阅读说明：本技术 用于三维尺寸的动态测量装置及其测量方法 (Dynamic measuring device for three-dimensional size and measuring method thereof ) 是由 张�浩 曹亮 张晓非 周之琪 丁宵月 郑清志 于 2019-11-21 设计创作，主要内容包括：一种用于三维尺寸的动态测量装置,包括用于自由锻锻件三维尺寸动态测量的平面相机组(100),平面相机组(100)包括至少四个图像传感器(101)和三维运算电路板(102),三维运算电路板(102)分别与多个图像传感器(101)电连接,三维运算电路板(102)配置成将多个图像数据计算为三维尺寸数据。通过采用非接触光学成像的方式,高速动态测量锻件的三维外轮廓尺寸,使锻造过程中能够测量出锻件的尺寸,进而能够决定每一步的锻造工艺参数,调整锻件锻造位置和压制深度,减轻工人的劳动强度,使每步工艺都能有工艺尺寸记录,通过得到三维尺寸数据结果,能够极大提高锻件的加工质量,提高了锻件加工尺寸的一致性。还涉及一种用于三维尺寸的测量方法。(A dynamic measurement device for three-dimensional dimensions comprises a planar camera set (100) for dynamically measuring the three-dimensional dimensions of a free forged piece, wherein the planar camera set (100) comprises at least four image sensors (101) and a three-dimensional operation circuit board (102), the three-dimensional operation circuit board (102) is respectively electrically connected with the image sensors (101), and the three-dimensional operation circuit board (102) is configured to calculate a plurality of image data into three-dimensional dimension data. By adopting a non-contact optical imaging mode, the three-dimensional outer contour dimension of the forge piece is dynamically measured at a high speed, so that the dimension of the forge piece can be measured in the forging process, further the forging process parameters of each step can be determined, the forging position and the pressing depth of the forge piece are adjusted, the labor intensity of workers is reduced, the process dimension can be recorded in each step, the processing quality of the forge piece can be greatly improved by obtaining a three-dimensional dimension data result, and the consistency of the processing dimension of the forge piece is improved. It also relates to a measuring method for three-dimensional dimensions.)

1. A dynamic measurement device for three-dimensional dimensions, comprising: a planar camera set;

the planar camera set comprises at least four image sensors and a three-dimensional operation circuit board, wherein the image sensors are positioned in the same plane and are in rectangular structures, and the optical axes of the image sensors are arranged in parallel and are configured to enable the scanning lines of the image sensors to be aligned in the horizontal and vertical directions;

the three-dimensional operation circuit board is electrically connected with the plurality of image sensors, respectively, and is configured to calculate a plurality of image data into three-dimensional size data.

2. The dynamic measurement device for three-dimensional dimensions according to claim 1, further comprising a lens;

the number of the lenses is the same as that of the image sensors, and the lenses are connected with the image sensors in a one-to-one correspondence manner.

3. The dynamic measuring device for three-dimensional dimensions according to claim 2, characterized in that it further comprises a far infrared filter;

and one end of the lens, which is far away from the image sensor, is connected with the far infrared filter lens.

4. The dynamic measurement device for three-dimensional dimensions of any of claims 1-3, further comprising a camera mount and a camera shock absorber;

the bottom of the plane camera set is connected with the camera mounting seat, and one side, away from the plane camera set, of the camera mounting seat is connected with the camera shock absorber.

5. The dynamic measurement device for three-dimensional dimensions of claim 4, wherein said camera shock absorber is provided in plurality, and a plurality of said camera shock absorbers are uniformly provided along said camera mount.

6. The dynamic measurement device for three-dimensional dimensions according to claim 4 or 5, characterized in that it further comprises a heat-insulating casing;

the planar camera set, the camera mounting seat and the camera shock absorber are all arranged in the heat preservation shell, and one end, far away from the camera mounting seat, of the camera shock absorber is connected with the inner wall of the heat preservation shell;

one side of the heat preservation casing, which corresponds to the image sensor, is provided with first through holes, and the number of the first through holes is the same as that of the image sensor.

7. The dynamic measurement device for three dimensions of claim 6, wherein each of the first through holes has a high temperature resistant tempered glass disposed thereon.

