阅读说明：本技术 阴极驱动单元、溅射阴极和用于组装阴极驱动单元的方法 (Cathode drive unit, sputtering cathode and method for assembling cathode drive unit ) 是由 约阿希姆·松嫩申 丹尼尔·谢弗-科皮托 托拜西·伯格曼 于 2019-02-12 设计创作，主要内容包括：描述了一种用于沉积源的阴极驱动单元(100)。所述阴极驱动单元包括：阴极支撑件(102)；和带驱动器,所述带驱动器用于旋转所述阴极支撑件。所述带驱动器包括：第一滑轮(112),所述第一滑轮耦接到驱动所述阴极支撑件的轴(103)；驱动组件(120),所述驱动组件具有第二滑轮(114)；带(116),所述带与所述第一滑轮和所述第二滑轮接合；引导件(130),所述引导件支撑所述驱动组件的至少一部分；和张紧器(140),所述张紧器向所述驱动组件的至少所述部分提供力以用于沿所述引导件移动所述驱动组件的至少所述部分。(A cathode drive unit (100) for a deposition source is described. The cathode driving unit includes: a cathode support (102); and a tape drive for rotating the cathode support. The tape drive includes: a first pulley (112) coupled to a shaft (103) driving the cathode support; a drive assembly (120) having a second pulley (114); a belt (116) engaged with the first and second pulleys; a guide (130) supporting at least a portion of the drive assembly; and a tensioner (140) providing a force to at least the portion of the drive assembly for moving at least the portion of the drive assembly along the guide.)

1. A cathode drive unit for a deposition source, comprising:

a cathode support;

a tape drive for rotating the cathode support, the tape drive comprising:

a first pulley coupled to a shaft driving the cathode support;

a drive assembly having a second pulley;

a belt engaged with the first pulley and the second pulley;

a guide supporting at least a portion of the drive assembly; and

a tensioner providing a force to at least the portion of the drive assembly for moving at least the portion of the drive assembly along the guide.

2. The cathode drive unit according to claim 1, wherein the tensioner is selected from a spring, a pneumatic cylinder, a hydraulic cylinder.

3. The cathode drive unit according to any one of claims 1 to 2, further comprising:

a first stop defining an end position for insertion of at least the portion of the drive assembly relative to the guide.

4. The cathode drive unit according to any one of claims 1 to 3, further comprising: a second stop defining an end position for tensioning the belt.

5. The cathode drive unit according to any one of claims 1 to 4, wherein the guide is provided at a portion of a plate, in particular an electrically insulating plate.

6. The cathode drive unit according to claim 5 wherein the tensioner is coupled to the plate.

7. The cathode drive unit according to any one of claims 1 to 6, wherein the guide is provided by at least one of a projection or a groove.

8. The cathode drive unit according to any one of claims 1 to 7, further comprising:

a second plate configured to engage at least the portion of the drive assembly.

9. The cathode drive unit according to any one of claims 1 to 8, further comprising: a lock configured to be secured in a tensioned position.

10. A rotatable cathode for vacuum processing of a substrate, comprising:

the cathode drive unit according to any one of claims 1 to 9, configured to rotate a target of the rotatable cathode.

11. The rotatable cathode of claim 10, further comprising:

a further tape drive configured to rotate a magnet assembly within the target, the further tape drive comprising:

a further first pulley coupled to a shaft, the shaft driving the cathode support;

a further drive assembly having a further second pulley;

a further belt engaged with the further first pulley and the further second pulley;

a further guide supporting at least a portion of the further drive assembly; and

a further tensioner providing a force to at least the portion of the further drive assembly for moving at least the portion of the further drive assembly along the further guide.

12. Rotatable cathode according to any one of claims 10 to 11, wherein the tensioner is selected from a spring, a pneumatic cylinder, a hydraulic cylinder.

13. The rotatable cathode of any one of claims 10 to 12, further comprising:

a first stop defining an end position for insertion of at least the portion of the drive assembly relative to the guide; and

a second stop defining an end position for tensioning the belt.

14. The rotatable cathode of any one of claims 10 to 13, further comprising:

a further lock configured to be secured in a tensioned position of the further belt.

