阅读说明：本技术 一种高散热性的led灯丝灯结构 (LED filament lamp structure with high heat dissipation performance ) 是由 李振华 刘芳 蒋海波 于 2021-02-09 设计创作，主要内容包括：本发明公开了一种高散热性的LED灯丝灯结构,灯头通过导热绝缘硅胶套与金属散热器相连；金属散热器与金属芯柱为整体式结构,金属芯柱与玻璃泡壳熔封成充有惰性导热气体的密闭空间,金属散热器设置在玻璃泡壳底端外部,所述的金属芯柱为中空圆柱形,外部为等距排列的散热片,每个散热片之间的间距大于大功率LED灯丝支架基板的厚度,大功率LED灯丝裸露出来的基板镶嵌在金属芯柱的散热片凹槽中,所述的散热片凹槽内填充透明的高导热材料；多个大功率LED灯丝上端引脚通过第二导丝点焊后相连,大功率LED灯丝下端引脚通过第一导丝点焊后与灯头中的驱动电源相连。本发明能够大大提高LED灯丝灯的使用寿命,大大降低了生产成本,实用性强。(The invention discloses a high-heat-dissipation LED filament lamp structure.A lamp cap is connected with a metal radiator through a heat-conducting insulating silica gel sleeve; the metal radiator and the metal core column are of an integral structure, the metal core column and the glass bulb shell are sealed by fusion to form a closed space filled with inert heat-conducting gas, the metal radiator is arranged outside the bottom end of the glass bulb shell, the metal core column is in a hollow cylindrical shape, radiating fins are arranged at equal intervals outside the metal core column, the distance between every two radiating fins is larger than the thickness of a high-power LED filament support substrate, the substrate exposed out of the high-power LED filament is embedded in a radiating fin groove of the metal core column, and the radiating fin groove is filled with transparent high-heat-conducting material; the pins at the upper ends of the plurality of high-power LED filaments are connected after spot welding through the second guide wire, and the pins at the lower ends of the high-power LED filaments are connected with a driving power supply in the lamp holder after spot welding through the first guide wire. The invention can greatly prolong the service life of the LED filament lamp, greatly reduce the production cost and has strong practicability.)

1. A high-heat-dissipation LED filament lamp structure is characterized by comprising a high-power LED filament (6), inert heat-conducting gas (10), a glass bulb shell (11) and a lamp cap (13), wherein the lamp cap (13) is connected with a metal radiator (91) through a heat-conducting insulating silica gel sleeve (12); the metal radiator (91) and the metal core column (92) are of an integral structure, the metal core column (92) and the glass bulb shell (11) are sealed in a melting mode to form a closed space filled with inert heat-conducting gas (10), the metal radiator (91) is arranged outside the bottom end of the glass bulb shell (11), the metal core column (92) is in a hollow cylindrical shape, radiating fins are arranged on the outside at equal intervals, the distance between every two radiating fins is larger than the thickness of a base plate of the high-power LED filament support (1), the base plate (3) exposed out of the high-power LED filament (6) is embedded in a radiating fin groove (7) of the metal core column (92), and the radiating fin groove (7) is filled with transparent high-heat-conducting materials; pins at the upper ends of the high-power LED filaments (6) are connected after spot welding through the second guide wires (82), and pins at the lower ends of the high-power LED filaments (6) are connected with a driving power supply in the lamp holder (13) after spot welding through the first guide wires (81).

2. The LED filament lamp structure with high heat dissipation performance according to claim 1, wherein the high-power LED filament (6) comprises a high-power LED filament support (1), a plurality of blue light chips (4) are fixed on the front surface of a substrate of the LED filament support (1), the blue light chips (4) are connected in series or in parallel through bonding wires (5), the front surface and the back surface of the substrate are respectively coated with front fluorescent glue (22) and back fluorescent glue (21), and a part of the substrate (3) is not coated with the fluorescent glue.

3. The structure of claim 1, wherein the number of the high power LED filaments (6) is not less than two.

4. The structure of the LED filament lamp with high heat dissipation performance as claimed in claim 1, wherein the high-power LED filament support (1) is made of sapphire, transparent ceramic or transparent glass, the width of the substrate is not less than 3mm, and a part of the substrate is reserved when metal terminals at two ends of the high-power LED filament support are riveted.

5. The structure of claim 1, wherein the surface of the metal stem (92) is plated with silver plating with high reflectivity.

6. The structure of claim 1, wherein the glass bulb (11) is replaced by a PC cover, and the PC cover is fastened to the metal heat sink to form an open space.

7. The structure of claim 1, wherein the metal heat sink (91) has a plurality of equally spaced fins.

Technical Field

The invention relates to the technical field of LEDs, in particular to an LED filament lamp structure with high heat dissipation performance.

