阅读说明：本技术 导电膜层压体及其制造方法 (Conductive film laminate and method for producing same ) 是由 权赫焕 安淳权 李昌勇 于 2021-03-31 设计创作，主要内容包括：本发明涉及导电膜层压体及其制造方法。该导电膜层压体包括：载体基板；以及切割图案,所述切割图案包括依次形成在载体基板上的导电膜衬里和导电粘合剂膜。具有窄的宽度的导电粘合剂膜可以被稳定地供应在载体基板上。导电粘合剂膜可用作用于触摸传感器的接合过程的各向异性导电膜。(The present invention relates to a conductive film laminate and a method for producing the same. The conductive film laminate includes: a carrier substrate; and a cutting pattern including a conductive film liner and a conductive adhesive film sequentially formed on the carrier substrate. The conductive adhesive film having a narrow width can be stably supplied on the carrier substrate. The conductive adhesive film may be used as an anisotropic conductive film for a bonding process of the touch sensor.)

1. A conductive film laminate comprising:

a carrier substrate; and

a cutting pattern including a conductive film liner and a conductive adhesive film sequentially formed on the carrier substrate.

2. The conductive film laminate of claim 1, further comprising a separation adhesive layer formed between the carrier substrate and the cut pattern.

3. The conductive film laminate of claim 2, further comprising a liner pattern on the release adhesive layer spaced apart from the cut pattern.

4. The conductive film laminate according to claim 3, wherein the liner pattern includes a pair of liner patterns spaced apart from the cutting pattern and opposed to each other in a horizontal direction.

5. The conductive film laminate of claim 1, further comprising a first release layer formed between the conductive film liner and the conductive adhesive film.

6. The conductive film laminate according to claim 5, further comprising a second release layer covering the cut pattern.

7. The conductive film laminate as claimed in claim 1, wherein the conductive adhesive film comprises an Anisotropic Conductive Film (ACF).

8. A method of manufacturing a conductive film laminate, comprising:

Forming a liner layer on a carrier substrate;

partially removing the liner layer to form an opening;

forming a pre-laminate including a conductive film liner layer and a conductive adhesive layer in the opening; and

cutting the pre-laminate to form a cut pattern comprising a conductive film liner and a conductive adhesive film.

9. The method of claim 8, wherein cutting the pre-laminate comprises repeating the cutting a plurality of times while moving a cutter comprising projections on both ends.

10. The method of claim 9, wherein the repeating the cutting a plurality of times comprises moving the cutter such that cutting areas of lobes of the cutter overlap one another.

11. The method according to claim 9, wherein a liner pattern is formed by partially removing the liner layer, and

cutting the prelaminate includes moving the cutter in a direction parallel to the sidewalls of the liner pattern.

12. The method of claim 8, further comprising forming a release adhesive layer on the carrier substrate prior to forming the liner layer.

Technical Field

The present invention relates to a conductive film laminate and a method for manufacturing the same. More particularly, the present invention relates to a conductive film laminate including an insulating layer and a conductive layer and a method for manufacturing the same.

Background

Recently, image display devices combining a touch input function with a display function have been actively developed in products such as smart phones, tablet PCs (tablet PCs), and center dashboards of automobiles. Accordingly, the touch sensor or the touch panel may be stacked on the display panel of the image display device.

The touch sensor includes a sensing electrode for recognizing a touch input of a user and a peripheral circuit for applying a signal to the sensing electrode. The peripheral circuit may be coupled to a Flexible Printed Circuit Board (FPCB) at a bezel portion of the image display device to receive a driving signal from the driving integrated circuit chip.

The flexible printed circuit board may be bonded by pressing the flexible printed circuit board against a peripheral circuit of the touch sensor in the bezel portion by, for example, an Anisotropic Conductive Film (ACF).

When the size of the display screen of the image display apparatus increases in a limited area, the area of the frame portion decreases, and thus the area or width of the anisotropic conductive film also decreases. In this case, it may be difficult to provide the anisotropic conductive film in a reduced-size state.

In addition, since the cut size of the anisotropic conductive film is reduced, leakage of the resin material and poor bonding may be caused.

For example, korean registered patent publication No.10-0716809 discloses electrical connection between an anisotropic conductive film and a flexible printed circuit board, but does not consider the manufacture of an anisotropic conductive film having a fine line width (fine line width) as described above.

Disclosure of Invention

According to an aspect of the present invention, there is provided a conductive film laminate having improved structural and mechanical stability and a method of manufacturing the same.

