阅读说明：本技术 一种改变贴片电阻封胶方式提高产品良率的工艺 (Process for improving product yield by changing adhesive sealing mode of chip resistor ) 是由 胡紫阳 程倩倩 李智 于 2020-12-08 设计创作，主要内容包括：本发明涉及贴片电阻塑封技术领域,公开了一种改变贴片电阻封胶方式提高产品良率的工艺,包括：获取待塑封的贴片电阻；根据所述待塑封的贴片电阻,对其进行均匀喷涂油漆。本发明实施例公开了一种改变贴片电阻封胶方式提高产品良率的工艺,通过获取待塑封的贴片电阻；根据所述待塑封的贴片电阻,对其进行均匀喷涂油漆。与现有技术相比,改善了塑封的复杂工艺,提高了产品良率,减少了工艺流程和生产成本,并且满足需要小封装电阻客户的需求。(The invention relates to the technical field of chip resistor plastic package, and discloses a process for improving the yield of products by changing the chip resistor sealing mode, which comprises the following steps: obtaining a chip resistor to be plastically packaged; and uniformly spraying paint on the chip resistor to be plastically packaged according to the chip resistor to be plastically packaged. The embodiment of the invention discloses a process for improving the yield of a product by changing a sealing glue mode of a chip resistor, which comprises the steps of obtaining a chip resistor to be subjected to plastic sealing; and uniformly spraying paint on the chip resistor to be plastically packaged according to the chip resistor to be plastically packaged. Compared with the prior art, the complex plastic package process is improved, the product yield is improved, the process flow and the production cost are reduced, and the requirements of customers needing small package resistors are met.)

1. A process for improving the yield of a product by changing the adhesive sealing mode of a chip resistor is characterized by comprising the following steps:

obtaining a chip resistor to be plastically packaged;

and uniformly spraying paint on the chip resistor to be plastically packaged according to the chip resistor to be plastically packaged.

2. The process for improving product yield by changing the encapsulation method of the chip resistor as claimed in claim 1, further comprising:

carrying out heat preservation and solidification treatment on the sprayed chip resistor;

and carrying out particle forming on the surface mounted resistor subjected to heat preservation treatment.

3. The process for improving the yield of chip resistors by changing the sealing manner of the chip resistors as claimed in claim 1, wherein the chip resistors are uniformly sprayed by a manual oil spraying technique to precisely control the thickness of the paint to micron level.

4. The process for improving the yield of products by changing the manner of sealing adhesive of the chip resistor as claimed in claim 1, wherein the paint is silicone resin paint, and the silicone resin paint can resist high temperature of more than 200 ℃ and high pressure of more than 500V.

Technical Field

The invention relates to the technical field of chip resistor plastic package, in particular to a process for improving the yield of products by changing a chip resistor sealing mode.

Background

In the plastic packaging process of the conventional chip resistor, plastic packaging glue easily overflows from a resistor terminal to influence subsequent tin plating (or tin plating can not be performed) of the terminal, and a glue removing process is required; in the process of removing the glue, the mechanical or laser treatment of the longitudinally redundant plastic sealing glue on the frame easily causes the deformation of the frame and burrs to generate bad products; the debugging of different product equipment is tedious, and the plastic packaging and glue removing process reduces the working efficiency and the product yield.

Therefore, how to provide a chip resistor plastic package process to change the chip resistor molding manner and improve the product yield is a technical problem to be solved urgently.

Disclosure of Invention

The technical problem to be solved by the invention is how to provide a chip resistor plastic package process to change the chip resistor sealing method and improve the product yield.

Therefore, according to a first aspect, an embodiment of the present invention discloses a process for improving product yield by changing a chip resistor sealing manner, including: obtaining a chip resistor to be plastically packaged; and uniformly spraying paint on the chip resistor to be plastically packaged according to the chip resistor to be plastically packaged.

The invention is further configured to further include: carrying out heat preservation and solidification treatment on the sprayed chip resistor; and carrying out particle forming on the surface mounted resistor subjected to heat preservation treatment.

The invention is further arranged to uniformly spray the chip resistor by a manual oil spraying technology so as to accurately control the thickness of the paint to a micron level.

The invention is further set that the paint is organic silicon resin paint which can resist high temperature of more than 200 ℃ and resist high pressure of more than 500V.

The invention has the following beneficial effects: the embodiment of the invention discloses a process for improving the yield of a product by changing a sealing glue mode of a chip resistor, which comprises the steps of obtaining a chip resistor to be subjected to plastic sealing; and uniformly spraying paint on the chip resistor to be plastically packaged according to the chip resistor to be plastically packaged. Compared with the prior art, the complex plastic package process is improved, the product yield is improved, the process flow and the production cost are reduced, and the requirements of customers needing small package resistors are met.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a process for improving product yield by changing a chip resistor sealing manner disclosed in this embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

The embodiment of the invention discloses a process for improving the yield of products by changing the sealing glue mode of a chip resistor, as shown in figure 1, the process comprises the following steps:

step S101, obtaining a chip resistor to be plastically packaged;

and S102, uniformly spraying paint on the chip resistor to be plastically packaged.

The embodiment of the invention discloses a process for improving the yield of a product by changing the adhesive sealing mode of a chip resistor, wherein the chip resistor to be subjected to plastic sealing is obtained; and uniformly spraying paint on the chip resistor to be plastically packaged according to the chip resistor to be plastically packaged. Compared with the prior art, the complex plastic package process is improved, the product yield is improved, the process flow and the production cost are reduced, and the requirements of customers needing small package resistors are met.

In the specific implementation process, the method further comprises the following steps: carrying out heat preservation and solidification treatment on the sprayed chip resistor; and carrying out particle forming on the surface mounted resistor subjected to heat preservation treatment.

In the specific implementation process, the chip resistors are uniformly sprayed by a manual oil spraying technology so as to accurately control the thickness of the paint to be in a micron level.

In the specific implementation process, the paint is organic silicon resin paint which can resist high temperature of more than 200 ℃ and resist high pressure of more than 500V.

The working principle is as follows: the embodiment of the invention discloses a process for improving the yield of a product by changing a sealing glue mode of a chip resistor, which comprises the steps of obtaining a chip resistor to be subjected to plastic sealing; and uniformly spraying paint on the chip resistor to be plastically packaged according to the chip resistor to be plastically packaged. Compared with the prior art, the complex plastic package process is improved, the product yield is improved, the process flow and the production cost are reduced, and the requirements of customers needing small package resistors are met.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.