阅读说明：本技术 介质波导滤波器及其介质陶瓷银层加工方法 (Dielectric waveguide filter and method for processing dielectric ceramic silver layer thereof ) 是由 曾卓玮 林显添 丁海 于 2020-12-28 设计创作，主要内容包括：本申请提供了一种介质波导滤波器及其介质陶瓷银层加工方法,所述方法包括：将介质波导滤波器的介质陶瓷表面喷银形成银层；烘干介质陶瓷上的所述银层；按照预设的清扫图层对烘干后的银层实施激光雕刻,完成所述银层的表面图形加工；烧结固化所述银层。本申请通过先对介质陶瓷烘干后的银层进行激光雕刻然后烧结的方式,对介质波导滤波器的介质陶瓷进行银层加工,避免加工过程中产生意外损伤,提升介质波导滤波器整体的可靠性。(The application provides a dielectric waveguide filter and a method for processing a dielectric ceramic silver layer thereof, wherein the method comprises the following steps: spraying silver on the surface of the dielectric ceramic of the dielectric waveguide filter to form a silver layer; drying the silver layer on the dielectric ceramic; performing laser engraving on the dried silver layer according to a preset cleaning layer to finish the surface pattern processing of the silver layer; and sintering and solidifying the silver layer. This application carries out laser engraving and then the mode of sintering through the silver layer to medium ceramic after drying earlier, carries out silver layer processing to medium ceramic of medium waveguide filter, avoids producing unexpected damage in the course of working, promotes the holistic reliability of medium waveguide filter.)

1. The method for processing the dielectric ceramic silver layer is characterized by comprising the following steps of:

spraying silver on the surface of the dielectric ceramic of the dielectric waveguide filter to form a silver layer;

drying the silver layer on the dielectric ceramic;

performing laser engraving on the dried silver layer according to a preset cleaning layer to finish the surface pattern processing of the silver layer;

and sintering and solidifying the silver layer.

2. The method for processing the dielectric ceramic silver layer according to 1 is characterized in that in the step of spraying silver on the surface of the dielectric ceramic of the dielectric waveguide filter to form the silver layer, a silver spraying machine is adopted to spray silver on the surface of the dielectric ceramic, and the silver spraying pressure is set as follows: 0.17 +/-0.05 Pa, and the viscosity of the silver paste is controlled as follows: 1.1. + -. 0.10 Pas.

3. The method for processing the silver layer of the dielectric ceramic according to 1, is characterized in that in the step of drying the silver layer on the dielectric ceramic, the dielectric ceramic after silver spraying is placed in a high-temperature environment for drying for a preset time, and the drying temperature is set to be any value between 120 ℃ and 180 ℃.

4. The method for processing the dielectric ceramic silver layer according to the claim 3, wherein the predetermined time is not less than 10 minutes.

5. The method for processing the silver layer of the dielectric ceramic according to the 1 is characterized in that the step of performing laser engraving on the dried silver layer according to the preset cleaning layer to finish the processing of the surface pattern of the dielectric ceramic comprises the following steps:

receiving process control parameters by a laser engraving machine;

driving a laser engraving machine to engrave the dried layer according to a preset cleaning layer according to the process control parameters;

and finishing the surface pattern processing of the silver layer after finishing the engraving by using a laser engraving machine.

6. The method for processing the dielectric ceramic silver layer according to the claim 5, wherein the process control parameters comprise: the laser pulse width is set to any value between 0 and 40 ns.

7. The method for processing the dielectric ceramic silver layer according to the claim 5, wherein the process control parameters comprise: and the marking times are set to be multiple times so as to control the laser engraving machine to perform multiple times of engraving according to the cleaning layer.

8. The method for processing the silver layer of the dielectric ceramic is characterized in that in the step of sintering and curing the silver layer, the dielectric ceramic is placed in a silver burning furnace to adapt to a sintering curve of silver paste used by the silver layer, and the silver burning furnace is controlled to change different temperatures to sinter and cure the silver layer.

9. The method for processing the dielectric ceramic silver layer is characterized in that the silver burning furnace is provided with a plurality of temperature zones on a time domain or a space domain to respectively sinter the silver layer at different temperatures.

10. The method for processing the dielectric ceramic silver layer according to 9, wherein the temperatures of a plurality of temperature zones through which the dielectric ceramic passes are arranged according to low temperature-high temperature-low temperature relative to each other.