The above aspects of the inventive concept are to be achieved by the following features or configurations:

(1) a conductive film laminate comprising: a carrier substrate; and a cutting pattern including a conductive film liner and a conductive adhesive film sequentially formed on the carrier substrate.

(2) The conductive film laminate according to the above (1), further comprising a separation adhesive layer formed between the carrier substrate and the cut pattern.

(3) The conductive film laminate according to the above (2), further comprising a liner pattern on the separation adhesive layer spaced apart from the cutting pattern.

(4) The conductive film laminate according to the above (3), wherein the liner pattern includes a pair of liner patterns spaced apart from the cut pattern and opposed to each other in a horizontal direction.

(5) The conductive film laminate according to the above (1), further comprising a first release layer formed between the conductive film liner and the conductive adhesive film.

(6) The conductive film laminate according to the above (5), further comprising a second release layer covering the cut pattern.

(7) The conductive film laminate according to the above (1), wherein the conductive adhesive film comprises an Anisotropic Conductive Film (ACF).

(8) A method of manufacturing a conductive film laminate, comprising: forming a liner layer on a carrier substrate; partially removing the liner layer to form an opening; forming a pre-laminate including a conductive film liner layer and a conductive adhesive layer in the opening; and

the pre-laminate is cut to form a cut pattern including the conductive film liner and the conductive adhesive film.

(9) The method according to the above (8), wherein the cutting the pre-laminated body includes repeating the cutting a plurality of times while moving a cutter having both ends including a convex portion.

(10) The method according to the above (9), wherein the repeating of the cutting a plurality of times includes moving the cutter so that cutting areas of the projections of the cutter overlap with each other.

(11) The method according to the above (9), wherein a liner pattern is formed by partially removing the liner layer, and the cutting the pre-laminated body includes moving the cutter in a direction parallel to a side wall of the liner pattern.

(12) The method according to the above (8), further comprising forming a release adhesive layer on the carrier substrate before forming the liner layer.

According to an embodiment of the present invention, a conductive adhesive layer may be formed on a carrier substrate, and the conductive adhesive layer may be cut to form a conductive adhesive film having a reduced width. The cutting process and the conveyance of the conductive adhesive film having a reduced width can be performed on the carrier substrate, so that the supply stability of the conductive film laminate of a fine-width (fine-width) can be improved.

In some embodiments, a liner pattern horizontally spaced apart from the conductive adhesive film may be formed on the carrier substrate. The step difference (step difference) due to the conductive adhesive film can be reduced by the liner pattern, so that the conductive film laminate can be stably wound on a roll or a shaft.

In some embodiments, the cutting process may be repeatedly performed such that the protrusions may be overlapped by using a cutter having protrusions at both ends. Therefore, a conductive adhesive film of a fine width can be manufactured with high reliability without defects such as resin leakage.

Drawings

Fig. 1 is a schematic sectional view illustrating a conductive film laminate according to an exemplary embodiment.

Fig. 2 is a schematic cross-sectional view illustrating a conductive film laminate according to some exemplary embodiments.

Fig. 3 to 6 are schematic sectional views illustrating a method of manufacturing a conductive film laminate according to an exemplary embodiment.

Fig. 7 is a schematic top plan view for describing a cutting process of a conductive adhesive layer according to an exemplary embodiment.

Fig. 8 is a schematic top plan view illustrating a touch sensor module manufactured according to an exemplary embodiment.

Detailed Description

According to an exemplary embodiment of the present invention, there are provided a conductive film laminate including a carrier substrate and a conductive adhesive film and a method of manufacturing the conductive film laminate.

The conductive film laminate may include a conductive adhesive film for electrical connection between a circuit board, such as a Flexible Printed Circuit Board (FPCB), and a pad for various signal transmission and data reception, such as a touch sensor, an antenna device, or an image display device.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art will appreciate that such embodiments, described with reference to the accompanying drawings, are provided for further understanding of the spirit of the invention and do not limit the claimed subject matter as disclosed in the detailed description and the appended claims.

Fig. 1 is a schematic sectional view illustrating a conductive film laminate according to an exemplary embodiment.

Referring to fig. 1, the conductive film laminate may include a carrier substrate 100, a conductive film liner 135, and a conductive adhesive film 155.

The carrier substrate 100 may include a resin material having sufficient flexibility and mechanical stability for winding the conductive film laminate onto a roll or a shaft. For example, non-limiting examples of the carrier substrate 100 may include Cyclic Olefin Polymer (COP), polyethylene terephthalate (PET), Polyacrylate (PAR), Polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallyl, Polyimide (PI), Cellulose Acetate Propionate (CAP), Polyethersulfone (PES), cellulose Triacetate (TAC), Polycarbonate (PC), Cyclic Olefin Copolymer (COC), Polymethylmethacrylate (PMMA), and the like.

