阅读说明：本技术 介质滤波器，收发信机及基站 (Dielectric filter, transceiver and base station ) 是由 张晓峰 袁本贵 刘止愚 沈振 于 2015-11-27 设计创作，主要内容包括：本发明实施例提供了一种介质滤波器,涉及通信设备组件技术领域,提供一种新的实现交叉耦合的介质滤波器结构。本发明实施例提供的介质滤波器包括至少三个介质谐振腔,每个谐振腔包括调试孔,调试孔位于本体上,每个调试孔与周围本体形成谐振腔；两两不相邻的谐振腔之间还包括有盲孔,盲孔用于实现交叉耦合。本发明实施例提供的介质谐振器简化了实现电容耦合的结构,使得结构更加小型化。(The embodiment of the invention provides a dielectric filter, relates to the technical field of communication equipment components, and provides a novel dielectric filter structure for realizing cross coupling. The dielectric filter provided by the embodiment of the invention comprises at least three dielectric resonant cavities, wherein each resonant cavity comprises a debugging hole, the debugging holes are positioned on a body, and each debugging hole and the surrounding body form a resonant cavity; and blind holes are also arranged between every two non-adjacent resonant cavities and are used for realizing cross coupling. The dielectric resonator provided by the embodiment of the invention simplifies the structure for realizing capacitive coupling, so that the structure is more miniaturized.)

1. A dielectric filter comprising a body, and further comprising:

each resonant cavity comprises debugging holes, the debugging holes are positioned on the body, and each debugging hole and the surrounding body form a single resonant cavity; blind holes are further formed among the resonant cavities and used for realizing cross coupling;

the through hole penetrates through the upper surface and the lower surface of the body, a first end of the section of the through hole is bent to face between the first debugging hole and the second debugging hole, and the first debugging hole is adjacent to the second debugging hole; and the second end of the cross section of the through hole is bent to face the first debugging hole and the third debugging hole, and the first debugging hole is adjacent to the third debugging hole.

2. The dielectric filter of claim 1, a depth of the blind hole being related to a transmission zero of the dielectric filter.

3. The dielectric filter of claim 1 or 2, the depth of the blind hole determining a polarity of cross-coupling of the dielectric filter, the polarity of cross-coupling comprising inductive coupling or capacitive coupling.

4. The dielectric filter of claim 3, wherein the depth of the blind holes determines the degree of cross-coupling of the dielectric filter.

5. The dielectric filter of any one of claims 1 to 4, wherein the depth of the blind holes is related to the polarity of the cross coupling, the depth of the blind holes is set from shallow to deep, and the polarity of the cross coupling is changed from inductive coupling to capacitive coupling.

6. The dielectric filter according to any one of claims 1 to 5, wherein the shape of the blind hole includes any one of: cylindrical, groove-shaped, strip-shaped and hole-shaped.

7. A dielectric filter as recited in claim 1, wherein the width of the blind hole is related to a transmission zero.

8. The dielectric filter of claim 4, wherein the width of the blind via is related to a transmission zero, comprising:

the larger the width of the blind hole is, the smaller the relative position of the transmission zero is, and the relative position of the transmission zero is larger than 1 relative to the central frequency point position of the dielectric filter.

9. The dielectric filter of any of claims 1 to 5, wherein the depth of the tuning holes is used to determine the resonant frequency of the resonant cavity corresponding to the tuning holes.

10. A transceiver, characterized in that it comprises a dielectric filter according to any one of claims 1 to 6.

11. A base station, characterized in that it comprises a transceiver according to claim 7.

Technical Field

The present invention relates to communication equipment components, and more particularly to dielectric filters, transceivers and base stations.

Background

In modern mobile communication technology, a dielectric filter has become an essential important component, and is widely applied to various mobile communication systems for filtering out noise waves or interference signals outside communication signal frequencies.

