阅读说明：本技术 射频组件组合及天线装置 (Radio frequency assembly combination and antenna device ) 是由 陈文祥 钟瑞泰 张耀元 邱宗文 宋芳燕 于 2019-10-08 设计创作，主要内容包括：本发明涉及一种天线装置,包括热固性塑料、天线组件、第一电感线圈及第一陶瓷电容。天线组件是导体并固定于热固性塑料。第一电感线圈是金属导体,并局部地或完全地被包覆于热固性塑料中,或形成在热固性塑料的表面。第一陶瓷电容以表面黏着技术固定于热固性塑料上,且第一电感线圈及第一陶瓷电容两者用以形成一个阻抗匹配网络。本发明利用热固性塑料相较陶瓷材料低介电系数的特点达到降低第一电感线圈产生寄生电容的目的,且热固性塑料还适用表面黏着技术(SMT)。(The invention relates to an antenna device which comprises thermosetting plastic, an antenna component, a first inductance coil and a first ceramic capacitor. The antenna assembly is a conductor and is fixed to the thermosetting plastic. The first inductor winding is a metal conductor and is partially or completely encased in or formed on the surface of the thermoset plastic. The first ceramic capacitor is fixed on the thermosetting plastic by a surface mount technology, and the first inductance coil and the first ceramic capacitor are both used for forming an impedance matching network. The invention achieves the purpose of reducing the parasitic capacitance generated by the first inductance coil by utilizing the characteristic of low dielectric coefficient of the thermosetting plastic compared with the ceramic material, and the thermosetting plastic is also suitable for Surface Mount Technology (SMT).)

1. A radio frequency assembly combination comprising:

a thermosetting plastic;

a first inductor coil, which is a metal conductor, partially or completely wrapped in the thermosetting plastic or formed on a surface of the thermosetting plastic; and

a first ceramic capacitor fixed on the thermosetting plastic by surface adhesion technique.

2. The radio frequency assembly of claim 1, wherein the thermosetting plastic comprises Phenolic resin (Phenolic Resins) and glass fibers.

3. The radio frequency assembly of claim 1, wherein the thermosetting plastic composition includes Epoxy resin (Epoxy) and fiberglass.

4. A radio frequency assembly according to claim 3, wherein the thermosetting plastic composition further comprises asbestos.

5. The radio frequency assembly of claim 1, wherein the Thermosetting plastic composition comprises Thermosetting polyester (Thermosetting polyester).

6. An antenna device, comprising:

a thermosetting plastic;

an antenna assembly which is a conductor and is located on the thermosetting plastic;

a first inductor coil, which is a metal conductor, partially or completely wrapped in the thermosetting plastic or formed on a surface of the thermosetting plastic; and

and the first inductance coil and the first ceramic capacitor are used for forming an impedance matching network.

7. The antenna apparatus of claim 6, wherein: the thermosetting plastic comprises the components of phenolic resin and glass fiber, or comprises the components of epoxy resin, glass fiber and asbestos, or comprises thermosetting polyester.

8. The antenna apparatus of claim 6, further comprising: and the first inductance coil, the first ceramic capacitor and the second inductance coil form a T-shaped impedance matching network together.

9. The antenna apparatus of claim 6, further comprising: and the first ceramic capacitor, the first inductance coil and the second ceramic capacitor form a pi-type impedance matching network together.

10. The antenna apparatus of claim 6, further comprising:

a second ceramic capacitor fixed on the thermosetting plastic by surface adhesion technology; and

a radio frequency switch, including a first end and a second end, the radio frequency switch is controlled to switch the first end and the second end of the radio frequency switch between two conduction modes, and the first end of the radio frequency switch is physically connected to the first end of the first inductance coil, the second end of the first inductance coil is electrically connected to the antenna assembly and the first end of the first ceramic capacitor, the second end of the first ceramic capacitor is grounded, the second end of the radio frequency switch is physically connected to the first end of the second ceramic capacitor, a second end of the second ceramic capacitor is grounded, and when the first end and the second end of the radio frequency switch are conducted, the first ceramic capacitor, the first inductance coil and the second ceramic capacitor are electrically conducted to form a pi-type impedance matching network, when the first end and the second end of the radio frequency switch are not conducted, the second ceramic capacitor disconnects the first inductance coil, and only the first ceramic capacitor and the first inductance coil form an L-shaped impedance matching network together.

