阅读说明：本技术 晶圆量测方法、装置、介质和电子设备 (Wafer measuring method, device, medium and electronic equipment ) 是由 朱贺 于 2021-01-14 设计创作，主要内容包括：本发明实施例提供了一种晶圆量测方法、装置、介质和电子设备,所述量测方法包括：获取晶圆量测区域图像；识别所述晶圆量测区域图像中的特征标记；确定所述特征标记在所述晶圆量测区域图像中的实际位置；根据所述特征标记的实际位置与所述特征标记的标准位置确定所述特征标记的偏移量；根据所述特征标记的偏移量确定所述晶圆量测区域图像中量测点的偏移量。本发明方案能够实时判别并发现量测点位的偏移问题,有利于及时调整量测位置,从而保证量测结果的准确性。(The embodiment of the invention provides a wafer measuring method, a wafer measuring device, a medium and electronic equipment, wherein the measuring method comprises the following steps: acquiring an image of a wafer measurement area; identifying feature marks in the wafer measurement area image; determining an actual position of the feature mark in the wafer metrology area image; determining the offset of the feature marker according to the actual position of the feature marker and the standard position of the feature marker; and determining the offset of the measuring point in the wafer measuring area image according to the offset of the characteristic mark. The scheme of the invention can judge and find the offset problem of the measuring point position in real time, and is beneficial to adjusting the measuring position in time, thereby ensuring the accuracy of the measuring result.)

1. A method for measuring a wafer, the method being applied to a patterned wafer, comprising:

acquiring an image of a wafer measurement area;

identifying feature marks in the wafer measurement area image;

determining an actual position of the feature mark in the wafer metrology area image;

determining the offset of the feature marker according to the actual position of the feature marker and the standard position of the feature marker;

and determining the offset of the measuring point in the wafer measuring area image according to the offset of the characteristic mark.

2. The method of claim 1, wherein the feature marks are unique in feature in the wafer metrology area image.

3. The method of claim 1, wherein the standard position of the feature marker in the wafer metrology area image is determined based on the position of the feature marker in a layout corresponding to the wafer metrology area image.

4. The method of claim 3, wherein an offset of the feature mark is calculated based on the actual position and the standard position of the feature mark in the wafer metrology area image.

5. The method of claim 1, wherein the actual location and the standard location of the feature mark in the wafer metrology area image comprise center coordinates of the actual location and the standard location of the feature mark in the wafer metrology area image.

6. The method of claim 5, wherein the offset between the actual position of the feature mark in the wafer metrology area image and the standard position is an offset between a center coordinate of the actual position of the feature mark in the wafer metrology area image and a center coordinate of the standard position.

7. The method of claim 1, further comprising:

and when the characteristic mark in the wafer measurement area image cannot be identified, prompting that the measurement point deviates.

8. The method of claim 1, further comprising: and setting the preset range of the offset according to the measuring point and the size of the measuring light spot of the machine.

9. The method of claim 8, wherein the measurement spot and the stage measurement spot have a fixed size.

10. The method of claim 9, wherein the measurement spot has a dimension that is a length or a width of the measurement spot, and the measurement spot has a dimension that is a diameter of the measurement spot.

11. The method of claim 8, wherein when the amount of displacement of the measurement point is within a predetermined range, no indication is given or no displacement of the measurement point is detected.

12. The method according to claim 8, characterized in that when the offset of the measuring point exceeds a preset range, a warning message is output or the measuring point is prompted to offset.

13. A wafer measuring apparatus, comprising:

the acquisition module is used for acquiring the wafer measurement area image;

the identification module is used for identifying the characteristic marks in the wafer measurement area image;

a determination module for determining an actual position of the feature mark in the wafer metrology area image;

and the analysis module is used for determining the offset of the feature mark according to the actual position of the feature mark and the standard position of the feature mark, and determining the offset of the measuring point in the wafer measuring area image according to the offset of the feature mark.

14. An electronic device, comprising:

one or more processors;

a storage device configured to store one or more programs which, when executed by the one or more processors, cause the one or more processors to carry out the method of any one of claims 1 to 12.

15. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the method according to any one of claims 1 to 12.

Technical Field

The present invention relates to the field of semiconductor technologies, and in particular, to a wafer measuring method and apparatus, a computer-readable storage medium, and an electronic device.

