阅读说明：本技术 一种超薄无纺布基材的双面胶产品无溢胶冲切方法 (Glue overflow-free punching method for double-sided adhesive tape product of ultrathin non-woven fabric substrate ) 是由 刘晓鹏 周姿 于 2019-11-27 设计创作，主要内容包括：本发明涉及一种超薄无纺布基材的双面胶产品无溢胶冲切方法,包括S1：覆膜,将无纺布基材的双面胶产品的PI层上覆盖保护膜层,将该保护膜层作为辅助承载膜,以该保护膜作为底层的承载带；S2：冲切,采用刀具以辅助离型膜作为冲切的起始位置,垂向由上至下冲切,直至切断PI层；S3：撕去保护膜,排出废料,得到冲切后的成品料带。与现有技术相比,本发明中重新设计了冲切方案,使得溢胶的产生方向收到了相反的水平作用冲量,并扩开了冲切处的口径,避免了溢胶的产生；本技术方案简便快捷,可广泛的适配于冲切生产线,并适用于各种形状的超薄无纺布基材的双面胶产品的批量化冲切,使得产品的良率显著提升。(The invention relates to a non-glue-overflow punching method for a double-sided adhesive tape product of an ultrathin non-woven fabric substrate, which comprises the following steps of S1: covering a film, namely covering a protective film layer on a PI layer of a double-sided adhesive tape product of a non-woven fabric substrate, taking the protective film layer as an auxiliary bearing film, and taking the protective film as a bearing belt of a bottom layer; s2: punching, namely punching vertically from top to bottom by using a cutter and taking the auxiliary release film as an initial punching position until the PI layer is cut off; s3: and tearing off the protective film, and discharging waste materials to obtain the punched finished material belt. Compared with the prior art, the punching scheme is redesigned, so that the generation direction of the excessive glue receives opposite horizontal action impulse, the caliber of the punching part is expanded, and the excessive glue is avoided; this technical scheme is simple and efficient, but extensive adaptation in die-cut production line to be applicable to the batched die-cut of the double faced adhesive tape product of the ultra-thin non-woven fabrics substrate of various shapes, make the yield of product show the promotion.)

1. The double-sided adhesive tape product non-glue-overflow punching method of the ultrathin non-woven fabric substrate is characterized by comprising the following steps of:

s1: covering a film, namely covering a protective film layer on a PI layer of a double-sided adhesive tape product of a non-woven fabric substrate, taking the protective film layer as an auxiliary bearing film, and taking the protective film as a bearing belt of a bottom layer;

s2: punching, namely punching vertically from top to bottom by using a cutter and taking the auxiliary release film as an initial punching position until the PI layer is cut off;

s3: and tearing off the protective film, and discharging waste materials to obtain the punched finished material belt.

2. The non-overflow punching method for the double-sided adhesive tape product of the ultrathin non-woven fabric substrate according to claim 1, wherein the thickness of the double-sided adhesive tape layer in the double-sided adhesive tape product is 0.02-0.04 mm.

3. The overflow-free punching method for the double-sided adhesive tape product of the ultrathin non-woven fabric substrate as claimed in claim 2, wherein the thickness of the double-sided adhesive tape layer in the double-sided adhesive tape product is 0.03 mm.

4. The no-glue-overflow punching method for the double-sided adhesive tape product of the ultrathin non-woven fabric base material as claimed in claim 1, wherein each layer structure after the film is coated in the step S1 is as follows in sequence: auxiliary release film layer, non-woven fabric double-sided adhesive layer, PI layer, protection film layer.

5. The no-flash punching method for double sided tape products of ultrathin non-woven fabrics as claimed in claim 1, wherein the section of the blade used in punching in S2 is triangular.

6. The no-flash punching method for double sided tape products of ultrathin non-woven fabrics as claimed in claim 5, characterized in that the section of the blade used in punching in S2 is right triangle.