11. The method for processing the dielectric ceramic silver layer according to 8, wherein the variation interval of the different temperatures is 500-950 ℃.

12. The method for processing the silver layer on the dielectric ceramic is characterized in that after the step of drying the silver layer on the dielectric ceramic, the following steps are preferentially carried out:

and detecting whether the thickness of the dried silver layer reaches a preset interval or not, and continuing to execute the subsequent steps after the thickness of the dried silver layer reaches the preset value.

13. The method for processing the dielectric ceramic silver layer according to 12, wherein the preset interval is as follows: 10-15 μm.

14. A dielectric waveguide filter comprising a dielectric ceramic prepared by the method for processing a silver layer of a dielectric ceramic as claimed in any one of claims 1 to 13.

Technical Field

The invention relates to a production and processing technology of a dielectric waveguide filter, in particular to a processing method of a dielectric ceramic silver layer.

Background

With the rapid development of the 5G era, miniaturization, light weight and low cost have become the future development trend of dielectric waveguide filters. In recent years, a miniaturized dielectric filter based on a microwave dielectric material has attracted much attention from the industry, in which a dielectric waveguide filter has been widely used in a 5G antenna and is applied in a 5G base station in mass.

In the dielectric ceramic silver surface processing technology, partial silver removal is needed on the surface of a silver coating layer after metallization of the surface of the dielectric ceramic, and the carving of a port excitation pattern and a coupling window pattern is completed. The existing commonly used method for removing silver from the silver surface of the dielectric ceramic comprises the following steps: a laser engraving processing technique of the silver layer after sintering and a customized special screen printing processing technique.

In the laser engraving process of the sintered silver layer, the high-power engraving layer and the low-power cleaning layer are combined to bombard the surface of the dielectric ceramic of the sintered dielectric waveguide filter to complete local engraving and silver removal of the surface of the dielectric ceramic, but the engraving and silver removal method adopting laser bombardment has great damage to the surface of the sintered dielectric ceramic, so that cracks are easily generated on the surface, the reliability of the dielectric waveguide filter is influenced, and carbide residues are left on the edge of the surface of the engraved and silver-removed dielectric ceramic, so that the high-sensitivity coupling window is greatly influenced.

Although the specific screen printing processing technology can ensure that the silver removing area of the dielectric waveguide filter is not damaged, the edge of the surface of the dielectric ceramic is provided with a chamfer because the existing dielectric waveguide filter taking ceramic as a medium is formed by dry pressing by using a mould, the silver on the surface of the dielectric ceramic can be coated only by adopting a surface silver spraying technology, the problem of silver coating on the chamfer of the product is difficult to solve by screen printing, and the existing screen printing technology has high precision for the position and the size of a silver removing pattern, the precision of the existing screen is difficult to meet the silver removing requirement of the dielectric waveguide filter, and the process cost is high.

Disclosure of Invention

The invention aims to provide a method for processing a dielectric ceramic silver layer.

Another object of the present invention is to provide a dielectric waveguide filter prepared by the method for processing the dielectric ceramic silver layer.

In order to achieve the above purpose, the invention provides the following technical scheme:

the invention provides a processing method of a dielectric ceramic silver layer, which is suitable for the primary purpose of the invention and comprises the following steps:

spraying silver on the surface of the dielectric ceramic of the dielectric waveguide filter to form a silver layer;

drying the silver layer on the dielectric ceramic;

performing laser engraving on the dried silver layer according to a preset cleaning layer to finish the surface pattern processing of the silver layer;

and sintering and solidifying the silver layer.

In a further embodiment, in the step of spraying silver on the surface of the dielectric ceramic of the dielectric waveguide filter to form the silver layer, a silver spraying machine is used for spraying silver on the surface of the dielectric ceramic, and the silver spraying pressure is set as follows: 0.17 +/-0.05 Pa, and the viscosity of the silver paste is controlled as follows: 1.1. + -. 0.10 Pas.

In a further embodiment, in the step of drying the silver layer on the dielectric ceramic, the dielectric ceramic after silver spraying is placed in a high-temperature environment to be dried for a predetermined time, and the drying temperature is set to be any value between 120 ℃ and 180 ℃.

In a preferred embodiment, the predetermined period of time is not less than 10 minutes.