8. The dynamic measurement device for three-dimensional dimensions according to claim 6 or 7, characterized by further comprising a heat dissipation mechanism;

one side of the heat preservation shell, which is far away from the side with the first through hole, is provided with a second through hole, the heat dissipation mechanism is arranged at the position of the second through hole, and the heat dissipation mechanism is connected with the side wall of the heat preservation shell and is configured to reduce the temperature in the heat preservation shell.

9. The dynamic measurement device for three-dimensional dimensions according to any of claims 6 to 8, characterized in that the outside of the insulated enclosure is coated with an insulating layer.

10. The dynamic measurement device for three-dimensional dimensions according to any of claims 6 to 9, further comprising a support;

the outside of one side lateral wall of heat preservation casing with the leg joint, just the inside of this side lateral wall of heat preservation shell with the camera bumper shock absorber is connected.

11. The dynamic measurement device for three-dimensional dimensions of claim 10, wherein the support comprises a column and a bracket;

the bracket is connected with the upright column in a sliding manner, and the heat preservation shell is connected with the bracket.

12. The dynamic measurement device for three dimensions of claim 11, further comprising a case shock absorber;

the case shock absorber is arranged between the heat preservation shell and the bracket, and the case shock absorber is respectively connected with the heat preservation shell and the bracket.

13. The dynamic measurement device for three-dimensional dimensions according to claim 12, characterized in that said case damper is provided in plurality, and a plurality of said case dampers are uniformly arranged along said bracket.

14. The dynamic measurement device for three-dimensional dimensions of any of claims 1-13, further comprising a display terminal;

and the display terminal is in electric signal connection with the three-dimensional operation circuit board.

15. The dynamic measurement device for three-dimensional dimensions according to any one of claims 1 to 14, characterized in that the three-dimensional operation circuit board is an fpga (field Programmable Gate array) three-dimensional operation circuit board.

16. A measuring method based on a dynamic measuring device for three dimensions according to any of claims 1 to 15, characterized in that it comprises the following steps:

and carrying out convolution matching operation on the plurality of two-dimensional images pairwise to obtain the edge of the object and the three-dimensional space coordinate position of the image characteristic point.

17. The dynamic measurement method for three-dimensional dimensions according to claim 16, wherein during image acquisition, automatic exposure parameter adjustment is performed according to changes in brightness of the image caused by changes in temperature of the object, configured such that the sharpness of the image remains unchanged.

18. The dynamic measurement method for three-dimensional dimensions according to claim 16 or 17, characterized in that it further comprises the following steps:

establishing a space rectangular coordinate system of a plurality of image sensors;

the original points of the space rectangular coordinate systems of the plurality of image sensors are arranged on the planes corresponding to the optical axis focuses of the plurality of image sensors and are positioned at the central points of the rectangular structures formed by the plurality of image sensors;

enabling a group of pixel points in the image sensors to form a unique corresponding relation with one point on any object in space;

and obtaining the spatial position coordinates of a point on any object in the space according to the spatial geometrical constraint conditions on the plurality of image sensors and the image similarity matching function.

19. The dynamic measurement method for three-dimensional dimensions of claim 18, wherein the step of having a set of pixel points within the plurality of image sensors form a unique correspondence with the point further comprises:

the method comprises the steps of obtaining corresponding points corresponding to one point on any object in space in the horizontal direction of a plurality of image sensors, wherein the corresponding points in the horizontal direction are located on the same horizontal scanning line, the corresponding points in the vertical direction are located on the same vertical scanning line, the corresponding points in the diagonal positions are located on the same diagonal line, and a plurality of pixel points simultaneously form a rectangle similar to the rectangle formed by the plurality of image sensors, so that the formed rectangle forms a matched space geometric constraint condition.

20. The dynamic measurement method for three-dimensional dimensions according to claim 19, characterized in that it further comprises the following steps: the three-dimensional operation circuit board is used for automatically calculating various sizes of various forgings to be measured after the three-dimensional operation software obtains the space three-dimensional position coordinates of the pixel points by using three-dimensional image processing software;

the three-dimensional image processing software extracts the three-dimensional size of the edge of the forge piece, automatically tracks the forge piece, separates the background and automatically extracts the size of the forge piece based on a general image processing algorithm and an object automatic identification mode based on a neural network.