Technical Field

The invention relates to a radio frequency component assembly applied to communication equipment and an antenna device comprising the radio frequency component assembly.

Background technology

Fig. 1 is a schematic diagram of a laser engraving antenna combined with an impedance matching circuit in the prior art. The laser engraving antenna 11 is characterized in that a thermoplastic plastic block 111 is subjected to surface activation treatment by laser, and the activated plastic block 111 is placed in a metal plating tank, so that a layer of metal 112 is deposited and attached on activated grains of the thermoplastic plastic block 111.

This conventional technique has the disadvantage that the thermoplastic material softens and deforms when exposed to high heat, so that it is not possible to solder the passive component 12 to the thermoplastic block 111 by Surface Mount Technology (SMT) high temperature, but it is necessary to additionally leave a space on the circuit board 13 for the passive component 12 of the matching circuit 14, which is not conducive to miniaturization design.

In addition, it is known that a high-frequency inductor commonly used in the impedance matching circuit 14 is usually made by making a very fine metal coil on a ceramic material, but the ceramic material has a disadvantage in that a dielectric constant (permittivity) is higher than that of a plastic material, and a material having a characteristic of a higher dielectric constant is accompanied by a larger capacitance value in the radio frequency application, but the inductance component is not desired to be accompanied by a capacitance effect with a high capacitance value in the engineering design, which causes interference to the inductance value, and further causes the impedance matching circuit in the actual application to deviate from the original optimized design, and the impedance matching effect cannot be achieved.

In order to solve the above-mentioned problems of the conventional technologies, the present invention provides a radio frequency assembly and an antenna apparatus including the radio frequency assembly.

Disclosure of Invention

The radio frequency assembly combination comprises thermosetting plastic, a first inductance coil and a first ceramic capacitor.

The first inductor winding is a metal conductor and is partially or completely encased in or formed on the surface of the thermoset plastic.

The first ceramic capacitor is fixed on the thermosetting plastic by a surface mount technology, and the first inductance coil and the first ceramic capacitor are both used for forming an impedance matching network, such as an L-shaped impedance matching network.

Preferably, the components of the thermoset include Phenolic Resins (Phenolic Resins) and glass fibers.

Preferably, the components of the thermoset include Epoxy resin (Epoxy) and glass fiber.

Preferably, the components of the thermosetting plastic include Epoxy resin (Epoxy), glass fiber, and asbestos.

Preferably, the Thermosetting plastic component comprises Thermosetting polyester (Thermosetting polyester).

The antenna device comprises thermosetting plastic, an antenna component, a first inductance coil and a first ceramic capacitor.

The antenna assembly is a conductor and is located on the thermoset plastic. The first inductance coil is a metal conductor, and the first inductance coil is partially or completely coated in the thermosetting plastic or formed on the surface of the thermosetting plastic, and the first ceramic capacitor is fixed on the thermosetting plastic by the surface adhesion technology.

Preferably, the thermosetting plastic comprises a composition of both phenolic resin and glass fiber, or both epoxy resin and glass fiber, or three of epoxy resin, glass fiber and asbestos, or one of thermosetting polyester.

Preferably, the antenna device further includes a second inductance coil. The second inductor is a metal conductor and is partially or completely wrapped in thermosetting plastic, and the first inductor, the first ceramic capacitor and the second inductor form an impedance matching network, such as a T-shaped matching network.

Preferably, the antenna device further includes a second ceramic capacitor. The second ceramic capacitor is fixed on the thermosetting plastic by a surface adhesion technology, and the first ceramic capacitor, the first inductance coil and the second ceramic capacitor form an impedance matching network, such as a pi-type matching network.