In a further embodiment, the step of performing laser engraving on the dried silver layer according to a preset cleaning layer to complete the processing of the surface pattern of the dielectric ceramic comprises the following steps:

receiving process control parameters by a laser engraving machine;

driving a laser engraving machine to engrave the dried layer according to a preset cleaning layer according to the process control parameters;

and finishing the surface pattern processing of the silver layer after finishing the engraving by using a laser engraving machine.

In a preferred embodiment, the process control parameters include: the laser pulse width is set to any value between 0 and 40 ns.

In a preferred embodiment, the process control parameters include: and the marking times are set to be multiple times so as to control the laser engraving machine to perform multiple times of engraving according to the cleaning layer.

In a further embodiment, in the step of sintering and curing the silver layer, the dielectric ceramic is placed in a silver firing furnace to adapt to a sintering curve of silver paste used for the silver layer, and the silver firing furnace is controlled to change different temperatures to sinter and cure the silver layer.

In a preferred embodiment, the silver burning furnace is characterized in that a plurality of temperature zones are provided in a time domain or a space domain to respectively perform sintering processing on the silver layer at different temperatures.

In a preferred embodiment, the temperatures of the plurality of temperature zones through which the dielectric ceramic passes are arranged in a low-high-low arrangement relative to one another.

In a preferred embodiment, the variation range of the different temperatures is 500-950 ℃.

In a further embodiment, after the step of drying the silver layer on the dielectric ceramic, the following steps are preferably performed:

and detecting whether the thickness of the dried silver layer reaches a preset interval or not, and continuing to execute the subsequent steps after the thickness of the dried silver layer reaches the preset value.

In a preferred embodiment, the preset interval is: 10-15 μm.

The invention also provides a dielectric waveguide filter which comprises the dielectric ceramic prepared by the method for processing the silver layer of the dielectric ceramic.

The technical scheme provided by the invention has the beneficial effects that:

the invention firstly carries out laser engraving on the silver layer on the surface of the dielectric ceramic of the dielectric waveguide filter and then carries out sintering on the silver layer, thereby ensuring that the surface of the dielectric ceramic of the dielectric waveguide filter is not damaged due to higher hardness of the sintered dielectric ceramic surface in the laser engraving process, and ensuring the integral reliability of the dielectric waveguide filter.

Secondly, after laser engraving of the silver layer on the surface of the dielectric ceramic is finished, sintering is carried out, and carbide generated on the silver layer at the edge of the device due to laser engraving can be removed at high temperature by using the high temperature of a sintering furnace, so that the carbide is prevented from influencing a high-sensitivity coupling window of the dielectric waveguide filter.

In addition, the invention is a novel process optimized based on the existing dielectric ceramic silver surface processing process, namely the processing method of the dielectric ceramic silver layer has feasibility and does not increase the process cost.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic flow chart of an exemplary embodiment of a method for processing a dielectric ceramic silver layer according to the present application;

fig. 2 is a schematic flow chart of another embodiment of the dielectric ceramic silver layer processing method of the present application.

Detailed Description

Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present invention. It should be understood that the drawings and the embodiments of the present invention are illustrative only and are not intended to limit the scope of the present invention.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be understood that the various steps recited in the method embodiments of the present invention may be performed in a different order and/or performed in parallel. Moreover, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the invention is not limited in this respect.

The term "include" and variations thereof as used herein are open-ended, i.e., "including but not limited to". The term "coupled" may refer to direct coupling or indirect coupling via intermediate members (elements). The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions for other terms will be given in the following description.

It should be noted that the terms "first", "second", and the like in the present invention are only used for distinguishing the devices, modules or units, and are not used for limiting the devices, modules or units to be different devices, modules or units, and are not used for limiting the sequence or interdependence relationship of the functions executed by the devices, modules or units.

Referring to fig. 1, a method for processing a dielectric ceramic silver layer according to the present invention, in an exemplary embodiment, includes the following steps:

step S11, silver spraying is carried out on the surface of the dielectric ceramic of the dielectric waveguide filter to form a silver layer:

silver spraying is carried out on the surface of the dielectric ceramic of the dielectric waveguide filter by using a silver spraying device, so that the surface of the dielectric ceramic forms a silver layer.

