阅读说明：本技术 一种电子元件用柔韧性强的橡胶高分子复合型胶粘剂 (High-flexibility rubber polymer composite adhesive for electronic element ) 是由 余金辉 倪伟佳 许新辉 于 2021-10-26 设计创作，主要内容包括：本发明公开了一种电子元件用柔韧性强的橡胶高分子复合型胶粘剂,涉及橡胶高分子复合型胶粘剂技术领域,具体为一种电子元件用柔韧性强的橡胶高分子复合型胶粘剂,主要由下列原料药制备而成,均为重量份：氯丁橡胶10-20份、环氧树脂6-16份、二氧化硅2-8份、环氧丙烯酸酯10-24份、二氯丙烷15-35份、增韧剂3-7份、耦合剂1-3份、抗氧剂3-5份、成膜助剂3-5份、着色剂3-7份、增稠剂1-3份、消泡剂3-5份。该电子元件用柔韧性强的橡胶高分子复合型胶粘剂,橡胶高分子复合型胶粘剂的柔韧性强度,能够有效的增强电子元件组件之间的粘接强度,以及能够有效的避免电子元件掉落。(The invention discloses a high-flexibility rubber polymer composite adhesive for electronic elements, which relates to the technical field of rubber polymer composite adhesives, in particular to a high-flexibility rubber polymer composite adhesive for electronic elements, and is mainly prepared from the following raw material medicines in parts by weight: 10-20 parts of chloroprene rubber, 6-16 parts of epoxy resin, 2-8 parts of silicon dioxide, 10-24 parts of epoxy acrylate, 15-35 parts of dichloropropane, 3-7 parts of toughening agent, 1-3 parts of coupling agent, 3-5 parts of antioxidant, 3-5 parts of film-forming assistant, 3-7 parts of colorant, 1-3 parts of thickening agent and 3-5 parts of defoaming agent. This compound adhesive of rubber polymer that flexibility is strong for electronic component, the pliability intensity of the compound adhesive of rubber polymer can effectual reinforcing bonding strength between the electronic component subassembly to and can effectually avoid electronic component to drop.)

1. A high-flexibility rubber polymer composite adhesive for electronic components is characterized by being mainly prepared from the following raw material medicines in parts by weight: 10-20 parts of chloroprene rubber, 6-16 parts of epoxy resin, 2-8 parts of silicon dioxide, 10-24 parts of epoxy acrylate, 15-35 parts of dichloropropane, 3-7 parts of toughening agent, 1-3 parts of coupling agent, 3-5 parts of antioxidant, 3-5 parts of film-forming assistant, 3-7 parts of colorant, 1-3 parts of thickening agent and 3-5 parts of defoaming agent.

2. The highly flexible rubber polymer composite adhesive for electronic components according to claim 1, wherein: the toughening agent is one or more of a rubber toughening agent and a thermoplastic elastomer toughening agent, the rubber toughening agent is one or more of liquid polysulfide rubber, liquid acrylate rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber and styrene butadiene rubber, and the thermoplastic elastomer toughening agent is one or more of polyurethane, styrene, polyolefin, polyester, syndiotactic 1, 2-polybutadiene and polyamide.

3. The highly flexible rubber polymer composite adhesive for electronic components according to claim 1, wherein: the antioxidant is one or more of aromatic amine antioxidant, hindered phenol antioxidant and auxiliary antioxidant, the aromatic amine antioxidant is one or more of diphenylamine, p-phenylenediamine and dihydroquinoline, the hindered phenol antioxidant is one or more of 2, 6-tertiary butyl-4-methylphenol, bisthioether and pentaerythritol ester, and the auxiliary antioxidant is one or more of didodecanol ester, bistetradecanol ester and bistearyl alcohol ester.

4. The highly flexible rubber polymer composite adhesive for electronic components according to claim 1, wherein: the film-forming assistant is one or more of propylene glycol butyl ether and propylene glycol methyl ether acetate.