Technical Field

The application relates to the technical field of three-dimensional size detection, in particular to a dynamic measuring device for three-dimensional size and a measuring method thereof.

Background

Free forging is a metal forming process, and is a technological process for finally forming a qualified forged piece by pressing a high-temperature forging blank for multiple times by adopting forging equipment such as a large-scale hydraulic press or a hydraulic press. Most of the forgings processed by free forging are large forgings, the temperature of the forgings is generally 1200-500 ℃, the forgings are heavy in weight and large in size, so that in the free forging process, feeding, rotation and rising and falling of the forgings are controlled by mechanical clamping equipment, and forging equipment and a clamping machine are operated indoors by workers to complete the forging process.

A forging process commander and an operator are required to be matched to complete a forging process in a forging field, the commander commands the operation of the operator through gestures, the forging depth, the pressing position adjustment of a forge piece and the like are all observed by human eyes, commanded by gestures and manually operated by the operator. In order to solve the defects that the free forging depends on manual operation and human eyes to observe the size in the prior art, various laser measuring devices are adopted to measure the size of the free forging.

However, in the prior art, the red hot forging generates high-temperature radiation, which causes serious interference to laser reflection, so that the measurement is difficult to meet the precision requirement; furthermore, because the laser measurement generally adopts a single-point measurement mode, when the measurement surface of the integral forging piece is large, the laser scanning time is too long, and the real-time measurement cannot be achieved; meanwhile, because the edge curvature of the shaft forging is large, various reflection measurement modes such as laser are adopted, and a reflection signal is difficult to generate at the edge of the horizontal shaft and cannot be measured. Therefore, the three-dimensional measurement of free forging in the prior art still has more defects.

Content of application

The application provides a dynamic measurement device and a measurement method for three-dimensional dimensions, which can at least achieve the technical effect of dynamically measuring the three-dimensional dimensions of a free forged piece.

The embodiment of the application can be realized as follows:

an embodiment of the present application provides a dynamic measurement device for three-dimensional dimensions, including: a planar camera set;

the planar camera set comprises at least four image sensors and a three-dimensional operation circuit board, wherein the image sensors are positioned in the same plane and are in rectangular structures, and the optical axes of the image sensors are arranged in parallel and are configured to enable the scanning lines of the image sensors to be aligned in the horizontal and vertical directions;

the three-dimensional operation circuit board is electrically connected with the plurality of image sensors, respectively, and is configured to calculate a plurality of image data into three-dimensional size data.

Optionally, a lens is further included;

the number of the lenses is the same as that of the image sensors, and the lenses are connected with the image sensors in a one-to-one correspondence manner.

Optionally, a far infrared filter lens is further included;

and one end of the lens, which is far away from the image sensor, is connected with the far infrared filter lens.

Optionally, a camera mount and a camera shock absorber are also included;

the bottom of the plane camera set is connected with the camera mounting seat, and one side, away from the plane camera set, of the camera mounting seat is connected with the camera shock absorber.

Optionally, the camera shock absorber is provided in plurality, and the plurality of camera shock absorbers are uniformly arranged along the camera mounting seat.

Optionally, the heat insulation device further comprises a heat insulation shell;

the planar camera set, the camera mounting seat and the camera shock absorber are all arranged in the heat preservation shell, and one end, far away from the camera mounting seat, of the camera shock absorber is connected with the inner wall of the heat preservation shell;

one side of the heat preservation casing, which corresponds to the image sensor, is provided with first through holes, and the number of the first through holes is the same as that of the image sensor.

Optionally, each of the first through holes is provided with high temperature resistant tempered glass.

Optionally, the device further comprises a heat dissipation mechanism;

one side of the heat preservation shell, which is far away from the side with the first through hole, is provided with a second through hole, the heat dissipation mechanism is arranged at the position of the second through hole, and the heat dissipation mechanism is connected with the side wall of the heat preservation shell and is configured to reduce the temperature in the heat preservation shell.

