current of the organic thin film transistor device of example 1 was 1.38 × 10 under-50V condition^-4A, greatly exceeds that of the organic thin film transistor device of comparative example 1 (3.5X 10)^-5A) Saturated current values under the same conditions. This indicates that the copper oxide layer is embedded, resulting in an increase in saturation current of the device. V is shown in FIG. 4(b) and FIG. 5(b)_DSI of the organic thin film transistor devices of example 1 and comparative example 1 at-45V_D-V_GSAnd (-I)_D)^1/2-V_GSCharacteristic curve diagram of (2). The threshold voltages of the organic thin film transistor devices of example 1 and comparative example 1 may be represented by (-I) in fig. 4(b), fig. 5(b), respectively_D)^1/2-V_GSIs extrapolated to V_GSThe shaft is obtained. From this, we found that the organic thin film transistor devices of example 2 and comparative example 1 were-7.9V, -21V, respectively. This illustrates the embedding of the copper oxide layer, which causes the threshold voltage of the organic thin film transistor device to drift from-21V to-7.9V, and thus the threshold voltage of the device is significantly reduced.

A series of comparisons of the performance of the organic thin film transistors of example 1 and comparative example 1 above are shown in table 1.

Table 1 properties of organic thin film transistors of example 1 and comparative example 1

Test example 2

FIG. 6 shows the transfer characteristic curve from V for example 2_GS0Starts scanning to-40V and then scans from-40V back to the starting point V_GS0When V is_GS0When the voltage is changed from 0V to 40V, the transfer characteristic curve of the device shows regular shift towards the positive grid voltage direction. In FIG. 6, the threshold voltage V_TCan be extrapolated from the tangent to the curve in FIG. 6 to V_GSThe shaft is obtained. As can be seen from FIG. 6, V_GS0When the threshold voltage is changed from 0V to 40V, the threshold voltage is shifted from-5V to 16.5V, and the saturation region field effect mobility is kept stable. Thus, the threshold voltage of such a device can be effectively controlled by using different V_GS0Controlling the transfer characteristics of the device.

Test example 3

In order to investigate the effect of the specific thickness of the copper oxide layer on the performance of the organic thin film transistor device, a series of organic thin film transistor devices containing copper oxide layers of different thicknesses were prepared based on example 1, i.e., the copper oxide layers were taken to be 0, 1, 2, 3, 5, and 7nm, respectively, and the transfer characteristic curves of the corresponding devices were tested, and the results are shown in fig. 7 (a). Showing (-I) of organic thin film transistors of different copper oxide layer thicknesses_D)^1/2-V_DS. As can be seen from FIG. 7(a), as the thickness of the copper oxide layer increases, (-I)_D)^1/2-V_DSThe curve drifts towards the more positive direction of the gate bias; while the threshold voltage and mobility of the device also change. When the thickness of the copper oxide layer is 3nm, the performance of the device reaches an optimal value, and the mobility is 0.18cm²V^-1S^-1The threshold voltage was-7.9V, as shown in FIG. 7 (b). As can be seen from fig. 7(b), when the thickness of the copper oxide layer is 0 to 3nm, the mobility increases and the threshold voltage decreases as the thickness of the copper oxide layer increases, and when it exceeds 3nm, the mobility does not increase any more but decreases, the threshold voltage becomes positive, the leakage current increases a lot, and the device performance deteriorates. Therefore, as the thickness of the copper oxide layer increases, the threshold voltage of the device decreases, and the mobility decreasesIs first increased and then decreased.

Therefore, when the thickness of the copper oxide layer is between 0 and 3nm, i.e., at a lower thickness, the copper oxide layer increases in coverage of the surface of the copper oxide layer covering pentacene with increasing thickness. The doping concentration is increased by the charge transfer of the copper oxide layer and the pentacene interface, and the movable hole number is increased by the pentacene from the CT (charge transfer) blend. The threshold voltage is reduced, and meanwhile, pentacene hole traps can be reduced through doping, so that carrier injection of a device with a copper oxide layer is improved, and the mobility of the device is increased. When the thickness of the copper oxide layer exceeds 3nm, for example, the thickness is increased to 5nm, the doping of the copper oxide layer and the pentacene interface reaches high doping concentration, the leakage current of the device is large, and the device is in a normally-open state. When the thickness is increased to 7nm, the saturation current of the device is not increased, which indicates that the doping concentration of the copper oxide layer and the pentacene interface reaches saturation. When the thickness of the copper oxide layer exceeds 3nm, the copper oxide layer may participate in current transmission of the device as the thickness of the copper oxide layer increases, but the mobility of the device is rather reduced due to the low conductive characteristics of the copper oxide layer. Therefore, as the thickness of the copper oxide layer increases, the threshold voltage of the device decreases, and the mobility increases and then decreases. This result also demonstrates the improvement in mobility of the organic thin film transistor with respect to the copper oxide layer previously attributed to the generation of CT blends resulting from electron transfer at the interface of copper oxide and pentacene, improving hole injection.