5. The highly flexible rubber polymer composite adhesive for electronic components according to claim 1, wherein: the defoaming agent is one or more of emulsified silicone oil, a high-alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether and polydimethylsiloxane.

6. The highly flexible rubber polymer composite adhesive for electronic components according to any one of claims 1 to 5, wherein the preparation method of the highly flexible rubber polymer composite adhesive for electronic components comprises the following steps:

s1, weighing: weighing chloroprene rubber, epoxy resin, silicon dioxide, epoxy acrylate, dichloropropane, a toughening agent, a coupling agent, an antioxidant, a film forming aid, a coloring agent, a thickening agent and a defoaming agent in sequence according to the mass parts of the raw materials;

s2, dissolving: adding epoxy resin into a reaction kettle, heating and stirring until the epoxy resin is dissolved;

s3, stirring: adding silicon dioxide into the dissolved epoxy resin, and continuously heating and stirring to carry out chelation reaction to obtain a pre-reaction semi-finished product;

s4, mixing the raw materials: sequentially adding the rest raw materials into the reaction kettle according to the mass parts of the raw materials, and continuously heating and stirring until the raw materials are uniformly mixed to obtain a mixture A;

s5, detecting, disinfecting and canning: and (5) extracting the mixture A in the step S4 and the raw material mixing as a sample for detection, and sterilizing and canning the mixture A which is detected to be proper.

7. The highly flexible rubber polymer composite adhesive for electronic components according to claim 6, wherein: in the step S2, during dissolution, the heating temperature is 40-60 ℃, and the stirring is carried out for 1-3h until the dissolution is finished.

8. The highly flexible rubber polymer composite adhesive for electronic components according to claim 6, wherein: in the step S3 and stirring, the heating temperature is 60-90 ℃, the stirring time is 2-5h, and the rotating speed of the reaction kettle is 600-.

9. The highly flexible rubber polymer composite adhesive for electronic components according to claim 6, wherein: in the step S4, in the raw material mixing, the heating temperature is 30-60 ℃, and the stirring is carried out at three rotating speeds, namely, low-speed stirring at 60-120r/min, medium-speed stirring at 1000-.

10. The highly flexible rubber polymer composite adhesive for electronic components according to claim 6, wherein: and (5) placing the mixture A in the step S4 and the raw material mixing under an ultraviolet lamp, irradiating for 1-3 days, and performing quality detection.

Technical Field

The invention relates to the technical field of rubber polymer composite adhesives, in particular to a rubber polymer composite adhesive with strong flexibility for electronic elements.

Background

Electronic components are basic elements in electronic circuits, typically individually packaged, and have two or more leads or metal contacts. Electronic components, such as amplifiers, radio receivers, oscillators, etc., must be interconnected to form an electronic circuit with a specific function, and one of the common ways of connecting electronic components is soldering to a printed circuit board. The electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.) or groups of various complexities, such as integrated circuits (op amps, resistors, logic gates, etc.).

The adhesive bonding refers to a technique for connecting the surfaces of homogeneous or heterogeneous objects together by using an adhesive, and has the characteristics of continuous stress distribution, light weight, sealing, low temperature of most processes and the like. The glue joint is particularly suitable for connecting different materials, different thicknesses, ultrathin specifications and complex components. The glue joint has the fastest recent development and extremely wide application industry, and has great influence on the improvement of high-tech scientific and technical progress and the daily life of people. Therefore, it is very important to research, develop and produce various adhesives.

The existing adhesive has the defects of low bonding strength, easy falling of a bonding assembly and inconvenient bonding.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a high-flexibility rubber polymer composite adhesive for electronic elements, which solves the problems that the existing adhesive in the background art is low in bonding strength, easy to drop a bonding assembly and inconvenient to bond.