Preferably, the antenna device further includes a second ceramic capacitor and a radio frequency switch. The second ceramic capacitor is fixed on the thermosetting plastic by the surface mount technology. The radio frequency switch comprises a first end and a second end, the radio frequency switch is controlled to enable the first end and the second end of the radio frequency switch to be switched between a conduction mode and a non-conduction mode, the first end of the radio frequency switch is physically connected with the first end of the first inductance coil, and the first end of the radio frequency switch is used for being electrically connected with the radio frequency signal source. The second end of the first inductance coil is electrically connected with the feed-in end of the antenna component and the first end of the first ceramic capacitor. The second terminal of the first ceramic capacitor is grounded. The second end of the radio frequency switch is physically connected with the first end of the second ceramic capacitor, and the second end of the second ceramic capacitor is grounded. When the first end and the second end of the radio frequency switch are conducted, the first ceramic capacitor, the first inductance coil and the second ceramic capacitor are electrically conducted to form a pi-shaped impedance matching network; when the first end and the second end of the radio frequency switch are not conducted, the second ceramic capacitor disconnects the first inductance coil, and only the first ceramic capacitor and the first inductance coil form an L-shaped impedance matching network together.

The invention has the following effects: the thermosetting plastic is used to replace ceramic or thermoplastic plastic as the support material of the first inductor coil, which not only avoids the capacitance effect generated by the traditional ceramic material inductor, but also can apply surface adhesion technology on any surface of the thermosetting plastic to combine with any chip type active and passive components due to the characteristic of high temperature resistance of the thermosetting material.

Drawings

Fig. 1 is a schematic diagram of a conventional technique.

Fig. 2 is a schematic diagram of a first preferred embodiment of the antenna device of the present invention.

Fig. 3 is an equivalent circuit diagram of the first preferred embodiment of the antenna device of the present invention.

Fig. 4 is a schematic diagram of a second preferred embodiment of the antenna device of the present invention.

Fig. 5 is an equivalent circuit diagram of a second preferred embodiment of the antenna device of the present invention.

Fig. 6 is a schematic diagram of an antenna device according to a third preferred embodiment of the present invention.

Fig. 7 is an equivalent circuit diagram of a third preferred embodiment of the antenna device of the present invention.

Fig. 8 is a schematic diagram of an antenna device according to a fourth preferred embodiment of the present invention.

Fig. 9 is an equivalent circuit diagram of a fourth preferred embodiment of the antenna device of the present invention.

FIG. 10 is a diagram of a first preferred embodiment of the RF assembly of the present invention.

FIG. 11 is a diagram of a second preferred embodiment of the RF assembly combination of the present invention.

Detailed Description

Referring to fig. 2 and 3, the first preferred embodiment of the antenna device of the present invention includes a thermosetting plastic 2, an antenna component 3, a first inductor coil 4 and a first ceramic capacitor 5.

The thermosetting plastic 2 comprises both phenolic resin and glass fiber, or comprises both epoxy resin and glass fiber, or comprises three of epoxy resin, glass fiber and asbestos, or comprises one of thermosetting polyester.

The antenna component 3 is a conductor and is located on the thermosetting plastic 2.

The first inductor winding 4 is a metal conductor and the first inductor winding 4 is partially or completely encased in the thermosetting plastic 2 or is formed on any surface of the thermosetting plastic 2. The first ceramic capacitor 5 is fixed to the thermosetting plastic 2 by a surface mount technology, and the first inductor winding 4 and the first ceramic capacitor 5 together form an L-shaped impedance matching network 45.

Referring to fig. 4 and 5, which are a schematic diagram and an equivalent circuit diagram of a second preferred embodiment of the antenna device of the present invention, the second preferred embodiment of the antenna device is similar to the first preferred embodiment, and the difference is: the second preferred embodiment further comprises a second inductor winding 6. The second inductor coil 6 is a metal conductor and is partially or completely wrapped in the thermosetting plastic 2, and the first inductor coil 4, the first ceramic capacitor 5, and the second inductor coil 6 together form a T-shaped impedance matching network 456.

Referring to fig. 6 and fig. 7, which are a schematic diagram and an equivalent circuit diagram of a third preferred embodiment of the antenna device of the present invention, the third preferred embodiment of the antenna device is similar to the first preferred embodiment, and the difference is: the third preferred embodiment further comprises a second ceramic capacitor 7. The second ceramic capacitor 7 is fixed on the thermosetting plastic 2 by a surface mount technology, and the first ceramic capacitor 5, the first inductor coil 4 and the second ceramic capacitor 7 together form a pi-type impedance matching network 457.

