阅读说明：本技术 晶圆湿处理工作站 (Wafer wet processing workstation ) 是由 黄富源 吴宗恩 邱云正 吴进原 于 2020-01-02 设计创作，主要内容包括：本揭示提供一种晶圆湿处理工作站,包含浸泡槽、机械手臂、和单晶圆处理设备。晶圆以其板面垂直于水平面的方式浸入预先注满工艺液体的所述浸泡槽内。机械手臂包含保持部和翻转部。所述晶圆保持于所述保持部上。翻转部控制所述保持部相对于所述水平面翻转。通过所述翻转部将所述保持部翻转90度而使得所述晶圆以其板面平行于所述水平面的方式传送。单晶圆处理设备施加清洗液体至浸泡过所述工艺液体的晶圆的所述板面。晶圆湿处理工作站可对晶圆执行浸泡、喷洗等一系列清洗工艺,以实现具有芯片微小化和高密度导线布局的晶圆的清洗。(The present disclosure provides a wafer wet processing workstation comprising an immersion tank, a robot, and a single wafer processing apparatus. The wafer is immersed in the immersion tank filled with the process liquid in advance in such a manner that the plate surface of the wafer is perpendicular to the horizontal plane. The robot arm includes a holding portion and a turning portion. The wafer is held on the holding portion. The overturning part controls the holding part to overturn relative to the horizontal plane. The holding part is turned over by 90 degrees through the turning part so that the wafer is conveyed in a manner that the plate surface of the wafer is parallel to the horizontal plane. The single wafer processing apparatus applies a cleaning liquid to the plate surface of the wafer immersed in the process liquid. The wafer wet processing workstation can perform a series of cleaning processes such as soaking, spraying and the like on the wafer so as to clean the wafer with the chip miniaturization and the high-density wire layout.)

1. A wafer wet processing workstation, comprising:

a soaking tank;

the cassette is arranged in the soaking tank and comprises a plurality of clamping grooves, and a wafer is placed in each clamping groove, wherein the clamping grooves are arranged at intervals along the horizontal direction, so that the wafer is immersed in the soaking tank filled with process liquid in advance in a mode that the surface of the wafer is vertical to the horizontal plane;

a robot arm, comprising:

a holding portion on which the wafer is held; and

the turnover part is connected with the holding part, controls the holding part to turn over relative to the horizontal plane, and turns over the holding part by 90 degrees through the turnover part so that the wafer is conveyed in a manner that the plate surface of the wafer is parallel to the horizontal plane; and

a single wafer processing apparatus disposed downstream of the soak tank, wherein the wafer soaked with the process liquid is placed on the single wafer processing apparatus, and the single wafer processing apparatus applies a cleaning liquid to the plate surface of the wafer.

2. The wafer wet processing station of claim 1, wherein the holding portion of the robot arm comprises:

a pair of holding arms spaced apart from each other; and

at least one pair of clamping jaws, wherein each clamping jaw is correspondingly arranged on one clamping arm, and each clamping jaw is contacted with the edge of the wafer to clamp the wafer between the clamping jaws.

3. A wafer wet processing station as recited in claim 2, wherein each of the jaws includes a recess, and the wafer is secured in the recess.

4. The wafer wet processing station of claim 2, wherein said pair of gripper arms are movable relative to each other to change a distance between said pair of gripper arms.

5. The wafer wet processing station of claim 2, further comprising a transfer device disposed adjacent to said robot arm and between said immersion tank and said single wafer processing apparatus, wherein said transfer device transfers said wafer immersed in said process liquid to said single wafer processing apparatus; and

wherein the transfer device includes a telescopic arm, and the telescopic arm is movable relative to the holding portion of the robot arm to extend between the pair of gripper arms.

6. The wafer wet processing station of claim 1, wherein the robot arm further comprises an elevating section that elevates the holding section in a vertical direction, and the wafer is taken out of the cassette in the vertical direction by the elevating movement of the elevating section or the wafer is put into the cassette in the vertical direction by the holding section by the lowering movement of the elevating section.

7. The wafer wet processing station of claim 1, wherein the robot further comprises a telescopic portion coupled to the flipping portion to move the holding portion in the horizontal direction.

8. The wafer wet processing station of claim 1, wherein each of said wafers has less than or equal to four points of contact with said cassette.

9. The wafer wet processing station of claim 1, wherein said single wafer processing apparatus comprises:

rotating an etching table, and applying chemical liquid to the plate surface of the wafer to remove residues attached to the wafer; and

and the rotary cleaning platform is arranged at the downstream of the rotary etching platform, and deionized water is applied to the plate surface of the wafer to remove the chemical liquid attached to the wafer.