In some embodiments, the release adhesive layer 110 may be formed on the carrier substrate 100. Separation adhesive layer 110 may include, for example, an adhesive material having sufficient adhesion to conductive film liner 135 to selectively separate conductive adhesive film 155. The release adhesive layer 110 may be formed using, for example, an acrylic-based or silicone-based adhesive.

The conductive film liner 135 may be formed on the separation adhesive layer 110. The conductive film liner 135 may include a release film for selectively separating the conductive adhesive film 155 from the conductive film laminate. As the conductive film liner 135, a release liner material generally used in the field of organic film laminates may be used without particular limitation.

Conductive adhesive film 155 may be laminated to conductive film liner 135. In an exemplary embodiment, the conductive adhesive film 155 may be an Anisotropic Conductive Film (ACF) including a resin layer and conductive balls dispersed in the resin layer. For example, the ACF generally used in the related art may be used as the conductive adhesive film 155 without particular limitation.

In some embodiments, the first release layer 140 may be formed between the conductive film liner 135 and the conductive adhesive film 155. The conductive adhesive film can be easily peeled off from the conductive film laminate by the first release layer 140. The first release layer 140 may include, for example, a silicone release coating.

In some embodiments, the second release layer 170 may be formed on the conductive adhesive film 155. The second release layer 170 may be used, for example, as a protective film of the conductive film laminate. When the conductive adhesive film 155 is adhered to the object, the second release layer 170 may be peeled, and then the conductive adhesive film 155 may be separated from the conductive film laminate to be supplied.

Fig. 2 is a schematic cross-sectional view illustrating a conductive film laminate according to some exemplary embodiments.

Referring to fig. 2, as described above, the separation adhesive layer 110 may be formed on the carrier substrate 100, and the conductive film liner 135 and the conductive adhesive film 155 may be sequentially formed on the separation adhesive layer 110. Conductive film liner 135 and conductive adhesive film 155 may be provided as a cut pattern 160 that shares substantially the same cut side (cut planar face).

The liner pattern 125 may be formed on the separation adhesive layer 110. The liner pattern 125 may be positioned on the release adhesive layer 110 along with the cut pattern 160.

In an exemplary embodiment, the liner pattern 125 may be horizontally spaced apart from both sides of the cut pattern 160. Accordingly, a gap G may be formed between the liner pattern 125 and the cutting pattern 160.

For example, a pair of liner patterns 125 may be formed to face each other, and the cutting pattern 160 is interposed between the pair of liner patterns 125.

The liner pattern 125 may serve as a partition wall pattern defining a space in which the cutting pattern 160 is formed. In addition, a level difference due to the cutting pattern 160 may be reduced by the liner pattern 125.

The second release layer 170 may be adhered onto the cutting pattern 160 to cover the conductive film laminate. For convenience of description, the second release layer 170 is illustrated as having a shape floating from the liner pattern 125, but the second release layer 170 may also contact the liner pattern 125.

According to the above-described exemplary embodiment, the conductive adhesive film 155 including, for example, the ACF may be formed on the carrier substrate 100 to be stably supplied by being wound on a roll or a reel, even when the width of the conductive adhesive film 155 is reduced.

In addition, the level difference may be reduced by the liner pattern 125 while achieving a space including the cutting pattern 160 of the conductive adhesive film 155, so that the winding stability may be further improved.

Fig. 3 to 6 are schematic sectional views illustrating a method of manufacturing a conductive film laminate according to an exemplary embodiment.

Referring to fig. 3, a separation adhesive layer 110 and a backing layer 120 may be sequentially formed on a carrier substrate 100. The separation adhesive layer 110 may be formed using, for example, an adhesive composition or tape based on a Pressure Sensitive Adhesive (PSA) or based on an Optically Clear Adhesive (OCA).

The backing layer 120 may be formed using a release liner material commercially available in the field of tape laminates or film laminates.

Referring to fig. 4, the backing layer 120 may be partially cut or removed to form a backing pattern 125. For example, a central portion of the backing layer 120 may be cut/removed to form a backing pattern 125, the backing pattern 125 extending substantially parallel to each other on both sides of the separation adhesive layer 110. The opening 110 may be formed by a space from which the backing layer 120 is removed.

Referring to fig. 5, a conductive film liner layer 130 and a conductive adhesive layer 150 may be formed in the opening 110. The conductive film liner layer 130 and the conductive adhesive layer 150 may substantially fill the opening 110 as one pre-laminate. For example, the prelaminate may completely fill the opening 110.

