阅读说明：本技术 半导体及显示面板制造设备用管道保温材料 (Pipeline heat-insulating material for semiconductor and display panel manufacturing equipment ) 是由 金相范 于 2020-09-18 设计创作，主要内容包括：公开的半导体及显示面板制造设备用管道保温材料包括保温材料本体构件、内侧保温罩构件、连接构件及外侧保温罩构件,因此在所述保温材料本体构件及所述内侧保温罩构件缠绕管道的状态下,所述外侧保温罩构件按压所述内侧保温罩构件,所述半导体及显示面板制造设备用管道保温材料的优点在于,无需额外的附加工作,例如绑扎等,也能够以简单地缠绕所述管道的方式进行施工,并且可提高所述管道的保温性能。(The disclosed pipe thermal insulation material for a semiconductor and display panel manufacturing apparatus includes a thermal insulation material body member, an inner thermal insulation cover member, a connection member, and an outer thermal insulation cover member, and thus the outer thermal insulation cover member presses the inner thermal insulation cover member in a state where the thermal insulation material body member and the inner thermal insulation cover member are wound around a pipe.)

1. A pipe heat insulating material for a semiconductor and display panel manufacturing apparatus, which is used for heat insulation by winding a pipe suitable for a semiconductor and display panel manufacturing apparatus capable of manufacturing at least one of a semiconductor and a display panel, the pipe heat insulating material comprising:

an insulation body member wrapped around a portion of an exterior face of the duct;

an inner insulating cover member covering at least a part of the outside face of the pipe other than the part covered by the insulating material body member;

a connecting member for connecting a side portion of the thermal insulation material body member and the inside thermal insulation cover member;

an outer heat insulating cover member which is connected to the other side portion of the heat insulating material body member in a state where the heat insulating material body member covers the outer surface of the pipe together with the inner heat insulating cover member, and which presses the inner heat insulating cover member toward the outer surface of the pipe by covering the inner heat insulating cover member; and

a protrusion stopper member protruding with a predetermined length in an inner face of the outer heat-insulating cover member,

in a state where one side portion of the heat insulating material body member is connected to the inner heat insulating cover member through the connecting member and the other side portion of the heat insulating material body member is connected to the outer heat insulating cover member,

the pipe is placed on the thermal insulation material body member when the inner side thermal insulation cover member and the outer side thermal insulation cover member are in an open state with respect to the thermal insulation material body member,

the inner insulating cover member covers the pipe on the insulating material body member in a state where the pipe is placed on the insulating material body member,

the outer heat-insulating cover member covers the inner heat-insulating cover member in a state where the inner heat-insulating cover member covers the pipe on the heat-insulating material body member, and the inner heat-insulating cover member covers the pipe so as to be closed as being wound around the pipe,

a protruding locking surface is formed on the other surface of the protruding stopper member facing the heat insulating material body member so that a distal end surface of the inner heat insulating cover member covering the pipe on the heat insulating material body member is locked to the protruding locking surface,

an inner heat-insulating engaging surface is formed on the other surface of the connecting member facing the heat-insulating material body member such that the distal end surface of the outer heat-insulating cover member covering the inner heat-insulating cover member is engaged with the inner heat-insulating engaging surface to fit the heat-insulating material body member, the inner heat-insulating cover member, and the outer heat-insulating cover member,

a connection side rotation gap making hole and a connection side rotation variable hole are formed in a connection portion of one side portion of the thermal insulation material body member and the connection member,

a rotary gap space between one side of the heat insulating material body member and the connecting member is formed when the inner heat insulating cover member is rotated in a state of being connected to the heat insulating material body member by the connecting member so that the heat insulating material body member and the inner heat insulating cover member cover the pipeline,

the connection side rotation variable hole communicates a space formed by the inner surfaces of the inner heat-insulating cover member and the heat-insulating material body member with the rotation gap-forming hollow hole,