In order to achieve the purpose, the invention is realized by the following technical scheme: a high-flexibility rubber polymer composite adhesive for electronic components is mainly prepared from the following raw material medicines in parts by weight: 10-20 parts of chloroprene rubber, 6-16 parts of epoxy resin, 2-8 parts of silicon dioxide, 10-24 parts of epoxy acrylate, 15-35 parts of dichloropropane, 3-7 parts of toughening agent, 1-3 parts of coupling agent, 3-5 parts of antioxidant, 3-5 parts of film-forming assistant, 3-7 parts of colorant, 1-3 parts of thickening agent and 3-5 parts of defoaming agent.

Preferably, the toughening agent is one or more of a rubber toughening agent and a thermoplastic elastomer toughening agent, the rubber toughening agent is one or more of liquid polysulfide rubber, liquid acrylate rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber and styrene butadiene rubber, and the thermoplastic elastomer toughening agent is one or more of polyurethane, styrene, polyolefin, polyester, syndiotactic 1, 2-polybutadiene and polyamide.

Preferably, the antioxidant is one or more of aromatic amine antioxidant, hindered phenol antioxidant and auxiliary antioxidant, the aromatic amine antioxidant is one or more of diphenylamine, p-phenylenediamine and dihydroquinoline, the hindered phenol antioxidant is one or more of 2, 6-tertiary butyl-4-methylphenol, bisthioether and pentaerythritol ester, and the auxiliary antioxidant is one or more of didodecanol ester, bistetradecanol ester and bistearyl alcohol ester.

Preferably, the film-forming assistant is one or more of propylene glycol butyl ether and propylene glycol methyl ether acetate.

Preferably, the defoaming agent is one or more of emulsified silicone oil, a higher alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether and polydimethylsiloxane.

Preferably, the preparation method of the rubber polymer composite adhesive with strong flexibility for the electronic element comprises the following steps:

s1, weighing: weighing chloroprene rubber, epoxy resin, silicon dioxide, epoxy acrylate, dichloropropane, a toughening agent, a coupling agent, an antioxidant, a film forming aid, a coloring agent, a thickening agent and a defoaming agent in sequence according to the mass parts of the raw materials;

s2, dissolving: adding epoxy resin into a reaction kettle, heating and stirring until the epoxy resin is dissolved;

s3, stirring: adding silicon dioxide into the dissolved epoxy resin, and continuously heating and stirring to carry out chelation reaction to obtain a pre-reaction semi-finished product;

s4, mixing the raw materials: sequentially adding the rest raw materials into the reaction kettle according to the mass parts of the raw materials, and continuously heating and stirring until the raw materials are uniformly mixed to obtain a mixture A;

s5, detecting, disinfecting and canning: and (5) extracting the mixture A in the step S4 and the raw material mixing as a sample for detection, and sterilizing and canning the mixture A which is detected to be proper.

Preferably, in the step S2, during the dissolution, the heating temperature is 40-60 ℃, and the stirring is carried out for 1-3h until the dissolution is finished.

Preferably, in the step S3 and the stirring, the heating temperature is 60-90 ℃, the stirring time is 2-5h, and the rotation speed of the reaction kettle is 600-2000 r/min.

Preferably, in the step S4, in the mixing of the raw materials, the heating temperature is 30-60 ℃, and the stirring is carried out at three rotating speeds, namely, low-speed stirring at 60-120r/min, medium-speed stirring at 1000-.

Preferably, the mixture A in the step S4 and the raw material mixing is placed under an ultraviolet lamp, irradiated for 1-3 days, and subjected to quality detection.

The invention provides a high-flexibility rubber polymer composite adhesive for electronic elements, which has the following beneficial effects:

1. the high-flexibility rubber polymer composite adhesive for the electronic element can effectively increase the flexibility of the rubber polymer composite adhesive through the toughening agent, the antioxidant can delay or inhibit the oxidation process of a polymer, can effectively prevent the aging of the polymer and prolong the service life of the polymer, the film-forming assistant can promote the plastic flow and elastic deformation of a high-molecular compound, improve the coalescence performance, and the defoaming agent can effectively reduce the surface tension of the rubber polymer composite adhesive and can effectively inhibit or eliminate foam generated.