10. The wafer wet processing station of claim 1, wherein said immersion tank includes a vibrator connected to said cassette, and said vibrator vibrates said cassette and concomitantly vibrates said wafers placed on said cassette.

Technical Field

The present disclosure relates generally to a workstation, and more particularly to a wafer wet processing workstation.

Background

With the miniaturization of semiconductor devices and the increase of the pattern density of interconnection (interconnection) of chips, the trend of wires toward smaller line width and space (fine line width and space) has led to a more serious challenge in the semiconductor cleaning and etching process. At present, a wafer or a substrate usually needs to be cleaned and etched in multiple steps to ensure that the final cleaning etching effect can meet the requirement of the device specification, and particularly, after photoresist stripping (photoresist stripping), metal lift-off (metal lift-off), and wafer de-bonding (post wafer de-bonding), the cleaning process of the residues of an adhesive layer (adhesive layer) and a stripper layer (release layer) on the surface of the wafer cannot be completed by only one step, and wafer soaking and single wafer spraying equipment must be combined.

On the other hand, in a general wafer soaking apparatus, a plurality of wafers are transferred one at a time from a feeding port to a cassette via a transfer device, and then the cassette is moved downward to be soaked in the soaking tank. After soaking for a process time, moving the cassette together with the plurality of wafers upward from the soak tank to exit the soak tank. And finally, the soaked wafers are sent to the next process one by one through the holding mechanism. However, in the wafer soaking apparatus, if the wafer is placed horizontally, the holding mechanism cannot individually and individually take out the wafer in the case where the cassette is completely soaked in the soaking bath, and the holding mechanism must wait until the cassette is lifted out of the soaking bath before the wafer can be taken out into the cassette. However, in the same cassette, the wafer taken out earlier is often under-soaked, and the wafer taken out later is easily over-soaked for a long time to cause damage to the wafer. That is, the horizontal wafer soaking apparatus cannot accurately control the soaking time of each wafer in the chemical soaking tank, and the yield of the wafer soaking process is easily affected.

Accordingly, there is a need for a wafer wet processing station that solves the problems of the prior art.

Disclosure of Invention

In order to solve the above-mentioned problems of the prior art, the present disclosure provides a wafer wet processing station, which is suitable for cleaning wafers with chip miniaturization and high-density wire layout to remove residues attached to the wafer surface in the previous process, and can precisely control the chemical soaking time of each wafer.

To achieve the above objects, the present disclosure provides a wafer wet processing station including a soak tank, a cassette, a robot, and a single wafer processing apparatus. The clamping boxes are arranged in the soaking tank and comprise a plurality of clamping grooves, and each clamping groove is used for placing a wafer, wherein the clamping grooves are arranged at intervals along the horizontal direction, so that the wafers are immersed in the soaking tank filled with process liquid in advance in a mode that the plate surface of each wafer is perpendicular to the horizontal plane. The robot arm includes a holding portion and a turning portion. The wafer is held on the holding portion. The turnover part is connected with the holding part, controls the holding part to turn over relative to the horizontal plane, and turns over the holding part by 90 degrees through the turnover part so that the wafer is conveyed in a mode that the plate surface of the wafer is parallel to the horizontal plane. A single wafer processing apparatus is disposed downstream of the soak tank, wherein the wafer soaked with the process liquid is placed on the single wafer processing apparatus, and the single wafer processing apparatus applies a cleaning liquid to the plate surface of the wafer.

In a preferred embodiment, the holding portion of the robot arm comprises a pair of gripping arms and at least a pair of gripping jaws. The pair of gripper arms are spaced apart from each other. The pair of clamping jaws are arranged to face each other, wherein each clamping jaw is correspondingly arranged on one clamping arm, and each clamping jaw is contacted with the edge of the wafer to clamp the wafer between the pair of clamping jaws.

In a preferred embodiment, each of the jaws includes a recess, wherein the wafer is secured within the recess.

In a preferred embodiment, the pair of gripper arms are movable relative to each other to vary the distance between the pair of gripper arms.

In a preferred embodiment, the wafer wet processing station further comprises a transfer device disposed adjacent to the robot arm and between the immersion tank and the single wafer processing apparatus, wherein the transfer device transfers the wafer immersed in the process liquid to the single wafer processing apparatus. The transfer device includes a telescopic arm, and the telescopic arm is movable relative to the holding portion of the robot arm to extend between the pair of gripper arms.