Background

Semiconductor factories generally face the problems of multiple processes and complex process, and in order to ensure the quality of wafers, parameters such as the key size of the wafers need to be measured, so that whether the production line is abnormal or not can be detected in time, and the measurement of the wafers plays a vital role in keeping the stability of the processes and reducing the production cost. Most measurement machines need to perform fixed-point measurement on the wafer, and the deviation of the measurement point will increase the operation amount of the machine, affect the normal process, and further decrease the yield of the product.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present invention and therefore may include information that does not constitute prior art known to a person of ordinary skill in the art.

Disclosure of Invention

An embodiment of the invention provides a wafer measuring method, a wafer measuring device, a computer-readable storage medium and an electronic device.

Additional features and advantages of the invention will be set forth in the detailed description which follows, or may be learned by practice of the invention.

According to a first aspect of the embodiments of the present invention, there is provided a wafer measurement method, which is applied to a patterned wafer, and includes:

acquiring an image of a wafer measurement area;

identifying feature marks in the wafer measurement area image;

determining an actual position of the feature mark in the wafer metrology area image;

determining the offset of the feature marker according to the actual position of the feature marker and the standard position of the feature marker;

and determining the offset of the measuring point in the wafer measuring area image according to the offset of the characteristic mark.

In one embodiment, the feature in the wafer metrology area image is unique.

In one embodiment, the standard position of the feature mark in the wafer metrology area image is determined according to the position of the feature mark in the layout corresponding to the wafer metrology area image.

In one embodiment, an offset of the feature mark is calculated according to the actual position and the standard position of the feature mark in the wafer metrology area image.

In one embodiment, the actual position and the standard position of the feature mark in the wafer metrology area image comprise center coordinates of the actual position and the standard position of the feature mark in the wafer metrology area image.

In one embodiment, the offset of the actual position of the feature mark in the wafer metrology area image from the standard position is an offset of a center coordinate of the actual position of the feature mark in the wafer metrology area image from a center coordinate of the standard position.

In one embodiment, further comprising:

and when the characteristic mark in the wafer measurement area image cannot be identified, prompting that the measurement point deviates.

In one embodiment, further comprising: and setting the preset range of the offset according to the measuring point and the size of the measuring light spot of the machine.

In one embodiment, the measurement spot and the machine measurement spot are fixed in size.

In one embodiment, the size of the measurement spot is the length or width of the measurement spot, and the size of the measurement spot is the diameter of the measurement spot.

In one embodiment, when the offset of the measurement point is within a preset range, no prompt is sent or no offset of the measurement point is suggested.

In one embodiment, when the offset of the measuring point exceeds a preset range, alarm information is output or the measuring point is prompted to offset. According to a second aspect of the embodiments of the present invention, there is provided a wafer measuring apparatus, comprising:

the acquisition module is used for acquiring the wafer measurement area image;

the identification module is used for identifying the characteristic marks in the wafer measurement area image;

a determination module for determining an actual position of the feature mark in the wafer metrology area image;

and the analysis module is used for determining the offset of the feature mark according to the actual position of the feature mark and the standard position of the feature mark, and determining the offset of the measuring point in the wafer measuring area image according to the offset of the feature mark.

According to a third aspect of embodiments of the present invention, there is provided an electronic apparatus, including:

one or more processors;

a storage device configured to store one or more programs that, when executed by the one or more processors, cause the one or more processors to implement a method as in any one of the above methods.

According to a fourth aspect of embodiments of the present invention, there is provided a computer-readable storage medium storing a computer program which, when executed by a processor, implements a method as in any one of the above methods.

The technical scheme provided by the embodiment of the invention has the following beneficial effects:

in the technical solution provided by some embodiments of the present invention, the offset of the feature mark is determined according to the actual position of the feature mark and the standard position of the feature mark, and since the relative position of the feature mark and the metrology point is fixed, the offset of the metrology point in the wafer metrology area image can be determined according to the offset of the feature mark. The scheme of the invention can judge and find the offset problem of the measuring point position in real time, and is beneficial to adjusting the measuring position in time, thereby ensuring the accuracy of the measuring result.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

FIG. 1 schematically illustrates a wafer metrology method in accordance with an exemplary embodiment of the present invention;