7. The no-flash punching method for double sided tape products of ultrathin non-woven fabrics as claimed in claim 6, characterized in that the right angle long side of the section of the punching type blade in S2 is vertical.

8. The method for die-cutting the double-sided adhesive tape product of the ultrathin non-woven fabric substrate without the flash according to claim 1, wherein the die-cutting direction in the step S2 is from the auxiliary release film layer to the protective film layer.

Technical Field

The invention relates to a preparation process of a double-sided adhesive tape product, in particular to a glue overflow-free punching method of a double-sided adhesive tape product of an ultrathin non-woven fabric substrate.

Background

For a double-sided adhesive tape product of an ultrathin non-woven fabric substrate, which comprises three layers of a PI layer, a non-woven fabric double-sided adhesive layer and a release film, see FIG. 1, wherein the thickness of the non-woven fabric double-sided adhesive layer is usually 0.03mm, the substrate of the non-woven fabric double-sided adhesive layer is an ultrathin non-woven fabric, glue is coated on two sides of the non-woven fabric, and the double-sided adhesive tape is formed by processing; the PI layer is a high-temperature-resistant hard material layer and is characterized in that the PI layer is not easy to separate after being bonded with the adhesive layer.

In the prior art, the double-sided adhesive tape products of ultrathin non-woven fabric substrates need to be punched so as to obtain the double-sided adhesive tape products with various shapes and sizes. However, in the existing punching technical scheme, punching is usually performed along the direction in fig. 1, glue overflow occurs after the product is punched, a partial product drawing obtained by waste discharge after punching is shown in fig. 2, and a phenomenon that glue is obviously pulled out at the punching boundary in the drawing, so that the glue overflow condition at the punching edge has a certain adverse effect on the quality of the product. The cutter is further applied to the punching of the double-sided adhesive tape product of the ultrathin non-woven fabric substrate in the prior art by replacing the cutter, but the effect is not ideal, and the adhesive overflow condition is difficult to eliminate.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide the glue overflow-free punching method for the double-sided adhesive tape product of the ultrathin non-woven fabric substrate, so that the glue overflow condition is avoided and the product yield is improved.

Aiming at the glue overflow condition, the invention analyzes the mechanism of the source of glue overflow and takes the mechanism analysis as the starting point of the invention.

Firstly, when the cutter is punched in the punching direction in fig. 1, the cutter cuts off the PI layer and the non-woven double-sided adhesive layer in sequence, and the common thickness of the non-woven double-sided adhesive layer is 0.03mm, so that the non-woven double-sided adhesive layer can be cut off only through the cutter point part in the punching process of the cutter, and the punching effect schematic diagram is shown in fig. 3. According to the punching effect graph, the cutter point finally penetrates through the double-sided adhesive layer of the non-woven fabric in the state after punching is finished, the adhesive surface can be seen to be thinner under a microscope due to the thinner thickness of the adhesive, and the adhesive is found to have flowability when being scraped by using tweezers, so that the two sides of the double-sided adhesive layer of the cut non-woven fabric generate adhesive overflow in the middle.

The invention improves the punching method according to the mechanism of glue overflow generation, and the aim of the invention can be realized by the following technical scheme:

the double-sided adhesive tape product non-glue-overflow punching method of the ultrathin non-woven fabric substrate comprises the following steps of:

s1: covering a film, namely covering a protective film layer on a PI layer of a double-sided adhesive tape product of a non-woven fabric substrate, taking the protective film layer as an auxiliary bearing film, and taking the protective film as a bearing belt of a bottom layer;

s2: punching, namely punching vertically from top to bottom by using a cutter and taking the auxiliary release film as an initial punching position until the PI layer is cut off;

s3: and tearing off the protective film, and discharging waste materials to obtain the punched finished material belt.

Furthermore, the thickness of the double-sided adhesive tape layer in the double-sided adhesive tape product is 0.02-0.04 mm.

Further preferably, the thickness of the double-sided adhesive tape layer in the double-sided adhesive tape product is 0.03 mm.