In a preferred embodiment, the robot further includes an elevating portion for elevating the holding portion in a vertical direction, and the elevating portion is moved to take out the wafer from the cassette in the vertical direction, or the elevating portion is moved to take in the wafer into the cassette in the vertical direction.

In a preferred embodiment, the robot arm further includes a telescopic portion connected to the turning portion to drive the holding portion to move along the horizontal direction.

In a preferred embodiment, the number of contact points between each wafer and the cassette is less than or equal to four.

In a preferred embodiment, the single wafer processing apparatus includes a rotary etching station and a rotary cleaning station. A rotary etching table applies a chemical liquid to the plate surface of the wafer to remove residues attached to the wafer. And the rotary cleaning table is arranged at the downstream of the rotary etching table, and deionized water is applied to the plate surface of the wafer to remove the chemical liquid attached to the wafer.

In a preferred embodiment, the immersion tank comprises a vibrator connected to the cassette, wherein the vibrator vibrates the cassette and concomitantly vibrates the wafers placed on the cassette.

Compared with the prior art, the wafer wet processing workstation disclosed by the invention can perform a series of cleaning processes such as chemical soaking, chemical liquid spraying, deionized water cleaning and drying on the wafer, so as to clean the wafer with the chip miniaturization and the high-density wire layout. Also, the present disclosure provides for precise control of the wafer soak time by providing a vertical soak tank and a robot associated with the soak tank, and linking the soak tank, the robot, and a controller of the wafer wet processing station.

Drawings

FIG. 1 shows a schematic view of a wafer wet processing workstation according to a preferred embodiment of the present disclosure;

FIG. 2 is a schematic diagram illustrating a first motion of a robot of the wafer wet processing station of FIG. 1;

FIG. 3 is a second schematic view of a robot arm of the wafer wet processing station of FIG. 1;

FIG. 4 is a perspective view of the wafer wet processing station of FIG. 3;

FIG. 5 shows a partial cross-sectional view of the wafer wet processing station of FIG. 4;

FIG. 6 shows a side view of a jaw of the robot arm;

FIG. 7 is a third schematic view of a robot arm of the wafer wet processing station of FIG. 1;

FIG. 8 is a first corresponding operational diagram of a robot and transfer device of the wafer wet processing station of FIG. 1;

FIG. 9 is a second corresponding diagram of the robot and the transfer device of the wafer wet processing station of FIG. 1;

FIG. 10 is a second corresponding diagram of the robot and the transfer device of the wafer wet processing station of FIG. 1; and

FIG. 11 is a schematic view of the turntable of the wafer wet processing station of FIG. 1.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present disclosure comprehensible, preferred embodiments accompanied with figures are described in detail below.

Referring to fig. 1, a schematic diagram of a wafer wet processing workstation 1 according to a preferred embodiment of the present disclosure is shown. The wafer wet processing workstation 1 comprises a feeding port 10, a conveying device 30, a mechanical arm 40, a soaking tank 50, a single wafer processing device 60 and a discharging port 70. The conveyor 30 is configured to be movable between the inlet 10, the immersion tank 50, the single wafer processing apparatus 60, and the outlet 70. The transfer device 30 is adjacent to the robot arm 40. The base of the robot 40 is fixed to one side of the immersion tank 50, and the robot 40 can perform a series of actions with respect to the immersion tank 50, which will be described in detail later.

The wafer wet processing workstation 1 of the present disclosure can be used for performing a series of cleaning processes such as chemical immersion, chemical liquid spray cleaning, and deionized Water (DI Water) cleaning and drying on the wafer. Taking photoresist stripping (photoresist stripping) as an example, a wafer to be processed is input from the input port 10 and is transferred to the robot 40 by the transfer device 30. The robot 40 places the wafer into the immersion tank 50 for chemical immersion, so that the process liquid penetrates into the photoresist, thereby causing the photoresist to swell and dissolve. After the wafer soaking is completed, the robot 40 takes out and transfers the wafer back to the transfer device 30, and transfers the wafer to the single wafer processing apparatus 60 through the transfer device 30. Then, a chemical solution is applied to the wafer by using a horizontal single-wafer rotating device to remove the photoresist residues, and deionized water is applied to remove the residual chemical solution, so that the wafer can be completely cleaned. Finally, the cleaned wafer is transferred to the discharge port 70 by the transfer device 30 for subsequent processes. The transfer of the wafers and the operation of the associated equipment in the wafer wet processing station 1 will be described in detail later.