As with the metal filter, achieving high selectivity of the dielectric filter requires cross-coupling to be formed in the dielectric filter. The cross coupling is divided into two forms of capacitive coupling and inductive coupling, wherein the capacitive coupling is to form a transmission zero at the low end of the response of the dielectric filter so as to form high selectivity of the low end of the dielectric filter; inductive coupling is the formation of transmission zeros at the high end of the dielectric filter response, thus creating high selectivity at the high end of the dielectric filter. At present, in a dielectric filter commonly used in the industry, a transmission zero of the dielectric filter can only realize inductive coupling, and an additional structure such as a cross-over PCB or a jumper cable is required to be cascaded outside a medium to realize capacitive coupling of the dielectric filter, or another non-cross-coupled adjacent cavity structure is required to realize capacitive coupling of the dielectric filter. These additional structures cause inconvenience to the fabrication, assembly and debugging of the dielectric filter.

In addition, with the increasing development of wireless communication technology, the volume miniaturization of the base station is required. The volume occupied by the dielectric filter in the base station also needs to be miniaturized, and the existing dielectric filter capable of realizing capacitive coupling can be realized only by a cascade attachment structure outside the medium, so that the existing dielectric filter cannot meet the requirement of the existing communication technology on the miniaturization of the base station.

Disclosure of Invention

The embodiment of the invention provides a dielectric filter, which solves the problem that the existing dielectric filter capable of realizing capacitive coupling occupies a large volume.

In a first aspect, an embodiment of the present application provides a dielectric filter, including a body, at least three resonant cavities, each resonant cavity including a tuning hole, the tuning holes being located on the body, each tuning hole forming a single resonant cavity with the surrounding body; and blind holes are also arranged between every two non-adjacent resonant cavities, the blind holes are not connected with the debugging holes, and the blind holes are used for realizing cross coupling. A conductive layer is also attached to the surface of the body of the resonant cavity.

In one possible design, the depth of the blind hole is related to the transmission zero of the dielectric filter.

In one possible design, the different blind hole depths may determine the polarity of cross-coupling of the dielectric filter, including inductive coupling or capacitive coupling.

In one possible design, different blind hole depths may determine different degrees of cross-coupling of the dielectric filter.

In one possible design, the depth of the blind hole is related to the polarity of the cross coupling, the depth of the blind hole is from shallow to deep, and the polarity of the cross coupling can be correspondingly changed from inductive coupling to capacitive coupling.

In one possible design, the shape of the blind hole includes any of the following: cylindrical, groove-shaped, strip-shaped and hole-shaped.

In one possible design, the width of the blind hole is related to the transmission zero. Specifically, the larger the width of the blind hole is, the smaller the relative position of the transmission zero is, and the relative position of the transmission zero is greater than 1 relative to the position of the central frequency point of the dielectric filter.

In one possible design, different depths of the debugging holes can be used for determining different resonant frequencies of the resonant cavities corresponding to the debugging holes, and each debugging hole can have different depths, so that the resonant cavity corresponding to each debugging hole can be provided with independent resonant frequencies according to specific scenes, and the resonant frequencies can be the same.

In another aspect, embodiments of the present invention provide a transceiver including various possible dielectric filters as described above.

In another aspect, an embodiment of the present invention further provides a base station, including the transceiver as described above.

The dielectric filter, the transceiver and the base station provided by the embodiment of the invention realize capacitive coupling through a new internal structure, simplify the manufacturing process and enable the structure of the dielectric filter to be more miniaturized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.

Fig. 1 is a perspective view of a structure of a dielectric filter according to an embodiment of the present invention;

fig. 2 is a top view of a structure of a dielectric filter according to an embodiment of the present invention;

fig. 3 is a bottom view of a structure of a dielectric filter according to an embodiment of the present invention;

fig. 4 is a simulation diagram of an implementation of inductive coupling of a dielectric filter according to an embodiment of the present invention;

fig. 5 is a simulation diagram of implementing capacitive coupling of a dielectric filter according to an embodiment of the present invention;

fig. 6 is a perspective view of a structure of a dielectric filter according to an embodiment of the present invention;

fig. 7 is a perspective view of a structure of a dielectric filter according to an embodiment of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

The structure and the application scenario described in the embodiment of the present invention are for more clearly illustrating the technical solution of the embodiment of the present invention, and do not limit the technical solution provided in the embodiment of the present invention, and it can be known by those skilled in the art that along with the development of communication technology, the technical solution provided in the embodiment of the present invention is also applicable to similar technical problems.