2. This compound adhesive of rubber polymer that flexibility is strong for electronic component, the pliability intensity of the compound adhesive of rubber polymer can effectual reinforcing bonding strength between the electronic component subassembly to and can effectually avoid electronic component to drop.

Detailed Description

In the following, technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.

Embodiment 1

The invention provides a technical scheme that: a high-flexibility rubber polymer composite adhesive for electronic components is mainly prepared from the following raw material medicines in parts by weight: 10 parts of chloroprene rubber, 6 parts of epoxy resin, 2 parts of silicon dioxide, 10 parts of epoxy acrylate, 15 parts of dichloropropane, 3 parts of toughening agent, 1 part of coupling agent, 3 parts of antioxidant, 3 parts of film-forming assistant, 3 parts of colorant, 1 part of thickening agent and 3 parts of defoaming agent.

The toughening agent is one or more of a rubber toughening agent and a thermoplastic elastomer toughening agent, the rubber toughening agent is one or more of liquid polysulfide rubber, liquid acrylate rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber and styrene butadiene rubber, and the thermoplastic elastomer toughening agent is one or more of polyurethane, styrene, polyolefin, polyester, syndiotactic 1, 2-polybutadiene and polyamide.

The antioxidant is one or more of aromatic amine antioxidant, hindered phenol antioxidant and auxiliary antioxidant, the aromatic amine antioxidant is one or more of diphenylamine, p-phenylenediamine and dihydroquinoline, the hindered phenol antioxidant is one or more of 2, 6-tertiary butyl-4-methylphenol, dithioether and pentaerythritol ester, and the auxiliary antioxidant is one or more of didodecanol ester, ditetradecanol ester and dioctadecyl alcohol ester.

The film forming assistant is one or more of propylene glycol butyl ether and propylene glycol methyl ether acetate.

The defoaming agent is one or more of emulsified silicone oil, high alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether and polydimethylsiloxane.

The preparation method of the rubber polymer composite adhesive with strong flexibility for the electronic element comprises the following steps:

s1, weighing: weighing 10 parts of chloroprene rubber, 6 parts of epoxy resin, 2 parts of silicon dioxide, 10 parts of epoxy acrylate, 15 parts of dichloropropane, 3 parts of toughening agent, 1 part of coupling agent, 3 parts of antioxidant, 3 parts of film-forming assistant, 3 parts of colorant, 1 part of thickening agent and 3 parts of defoaming agent in sequence according to the mass parts of the raw materials;

s2, dissolving: adding 6 parts of epoxy resin into a reaction kettle, heating and stirring until the epoxy resin is dissolved;

s3, stirring: adding 2 parts of silicon dioxide into 6 parts of the dissolved epoxy resin, and continuously heating and stirring to carry out chelation reaction to obtain a pre-reaction semi-finished product;

s4, mixing the raw materials: sequentially adding 10 parts of the rest raw materials of chloroprene rubber, 10 parts of epoxy acrylate, 15 parts of dichloropropane, 3 parts of toughening agent, 1 part of coupling agent, 3 parts of antioxidant, 3 parts of film-forming aid, 3 parts of colorant, 1 part of thickener and 3 parts of defoaming agent into a reaction kettle according to the mass parts of the raw materials, and continuously heating and stirring until the raw materials are uniformly mixed to obtain a mixture A;

s5, detecting, disinfecting and canning: and (5) extracting the mixture A in the step S4 and the raw material mixing as a sample for detection, and sterilizing and canning the mixture A which is detected to be proper.

And step S2, heating to 40 ℃ in the dissolving process, and stirring for 1h until the solution is dissolved.

And step S3, in the stirring process, the heating temperature is 60 ℃, the stirring time is 2 hours, and the rotating speed of the reaction kettle is 600 r/min.

And step S4, in the mixing of the raw materials, the heating temperature is 30 ℃, and the raw materials are stirred at three rotating speeds, namely low-speed stirring for 60r/min, medium-speed stirring for 1000r/min and high-speed stirring for 1500 r/min.