The conductive film backing layer 130 may be formed using a release backing material substantially the same as or similar to the release backing material of the backing layer 120. The conductive adhesive layer 150 may be formed using, for example, ACF.

In some embodiments, a first release layer 140 as shown in fig. 1 may be formed between the conductive film liner layer 130 and the conductive adhesive layer 150.

Referring to fig. 6, the pre-laminate formed in the opening 110 may be cut to form a cut pattern 160 including the conductive film liner 135 and the conductive adhesive film 155.

The cutting pattern 160 having a reduced width may be formed of a pre-laminate through a cutting process. In addition, the cutting pattern 160 may be spaced apart from the liner pattern 125 to form a gap G.

As described above, the cutting process of the conductive adhesive layer 150 may be performed while being combined with the carrier substrate 100, so that the conductive adhesive film 155 having a thin width may be more stably formed.

The liner pattern 125 may serve as a partition wall pattern that supports the pre-laminate during the cutting process. Further, the liner pattern 125 may substantially serve as a guide pattern for performing a cutting process. Accordingly, leakage/damage of the resin layer or the conductive balls included in the conductive adhesive layer 150 may be prevented, and the cutting process may be stably performed.

Thereafter, as shown in fig. 2, a second release layer 170 may be formed on the conductive adhesive film 155 and the liner pattern 125 to form a conductive film laminate.

Fig. 7 is a schematic top plan view for describing a cutting process of a conductive adhesive layer according to an exemplary embodiment.

Referring to fig. 7, the pre-laminate including the conductive adhesive layer 150 may be cut using a cutter 50, as described with reference to fig. 6, to form a conductive adhesive film 155.

In an exemplary embodiment, both ends of the cutter 50 may be formed with protrusions 55. The convex portion 55 may have a curved shape. For example, a pair of cutters 50 may be aligned on both ends of the conductive adhesive layer 150 in the width direction in a plan view, and then the cutting process may be repeatedly performed while moving the cutters 50 in the length direction.

The cutter 50 including the convex portion 55 (which may have a curved shape) may be used, so that mechanical damage to the conductive adhesive layer 150 at the cut edge portion may be prevented. In addition, the cutting process can be gradually performed while repeatedly moving the cutter 50, so that leakage of the resin at the cut surface can be suppressed.

In some embodiments, the liner pattern 125 may be substantially provided as a guide pattern for the cutting process. For example, in plan view, the cutter 50 may move in a direction substantially parallel to the sidewall of the liner pattern 125.

As shown in fig. 7, the sub-cut line 60 of a dotted line shape may be formed by a single cut, and the cutting may be repeated so that a portion of the sub-cut line 60 formed by the protrusion 55 or a cut region formed by the protrusion 55 may overlap while moving the cutter 50 in the length direction.

Accordingly, the cutting line 65 extending in a substantially straight shape may be formed to obtain the conductive adhesive film 155 having a fine line width.

For example, the conductive adhesive film 155 having a fine line width of about 1mm or less, about 0.5mm or less, or about 0.4mm or less can be formed with high reliability by using the above-described stack structure and the cutting process.

Fig. 8 is a schematic top plan view illustrating a touch sensor module manufactured according to an exemplary embodiment.

Referring to fig. 8, the touch sensor module 200 may include sensing electrodes 210 and 220 disposed on a substrate layer 205.

The substrate layer 205 may comprise, for example, a flexible transparent insulating material. For example, the substrate layer 105 may include Cyclic Olefin Polymer (COP), polyethylene terephthalate (PET), Polyacrylate (PAR), Polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallyl, Polyimide (PI), Cellulose Acetate Propionate (CAP), Polyethersulfone (PES), cellulose Triacetate (TAC), Polycarbonate (PC), Cyclic Olefin Copolymer (COC), polymethyl methacrylate (PMMA), and the like. The substrate layer 205 may include an inorganic insulating material such as glass or silicon oxide.

The substrate layer 205 may include an active area AA and a bonding area BA. The active area AA may include a central portion of the substrate layer 205 and may be an area where a user's touch is substantially recognized to generate a signal. For example, when a user's touch is input onto the active area AA, a change in capacitance may occur due to the sensing electrodes 210 and 220. Thus, a physical touch can be converted to an electrical signal to enable touch sensing.

The sensing electrodes 210 and 220 may include a first sensing electrode 210 and a second sensing electrode 220.