In view of the problems of the prior dielectric filter mentioned in the background art, the embodiment of the present invention provides a dielectric filter, and creatively provides a new structure to realize capacitive coupling without an additional structure of dielectric external cascade. The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be noted that the drawings provided by the embodiments of the present invention are only schematic illustrations of the embodiments of the present invention, and are not intended to limit the scope of the present invention.

As shown in fig. 1, the dielectric filter includes at least three resonant cavities, and the embodiment of the present invention is described by taking a dielectric filter including four resonant cavities as an example. The main structure of the dielectric resonator comprises a body (1), wherein 4 debugging holes (11, 12, 13 and 14) are respectively arranged at four corners of the body (1), and through holes (101 and 102) are also arranged between adjacent debugging holes. The through hole penetrates through the upper surface and the lower surface of the body (1). In the present embodiment, the through holes (101 and 102) are each designed as a bar-shaped groove, and both ends thereof are bent toward between adjacent two of the debugging holes, respectively. Taking the through hole (101) as an example, the through hole (101) is in a strip groove shape, the depth of the through hole penetrates through the upper surface and the lower surface of the body (1), one end (1011) of the strip groove shape is bent to face between the debugging hole (11) and the debugging hole (12), and the other end is bent to face between the debugging hole (11) and the debugging hole (14). The via (101) isolates the pilot hole (11) from other pilot holes (e.g., 12 and 14) to form a resonant cavity around the pilot hole (11). Similarly, the through hole (101) and the through hole (102) separate the 4 tuning holes, so that a single resonant cavity is formed around each tuning hole. Thus, the dielectric resonator shown in fig. 1 contains 4 resonant cavities. One end of each debugging hole penetrates through the upper surface of the body (1), the other end of each debugging hole penetrates into the body (1) to form a concave shape, the depth of each debugging hole can be designed and manufactured as required, different depths can be set through the debugging holes, so that the formed resonant cavities form different resonant frequencies, each debugging hole can be set to different depths according to specific application scenes, the debugging holes can be set to the same depth, and the debugging holes can also be set to different depths.

As shown in fig. 1, the resonant cavity formed around the tuning hole (12) is not adjacent to the resonant cavity formed around the tuning hole (14). For the two non-adjacent resonant cavities, a blind hole (100) is arranged, the position of which is shown in figure 1, and the blind hole (100) is arranged between the debugging hole (12) and the debugging hole (14). The blind hole (100) in the embodiment is designed to be in a strip groove shape, the upper end of the blind hole (100) penetrates through the upper surface of the body (1), and the lower end of the blind hole can be set to be deep as required. One end of the blind hole (100) is close to the resonant cavity formed by the debugging hole (12), and the other end is close to the resonant cavity formed by the debugging hole (14). Two ends of the blind hole (100) are not communicated with the debugging hole (12) and the debugging hole (14). The blind hole (100) is not communicated with the through holes (101 and 102) positioned at both sides thereof.

The shapes of the through hole, the debugging hole and the blind hole in the embodiment of the invention can be square, round, strip, olive or other shapes on the plane, and are not limited in the embodiment of the invention.

Wherein the body (1) is typically made of a solid dielectric material, preferably ceramic. The ceramic has high dielectric constant and good hardness and high temperature resistance, so the ceramic becomes a common solid dielectric material in the field of dielectric filters. Of course, other materials known to those skilled in the art, such as glass, electrically insulating polymers, etc., may be used as the dielectric material.

In the specific design and manufacture, the body with the debugging holes, the through holes and the blind holes can be obtained by forming the integrated body (1), and then the surface metallization, such as surface electroplating, is carried out on the body to obtain the dielectric filter. In this way, the body of the dielectric resonator comprised by the dielectric filter is continuous. The dielectric filter is obtained by adopting an integrated forming mode, so that the processing technology is simpler.

For a dielectric filter with more cavities, as shown in fig. 7, a dielectric filter with more resonant cavities can be formed by cascading on the basis of a fixed structure with three cavities (as shown in fig. 6) or four cavities. For a dielectric filter with more cavities, blind holes are arranged between non-adjacent resonant cavities, so that cross coupling is realized. The structural implementation of the dielectric filter including three resonant cavities or a dielectric filter including more resonant cavities is not described herein with reference to the above embodiments.