the connection-side rotation variable hole is gradually enlarged as moving from the connection-side rotation gap hollow hole to the respective inner surface sides of the inner heat-retaining cover member and the heat-retaining material body member when the inner heat-retaining cover member and the outer heat-retaining cover member are in an open state with respect to the heat-retaining material body member,

the connection side rotation gap making hole forms a circular hole in a portion where one side portion of the thermal insulation material body member and the connection member are connected,

the connection-side rotation variable hole is deformed into a shape having a predetermined width as moving from the connection-side rotation gap hollow hole to the respective inner surface sides of the inner heat insulating cover member and the heat insulating material body member in a state where the inner heat insulating cover member covers the pipe on the heat insulating material body member,

an outer rotary gap making hole and an outer rotary variable hole are formed in a part where the other side part of the heat insulating material body member is connected with the outer heat insulating cover member,

a rotation clearance space is formed between the other side portion of the heat insulating material body member and the outer heat insulating cover member when the outer heat insulating cover member is rotated in a state of being connected to the heat insulating material body member so that the outer heat insulating cover member covers the inner heat insulating cover member and the inner heat insulating cover member covers the pipeline,

the outer rotary variable hole communicates a space formed by the inner surfaces of the outer heat-insulating cover member and the heat-insulating material body member with the outer rotary clearance cavity hole,

the outer rotatable variable hole is gradually enlarged as moving from the outer rotatable clearance hollow hole to the inner surface sides of the outer heat insulating cover member and the heat insulating material body member when the inner heat insulating cover member and the outer heat insulating cover member are opened with respect to the heat insulating material body member,

the outer rotatable variable hole is deformed to have a predetermined width as moving from the outer rotatable gap hollow hole to the inner surfaces of the outer heat insulating cover member and the heat insulating material body member in a state where the outer heat insulating cover member covers the inner heat insulating cover member and the inner heat insulating cover member covers the duct.

2. The piping insulation material for semiconductor and display panel manufacturing equipment according to claim 1, wherein at least one of the insulation material body member, the inner insulation cover member, and the outer insulation cover member is formed with an elastic hollow hole, the insulation material body member and the inner insulation cover member cover the piping, and when the outer insulation cover member covers the inner insulation cover member, the insulation material body member, the inner insulation cover member, and the outer insulation cover member are elastically deformed along with the elastic hollow hole, so that the insulation material body member, the inner insulation cover member, and the outer insulation cover member are kept in a state of being coupled to each other.

Technical Field

The invention relates to a pipeline heat insulation material for semiconductor and display panel manufacturing equipment.

Background

The manufacturing equipment of semiconductors and display panels is equipment capable of manufacturing at least one of semiconductors and display panels, and is applied to various pipes for flowing various fluids.

In the duct applied to the manufacturing equipment of such a semiconductor and display panel, a duct insulating material is applied as necessary to maintain the temperature, and patent documents provided below are given as examples for explaining the duct insulating material for the manufacturing equipment of such a semiconductor and display panel.

However, many of the conventional pipe heat insulating materials for semiconductor and display panel manufacturing apparatuses are cylindrical, and usually have a pipe that is simply wound with one side thereof being simply opened, but in this case, the heat insulating performance is deteriorated because one side thereof is still opened, and in addition, there is a problem that the pipe needs to be additionally bonded with an adhesive tape or the like, and in addition, as described in the above patent document, the pipe is also connected by self-coupling to the pipe, but in this case, the connection structure is also complicated, and therefore, the apparatus is complicated and the installation thereof is not easy under the condition in the installation site where many pipes are installed.

Documents of the prior art

Patent document

Patent document 1: korean laid-open patent No. 10-2005-0031904, published: in 2005, 04/06 th, invention name: heat insulation structure and heat insulation kit of pipeline

Disclosure of Invention

Technical problem

An object of the present invention is to provide a pipe thermal insulation material for a semiconductor and display panel manufacturing apparatus, which can be easily wound around a pipe without additional work such as binding, and which can improve the thermal insulation performance of the pipe.