The first sensing electrodes 210 may be arranged along a length direction or a column direction of the substrate layer 205 or the touch sensor module, for example. Accordingly, the first sensing electrode column may be formed of the plurality of first sensing electrodes 210. In addition, a plurality of first sensing electrode columns may be arranged along a width direction or a row direction.

In some embodiments, the first sensing electrodes 210 adjacent in the column direction may be physically or electrically connected to each other through the connection part 215. For example, the connection part 215 may be integrally formed on the same level as the first sensing electrode.

The second sensing electrodes 220 may be arranged in a row direction or a width direction. In some embodiments, the second sensing electrodes 220 may be physically spaced apart from each other as island-type unit electrodes. In this case, the second sensing electrodes 220 adjacent in the row direction may be electrically connected to each other through the bridge electrode 225.

The second sensing electrodes 220 may be connected to each other by a bridge electrode 225 and arranged in a row direction, so that a second sensing electrode row may be formed. The plurality of second sensing electrode rows may be arranged along a column direction or a length direction.

The sensing electrodes 210 and 220 and the bridge electrode 225 may each include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy including at least one of the above metals (e.g., a silver-palladium-copper (APC) alloy or a copper-calcium (CuCa) alloy). These may be used alone or in combination thereof. For example, the sensing electrodes 210 and 220 may have a mesh structure including a metal or an alloy.

The sensing electrodes 210 and 220 and the bridge electrode 225 may include a transparent conductive material, for example, a transparent conductive oxide such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), zinc oxide (ZnO), Indium Zinc Tin Oxide (IZTO), Cadmium Tin Oxide (CTO), etc., silver nanowire (AgNW), Carbon Nanotube (CNT), graphene, conductive polymer, etc.

In some embodiments, the sensing electrodes 210 and 220 may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the sensing electrodes 210 and 220 may have a double-layer structure of a transparent conductive oxide layer-metal layer, or a triple-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer may improve the flexibility characteristics, and the low resistance of the metal layer may increase the signal transmission speed. The transparent conductive oxide layer may improve corrosion resistance and transparency.

In some embodiments, the bridge electrode 225 may be formed on an insulating layer (not shown). The insulating layer may at least partially cover the connection portion 215 included in the first sensing electrode 210, and at least partially cover the second sensing electrode 220 around the connection portion 215. The bridge electrode 225 may be formed through the insulating layer and may be electrically connected to the second sensing electrodes 220 adjacent to each other with the connection portion 215 between the second sensing electrodes 220 adjacent to each other.

The insulating layer may include an inorganic insulating material such as silicon oxide or silicon nitride, or an organic insulating material such as an acrylic resin or a siloxane-based resin.

Traces 230 may branch (branch) and extend from each of the first and second columns of sense electrodes. The trace 230 may branch from each end of the first and second sensing electrode columns and the second sensing electrode row, and may extend over a peripheral area of the active area AA.

The traces 230 may extend toward a bonding area BA allocated to a portion of one end of the substrate layer 205 in the length direction, for example. The ends of the traces 230 may be grouped together at a junction BA of the substrate layer 205. The pads 240 may be formed on the bonding area BA, and each pad 240 may be connected to a trace 230. In an embodiment, the ends of the traces 230 may be provided as pads 240.

The connection structure of the trace 230 and the pad 240 is omitted in fig. 8 for convenience of description.

In some embodiments, the touch sensor module may be formed through a transfer process. For example, a sensing electrode layer including the above-described sensing electrodes 210 and 220, bridge electrode 225, and trace 230 may be formed on a carrier substrate. Thereafter, the sensing electrode layer may be transferred to the substrate layer 205, and the carrier substrate may be peeled off and removed to obtain the touch sensor structure.

In an embodiment, a separation layer including an organic material for promoting peeling may be formed between the sensing electrode layer and the carrier substrate. The sensing electrode layer and the substrate layer 205 may be bonded to each other by an adhesive layer.

According to the above-described exemplary embodiment, the conductive adhesive film 155 may be separated from the conductive film laminate and adhered to the pad 240. Thereafter, a circuit board 250, such as a Flexible Printed Circuit Board (FPCB), may be stacked on the conductive adhesive film 155, and a pressure bonding process may be performed.

Accordingly, the pad 240 and the circuit board 250 may be electrically connected to each other through the conductive adhesive film 155 to transmit a driving signal, a scanning signal, and the like for touch sensing.

When the sizes of the pad 240 and the bonding area BA are reduced, the narrow conductive adhesive film 155 may be stably supplied and adhered from the conductive film laminate according to the above-described exemplary embodiment. Accordingly, the area of the active area AA may be relatively increased while improving the electrical stability and sensing reliability of the touch sensor module 200.