Referring to fig. 2, a first operation of the robot 40 of the wafer wet processing workstation 1 of fig. 1 is shown. The wafer wet processing station 1 further comprises a cassette 90 disposed within the soak tank 50. The cassette 90 includes a plurality of pockets 91, and each pocket 91 is used for placing one wafer 2. It should be noted that the plurality of chucking grooves 91 are arranged at intervals along the horizontal direction (i.e., the X direction) so that the wafer 2 is immersed in the immersion tank 50 filled with the process liquid 3 in advance in such a manner that the plate surface thereof is perpendicular to the horizontal plane (i.e., the XY plane). The disclosed wafer wet processing station 1 replaces the horizontal soaking tank with a vertical soaking tank 50(vertical soaking tank). By this design, a plurality of wafers 2 are vertically arranged in the soaking tank 50, so that the process liquid 3 which circularly flows up and down can fully contact the surface of each wafer 2, thereby preventing the problems of poor circulating flow field and impurity back-sticking caused by blocking the liquid medicine flow and bubble discharge due to the horizontal arrangement of the wafers in the horizontal soaking tank. In addition, the immersion tank 50 includes additional components 51 (including, for example, a vibrator, a heater, a circulation line, a filter, etc.) so that the immersion tank 50 has functions of heating (circulation), filtering (filtration), vibration (agitation), etc. of the chemical liquid, thereby causing the chemical liquid to keep flowing and sufficiently contacting the surface of each wafer 2. The vibrator of the attachment 51 is connected to the cassette 90 and is adjustable. The adjustable vibrator is used to adjust the vibration frequency and amplitude, so that the cassette 90 vibrates and the wafer 2 placed on the cassette 90 vibrates. Thus, the reaction between the wafer 2 and the process liquid 3 can be promoted by generating a proper vibration of the wafer 2 during the vertical soaking process, and the process liquid 3 in the soaking tank 50 can be prevented from generating a flow field obstruction at the edge of the wafer 2.

As shown in fig. 2, the robot 40 is used for picking, placing and transferring the wafer 2. The robot arm 40 includes a base 41, an elevating unit 42, an expanding/contracting unit 43, a reversing unit 44, and a holding unit 45. The base 41 is fixed to one side of the immersion tank 50. The elevating portion 42 is provided on the base 41 for elevating the expanding and contracting portion 43, the turning portion 44, and the holding portion 45 together in the vertical direction (i.e., Z direction). The holding portion 45 is used to take and place the wafer 2 and hold the wafer 2 thereon. The wafer 2 is taken out from the cassette 90 by the holding portion 45 being driven by the ascending movement of the ascending/descending portion 42 in the vertical direction, or the wafer 2 is taken in the cassette 90 by the holding portion 45 being driven by the descending movement of the ascending/descending portion 42 in the vertical direction. The turning part 44 is connected between the expanding part 43 and the holding part 45. The expansion part 43 is used to drive the turning part 44 and the holding part 45 to move along the horizontal direction. Specifically, the expansion portion 43 includes a first stage 431 and a second stage 432. The turning part 44 and the holding part 45 are horizontally moved toward the base 41 by controlling the approach of the first section 431 toward the second section 432. The turning part 44 and the holding part 45 are horizontally moved in a direction away from the base 41 by controlling the first segment 431 to be away from the second segment 432. The turning part 44 controls the holding part 45 to perform a turning operation 46 with respect to the horizontal plane. It should be understood that the robot 40 includes various components such as sensors, controllers, drivers, etc. to realize the lifting operation of the lifting unit 42, the extending and retracting operation of the extending and retracting unit 43, the turning operation of the turning unit 44, the picking and placing operation of the wafer 2 by the holding unit 45, etc.

Referring to fig. 3 and 4, fig. 3 shows a second operation of the robot 40 of the wafer wet processing workstation 1 of fig. 1, and fig. 4 shows a perspective view of the wafer wet processing workstation 1 of fig. 3. As shown in fig. 3 and 4, after the wafer 2 is soaked for a certain time, the robot 40 takes out the soaked wafer 2. Specifically, the turning part 44 of the robot arm 40 pivots to turn the holding part 45 by 90 degrees with respect to the horizontal plane, so that the holding part 45 turns to be perpendicular to the horizontal plane. Then, the telescopic portion 43 of the robot 40 drives the holding portion 45 to move to a position above the wafer 2 to be taken out by the relative movement of the first segment 431 and the second segment 432. Subsequently, the lift unit 42 of the robot 40 controls the holding unit 45 to move down in the vertical direction to pick up the target wafer 2.