Technical scheme

According to an aspect of the present invention, there is provided a pipe insulation material for a semiconductor and display panel manufacturing apparatus, which is wound around a pipe suitable for a semiconductor and display panel manufacturing apparatus that can manufacture at least one of a semiconductor and a display panel to insulate the pipe, the pipe insulation material comprising: an insulation body member wrapped around a portion of an exterior face of the duct; an inner insulating cover member covering at least a part of the outside face of the pipe other than the part covered by the insulating material body member; a connecting member for connecting a side portion of the thermal insulation material body member and the inside thermal insulation cover member; an outer heat insulating cover member which is connected to the other side portion of the heat insulating material body member in a state where the heat insulating material body member covers the outer surface of the pipe together with the inner heat insulating cover member, and which presses the inner heat insulating cover member toward the outer surface of the pipe by covering the inner heat insulating cover member; and a protrusion stopper member that protrudes by a predetermined length from an inner surface of the outer heat insulating cover member, and that, in a state where one side portion of the heat insulating material body member is connected to the inner heat insulating cover member via the connecting member and the other side portion of the heat insulating material body member is connected to the outer heat insulating cover member, when the inner heat insulating cover member and the outer heat insulating cover member are in an open state with respect to the heat insulating material body member, the pipe is placed on the heat insulating material body member, the inner heat insulating cover member covers the pipe on the heat insulating material body member in a state where the pipe is placed on the heat insulating material body member, and the outer heat insulating cover member covers the inner heat insulating cover member for covering the pipe in a state where the inner heat insulating cover member covers the pipe on the heat insulating material body member, a protruding locking surface is formed on the other surface of the protruding stopper member facing the heat insulating material body member so that the distal end surface of the inner heat insulating cover member covering the pipe is locked to the protruding locking surface, an inner heat insulating locking surface is formed on the other surface of the connecting member facing the heat insulating material body member so that the distal end surface of the outer heat insulating cover member covering the inner heat insulating cover member is locked to the inner heat insulating locking surface, the heat insulating material body member, the inner heat insulating cover member, and the outer heat insulating cover member are fitted to each other, and a connecting-side rotation-gap hollow hole and a connecting-side rotation-variable hole are formed in a connecting portion between one side portion of the heat insulating material body member and the connecting member, wherein the connection-side rotation gap forming hole forms a rotation gap space between a side portion of the heat insulating material body member and the connection member when the inner heat insulating cover member is rotated in a state of being connected to the heat insulating material body member by the connection member so that the heat insulating material body member and the inner heat insulating cover member cover the pipeline, and the connection-side rotation variable hole communicates a space formed by inner surfaces of the inner heat insulating cover member and the heat insulating material body member with the rotation gap forming hole, and moves from the connection-side rotation gap forming hole to inner surface sides of the inner heat insulating cover member and the heat insulating material body member when the inner heat insulating cover member and the outer heat insulating cover member are opened with respect to the heat insulating material body member, the connection-side rotary variable hole is enlarged gradually, the connection-side rotary gap making hole forms a circular hole in a portion where one side portion of the heat insulating material body member and the connection member are connected, the connection-side rotary variable hole is deformed into a shape having a predetermined width as moving from the connection-side rotary gap making hole to each inner surface side of the inner heat insulating cover member and the heat insulating material body member in a state where the inner heat insulating cover member covers the pipeline on the heat insulating material body member, an outer rotary gap making hole and an outer rotary variable hole are formed in a portion where the other side portion of the heat insulating material body member and the outer heat insulating cover member are connected, and for the outer rotary gap making hole, when the outer heat insulating cover member is rotated in a state where the outer heat insulating cover member is connected to the heat insulating material body member so that the outer heat insulating cover member covers the inner heat insulating cover member and the inner heat insulating cover member When the member covers the pipe, a rotation gap space is formed between the other side portion of the heat insulating material body member and the outer heat insulating cover member, the outer rotation variable hole communicates a space formed by the outer heat insulating cover member and each inner surface of the heat insulating material body member with the outer rotation gap hollow hole, the outer rotation variable hole is gradually enlarged as moving from the outer rotation gap hollow hole to each inner surface side of the outer heat insulating cover member and the heat insulating material body member when the inner heat insulating cover member and the outer heat insulating cover member are opened with respect to the heat insulating material body member, and the outer rotation variable hole is gradually enlarged as moving from the outer rotation gap hollow hole to each inner surface side of the outer heat insulating cover member and the heat insulating material body member in a state where the outer heat insulating cover member covers the inner heat insulating cover member and the inner heat insulating cover member covers the pipe, the outer rotationally variable hole is deformed into a shape having a predetermined width.