FIG. 2 illustrates a schematic view of a wafer metrology area image in one embodiment of the present disclosure;

FIG. 3 illustrates a schematic diagram of a signature in one embodiment of the present disclosure;

FIG. 4 illustrates a schematic view of a wafer metrology area image in one embodiment of the present disclosure;

FIG. 5 illustrates a schematic view of a wafer metrology area image in one embodiment of the present disclosure;

FIG. 6 is a flow chart illustrating wafer metrology according to one embodiment of the present disclosure;

FIG. 7 illustrates a wafer measurement apparatus in one embodiment of the present disclosure;

FIG. 8 illustrates a computer system of an electronic device in one embodiment of the disclosure.

Detailed Description

Exemplary embodiments will now be described more fully with reference to the accompanying drawings. The exemplary embodiments, however, may be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the module of the icon is turned upside down, the component described as "upper" will become the component "lower". Other relative terms, such as "high," "low," "top," "bottom," "left," "right," and the like are also intended to have similar meanings. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," and the like are used to denote the presence of one or more elements/components/parts; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.

Semiconductor factories generally face the problems of multiple processes and complex process, and in order to ensure the quality of wafers, parameters such as the key size of the wafers need to be measured, so that whether the production line is abnormal or not can be detected in time, and the measurement of the wafers plays a vital role in keeping the stability of the processes and reducing the production cost. Most measurement machines need to perform fixed-point measurement on the wafer, and the deviation of the measurement point will increase the operation amount of the machine, affect the normal process, and further decrease the yield of the product.

In order to solve the above problems, the present invention provides a wafer measuring method for determining whether a wafer measuring point is shifted, so as to improve the accuracy of wafer measurement.

Fig. 1 schematically illustrates a wafer measurement method according to an exemplary embodiment of the present invention. The method provided by the embodiment of the invention can be executed by any electronic equipment with computer processing capability, such as a terminal device and/or a server. Referring to fig. 1, the wafer measuring method is applied to a patterned wafer, and may include the following steps:

step S102, obtaining a wafer measurement area image;

step S104, identifying a characteristic mark in the wafer measurement area image;

step S106, determining the actual position of the feature mark in the wafer measurement area image;

step S108, determining the offset of the feature mark according to the actual position of the feature mark and the standard position of the feature mark;

step S110, determining the offset of the measuring point in the wafer measuring area image according to the offset of the characteristic mark.

The patterned wafer is subjected to exposure, development, etching and other processes.

In the technical scheme of the embodiment of the invention, the offset of the measuring point in the wafer measuring area image is determined according to the offset of the actual position of the characteristic mark and the standard position of the characteristic mark and the relative position fixation of the characteristic mark and the measuring point, so that the measuring of the measuring point in the wafer can be realized.

In step S102, a wafer measurement area image is acquired.

FIG. 2 illustrates a schematic view of a wafer metrology area image 200 in one embodiment of the present disclosure. Referring to fig. 2, the image 200 is fixed in size, and the coordinates (0,0) are defined as the lower left corner of the image 200, (a, b) are the center of the image 200, and (a, b) are always the center of the actual measurement point of the machine. Defining the coordinates of the feature mark 201 in the image 200 with respect to the standard center point of the origin as (m, n); the coordinates of the center point of the feature mark 201 in the actual measurement result of the machine are marked as (m ', n'). The standard center point coordinates of the measurement point 202 in the image 200 with respect to the origin are defined as (c, d), and the center point coordinates of the actual measurement point of the machine are labeled as (c ', d').

In step S104, a feature mark in the wafer metrology area image is identified.

Referring to fig. 2, in step S104, a feature mark 201 in the wafer metrology area image 200 is identified. In one embodiment, the feature 201 is unique within the wafer metrology area image 200. In one embodiment, the feature marks in the wafer metrology area image are identified according to standard feature marks corresponding to the feature marks in the layout, wherein the positions of the standard feature marks are standard positions of the feature marks. In actual operation, the wafer metrology area image 200 may be matched with a standard signature corresponding to the signature in the layout to obtain the signature 201. In some embodiments, the feature marks may be special patterns in the image that are clearly recognizable at any edge or that are clearly distinguishable from other similar patterns in the metrology image. If the measurement point or a combination of multiple measurement points is unique and easily identifiable, it can also be used as a feature marker. Likewise, bars and squares may be used as the feature marks. FIG. 3 illustrates a schematic diagram of a signature in one embodiment of the present disclosure. In one embodiment, when the feature mark in the wafer measurement area image cannot be identified, the wafer measurement area is prompted to shift. That is, if the feature mark cannot be recognized when the wafer measurement area image is recognized, a prompt is issued.