The blind holes (100) are associated with the coupling of a dielectric filter, and the cross-coupling form of the dielectric filter can be determined by determining the depth of the blind holes (100). The depth of the blind hole herein means the depth of the blind hole from the upper surface of the dielectric filter to the inside of the dielectric filter body (1). By determining that the depth of the blind hole is changed from small to large, the polarity of cross coupling of the dielectric filter can be changed from inductive coupling to capacitive coupling. The depth of the blind hole can be set according to the requirements of application scenes, so that the cross coupling degree is changed in different degrees.

In the specific design and manufacture, the depth of the blind hole is generally determined according to the requirements of application scenarios and then fixed. Specifically, according to the cross coupling characteristics to be realized by the dielectric filter, for example, the corresponding degree of inductive coupling to be realized, the corresponding depth of the blind hole is determined and then fixed; correspondingly, the corresponding depth of the blind hole can also be determined and fixed according to the corresponding degree of capacitive coupling to be realized. Through a fixed implementation mode, the quality is controllable during manufacturing, and the parameters can be ensured not to deviate during subsequent use, so that the quality is more stable. In the implementation, the blind hole depth adjustable dielectric filter can be designed to adapt to application scenes needing different parameters.

The depth of the blind hole can be set according to the requirements of the practical application scenario, such as the frequency of the transmission zero, or the degree of inductive coupling or capacitive coupling to be realized, which is not limited herein.

The number of the blind holes (100) connecting two non-adjacent resonant cavities shown in fig. 1 is one, but a plurality of blind holes can be designed, and the number, the position, the specific depth and the like of the blind holes can be determined according to the number of zero points and/or the frequency which are actually required to be transmitted.

The width of the blind hole (100) is related to the transmission zero point. Specifically, the larger the width of the blind hole is, the smaller the relative position of the transmission zero is, and the relative position of the transmission zero is greater than 1 relative to the position of the central frequency point of the dielectric filter.

The blind holes also have resonance frequencies, the resonance frequencies of the blind holes generally do not participate in resonance of the pass band of the filter body, namely the resonance frequencies of the blind holes can be higher than the resonance frequency of the pass band of the filter and can also be lower than the resonance frequency of the pass band of the filter, when the resonance frequencies of the blind holes are higher than the frequency of the pass band of the dielectric filter, the cross coupling shows inductive coupling, and when the resonance frequencies of the blind holes are lower than the frequency of the pass band of the dielectric filter, the cross coupling shows capacitive coupling. The resonant frequency of the blind hole may be determined by the depth of the blind hole. As the depth of the blind holes increases, the resonant frequency of the blind holes gradually decreases, and the cross-coupling switches from inductive coupling to capacitive coupling as the frequency decreases from the high end to the low end of the pass band of the filter. In one specific implementation, a dielectric filter comprising four resonators, when the depth of the blind hole is 2/5 of the total height of the dielectric filter, the cross coupling is inductive coupling, and the transmission zero is on the right side of the passband, as shown in fig. 4. When the blind hole depth becomes 3/5 of total height, the cross-coupling is capacitive coupling with the transmission zero to the left of the passband, as shown in fig. 5.

The surface of the dielectric resonator is attached with a conductive layer. The blind hole, the through hole and the sunken surface of the debugging hole can be also attached with a conductive layer.

In the dielectric filter provided by the embodiment of the invention, the blind holes are connected between the nonadjacent resonant cavities, so that the capacitive coupling can be realized in the dielectric resonator without cascading an external additional structure, and the miniaturization of the dielectric filter is realized. Meanwhile, compared with a dielectric filter for realizing capacitive coupling by a cascade external additional structure, the manufacturing process of the structure for realizing cross coupling is simplified.

The dielectric filter provided by the embodiment of the invention is mainly used for the radio frequency front end of a high-power wireless communication base station.

The embodiment of the invention also provides a transceiver, and the dielectric filter provided in the embodiment is adopted in the transceiver. The dielectric filter may be used to filter a radio frequency signal.

The embodiment of the invention also provides a base station, and the base station adopts the transceiver provided in the embodiment.

The above-mentioned embodiments, objects, technical solutions and advantages of the present invention are further described in detail, it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made on the basis of the technical solutions of the present invention should be included in the scope of the present invention.