Advantageous effects

According to the pipe thermal insulation material for a semiconductor and display panel manufacturing apparatus of an aspect of the present invention, since the pipe thermal insulation material for a semiconductor and display panel manufacturing apparatus includes the thermal insulation material body member, the inner thermal insulation cover member, the connection member, and the outer thermal insulation cover member, the outer thermal insulation cover member presses the inner thermal insulation cover member in a state where the thermal insulation material body member and the inner thermal insulation cover member are wound around the pipe, the thermal insulation material has advantages in that it can be constructed in a manner of simply winding the pipe without additional work such as binding, and the thermal insulation performance of the pipe can be improved.

Drawings

Fig. 1 is a sectional view showing a pipe insulation material for a semiconductor and display panel manufacturing apparatus in an open state according to an embodiment of the present invention.

Fig. 2 is a sectional view showing a closed state of a pipe thermal insulating material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention in order that a pipe can be wound.

Fig. 3 is a perspective view illustrating an opened state of the pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention.

Fig. 4 is a sectional view showing a state in which a pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention is in an open state and a pipe is placed inside.

Fig. 5 is a sectional view showing a closed state of the pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention in a manner of winding a pipe placed inside thereof.

Fig. 6 is a sectional view showing an opened state of a pipe insulation material for a semiconductor and display panel manufacturing apparatus according to another embodiment of the present invention.

Detailed Description

Hereinafter, a pipe heat insulating material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

Fig. 1 is a sectional view showing an opened state of a pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention, fig. 2 is a sectional view showing a closed state of the pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention in order to allow a pipe to be wound, fig. 3 is a perspective view showing an opened state of the pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention, fig. 4 is a sectional view showing a state in which the pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention is opened and a pipe is placed inside thereof, and fig. 5 is a sectional view showing a closed state of the pipe insulation material for a semiconductor and display panel manufacturing apparatus according to an embodiment of the present invention in such a manner that the pipe is placed inside thereof is wound.

Referring to fig. 1 to 5 together, the pipe thermal insulation material 100 for a semiconductor and display panel manufacturing apparatus according to the present embodiment performs thermal insulation by winding a pipe 10 suitable for a semiconductor and display panel manufacturing apparatus that can manufacture at least one of a semiconductor and a display panel, and includes a thermal insulation material body member 110, an inner thermal insulation cover member 120, a connection member 140, and an outer thermal insulation cover member 130.

The insulation body member 110 is wound around a portion of the outer face of the pipe 10, and the inner face 111 of the insulation body member 110 has a curved shape so as to be in contact with a portion of the outer face of the pipe 10.

The inner heat insulating cover member 120 is configured to cover at least a part of the outer surface of the pipe 10 except for a part covered with the heat insulating material body member 110 and to have a curved shape with a predetermined curvature, and the inner surface 121 of the inner heat insulating cover member 120 is configured to have a curved shape so as to be able to contact at least a part of the outer surface of the pipe 10 except for a part covered with the heat insulating material body member 110.