Further, the silver spraying device is a silver spraying machine, preferably a full-automatic silver spraying machine, the silver spraying air pressure is set to be 0.17 ± 0.05Pa, and the viscosity of the silver paste used by the silver spraying machine is as follows: 1.1 +/-0.10 Pas; the silver spraying machine with the silver spraying air pressure and the silver paste viscosity can ensure that the silver spraying machine sprays silver on the surface of the dielectric ceramic to form a silver layer, the silver paste is uniformly distributed, and the silver paste is not easy to fall off from the surface of the dielectric ceramic.

Step S12, drying the silver layer on the dielectric ceramic:

before laser engraving and sintering the silver layer of the dielectric ceramic, the silver layer of the dielectric ceramic needs to be pretreated, namely, the silver layer on the dielectric ceramic is dried, so that the silver layer of the dielectric ceramic is preliminarily fixed, and the silver layer is prevented from generating bubbles and flowing and deforming.

Further, the silver layer of the dielectric ceramic is dried at any temperature within a predetermined time period within a drying temperature range of 120-180 ℃, wherein the predetermined time period is not less than 10 minutes, and the specific drying time can be determined by the drying temperature but follows the drying temperature range and the predetermined time. In a preferred embodiment, the drying temperature can be controlled to any value between 140 ℃ and 160 ℃ under the constraint of a predetermined time period of 10 minutes, for example, taking the median value of 150 ℃, and the drying effect is found to be better.

Preferably, after the silver layer of the dielectric ceramic is dried, a thickness measuring device can be used for detecting whether the thickness of the silver layer of the dielectric ceramic after the drying is within a preset interval, if the thickness of the silver layer reaches within the preset interval, subsequent laser engraving and sintering can be carried out, and if the thickness of the silver layer does not reach within the preset interval, the dielectric ceramic is treated as a defective product.

The preset interval is usually larger than 10 μm, and is preferably set in the range of 10-15 μm, or is directly set according to 10 μm, 11 μm, and 12 μm, and the thickness range can ensure that the thickness of the silver layer of the dielectric ceramic after sintering reaches the application precision requirement of the dielectric waveguide filter.

Step S13, laser engraving is carried out on the dried silver layer according to a preset cleaning layer, and the processing of the surface pattern of the silver layer is completed:

after the silver layer of the dielectric ceramic is dried, laser engraving is carried out on the silver layer of the dielectric ceramic according to a preset cleaning layer by using a laser engraving machine, so that a pattern formulated by the cleaning layer is formed on the surface of the silver layer, and the primary engraving of a port excitation pattern and a coupling window pattern of the dielectric ceramic of the dielectric waveguide filter is completed.

And the cleaning layer is used for describing an engraving path of the laser engraving machine for engraving the silver layer of the dielectric ceramic so as to control the laser engraving machine to engrave a port excitation pattern and a coupling window pattern required by the dielectric waveguide filter on the silver layer of the dielectric ceramic according to the engraving path.

Referring to fig. 2, the specific laser engraving steps of the silver layer of the dielectric ceramic by the laser engraving machine are as follows:

step S131, receiving process control parameters by the laser engraving machine:

and the laser engraving machine receives the process control parameters so as to perform laser engraving on the silver layer of the dielectric ceramic according to the cleaning layer and the process control parameters.

The process control parameters are used for controlling a laser engraving machine to perform laser engraving on the silver layer of the dielectric ceramic according to preset parameters, and in one embodiment, the process control parameters mainly comprise: the marking times and the pulse width are more than 1, so that a laser engraving machine can perform laser engraving on the silver layer of the dielectric ceramic for multiple times, silver residues do not exist at scribed lines of a pattern formed by the silver layer of the dielectric ceramic, and the setting range of the pulse width is 0-40ns, so that the duration of the laser power maintenance of the laser engraving machine is controlled to be suitable for the laser engraving of the silver layer of the dielectric ceramic, preferably, the pulse width can be set to any value between 2 and 10ns, for example, the actual measurement of the laser engraving machine between 3ns, 5ns, 7ns and 9ns can obtain a better engraving effect, and therefore, the setting can be performed based on the situation; on the premise of following the setting of the parameters, the parameters of the process control parameters are determined by the engraving path of the cleaning layer.

Indeed, the specific parameters may be different for different laser engravers, for example, some laser engravers may further need to set their marking speed, jump speed, on-delay, off-delay, laser frequency, etc., and these parameters may be partially or wholly set by default by the laser engraver, and may be flexibly determined by those skilled in the art according to the principles disclosed herein. For example, in one embodiment, the marking speed may be 1800mm/s, the jumping speed may be 2000mm/s, the on-delay may be 10 μ s, the off-delay may be 30 μ s, and the laser frequency may be 500 KHz. The parameter setting of the embodiment can enable the laser engraving machine to perform engraving with higher efficiency, and the overall effect of the obtained product is better after the whole process of the method.