And (5) placing the mixture A obtained in the step (S4) in the raw material mixing process under an ultraviolet lamp, irradiating for 1 day, and performing quality detection.

Example II

A high-flexibility rubber polymer composite adhesive for electronic components is mainly prepared from the following raw material medicines in parts by weight: 15 parts of chloroprene rubber, 11 parts of epoxy resin, 5 parts of silicon dioxide, 17 parts of epoxy acrylate, 25 parts of dichloropropane, 5 parts of toughening agent, 2 parts of coupling agent, 4 parts of antioxidant, 4 parts of film-forming assistant, 5 parts of colorant, 2 parts of thickening agent and 4 parts of defoaming agent.

The toughening agent is one or more of a rubber toughening agent and a thermoplastic elastomer toughening agent, the rubber toughening agent is one or more of liquid polysulfide rubber, liquid acrylate rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber and styrene butadiene rubber, and the thermoplastic elastomer toughening agent is one or more of polyurethane, styrene, polyolefin, polyester, syndiotactic 1, 2-polybutadiene and polyamide.

The antioxidant is one or more of aromatic amine antioxidant, hindered phenol antioxidant and auxiliary antioxidant, the aromatic amine antioxidant is one or more of diphenylamine, p-phenylenediamine and dihydroquinoline, the hindered phenol antioxidant is one or more of 2, 6-tertiary butyl-4-methylphenol, dithioether and pentaerythritol ester, and the auxiliary antioxidant is one or more of didodecanol ester, ditetradecanol ester and dioctadecyl alcohol ester.

The film forming assistant is one or more of propylene glycol butyl ether and propylene glycol methyl ether acetate.

The defoaming agent is one or more of emulsified silicone oil, high alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether and polydimethylsiloxane.

The preparation method of the rubber polymer composite adhesive with strong flexibility for the electronic element comprises the following steps:

s1, weighing: weighing 15 parts of chloroprene rubber, 11 parts of epoxy resin, 5 parts of silicon dioxide, 17 parts of epoxy acrylate, 25 parts of dichloropropane, 5 parts of a toughening agent, 2 parts of a coupling agent, 4 parts of an antioxidant, 4 parts of a film-forming assistant, 5 parts of a coloring agent, 2 parts of a thickening agent and 4 parts of a defoaming agent in sequence according to the mass parts of the raw materials;

s2, dissolving: adding 11 parts of epoxy resin into a reaction kettle, heating and stirring until the epoxy resin is dissolved;

s3, stirring: adding 5 parts of silicon dioxide into 11 parts of the dissolved epoxy resin, and continuously heating and stirring to carry out chelation reaction to obtain a pre-reaction semi-finished product;

s4, mixing the raw materials: adding 15 parts of the rest raw materials of chloroprene rubber, 17 parts of epoxy acrylate, 25 parts of dichloropropane, 5 parts of toughening agent, 2 parts of coupling agent, 4 parts of antioxidant, 4 parts of film-forming aid, 5 parts of colorant, 2 parts of thickener and 4 parts of defoaming agent into a reaction kettle in sequence according to the mass parts of the raw materials, and continuously heating and stirring until the raw materials are uniformly mixed to obtain a mixture A;

s5, detecting, disinfecting and canning: and (5) extracting the mixture A in the step S4 and the raw material mixing as a sample for detection, and sterilizing and canning the mixture A which is detected to be proper.

And step S2, heating to 50 ℃ in the dissolving process, and stirring for 2 hours until the solution is dissolved.

And step S3, in the stirring process, the heating temperature is 75 ℃, the stirring time is 3.5h, and the rotating speed of the reaction kettle is 1300 r/min.

And step S4, in the raw material mixing, the heating temperature is 45 ℃, stirring is carried out at three rotating speeds, namely, low-speed stirring for 90r/min, medium-speed stirring for 1250r/min and high-speed stirring for 2250 r/min.

And (5) placing the mixture A obtained in the step (S4) in the raw material mixing process under an ultraviolet lamp, irradiating for 2 days, and performing quality detection.