The connecting member 140 is used to connect one side portion of the heat insulating material body member 110 and the inner heat insulating cover member 120, and extends from the outside of one side portion of the heat insulating material body member 110 to the inside of one side portion of the heat insulating material body member 110 by a predetermined length, and a distal end portion of the connecting member 140 extending to the inside of one side portion of the heat insulating material body member 110 is connected to the inner heat insulating cover member 120, so that the inner heat insulating cover member 120 and the outer heat insulating cover member 130 overlap each other, so that when the inner heat insulating cover member 120 and the heat insulating material body member 110 cover the pipeline 10, the thickness of the inner heat insulating cover member 120 and the outer heat insulating cover member 130 overlapping each other is the same as the thickness of the heat insulating material body member 110, and the inner heat insulating cover member 120, the outer heat insulating cover member 130 and the heat insulating material body member 110 cover the pipeline 10 in a mutually fitted state 10, the pipe 10 is wound in a cylindrical shape having a predetermined thickness.

The outer heat insulating cover member 130 is connected to the other side portion of the heat insulating material body member 110 in a state where the heat insulating material body member 110 and the inner heat insulating cover member 120 cover the outer surface of the duct 10 together, and the inner heat insulating cover member 120 is pressed toward the outer surface of the duct 10 by covering the inner heat insulating cover member 120, whereby the outer heat insulating cover member 130 is curved with a predetermined curvature, and the inner surface 131 of the outer heat insulating cover member 130 is curved so as to be in contact with the inner heat insulating cover member 120.

In a state where one side portion of the heat insulating material body member 110 is connected to the inner heat insulating cover member 120 via the connecting member 140 and the other side portion of the heat insulating material body member 110 is connected to the outer heat insulating cover member 130, as shown in fig. 1, when the inner heat insulating cover member 120 and the outer heat insulating cover member 130 are in an open state with respect to the heat insulating material body member 110, as shown in fig. 4, the pipe 10 is placed on the inner surface 111 of the heat insulating material body member 110, and in a state where the pipe 10 is placed on the heat insulating material body member 110, as shown in fig. 5, the inner heat insulating cover member 120 covers the pipe 10 on the heat insulating material body member 110, and in a state where the inner heat insulating cover member 120 covers the pipe 10 on the heat insulating material body member 110, the outer insulating cover member 130 covers the inner insulating cover member 120, and the inner insulating cover member 120 covers the pipeline 10 so as to be closed in a manner of surrounding the pipeline 10.

On the other hand, the pipe thermal insulation material 100 for a semiconductor and display panel manufacturing apparatus further includes a protruding stopper member 150.

The protruding stopper member 150 protrudes by a predetermined length from the inner surface of the outer heat insulating cover member 130, and a protruding locking surface 151 is formed on the other surface of the protruding stopper member 150 than the surface facing the heat insulating material body member 110, so that the distal end surface 122 of the inner heat insulating cover member 120 covering the pipe 10 on the heat insulating material body member 110 is locked to the protruding locking surface 151 when the inner heat insulating cover member 120 covers the pipe 10.

In the connecting member 140, an inner heat-insulating engagement surface 141 is formed on the other surface different from the surface facing the heat-insulating material body member 110, and when the inner heat-insulating cover member 120 covers the pipeline 10 and the outer heat-insulating cover member 130 covers the inner heat-insulating cover member 120, the distal end surface 132 of the outer heat-insulating cover member 130 covering the inner heat-insulating cover member 120 is engaged with the inner heat-insulating engagement surface 141, and the heat-insulating material body member 110, the inner heat-insulating cover member 120, and the outer heat-insulating cover member 130 are engaged with each other.

A connection side rotation gap forming hole 160 and a connection side rotation variable hole 161 are formed at a connection portion between one side portion of the heat insulating material body member 110 and the connection member 140.