In step S106, the actual position of the feature mark in the wafer metrology area image is determined.

Referring to fig. 2, in step S106, in one embodiment, determining the actual position of the feature mark 201 in the wafer metrology area image 200 includes: the center coordinates (m ', n') of the feature markers 201 in the wafer metrology area image 200 are determined.

In step S108, an offset of the feature mark is determined according to the actual position of the feature mark and the standard position of the feature mark.

In one embodiment, the feature labels in the wafer metrology area image and corresponding standard feature labels in the layout are transformed into the same coordinate system.

Referring to fig. 2, in step S108, in one embodiment, comparing the actual position coordinates (m ', n') of the feature marker 201 with the standard position coordinates (m, n) of the feature marker 201 to determine the offset of the feature marker comprises: the center coordinates (m ', n') of the feature mark 201 in the wafer metrology area image 200 are compared to the center coordinates (m, n) of the standard feature mark to obtain an offset of the center coordinates of the feature mark 201 in the wafer metrology area image 200. Fig. 2 is an image of the wafer measurement area in an ideal state, where (m ', n') coincides with (m, n), but (m ', n') has a certain offset with respect to (m, n) in actual measurement, as shown in fig. 4 and 5. In one embodiment, the actual position and the standard position of the feature mark in the wafer metrology area image comprise center coordinates of the actual position and the standard position of the feature mark in the wafer metrology area image. In one embodiment, the offset of the actual position of the feature mark in the wafer metrology area image from the standard position is an offset of a center coordinate of the actual position of the feature mark in the wafer metrology area image from a center coordinate of the standard position.

In step S110, the offset of the metrology point in the wafer metrology area image is determined according to the offset of the feature mark.

Referring to fig. 2, in step S110, in one embodiment, the offset of the metrology point 202 in the wafer metrology area image 200 is estimated according to the relative position of the standard position (m, n) of the standard feature mark in the layout and the metrology point (c, d) in the layout and according to the offset of the feature mark 201. That is, since the relative positions of the feature marks and the measurement points are fixed in the layout, the amount of shift of the feature mark 201 can be equivalent to the amount of shift of the measurement points at the time of actual measurement.

In one embodiment, the preset range of the offset is set according to the measurement point and the size of the measurement light spot of the machine. In one embodiment, the measurement spot and the machine measurement spot are fixed in size. In one embodiment, the size of the measurement spot is the length or width of the measurement spot, and the size of the measurement spot is the diameter of the measurement spot. In one embodiment, when the offset of the measurement point in the wafer measurement area image is within a preset range, the detection is prompted to pass or not to be prompted.

FIG. 4 illustrates a schematic view of a wafer metrology area image 400 in one embodiment of the present disclosure. Referring to fig. 4, the size of the measurement spot 402 is fixed to the size of the measurement spot 403 of the machine, in an embodiment, the length and width of the measurement spot 402 is 80 μm × 80 μm, the diameter d of the measurement spot 403 of the machine is 60 μm, the center coordinates of the actual position of the feature mark are (m ', n'), and the center coordinates of the standard position are (m, n), so that the predetermined range is m-10 ≦ m '≦ m +10, and n-10 ≦ n' ≦ n + 10. Since the position of the measurement point 402 is fixed relative to the feature mark 401, the offset between the coordinate of the standard center point (c, d) of the measurement point 402 and the coordinate of the actual measurement center point (c ', d') can be calculated according to the offset between the coordinate of the center of the actual position of the feature mark 401 and the coordinate of the center of the standard position, and then whether the measurement point 402 is offset is determined, specifically, the determining step is as follows:

if m ', n', i.e., c ', a, d', b, the actual measurement point of the machine is the center of the measurement point that needs to be measured, which means that the offset of the measurement point is within the preset range, as shown in fig. 2.