In order to search for the cause of the above data, we have conducted intensive studies on the charge separation mechanism of a copper oxide layer in an organic thin film transistor having the copper oxide layer. We believe that at V_GS0Under the action, the electron capture mechanism of the organic thin film transistor with the copper oxide layer is shown in fig. 8: when V is_GS0The copper oxide layer can act as a charge generation layer when applied to an organic thin film transistor having the copper oxide layer. At V_GS0Under the action, the organic thin film transistor of the copper oxide layer is in an off state and has very low off-state current, and the copper oxide layer shows dielectric characteristics and has very high resistance at V_GS0Under the action of the electric field, a reverse electric field is generated and points to the copper electrode, the reverse electric field is applied to the copper oxide layer, and Fo possibly occurs to the copper oxide layerwler-Nordheim (electric field assisted electron tunneling) tunneling. Electrons on the valence band of the copper oxide layer are excited under the action of an additional electric field to jump to a band gap trap level (phi) of the copper oxide layer_t) Or the conduction band, leaving holes in the valence band of the copper oxide layer, the charges are separated by this additional electric field to generate electron and hole pairs (as shown in figure 8). The generated holes are injected into the adjacent pentacene under the action of the additional electric field, and additional hole current (J) is generated_h,CGL) Source and drain current (I) of organic Thin Film Transistor (TFT) resulting in copper oxide layer_D) Increasing; the generated electrons are trapped at the interface of the copper oxide layer and pentacene, and because the copper oxide layer has electron traps and poor electron conduction capability of pentacene, the generated electrons cannot be injected into the adjacent pentacene to generate additional electron current (J)_e,CGL). Thus, the generated electrons are trapped at the interface of the copper oxide layer and pentacene. With the addition of V_GS0The larger the number of electron-hole pairs generated, the larger the number of electrons trapped at the interface of the copper oxide layer and pentacene.

This mechanism also proves that: v_GS0The larger the size, the larger the number of electrons trapped in the copper oxide layer. At this time, the trapped electrons, not the copper oxide layer, are taken from the HOMO level of pentacene by interface doping. Thus, V added_GS0There is no effect on the doping between the copper oxide layer and the pentacene interface, and V can also be explained_GS0Has no influence on the mobility of the organic thin film transistor of the copper oxide layer. The formation of the interface doping and charge transfer blend only occurs in the thin layer in direct contact with the interface, and the interface doping is saturated when the copper oxide layer film is evaporated on the surface of pentacene.

In summary, the copper oxide layer functions in the organic thin film transistor with the copper oxide layer as follows:

1. in the absence of an electric field (from V)_GS0Generated) under the action, when the copper oxide layer film is evaporated on the surface of the pentacene, the copper oxide layer and the pentacene generate interface doping to form a CT mixed body, thereby reducing hole traps in the pentacene and improving the copper oxideAnd injecting carriers into the organic thin film transistor of the layer, so that the mobility of the organic thin film transistor of the copper oxide layer is improved, and holes generated in the CT blend body are generated, so that the threshold voltage of the device is reduced to-7.9V, the threshold voltage of the device is reduced, and the current of the device is increased. At this time, the copper oxide layer captures electrons from the HOMO level of pentacene by doping.

2. In the presence of an electric field (formed by V)_GS0Generated) under the action of the reverse electric field, at which time the copper oxide layer acts as a charge generation layer and electrons and holes are separated under the action of the reverse electric field. The generated electrons are trapped at the interface of the copper oxide layer and pentacene due to the copper oxide layer's electron trapping ability and the poor electron conducting ability of pentacene. This is a different mechanism of trapping electrons than the first case. Added V_GS0The larger the number of electron captures.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.