The connection side rotation gap making hole 160 is used for a rotation gap space between one side portion of the heat insulating material body member 110 and the connection member 140, which is formed in a state where the inner heat insulating cover member 120 is connected to the heat insulating material body member 110 by the connection member 140, so that the heat insulating material body member 110 and the inner heat insulating cover member 120 cover the pipeline 10 by rotating the inner heat insulating cover member 120.

The connection-side rotation variable hole 161 communicates a space formed by the inner surfaces of the inner heat-insulating cover member 120 and the heat-insulating material body member 110 with the connection-side rotation gap-forming hole 160.

The connection-side rotation gap-making hole 160 is formed as a circular hole at a connection portion between one side portion of the heat insulating material body member 110 and the connection member 140, and the connection-side rotation variable hole 161 communicates the connection-side rotation gap-making hole 160 with an internal space of the pipe heat insulating material 100 for a semiconductor and display panel manufacturing apparatus.

When the inner heat insulating cover member 120 and the outer heat insulating cover member 130 are in an open state with respect to the heat insulating material main body member 110, the connection-side rotation variable hole 161 is gradually enlarged as the connection-side rotation gap hole 160 moves toward the respective inner surface sides of the inner heat insulating cover member 120 and the heat insulating material main body member 110, and the connection-side rotation variable hole 161 is deformed into a shape having a predetermined width as the connection-side rotation gap hole 160 moves toward the respective inner surface sides of the inner heat insulating cover member 120 and the heat insulating material main body member 110 in a state where the inner heat insulating cover member 120 covers the duct 10 on the heat insulating material main body member 110.

An outer rotational clearance forming hole 165 and an outer rotational variable hole 166 are formed in a connecting portion between the other side portion of the heat insulating material body member 110 and the outer heat insulating cover member 130.

The outer rotation gap forming hole 165 is used for a rotation gap space between the other side portion of the heat insulating material body member 110 and the outer heat insulating cover member 130. The outer rotation gap making hole 165 is formed in a state where the outer heat insulating cover member 130 is connected to the heat insulating material body member 110, so that the outer heat insulating cover member 130 is rotated so that the outer heat insulating cover member 130 covers the inner heat insulating cover member 120 and the inner heat insulating cover member 120 covers the pipeline 10.

The outer rotatable hole 166 communicates the space formed by the inner surfaces of the outer heat insulating cover member 130 and the heat insulating material body member 110 with the outer rotatable gap-forming hole 165.

When the inner heat insulating cover member 120 and the outer heat insulating cover member 130 are in an open state with respect to the heat insulating material body member 110, the outer rotatable variable hole 166 is gradually enlarged as moving from the outer rotatable gap hole 165 to the respective inner surfaces of the outer heat insulating cover member 130 and the heat insulating material body member 110, and the outer rotatable variable hole 166 is deformed to have a shape having a predetermined width as moving from the outer rotatable gap hole 165 to the respective inner surfaces of the outer heat insulating cover member 130 and the heat insulating material body member 110 in a state where the outer heat insulating cover member 130 covers the inner heat insulating cover member 120 and the inner heat insulating cover member 120 covers the duct 10.

In this embodiment, the heat insulating material body member 110, the inner heat insulating cover member 120, the connecting member 140, the outer heat insulating cover member 130, and the protruding stopper member 150 may be integrally molded, and may be formed of a plastic resin having elasticity.

Hereinafter, the operation of the pipe thermal insulation material 100 for a semiconductor and display panel manufacturing apparatus according to the embodiment will be described with reference to the drawings.

As shown in fig. 1, when the inner heat insulating cover member 120 and the outer heat insulating cover member 130 are in an open state with respect to the heat insulating material body member 110, as shown in fig. 4, the duct 10 is placed on the inner surface 111 of the heat insulating material body member 110, and as shown in fig. 5, in a state where the duct 10 is placed on the heat insulating material body member 110, the inner heat insulating cover member 120 covers the duct 10 on the heat insulating material body member 110, and in a state where the inner heat insulating cover member 120 covers the duct 10 on the heat insulating material body member 110, the outer heat insulating cover member 130 covers the inner heat insulating cover member 120 and the inner heat insulating cover member 120 covers the duct 10, thereby closing the duct 10.