Optionally, the exterior of the thermal insulation casing is coated with a thermal insulation layer.

Optionally, a bracket is also included;

the outside of one side lateral wall of heat preservation casing with the leg joint, just the inside of this side lateral wall of heat preservation shell with the camera bumper shock absorber is connected.

Optionally, the support comprises a post and a bracket;

the bracket is connected with the upright column in a sliding manner, and the heat preservation shell is connected with the bracket.

Optionally, a chassis damper is further included;

the case shock absorber is arranged between the heat preservation shell and the bracket, and the case shock absorber is respectively connected with the heat preservation shell and the bracket.

Optionally, the chassis damper is provided in plurality, and the plurality of chassis dampers are uniformly arranged along the bracket.

Optionally, the system further comprises a display terminal;

and the display terminal is in electric signal connection with the three-dimensional operation circuit board.

Optionally, the three-dimensional operation circuit board is an fpga (field Programmable Gate array) three-dimensional operation circuit board.

The measuring method based on the dynamic measuring device for the three-dimensional size provided by the embodiment of the application comprises the following steps:

and carrying out convolution matching operation on the plurality of two-dimensional images pairwise to obtain the edge of the object and the three-dimensional space coordinate position of the image characteristic point.

Optionally, in the image acquisition process, automatic exposure parameter adjustment is performed according to a change in brightness of an image caused by a change in temperature of the object, and the image is configured such that the sharpness of the image remains unchanged.

Optionally, the method further comprises the following steps:

establishing a space rectangular coordinate system of a plurality of image sensors;

the original points of the space rectangular coordinate systems of the plurality of image sensors are arranged on the planes corresponding to the optical axis focuses of the plurality of image sensors and are positioned at the central points of the rectangular structures formed by the plurality of image sensors;

enabling a group of pixel points in the plurality of image sensors to form a unique corresponding relation with one point on any object in space;

and obtaining the spatial position coordinates of a point on any object in the space according to the spatial geometrical constraint conditions on the plurality of image sensors and the image similarity matching function.

Optionally, the step of forming a unique corresponding relationship between a group of pixel points and the point in the plurality of image sensors further comprises:

the method comprises the steps of obtaining corresponding points corresponding to one point on any object in space in the horizontal direction of a plurality of image sensors, wherein the corresponding points in the horizontal direction are located on the same horizontal scanning line, the corresponding points in the vertical direction are located on the same vertical scanning line, the corresponding points in the diagonal positions are located on the same diagonal line, and a plurality of pixel points simultaneously form a rectangle similar to the rectangle formed by the plurality of image sensors, so that the formed rectangle forms a matched space geometric constraint condition.

Optionally, the method further comprises the following steps: the three-dimensional operation circuit board is used for automatically calculating various sizes of various forgings to be measured after the three-dimensional operation software obtains the space three-dimensional position coordinates of the pixel points by using three-dimensional image processing software;

the three-dimensional image processing software extracts the three-dimensional size of the edge of the forge piece, automatically tracks the forge piece, separates the background and automatically extracts the size of the forge piece based on a general image processing algorithm and an object automatic identification mode based on a neural network.

The beneficial effects of the application include, for example: the three-dimensional measurement device is used for dynamically measuring the three-dimensional size of a free forging piece through a planar camera set, the planar camera set comprises at least four image sensors and a three-dimensional operation circuit board, the image sensors are located in the same plane and are in rectangular structures, and the optical axes of the image sensors are arranged in parallel and are configured to enable the scanning lines of the image sensors to be aligned in the horizontal and vertical directions; the three-dimensional operation circuit board is electrically connected with the image sensors respectively and is configured to calculate the image data into three-dimensional size data; by adopting a non-contact optical imaging mode, the three-dimensional outer contour dimension of the forge piece is dynamically measured at a high speed, so that the dimension of the forge piece can be measured in the forging process, further the forging process parameters of each step can be determined, the forging position and the pressing depth of the forge piece are adjusted, the labor intensity of workers is reduced, the process dimension can be recorded in each step, the processing quality of the forge piece can be greatly improved by obtaining a three-dimensional dimension data result, and the consistency of the processing dimension of the forge piece is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic overall structure diagram of a dynamic measurement device for three-dimensional dimensions provided in an embodiment of the present application;