Background

The LED filament lamp can realize the effect of building a tungsten filament lamp by emitting light at 360 degrees without adding a lens, and the style design is more variable. Nowadays, the LED filament lamp is only used as decorative illumination, and has replaced the ball bubble to be used for functional illumination, and along with the promotion power of luminous flux demand also continuously increases, has also had higher requirement to heat dispersion, optimizes the heat radiation structure of LED filament lamp now, and reinforcing stability also receives more and more attention.

2000lm, 6000lm, and even 10000lm of high-power and high-luminous-flux LED filament lamps are put forward in the market at present and used in the field of illumination, and the luminous flux is improved by only increasing the number of filaments and the width of the filaments on the basis of using high-voltage and low current of the traditional LED filament lamp and filling inert gas in a bulb for heat dissipation. Increase LED filament base plate width, increase the blue light chip number, fill into more inert gas's mode, though can promote heat dispersion, high-power illumination LED filament lamp cost greatly increased loses the competitiveness with the ball bubble on the market, and glass bubble heat can only rely on the convection current of radiation and inside gas to carry out heat conduction and heat dissipation simultaneously, causes thermal piling up easily, makes the life-span of LED filament shorten.

In summary, the present invention provides a high luminous flux and high heat dissipation type LED filament lamp structure, so as to achieve the purposes of prolonging the lifetime of the LED filament lamp and reducing the cost.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide the LED filament lamp structure with high heat dissipation performance, the structural design is reasonable, the service life of the LED filament lamp can be greatly prolonged, the production cost is greatly reduced, and the practicability is high.

In order to achieve the purpose, the invention is realized by the following technical scheme: a high-heat-dissipation LED filament lamp structure comprises a high-power LED filament, inert heat-conducting gas, a glass bulb shell and a lamp cap, wherein the lamp cap is connected with a metal radiator through a heat-conducting insulating silica gel sleeve; the metal radiator and the metal core column are of an integral structure, the metal core column and the glass bulb shell are sealed by fusion to form a closed space filled with inert heat-conducting gas, the metal radiator is arranged outside the bottom end of the glass bulb shell, the metal core column is in a hollow cylindrical shape, radiating fins are arranged at equal intervals outside the metal core column, the distance between every two radiating fins is larger than the thickness of a high-power LED filament support substrate, the substrate exposed out of the high-power LED filament is embedded in a radiating fin groove of the metal core column, and the radiating fin groove is filled with transparent high-heat-conducting material; the pins at the upper ends of the plurality of high-power LED filaments are connected after spot welding through the second guide wire, and the pins at the lower ends of the high-power LED filaments are connected with a driving power supply in the lamp holder after spot welding through the first guide wire.

Preferably, the high-power LED filament comprises a high-power LED filament support, a plurality of blue light chips are fixed on the front surface of a substrate of the LED filament support, the blue light chips are connected in series or in parallel through bonding wires, the front surface and the back surface of the substrate are respectively coated with front fluorescent glue and back fluorescent glue, and part of the substrate is not coated with the fluorescent glue.

Preferably, the number of the high-power LED filaments is not less than two.

Preferably, the high-power LED filament support is made of sapphire, transparent ceramic or transparent glass, the width of the substrate is larger than or equal to 3mm, and a part of the substrate is reserved outside when metal terminals at two ends of the high-power LED filament support are riveted.

Preferably, the surface of the metal core column is electroplated with a silver plating layer with high light reflection degree.

Preferably, the glass bulb can be replaced by a PC cover, and the PC cover is buckled on the metal radiator to form an open space.

Preferably, the metal heat sink surface is arranged with equidistant long fins.

The invention has the following beneficial effects:

1. compared with the existing high-power LED filament lamp on the market, the high-power LED filament lamp only takes the heat on the high-power LED filament to the bulb shell and transfers the heat to the air through the inert gas in the bulb shell, the second heat dissipation way is added on the basis of the first heat dissipation way, one side of the filament substrate is directly embedded on the metal core column, the heat of the filament can be directly transferred to the metal radiator through the metal core column and then quickly diffused to the air, and the heat dissipation speed of the metal radiator is far higher than the convection heat dissipation speed of the inert gas;

2. the heat of the lamp filament can be directly diffused into the air through the metal core column and the metal radiator, and does not need to be radiated by filling inert gas in a sealing way through the glass bulb, finished product manufacturers can select a PC cover which is high in light transmittance and not easy to break to replace glass materials, and the inert gas filling process is omitted, so that the material cost and the labor production cost are reduced, and the competitive advantage of products is improved;

3. the direct and efficient heat dissipation mode combining the metal core column with the metal radiator is adopted, the high-power LED filament lamp is designed without heat dissipation through high-voltage small current, chip quantity increase and substrate width increase, a relatively narrower substrate can be directly used, the higher current drives less chip quantity, so that the LED high-power filament achieves the same lumen and light effect in a hot state, the manufacturing cost of the high-power LED filament lamp is greatly reduced, and the competitive advantage of products is further promoted;

4. the long edges of the high-power LED filament substrate are embedded in the grooves of the metal core columns, so that the two ends and the middle part of the high-power LED filament can be well radiated, and the high-power LED filament still keeps the 360-degree light emitting characteristic in the filament lamp due to the transparent high-thermal-conductivity glue in the grooves and the silver layers on the surfaces of the metal core columns.