Referring to fig. 5 and 6, fig. 5 shows a partial cross-sectional view of the wafer wet processing station 1 of fig. 4, and fig. 6 shows a side view of the clamping jaw 452 of the robot 40. As shown in fig. 5, the holding portion 45 of the robot arm 40 includes a pair of gripping arms 451 and two pairs of gripping claws 452. The pair of gripper arms 451 are disposed adjacent to and spaced apart from each other. Each pair of the two pairs of the clamping jaws 452 is disposed facing each other, and each clamping jaw 452 is disposed on one of the clamping arms 451. That is, in the present embodiment, two clamping jaws 452 are connected to each clamping arm 451, and the clamping jaw 452 on the clamping arm 451 and the other clamping jaw 452 on the other clamping arm 451 correspond to each other (for example, when the holding portion 45 is perpendicular to the horizontal plane, the pair of clamping jaws 452 are at the same horizontal level). Further, the holding portion 45 grabs the target wafer 2 with the intention that each of the gripping claws 452 holds the wafer 2 between the pair of gripping claws 452 by coming into contact with the edge of the wafer 2. Specifically, as shown in fig. 6, each jaw 452 includes a recess 453, and the edge of the wafer 2 is held in the recess 453 of the jaw 452. It should be noted that the number of the clamping jaws 452 in the present embodiment is four, but is not limited thereto.

As shown in fig. 5, the cassette 90 includes four cross bars 92. Each of the cross bars 90 has a row of slots 91 for receiving the wafer 2. And, the wafer 2 placed in the cassette 90 is in contact with only the cross bar 92. That is, in the present embodiment, the number of contact points between each wafer 20 and the cassette 90 is four. It should be understood that other contact point designs may be used in other embodiments. Preferably, the number of contact points between each wafer 20 and the cassette 90 is equal to or less than four. In the present disclosure, by designing the cassette 90 to have only four or less contacts with the edge of the wafer 2, the area of the cassette 90 obstructing the flow of the process liquid 3 can be minimized. Further, the cross bar 92 of the cassette 90 is disposed to correspond to the bottom of the wafer 2 and not to contact the left and right sides of the wafer 2. Therefore, the holding portion 45 of the robot arm 40 can smoothly project into the inside of the cassette 90 without structurally interfering with the cassette 90.

Referring to fig. 7, a third schematic diagram of the robot 40 of the wafer wet processing workstation 1 of fig. 1 is shown. After the holding unit 45 of the robot 40 has grasped the target wafer 2, the elevating unit 42 of the robot 40 controls the holding unit 45 to ascend in the vertical direction to take out the wafer 2 from the cassette 90. In the present disclosure, when the robot 40 takes out the wafer 2, the wafer 2 is lifted in the vertical direction in a manner that the plate surface thereof is vertical to the horizontal plane, so the process liquid 3 is easy to flow back into the soaking tank 60 due to gravity, and thus the waste of the process liquid 3 and the contamination of the robot 40 caused by the process liquid 3 carried on the surface of the wafer 2 when the wafer 2 is lifted can be avoided. Moreover, the cassette 90 of the present disclosure does not need to be moved (e.g., moved away from the immersion tank 50), but rather is moved into the immersion tank 50 by the robot 40 for wafer pick-and-place.

Referring to fig. 8, a first corresponding operation of the robot 40 and the transfer device 30 of the wafer wet processing workstation 1 of fig. 1 is shown. After the robot 40 takes out the wafer 2 from the cassette 90, the reversing section 44 of the robot 40 reverses the holding section 45 by 90 degrees so that the wafer 2 is transferred with its plate surface parallel to the horizontal plane. The robot 40 then transfers the soaked wafer to the transfer device 30.