fig. 2 is a schematic diagram of an explosive structure of a dynamic measurement device for three-dimensional dimensions provided by an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a support for a dynamic measurement device of three-dimensional dimensions according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of an installation position of a dynamic measurement device for three-dimensional dimensions provided by an embodiment of the present application;

fig. 5 is a schematic structural diagram of a measurement process of a dynamic measurement device for three-dimensional dimensions according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a rectangular coordinate system for a dynamic measurement method of three-dimensional dimensions according to an embodiment of the present application;

fig. 7 is an imaging schematic diagram of a dynamic measurement method for three-dimensional dimensions according to an embodiment of the present application.

Icon: 100-plane camera set; 101-an image sensor; 102-a three-dimensional operation circuit board; 200-lens; 300-far infrared filter lens; 400-camera mount; 500-camera shock absorber; 600-heat preservation of the shell; 601-a first via; 700-a heat dissipation mechanism; 800-a stent; 801-upright column; 802-a cradle; 900-case shock absorber.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 5, embodiments of the present application provide a dynamic measurement apparatus for three-dimensional dimensions, including: a planar camera group 100; the planar camera set 100 includes at least four image sensors 101 and a three-dimensional operation circuit board 102, the image sensors 101 are located in the same plane, the image sensors 101 are in a rectangular structure, optical axes of the image sensors 101 are arranged in parallel, and scanning lines of the image sensors 101 are aligned in horizontal and vertical directions; the three-dimensional operation circuit board 102 is electrically connected to the plurality of image sensors 101, respectively, and the three-dimensional operation circuit board 102 is configured to calculate a plurality of image data as three-dimensional size data.

Alternatively, a plurality of image sensors 101 are disposed on the image acquisition circuit, and the plurality of image sensors 101 are respectively electrically connected to the image acquisition circuit, wherein the number of the image sensors 101 may be four, six, eight, or the like, and preferably, the image sensors 101 employ a 2 × 2 array, a 2 × 3 array, a 2 × 4 array, or the like.

Alternatively, the resolution of the image sensor 101 ranges from 500 to 4000 ten thousand pixels, preferably 1000 ten thousand pixels, the optimal size of the rectangular structure formed by the center of the image sensor 101 is 280 × 60mm, and the length and width dimensions can be adjusted by enlarging or reducing according to the requirement of measurement accuracy.

Since the image sensor 101 provided by the present embodiment preferably employs four image sensors 101, four image sensors 101 are taken as an example in the following, but it still belongs to the protection scope of the embodiments of the present application to employ six, eight, etc. image sensors 101.

Optionally, the core of the three-dimensional operation circuit board 102 is an FPGA (field Programmable Gate array) chip, the three-dimensional operation circuit board 102 acquires four images of the image acquisition circuit board through a high-speed data channel, calculates the four images through FPGA internal software, directly calculates the four image data into three-dimensional point cloud data, and directly transmits an operation result to a display terminal described below.

In addition, the three-dimensional operation circuit board 102 may be disposed at the display terminal, and after the plurality of image sensors 101 acquire the plurality of image data, the plurality of image data are transmitted to the display terminal through the image acquisition circuit, and the three-dimensional operation circuit board 102 performs the three-dimensional operation at the display terminal.

The beneficial effects of the embodiment include, for example: the planar camera set 100 is used for dynamically measuring the three-dimensional size of a free forged piece, the planar camera set 100 comprises at least four image sensors 101 and a three-dimensional operation circuit board 102, the image sensors 101 are located in the same plane, the image sensors 101 are in a rectangular structure, optical axes of the image sensors 101 are arranged in parallel, and scanning lines of the image sensors 101 are aligned in the horizontal direction and the vertical direction; the three-dimensional operation circuit board 102 is electrically connected to the plurality of image sensors 101, respectively, the three-dimensional operation circuit board 102 being configured to calculate a plurality of image data into three-dimensional size data; by adopting a non-contact optical imaging mode, the three-dimensional outer contour dimension of the forge piece is dynamically measured at a high speed, so that the dimension of the forge piece can be measured in the forging process, further the forging process parameters of each step can be determined, the forging position and the pressing depth of the forge piece are adjusted, the labor intensity of workers is reduced, the process dimension can be recorded in each step, the processing quality of the forge piece can be greatly improved by obtaining a three-dimensional dimension data result, and the consistency of the processing dimension of the forge piece is improved.