Further, each layer structure after coating in S1 is: auxiliary release film layer, non-woven fabric double-sided adhesive layer, PI layer, protection film layer.

Further, the blade used for the die cutting in S2 has a triangular cross section.

Further preferably, the section of the blade used for punching in S2 is a right triangle, and the right triangle blade can better provide horizontal momentum during punching, and is very suitable for use in the present invention.

Further, the long side of the right angle of the cross section of the die-cut blade in S2 is the vertical direction. Better results are obtained by concentrating the horizontal component of the action of the cutting edge on one side during the blanking process

Further, if the punched scrap is a closed figure, the direction corresponding to the blade bevel edge is the side of the scrap.

Further, the direction of the die cutting in S2 is from the auxiliary release film layer to the protective film layer.

The action mechanism is as follows: this technical scheme makes the blade point portion pass non-woven fabrics double-sided adhesive layer at die-cut in-process priority for non-woven fabrics double-sided adhesive layer is by vertical cutting off, and die-cut in-process moves down gradually along with the blade tip, and double-sided adhesive layer is widened gradually by the cutting edge of cutting off position department, makes non-woven fabrics double-sided adhesive layer receive the effect impulse of level to both sides, and the effect direction of this impulse is opposite with the production direction of overflowing gluey, just so prevented the production of overflowing gluey after die-cut.

Compared with the prior art, the invention has the following advantages:

1) the punching scheme is redesigned in the technical scheme, so that the generation direction of the overflowing glue receives opposite horizontal action impulse, the caliber of the punching position is expanded, and the overflowing glue is avoided.

2) This technical scheme is simple and efficient, but extensive adaptation in die-cut production line to be applicable to the batched die-cut of the double faced adhesive tape product of the ultra-thin non-woven fabrics substrate of various shapes, make the yield of product show the promotion.

Drawings

FIG. 1 is a schematic structural diagram of a double-sided adhesive tape product of an ultrathin non-woven fabric substrate in the prior art;

FIG. 2 is a partial view of a product obtained by waste discharge after completion of die cutting;

FIG. 3 is a schematic diagram illustrating the effect of die cutting in the prior art;

FIG. 4 is a schematic view of a die cutting embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating the effect of die cutting in the present embodiment;

fig. 6 is a partial view of a product obtained by waste discharge after the punching is completed according to the technical scheme.

Detailed Description

The invention is described in detail below with reference to the figures and specific embodiments.

Examples

Firstly, a protective film is covered on the PI layer, the protective film is used as an auxiliary bearing film, the protective film is used as a bearing belt of a bottom layer, and the original auxiliary release film is used as a punching starting position.

And then, punching is carried out by starting from the auxiliary release film, a cutter point sequentially penetrates through the auxiliary release film, the non-woven fabric double-sided adhesive layer and the PI layer in the punching process, the punching process is terminated when the cutter point finally reaches the protective film, then the waste material is discharged by tearing off the protective film, the non-glue-overflowing punched ultrathin non-woven fabric substrate double-sided adhesive tape product can be obtained, the obtained punched and waste-discharged product is partially enlarged and shown in fig. 6, and the phenomenon that the adhesive layer is obviously pulled out from the punched edge can be seen.

Actual micro die cutting process for this example:

this technical scheme is at die-cut in-process preferentially make the blade tip portion pass the two-sided glue film of non-woven fabrics, see figure 5, make the two-sided glue film of non-woven fabrics by vertical cutting off, die-cut in-process moves down along with the blade tip gradually, the two-sided glue film is widened gradually by the cutting edge of cutting off position department, if the waste material of die-cut is closed figure, the direction that the cutting edge hypotenuse corresponds is one side of waste material, encircle and treat die-cut regional cutting edge hypotenuse and produce the horizontal momentum of side direction, make the two-sided glue film of non-woven fabrics receive the effect momentum of level to both sides, the effect direction of this momentum is opposite with the production direction of excessive glue, just so just in time prevented.

The embodiments described above are described to facilitate an understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.