If m-10. ltoreq. m '. ltoreq.m +10 and n-10. ltoreq. n +10, then c-10. ltoreq. c +10 and d-10. ltoreq. d +10, i.e.a-10. ltoreq. c '. ltoreq.a +10 and b-10. ltoreq. d '. ltoreq.b +10, the point of measurement is stated to be within the predetermined range, although it is offset to some extent, as shown in FIG. 4.

In one embodiment, when the offset of the measuring point exceeds a preset range, alarm information is output or the measuring point is prompted to offset.

FIG. 5 illustrates a schematic view of a wafer metrology area image 500 in one embodiment of the present disclosure.

Referring to fig. 5, the dimension of the measurement spot 502 is fixed with the dimension of the measurement spot 503 of the machine, in an embodiment, the length and width of the measurement spot 502 is 80 μm × 80 μm, the diameter d of the measurement spot 403 of the machine is 60 μm, the center coordinates of the actual position of the feature mark are (m ', n'), and the center coordinates of the standard position are (m, n), so that the predetermined range is m-10 ≦ m '≦ m +10, and n-10 ≦ n' ≦ n + 10. Since the position of the measurement point 502 is fixed relative to the feature mark 501, the offset between the coordinate of the standard center point (c, d) of the measurement point 502 and the coordinate of the actual measurement center point (c ', d') can be calculated according to the offset between the coordinate of the center of the actual position of the feature mark 501 and the coordinate of the center of the standard position, and then whether the measurement point 502 is offset is determined, specifically, the determining step is as follows:

if m 'is less than or equal to m-10 or m' is less than or equal to m +10 or n 'is less than or equal to n-10 or n' is less than or equal to n +10, then c 'is less than or equal to c-10 or c' is less than or equal to c +10 or d 'is less than or equal to d-10 or d' is greater than or equal to d +10, i.e. c 'is less than or equal to a-10 or c' is greater than or equal to a +10 or d 'is less than or equal to b-10 or d' is greater than or equal to b +10, then the measurement point is completely out of the preset range of measurement, and the machine station will send out an alarm signal after detecting that the measurement point is out of the preset range to prompt a technician.

In the actual wafer measurement process, the machine usually records the final measurement position in the form of an image, and taking the film thickness measurement machine as an example, ideally, the center of the measurement point coincides with the center point of the image, as shown in fig. 2.

In the actual measurement, the size of the measuring point and the size of the machine measuring spot are known, so that when the measuring point in the image obtained by the final test of the computer machine and the size of the machine measuring spot are obtained, the size of the measuring point in the image and the size of the machine measuring spot can be finally obtained by converting the proportional relation between the image size and the actual sizes of the measuring point and the machine measuring range.

The feature mark is defined and the measured image is identified, and since the relative position between the feature mark and the center of the measurement point is fixed, the change of the center point of the measurement point can be obtained through the change of the center point position of the feature mark, and whether the measurement point is deviated or not can be further judged, as shown in fig. 4 and 5.

Fig. 6 shows a schematic flow chart of wafer metrology according to an embodiment of the present disclosure, which includes the following steps:

s602: acquiring measurement area images, measuring the positions of the patterned wafer, generating real-time measurement images after the measurement of each position is finished, and numbering the measurement images of different positions as an image 1 … image n respectively;

s604: and identifying the characteristic mark, identifying the pixel point in the measured image according to the pixel characteristic of the characteristic mark in the layout, extracting the pixel characteristic when the pixel characteristic of the pixel point in the measured image corresponds to the pixel characteristic of the characteristic mark in the layout to obtain the image corresponding to the characteristic mark in the measured image, and if the pixel characteristic does not correspond to the pixel characteristic, failing to identify and further judging that the measured position of the wafer deviates.

S606: acquiring the actual position coordinates of the feature marker in the measurement image, and after acquiring the image corresponding to the feature marker in the measurement image, as shown in fig. 2, directly acquiring the actual position coordinates (m ', n') of the feature marker in the measurement image 200 according to the measurement image 200;

s608: calculating an offset, comparing the actual position coordinates (m ', n') of the feature marks with the input standard position coordinates (m, n) of the feature marks, and if the calculated offset is within a preset range, displaying that the measured position is correct; otherwise, the measurement position is displayed to be deviated.

Embodiments of the apparatus of the present invention are described below, which can be used to perform the wafer position measurement method of the present invention.