Drawings

The invention is described in detail below with reference to the drawings and the detailed description;

FIG. 1 is a schematic view of a high power LED filament support of the present invention;

FIG. 2 is a schematic diagram of a high power LED filament according to the present invention;

FIG. 3 is a schematic view of the backside structure of FIG. 2;

fig. 4 is a schematic structural diagram of the present invention.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

Referring to fig. 1 to 4, the following technical solutions are adopted in the present embodiment: a high-heat-dissipation LED filament lamp structure comprises a high-power LED filament 6, inert heat-conducting gas 10, a glass bulb 11 and a lamp cap 13, wherein the lamp cap 13 is connected with a metal radiator 91 through a heat-conducting insulating silica gel sleeve 12, and the heat generated by a driving power supply inside the lamp cap 11 is transferred to the metal radiator 91 through the heat-conducting insulating silica gel sleeve 12; the metal radiator 91 and the metal core column 92 are of an integral structure, the metal core column 92 and the glass bulb shell 11 are sealed in a melting mode to form a closed space filled with inert heat-conducting gas 10, the metal radiator 91 is arranged outside the bottom end of the glass bulb shell 11, the metal core column 92 is of a hollow cylindrical shape, radiating fins are arranged on the outer portion of the metal core column 92 at equal intervals, the distance between every two radiating fins is slightly larger than the thickness of the substrate of the high-power LED filament support 1, the substrate 3 exposed out of the high-power LED filament 6 is embedded in a radiating fin groove 7 of the metal core column 92, the radiating fin groove 7 is filled with transparent high-heat-conducting material, heat generated by the high-power LED filament 6 is directly transmitted to the metal radiator 91 through the metal core column 92; the pins at the upper ends of the plurality of high-power LED filaments 6 are connected after spot welding through the second guide wires 82, and the pins at the lower ends of the high-power LED filaments 6 are connected with the driving power supply in the lamp holder 13 after spot welding through the first guide wires 81.

The high-power LED lamp filament 6 comprises a high-power LED lamp filament support 1, a plurality of blue light chips 4 are fixedly arranged on the front surface of a substrate of the LED lamp filament support 1, the blue light chips 4 are connected in series or in parallel through bonding wires 5, the front surface and the back surface of the substrate are respectively coated with a front fluorescent glue 22 and a back fluorescent glue 21, and part of the substrate 3 is not coated with the fluorescent glue.

The number of the high-power LED filaments 6 is not less than two.

The width of the substrate made of sapphire, transparent ceramic and transparent glass is more than or equal to 3mm, and a high-power LED filament support with a part of the substrate outside is reserved when metal terminals at two ends are riveted; when the front and back surfaces of the substrate are coated with the fluorescent glue, one part of the substrate is not coated with the fluorescent glue; the metal core column and the metal radiator are integrated and are made of high-thermal-conductivity materials such as copper, aluminum, alloy and the like; after the high-power LED filament substrate is embedded in the groove of the metal core column radiating fin, filling transparent high-heat-conducting material into the groove; the metal core column is in a hollow cylindrical shape, radiating fins with equal intervals are arranged on the outer surface of the cylindrical shape, and the distance between the radiating fins is slightly larger than the thickness of the high-power LED filament substrate; a silver coating with high reflection degree is electroplated on the surface of the metal core column; the glass bulb shell and the metal core column are sealed in a melting mode to form a closed space filled with inert heat-conducting gas, and a PC cover with high light transmittance and low probability of breakage can be selected to be buckled on the metal radiator to form an open space; the metal radiator is arranged outside the bulb shell, and strip radiating fins with equal intervals are arranged on the surface of the metal radiator.

The specific principle of the embodiment is as follows: selecting a high-power LED filament support with a transparent ceramic substrate with the width larger than or equal to 3mm and a part of substrate outside when metal terminals at two ends are riveted; fixing a blue light chip on the high-power LED filament support on one surface of the substrate through heat-conducting glue, controlling the width of a chip placement area within the riveting width of the metal terminal, and connecting the chip placement area and the metal terminal in series or in parallel by using a bonding wire; coating fluorescent glue on the front and back surfaces of the substrate by a normal LED filament glue-pouring packaging process, wherein the width of the fluorescent glue on the front and back surfaces is consistent with the riveting width of the metal terminal, so that the residual substrate is exposed; the high-power LED lamp filament comprises a metal core column, wherein a heat dissipation sheet is arranged on the metal core column, the metal core column is arranged on the metal core column, and the metal core column is arranged on the metal core column.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.