In addition, due to the guarantee of the quality of the forged piece, the size reserved processing amount of the original forged piece design can be reduced, and the material cost of the workpiece can be greatly reduced. Because the data measurement feedback is timely, and meanwhile, the time and times of manual measurement are reduced, the forging process time is greatly saved, the times of remelting are reduced, and the working hours are saved; optionally, on the basis of the dynamic measuring device for three-dimensional dimensions provided by the embodiment, the device can be combined with forging equipment, and the full-automatic production of free forging can be realized in the future.

Optionally, a lens 200 is further included; the number of lenses 200 is the same as the number of image sensors 101, and the lenses 200 are connected to the image sensors 101 in a one-to-one correspondence.

Preferably, the lens 200 is an industrial lens, and the parameter selection requirement of the lens 200 is the same as the parameter of the corresponding image sensor 101, and for the size of the measurement field of view, when a large measurement range is required for measuring a large workpiece, the modes of reducing the focal length value of the lens 200, increasing the size of the target surface of the image sensor 101, improving the resolution of the image sensor 101 and increasing the installation distance can be adopted.

Optionally, a far infrared filter 300 is further included; an end of the lens 200 remote from the image sensor 101 is connected to a far infrared filter 300.

Wherein, far infrared filter 300 adopts the mode of narrow band-pass, only allows far infrared light to pass through, and the best center wavelength of narrow band-pass selects to be 850nm, uses this far infrared filter 300 back, can effectively get rid of background interference, and can show the clear demonstration of high temperature red hot forging in the image.

Optionally, a camera mount 400 and a camera shock absorber 500; the bottom of the planar camera set 100 is connected to the camera mount 400, and one side of the camera mount 400 facing away from the planar camera set 100 is connected to the camera damper 500.

Alternatively, the camera shock absorbers 500 are provided in plurality, and the plurality of camera shock absorbers 500 are uniformly arranged along the camera mount 400.

In order to ensure the stability of the planar camera set 100 during the shooting process, the bottom of the planar camera set 100 is provided with a camera mounting seat 400, and the bottom of the camera mounting seat 400 is used for mounting camera shock absorbers 500, wherein the number of the camera shock absorbers 500 can adopt four or six uniform distribution modes; alternatively, the camera shock absorber 500 may employ a steel wire nonlinear camera-specific shock absorber.

Optionally, a heat insulation case 600 is further included; the planar camera set 100, the camera mounting base 400 and the camera shock absorber 500 are all arranged in the heat preservation enclosure 600, and one end of the camera shock absorber 500, which is far away from the camera mounting base 400, is connected with the inner wall of the heat preservation enclosure 600; the side of the heat insulation case 600 corresponding to the image sensor 101 is provided with first through holes 601, and the number of the first through holes 601 is the same as that of the image sensors 101.

Optionally, the thermal insulation case 600 is made of an aluminum alloy without temperature deformation, four first through holes 601 configured as lens interfaces are disposed at positions of the thermal insulation case 600 corresponding to the image sensor 101, and preferably, an aluminum alloy heat sink may be separately mounted on the back of the thermal insulation case 600 to design two external interfaces of a power supply and data.

Optionally, each first through hole 601 is provided with high temperature resistant tempered glass, which can be used for image capturing, light transmission, and high temperature resistance of the lens 200 and the planar camera set 100.

Optionally, a heat dissipation mechanism 700 is further included; a second through hole is formed in one side of the heat-insulating case 600, which is far away from the side having the first through hole 601, the heat dissipation mechanism 700 is disposed at the second through hole, and the heat dissipation mechanism 700 is connected to a side wall of the heat-insulating case 600, and configured to reduce the temperature inside the heat-insulating case 600.