15. A method of tensioning a belt of a belt drive for rotation of a cathode, comprising:

moving at least a portion of the drive assembly in the installed position;

mounting the belt to a cathode support and the drive assembly;

connecting at least the portion of the drive assembly to a tensioner;

moving at least the portion of the drive assembly to a stop position against the force of the tensioner; and

optionally, the position of at least the portion of the drive assembly is fixed at the stop position.

FIELD

Embodiments described herein relate to layer deposition by sputtering from a target. In particular, embodiments of the present disclosure may relate to a rotatable cathode and a Cathode Drive Unit (CDU). Some embodiments are particularly directed to sputtering layers on large area substrates. Embodiments described herein relate in particular to a sputter deposition apparatus comprising one or more cathode assemblies, in particular rotatable cathode assemblies having a cathode drive unit for rotating the cathode, in particular a rotatable (i.e. cylindrical) cathode.

Background

In many applications, it is necessary to deposit a thin layer on a substrate. The substrate may be coated in one or more chambers of a coating apparatus. The substrate may be coated in vacuum using vapor deposition techniques.

Several methods are known for depositing materials on a substrate. For example, the substrate may be coated by a Physical Vapor Deposition (PVD) process, a Chemical Vapor Deposition (CVD) process, a Plasma Enhanced Chemical Vapor Deposition (PECVD) process, or the like. The process is performed in the processing equipment or chamber in which the substrate to be coated is located. A deposition material is provided in the apparatus. A variety of materials and their oxides, nitrides or carbides may be used for deposition on the substrate. The coated material can be used in several applications and in several technical fields. For example, substrates for displays are typically coated by a Physical Vapor Deposition (PVD) process. Further applications include insulating panels, Organic Light Emitting Diode (OLED) panels, substrates with Thin Film Transistors (TFTs), color filters or the like.

For PVD processes, the deposition material may be present in a solid phase as a target. By bombarding the target with energetic particles, atoms of the target material (i.e. the material to be deposited) are emitted from the target. Atoms of the target material are deposited on the substrate to be coated. In PVD processes, the sputtered material (i.e., the material to be deposited on the substrate) may be arranged in different ways. For example, the target may be made of the material to be deposited, or may have a backing member on which the material to be deposited is fixed. A target comprising a material to be deposited is supported or fixed in a predetermined position in the deposition chamber. In case a rotatable target is used, the target is connected to a rotating shaft or to a connecting element connecting the shaft and the target.

Segmented planar targets, monolithic planar targets, and rotatable targets can be used for sputtering. Due to the geometry and design of the cathode, rotatable targets typically have higher utilization and increased operating time compared to planar targets. The use of a rotatable target can extend service life and reduce costs.

Sputtering can be performed as magnetron sputtering, wherein a magnet assembly is utilized to confine the plasma to improve sputtering conditions. Plasma confinement can be used to adjust the particle distribution of the material to be deposited on the substrate.

The cathode drive units rotate the target and/or cathode, respectively, requiring maintenance. Particularly for large area substrates having multiple cathodes for depositing material on the substrate, maintenance can be time consuming. It would therefore be beneficial to provide an improved cathode drive unit, an improved cathode, an improved deposition system and an improved method of mounting a cathode drive unit.

SUMMARY

In view of the above, a method and a charged particle multibeam apparatus for inspecting a sample with an array of charged particle beamlets according to the independent claims are provided. Further aspects, advantages and features are apparent from the dependent claims, the description and the accompanying drawings.

According to one embodiment, a cathode drive unit for a deposition source is provided. The cathode driving unit includes: a cathode support; and a tape drive for rotating the cathode support. The tape drive includes: a first pulley coupled to a shaft driving the cathode support; a drive assembly having a second pulley; a belt engaged with the first pulley and the second pulley; a guide supporting at least a portion of the drive assembly; and a tensioner providing a force to at least the portion of the drive assembly for moving at least the portion of the drive assembly along the guide.

According to one embodiment, a rotatable cathode for vacuum processing of a substrate is provided. The cathode includes a cathode drive unit according to any one of the embodiments of the present disclosure to rotate a target of the rotatable cathode.

According to one embodiment, a method of tensioning a belt of a belt drive for cathode rotation is provided. The method comprises the following steps: moving at least a portion of the drive assembly in the installed position; mounting the belt to a cathode support and the drive assembly; connecting at least the portion of the drive assembly to a tensioner; moving at least the portion of the drive assembly to a stop position against the force of the tensioner; and optionally fixing the position of at least the portion of the drive assembly at the stop position.