Step S132, the laser engraving machine is driven by the process control parameters to engrave the dried layer according to the preset cleaning layer:

and engraving the engraving path made by the cleaning layer on the silver layer of the dielectric ceramic by the laser engraving machine according to the preset parameters of the process control parameters.

Step S133, finishing the processing of the surface pattern of the silver layer after finishing engraving by a laser engraving machine:

and after the laser engraving machine finishes engraving the figure specified by the cleaning figure layer on the silver layer of the dielectric ceramic according to the process control parameters, namely finishing engraving the figure of the silver layer of the dielectric ceramic, and then sintering the silver layer of the dielectric ceramic.

Step S14, sintering and curing the silver layer:

and after the pattern engraving processing of the silver layer of the dielectric ceramic is finished, sintering the silver layer of the dielectric ceramic.

And sintering the silver layer of the dielectric ceramic by using high temperature not higher than the melting point of silver to reinforce the silver layer of the dielectric ceramic, so that the surface of the ceramic dielectric is more tightly combined with the silver layer, and the overall reliability of the dielectric waveguide filter is improved.

Further, the dielectric ceramic is placed into a silver firing furnace, and the silver firing furnace is controlled to sinter the silver layer of the dielectric ceramic in different temperature zones according to a sintering curve set by the temperature of the silver layer suitable for the dielectric ceramic.

The sintering curve is generally expressed by taking an abscissa as time and an ordinate as temperature in a rectangular plane coordinate system, and can also be a curve formed by combining different temperature zones, namely the sintering curve specifies that the dielectric ceramic is sintered at corresponding temperatures in different times.

The trend of the sintering curve is low temperature-high temperature-low temperature, the low temperature is not lower than 500 ℃, the high temperature is not higher than 950 ℃, so as to control the temperatures of a plurality of temperature zones in the sintering furnace to be arranged according to the mutually opposite low temperature-high temperature-low temperature, and in one embodiment, the specific temperature zone setting can be referred to as the following table:

the concrete implementation mode of controlling the silver burning furnace according to the sintering curve is as follows:

in one mode, according to the sintering curve, the silver layer of the dielectric ceramic can be sintered by controlling a silver sintering furnace to use temperature zones corresponding to different time periods in different time periods.

In another mode, the silver burning furnace is a mesh-belt silver burning furnace, a plurality of different temperature zones are arranged in the mesh-belt silver burning furnace, the medium ceramic is transmitted to the different temperature zones through a mesh belt for sintering, and the sintering curve can control the temperature of each temperature zone of the mesh-belt silver burning furnace and the transmission speed of the mesh belt, so that the medium ceramic is sintered at the corresponding temperature in the mesh-belt silver sintering furnace according to the corresponding time of the sintering curve.

When the silver layer of the dielectric ceramic is sintered in the silver firing furnace, carbides generated in laser engraving of the edge of the dielectric ceramic can be eliminated through high temperature, the carbides on the edge of the dielectric ceramic are cleaned, and the carbides are prevented from influencing a high-sensitivity coupling window of the dielectric ceramic.

The dielectric waveguide filter processed by the dielectric ceramic silver layer processing method comprises the dielectric ceramic, and the silver layer processing can be carried out on the dielectric ceramic by the dielectric ceramic silver layer processing method.

In summary, the method for processing the silver layer of the dielectric ceramic provided by the invention firstly carries out laser engraving on the silver layer of the dielectric ceramic, and then sinters the silver layer of the dielectric ceramic, so that the silver layer after sintering is prevented from being high in hardness and damaged in the laser engraving process, and carbide generated in the laser engraving process of the dielectric ceramic is eliminated through high-temperature sintering, thereby improving the overall reliability of the dielectric waveguide filter.

The foregoing description is only exemplary of the preferred embodiments of the invention and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention according to the present invention is not limited to the specific combination of the above-mentioned features, but also encompasses other embodiments in which any combination of the above-mentioned features or their equivalents is possible without departing from the scope of the invention as defined by the appended claims. For example, the above features and (but not limited to) features having similar functions of the present invention are mutually replaced to form the technical solution.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.