Referring to fig. 8 and 9, which are a schematic diagram and an equivalent circuit diagram of a fourth preferred embodiment of the antenna device of the present invention, the fourth preferred embodiment of the antenna device is similar to the third preferred embodiment, and the difference is: the fourth preferred embodiment further comprises a radio frequency switch 8.

The rf switch 8 includes a first terminal 81 and a second terminal 82, the rf switch 8 is controlled to switch the first terminal 81 and the second terminal 82 between a conducting mode and a non-conducting mode, the first terminal 81 of the rf switch 8 is physically connected to the first terminal 41 of the first inductor 4, and the first terminal 81 of the rf switch 8 is used to electrically connect to the rf signal source. The second terminal 42 of the first inductor coil 4 is electrically connected to the feed terminal of the antenna component 3 and to the first terminal 51 of the first ceramic capacitor 5, and the second terminal 52 of the first ceramic capacitor 5 is grounded. The second terminal 82 of the rf switch 8 is physically connected to the first terminal 71 of the second ceramic capacitor 7, and the second terminal 72 of the second ceramic capacitor 7 is grounded. When the first terminal 81 and the second terminal 82 of the rf switch 8 are conducted, the first ceramic capacitor 5, the first inductor coil 4, and the second ceramic capacitor 7 are electrically conducted to form a pi-type impedance matching network 457; when the first terminal 81 and the second terminal 82 of the rf switch 8 are not conducted, the second ceramic capacitor 7 turns off the first inductor coil 4, and only the first ceramic capacitor 5 and the first inductor coil 4 together form an L-shaped impedance matching network 45.

Referring to fig. 10, a first preferred embodiment of the rf device assembly of the present invention is illustrated, wherein the first preferred embodiment of the rf device assembly comprises a thermosetting plastic 2, a first inductor coil 4 and a first ceramic capacitor 5. The first inductor winding 4 is a metal conductor and the first inductor winding 4 is partially or completely encased in the thermosetting plastic 2.

Referring to fig. 11, a second preferred embodiment of the rf device assembly of the present invention is illustrated, which is similar to the first preferred embodiment, except that: the first inductor winding 4 of the second preferred embodiment is formed on the surface of the thermosetting plastic 2 in a meandering manner.

It should be noted that the removal of the antenna element 3 from any of the preferred embodiments of the radio frequency module assembly of the present invention may be an embodiment of the radio frequency module assembly of the present invention.

The invention has the following effects: (1) the thermosetting plastic is used for replacing ceramic or thermoplastic plastic materials as the supporting material of the first inductance coil 4, so that the capacitance effect generated by the traditional ceramic material inductance is avoided, and any chip-type active and passive components, such as the first ceramic capacitor 5, the second ceramic capacitor 7 and the radio frequency switch 8, can be combined on any surface of the thermosetting plastic 2 by applying a surface adhesion technology due to the characteristic of high welding temperature resistance of the thermosetting plastic 2; (2) when the three-dimensional thermosetting plastic 2 is used as a supporting material of the antenna component 3, L, T, the pi-type impedance matching circuit 45, 456, 457 and the radio frequency switch 8 which are originally required to be arranged on the circuit board can be moved to the unused residual space of the antenna component 3 on the thermosetting plastic 2, so that the area of the circuit board is saved; and (3) the antenna device of the present invention integrates the antenna element 3 and the circuit into a single device, which is very convenient for the communication system manufacturer to purchase and use directly.

The above description is only an example of the present invention, and is not intended to limit the scope of the present invention.

Reference numerals

11: laser engraving antenna

111: plastic block

12: passive component

13: circuit board

14: impedance matching circuit

2: thermosetting plastic

3: antenna assembly

4: first inductance coil

41: first end

42: second end

5: first ceramic capacitor

51: first end

52: second end

45: l-type impedance matching network

6: second inductance coil

456: t-type impedance matching network

7: second ceramic capacitor

71: first end

72: second end

457: pi-type impedance matching network

8: radio frequency switch

81: first end

82: second end