Referring to fig. 9 and 10, fig. 9 shows a second corresponding operation of the robot 40 and the conveyor 30 of the wafer wet processing workstation 1 of fig. 1, and fig. 10 shows a second corresponding operation of the robot 40 and the conveyor 30 of the wafer wet processing workstation 1 of fig. 1. As shown in fig. 9, the transfer device 30 includes a telescopic arm 31. The telescopic arm 31 is movable relative to the holding portion 45 of the robot arm 40. Specifically, when a wafer on the robot 40 is to be removed, the telescopic arm 31 of the transfer device 30 extends between the pair of gripper arms 451 of the robot 40 and is located below the wafer 2. Also, the retractable arm 31 may employ suitable elements to hold the wafer 2 thereon, such as a vacuum chuck, a clamping mechanism, and the like. As shown in fig. 10, after the wafer 2 is fixed thereon by the transfer device 30, the pair of gripper arms 451 of the robot 40 can move relative to each other to change the distance between the gripper arms 451, thereby releasing the gripping fixation of the wafer. Specifically, the relative movement of the pair of gripper arms 451 as described herein means that the pair of gripper arms 451 move away from each other to increase the distance therebetween (which is greater than the diameter of the wafer 2)_，The robot 40 releases the clamping of the wafer. It will be appreciated that when the pair of gripper arms 451 are used to grip the wafer 2, the pair of gripper arms 451 are first moved away from each other to increase the distance therebetween (which is greater than the diameter of the wafer 2), and then moved closer to each other to decrease the distance therebetween (which is approximately equal to the diameter of the wafer 2) to grip the wafer 2 therebetween. Then, the telescopic arm 31 of the transfer device 30 is moved in a direction away from the robot arm 40, andthe transfer device 30 transfers the wafer 2 downstream. Specifically, as shown in FIG. 1, the transfer device 30 is disposed adjacent to the robot 40 and between the immersion tank 50 and the single wafer processing apparatus 60. The transfer device 30 is configured for transferring the wafer 2 soaked with the process liquid 3 to a downstream single wafer processing apparatus 60.

As shown in fig. 1, a single wafer processing apparatus 60 is disposed downstream of the soak tank 50 for carrying the wafer 2 soaked with the process liquid 3 and applying a cleaning liquid to the plate surface of the wafer 2. In this embodiment, the single wafer processing apparatus 60 includes a first rotary etching station 610, a second rotary etching station 620, and a rotary cleaning station 630. The second rotary etching stage 620 is disposed downstream of the first rotary etching stage 610, and the rotary cleaning stage 630 is disposed downstream of the second rotary etching stage 620, so that the wafer 2 is sequentially placed on the first rotary etching stage 610, the second rotary etching stage 620, and the rotary cleaning stage 630. When the wafer 2 is placed on the first rotary etching stage 610 and the second rotary etching stage 620, different chemical liquids are respectively applied to the plate surface of the wafer 2 to remove residues attached to the wafer 2. Also, when the wafer 2 is placed on the spin rinse table 630, the wafer 2 is applied with deionized water to the plate surface of the wafer 2 to remove the chemical liquid attached to the wafer 2. For example, referring to fig. 11, a working schematic diagram of a turntable of the wafer wet processing workstation 1 of fig. 1 is shown. The rotary stage in FIG. 11 may be part of the first rotary etching stage 610, the second rotary etching stage 620, or the rotary cleaning stage 630. The spin stand comprises a spin base 601, a susceptor 602, and a liquid supply device 603. The wafer 2 is placed on the susceptor 602. The rotary base 601 can rotate around a shaft to rotate the wafer 2 placed thereon. The liquid supply device 603 may provide a corresponding liquid (e.g., a chemical liquid or deionized water) to the surface of the wafer 2. Therefore, the wafer 2 can be cleaned with a miniaturized chip and a high-density wiring layout by performing the above-described series of cleaning processes at the wafer wet processing station 1.

In summary, the wafer wet processing workstation of the present disclosure can be used for performing a series of cleaning processes such as chemical immersion, chemical liquid spray cleaning, and deionized Water (DI Water) cleaning and drying on a wafer, so as to clean the wafer with miniaturized chip and high-density wire layout. Also, the disclosed wafer wet processing station replaces the horizontal soak tank with a vertical soak tank. By the design, the wafers are vertically arranged in the soaking tank, so that the process liquid which circularly flows up and down can be fully contacted with the surface of each wafer, and the problems of poor circulating flow field, impurity rewet and the like caused by blocking of liquid medicine flow and bubble discharge due to horizontal arrangement of the wafers in a horizontal soaking tank can be prevented. In another aspect, the present disclosure provides for precise control of the wafer soak time by providing a vertical soak tank and a robot associated with the soak tank, and linking the soak tank, the robot, and a controller of the wafer wet processing station. For example, when a wafer is first soaked and a predetermined soaking time is reached, the controller may command the robot to first take the wafer out of the vertical soaking tank, so as to precisely control the soaking time of each wafer in the chemical soaking tank.

The foregoing is merely a preferred embodiment of the present disclosure, and it should be noted that modifications and refinements may be made by those skilled in the art without departing from the principle of the present disclosure, and these modifications and refinements should also be regarded as the protection scope of the present disclosure.