As shown in fig. 7, a wafer measuring apparatus 700 according to an embodiment of the present invention may include:

an obtaining module 710, configured to obtain an image of a wafer measurement area;

an identifying module 720, configured to identify a feature mark in the wafer metrology area image;

a determining module 730 for determining an actual position of the feature mark in the wafer metrology area image;

an analysis module 740, configured to determine an offset of the feature mark according to the actual position of the feature mark and the standard position of the feature mark, and determine an offset of a measurement point in the wafer metrology area image according to the offset of the feature mark.

For details which are not disclosed in the embodiments of the apparatus of the present invention, reference is made to the above-described embodiments of the wafer measuring method of the present invention, since each functional module of the wafer measuring apparatus of the exemplary embodiments of the present invention corresponds to a step of the above-described exemplary embodiments of the wafer measuring method.

In the wafer measuring device provided in the embodiment of the present invention, the offset of the measuring point in the image of the wafer measuring area is determined by the offset between the actual position of the feature mark and the standard position of the feature mark. The scheme of the invention can judge and find the offset problem of the measuring point position in real time, and is beneficial to adjusting the measuring position in time, thereby ensuring the accuracy of the measuring result.

Referring now to FIG. 8, shown is a block diagram of a computer system 800 suitable for use in implementing an electronic device of an embodiment of the present invention. The computer system 800 of the electronic device shown in fig. 8 is only an example, and should not bring any limitation to the function and the scope of use of the embodiments of the present invention.

As shown in fig. 8, the computer system 800 includes a Central Processing Unit (CPU)801 that can perform various appropriate actions and processes in accordance with a program stored in a Read Only Memory (ROM)802 or a program loaded from a storage section 808 into a Random Access Memory (RAM) 803. In the RAM 803, various programs and data necessary for system operation are also stored. The CPU 801, ROM 802, and RAM 803 are connected to each other via a bus 804. An input/output (I/O) interface 805 is also connected to bus 804.

The following components are connected to the I/O interface 805: an input portion 806 including a keyboard, a mouse, and the like; an output section 807 including a signal such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage portion 808 including a hard disk and the like; and a communication section 809 including a network interface card such as a LAN card, a modem, or the like. The communication section 809 performs communication processing via a network such as the internet. A drive 810 is also connected to the I/O interface 805 as necessary. A removable medium 811 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 810 as necessary, so that a computer program read out therefrom is mounted on the storage section 808 as necessary.

In particular, according to an embodiment of the present invention, the processes described above with reference to the flowcharts may be implemented as computer software programs. For example, embodiments of the invention include a computer program product comprising a computer program embodied on a computer-readable storage medium, the computer program comprising program code for performing the method illustrated by the flow chart. In such an embodiment, the computer program can be downloaded and installed from a network through the communication section 809 and/or installed from the removable medium 811. The computer program executes the above-described functions defined in the system of the present application when executed by the Central Processing Unit (CPU) 801.

It should be noted that the computer readable storage medium shown in the present invention can be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present invention, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In the present invention, however, a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable storage medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable storage medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams or flowchart illustration, and combinations of blocks in the block diagrams or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

The units described in the embodiments of the present invention may be implemented by software, or may be implemented by hardware, and the described units may also be disposed in a processor. Wherein the names of the elements do not in some way constitute a limitation on the elements themselves.

As another aspect, the present application also provides a computer-readable storage medium, which may be included in the electronic device described in the above embodiments; or may exist separately without being assembled into the electronic device. The computer readable storage medium carries one or more programs which, when executed by the electronic device, cause the electronic device to implement the wafer metrology method as described in the embodiments above.

For example, the electronic device may implement the various steps as shown in fig. 1.

It should be noted that although in the above detailed description several modules or units of the device for action execution are mentioned, such a division is not mandatory. Indeed, the features and functionality of two or more modules or units described above may be embodied in one module or unit, according to embodiments of the invention. Conversely, the features and functions of one module or unit described above may be further divided into embodiments by a plurality of modules or units.

Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein may be implemented by software, or by software in combination with necessary hardware. Therefore, the technical solution according to the embodiment of the present invention can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a usb disk, a removable hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which can be a personal computer, a server, a touch terminal, or a network device, etc.) to execute the method according to the embodiment of the present invention.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.