Example three

The invention provides a technical scheme that: a high-flexibility rubber polymer composite adhesive for electronic components is mainly prepared from the following raw material medicines in parts by weight: 20 parts of chloroprene rubber, 16 parts of epoxy resin, 8 parts of silicon dioxide, 24 parts of epoxy acrylate, 35 parts of dichloropropane, 7 parts of toughening agent, 3 parts of coupling agent, 5 parts of antioxidant, 5 parts of film-forming assistant, 7 parts of coloring agent, 3 parts of thickening agent and 5 parts of defoaming agent.

The toughening agent is one or more of a rubber toughening agent and a thermoplastic elastomer toughening agent, the rubber toughening agent is one or more of liquid polysulfide rubber, liquid acrylate rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber and styrene butadiene rubber, and the thermoplastic elastomer toughening agent is one or more of polyurethane, styrene, polyolefin, polyester, syndiotactic 1, 2-polybutadiene and polyamide.

The antioxidant is one or more of aromatic amine antioxidant, hindered phenol antioxidant and auxiliary antioxidant, the aromatic amine antioxidant is one or more of diphenylamine, p-phenylenediamine and dihydroquinoline, the hindered phenol antioxidant is one or more of 2, 6-tertiary butyl-4-methylphenol, dithioether and pentaerythritol ester, and the auxiliary antioxidant is one or more of didodecanol ester, ditetradecanol ester and dioctadecyl alcohol ester.

The film forming assistant is one or more of propylene glycol butyl ether and propylene glycol methyl ether acetate.

The defoaming agent is one or more of emulsified silicone oil, high alcohol fatty acid ester compound, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene amine ether, polyoxypropylene glycerol ether, polyoxypropylene polyoxyethylene glycerol ether and polydimethylsiloxane.

The preparation method of the rubber polymer composite adhesive with strong flexibility for the electronic element comprises the following steps:

s1, weighing: weighing 20 parts of chloroprene rubber, 16 parts of epoxy resin, 8 parts of silicon dioxide, 24 parts of epoxy acrylate, 35 parts of dichloropropane, 7 parts of toughening agent, 3 parts of coupling agent, 5 parts of antioxidant, 5 parts of film-forming assistant, 7 parts of coloring agent, 3 parts of thickening agent and 5 parts of defoaming agent in sequence according to the mass parts of the raw materials;

s2, dissolving: adding 16 parts of epoxy resin into a reaction kettle, heating and stirring until the epoxy resin is dissolved;

s3, stirring: adding 8 parts of silicon dioxide into 16 parts of the dissolved epoxy resin, and continuously heating and stirring to carry out chelation reaction to obtain a pre-reaction semi-finished product;

s4, mixing the raw materials: sequentially adding 20 parts of the rest raw materials of chloroprene rubber, 24 parts of epoxy acrylate, 35 parts of dichloropropane, 7 parts of toughening agent, 3 parts of coupling agent, 5 parts of antioxidant, 5 parts of film-forming aid, 7 parts of colorant, 3 parts of thickener and 5 parts of defoaming agent into a reaction kettle according to the mass parts of the raw materials, and continuously heating and stirring until the raw materials are uniformly mixed to obtain a mixture A;

s5, detecting, disinfecting and canning: and (5) extracting the mixture A in the step S4 and the raw material mixing as a sample for detection, and sterilizing and canning the mixture A which is detected to be proper.

And step S2, heating to 60 ℃ in the dissolving process, and stirring for 3 hours until the solution is dissolved.

And step S3, in the stirring process, the heating temperature is 90 ℃, the stirring time is 5h, and the rotating speed of the reaction kettle is 2000 r/min.

And step S4, in the mixing of the raw materials, the heating temperature is 60 ℃, and the raw materials are stirred at three rotating speeds, namely 120r/min at a low speed, 1500r/min at a medium speed and 3000r/min at a high speed.

And (5) placing the mixture A obtained in the step (S4) in the raw material mixing process under an ultraviolet lamp, irradiating for 3 days, and carrying out quality detection.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.