At this time, the connection-side rotation variable hole 161 and the outer rotation variable hole 166, which have enlarged shapes, are deformed into shapes having a predetermined width as they move into the duct insulating material 100 for semiconductor and display panel manufacturing equipment, and thus the inner heat insulating cover member 120 and the outer heat insulating cover member 130 are smoothly deformed by the connection-side rotation gap forming holes 160, the outer rotation gap forming holes 165, the connection-side rotation variable hole 161, and the outer rotation variable hole 166, and surround the duct 10.

As described above, since the duct thermal insulation material 100 for a semiconductor and display panel manufacturing apparatus includes the thermal insulation material body member 110, the inner thermal insulation cover member 120, the connection member 140, and the outer thermal insulation cover member 130, the outer thermal insulation cover member 130 presses the inner thermal insulation cover member 120 in a state where the thermal insulation material body member 110 and the inner thermal insulation cover member 120 surround the duct 10, and thus, the construction of surrounding the duct 10 can be easily performed without performing additional work such as binding, and the thermal insulation performance of the duct 10 can be improved.

Hereinafter, a pipe thermal insulating material for a semiconductor and display panel manufacturing apparatus according to another embodiment of the present invention will be described with reference to the drawings. In this description, what has been described and repeated in the foregoing embodiment of the present invention will be replaced, and the description thereof will be omitted herein.

Fig. 6 is a sectional view showing a pipe insulation material for a semiconductor and display panel manufacturing apparatus in an opened state according to another embodiment of the present invention.

Referring to fig. 6, in the present embodiment, at least one of the heat insulating material body member 210, the inner heat insulating cover member 220, and the outer heat insulating cover member 230 is formed with the elastic holes 270, 271, 272, and when the heat insulating material body member 210 and the inner heat insulating cover member 220 cover the pipe and the outer heat insulating cover member 230 covers the inner heat insulating cover member 220, the heat insulating material body member 210, the inner heat insulating cover member 220, and the outer heat insulating cover member 230 are elastically deformed to maintain the coupled state of the heat insulating material body member 210, the inner heat insulating cover member 220, and the outer heat insulating cover member 230.

For example, the elastic holes 270, 271, 272 are formed in each of the heat insulating material body member 210, the inner heat insulating cover member 220, and the outer heat insulating cover member 230, and the elastic holes 270, 271, 272 are formed in the heat insulating material body member 210, the inner heat insulating cover member 220, and the outer heat insulating cover member 230, and have a closed shape with respect to the outside.

When the thermal insulation material body member 210 and the inner thermal insulation cover member 220 surround the pipeline and the outer thermal insulation cover member 230 surrounds the inner thermal insulation cover member 220 as the elastic holes 270, 271, 272 are formed, the elastic holes 270, 271, 272 are deformed, so that the thermal insulation material body member 210 and the inner thermal insulation cover member 220 elastically surround the pipeline in close contact with the pipeline.

While particular embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. It is to be understood, however, that such modifications and variations are intended to be included within the scope of the present invention.

Industrial applicability

With the pipe heat insulating material for a semiconductor and display panel manufacturing apparatus according to an aspect of the present invention, it is possible to easily perform construction for surrounding a pipe without performing additional work such as binding or the like, and to improve heat insulating performance to the pipe, and thus it is considered that industrial applicability thereof is high.

Description of reference numerals

100: pipeline heat-insulating material for semiconductor and display panel manufacturing equipment

110: thermal insulation material body member

120: inner side heat preservation cover component

130: outer side heat preservation cover component

140: connecting member

150: protruding stopper member