Wherein, the rear part of the thermal insulation casing 600 relative to the lens 200 is provided with a second through hole configured to mount the heat dissipation mechanism 700, preferably, the heat dissipation mechanism 700 is an exhaust fan; a circular hole may be formed in the bottom of the thermal insulation case 600 to allow the transmission of the cable and the connection with the cable sheath.

Optionally, a plurality of heat dissipation mechanisms 700 may be provided, the plurality of heat dissipation mechanisms 700 are uniformly disposed on one side of the heat-insulating case 600, and the number of the second through holes corresponds to the number of the heat dissipation mechanisms 700.

In order to prevent the temperature of the thermal insulation casing 600 from rising due to high temperature radiation, optionally, the exterior of the thermal insulation casing 600 is covered with a thermal insulation layer, wherein the thermal insulation layer is made of asbestos thermal insulation pads, and the exterior of the asbestos thermal insulation pads is entirely covered with bakelite plates for fixing the asbestos thermal insulation pads, and at the same time, the thermal insulation function can also be achieved.

Optionally, a bracket 800 is also included; the outside of one side wall of the heat-insulating casing 600 is connected to the bracket 800, and the inside of the one side wall of the heat-insulating casing 600 is connected to the camera shock absorber 500.

Since the side of the thermal insulation case 600 connected to the bracket 800 needs to be swung, the outer side wall of the thermal insulation case 600 is connected to the bracket 800 and the inner side wall of the thermal insulation case is connected to the camera damper 500.

In order to ensure that the planar camera set 100 can better perform shooting measurement on the freely forged piece, the heat preservation casing 600 with the planar camera set 100 is connected with the bracket 800, optionally, the bracket 800 is 2m to 12m away from the center of the forging device, preferably, the optimal position is 5m, and at 5m, if a 16mm lens 200 and a 1 inch target surface camera are selected, the measurement range (width x height) is 3 x 2 m.

Optionally, the stand 800 includes a post 801 and a bracket 802; bracket 802 and upright 801 are connected in a sliding manner, and heat preservation casing 600 is connected with bracket 802.

Wherein, stand 801 can be through rag screw and ground fixed connection, and then can guarantee support 800's overall stability, and bracket 802 and stand 801's slip mode can be multiple, for example: through the sliding mode of the sliding block and the groove, the sliding block is arranged on one side, connected with the upright post 801, of the bracket 802, the groove is formed in the upright post 801, so that the bracket 802 can slide relative to the upright post 801, the bracket 802 is in transmission connection with the motor through the fixed pulley and the steel wire rope, the bracket 802 can reciprocate along the upright post 801 under the driving action of the motor, and the motor can ensure the stability of the bracket 802 through the steel wire rope; optionally, a damping layer is arranged between the bracket 802 and the upright 801, so that the stability of the bracket 802 can be better ensured.

For another example: the direction through gear and rack between bracket 802 and the stand 801 rolls and connects, perhaps connects etc. through the meshing of a plurality of gears between bracket 802 and the stand 801, because bracket 802 all can drive wire rope through motor or hoist engine and carry out the drive connection, will not be repeated here.

Optionally, a chassis damper 900 is also included; case damper 900 is disposed between heat-insulating case 600 and bracket 802, and case damper 900 is connected to heat-insulating case 600 and bracket 802, respectively.

Optionally, the chassis damper 900 is provided in plurality, and the plurality of chassis dampers 900 are uniformly arranged along the bracket 802. In order to ensure the stability of the planar camera set 100 in the shooting process, case shock absorbers are installed at the bottom of the heat preservation case 600, wherein the number of the case shock absorbers 900 can be four or six in a uniform distribution mode; alternatively, the case damper 900 may employ a camera-dedicated damper.

In addition, when the size of the forging exceeds the measurement area and the overall appearance of the forging cannot be measured, the bracket 800 can be placed farther away from the forging, the focal length of the lens 200 is reduced, and the resolution of the image sensor 101 is increased; or, a plurality of brackets 800 and the planar camera units 100 are added in the parallel direction of the forging, and the three-dimensional measurement data of the planar camera units 100 are spliced to form the three-dimensional data of the integral forging in a calibration mode.

Optionally, the system further comprises a display terminal; the display terminal is electrically connected to the three-dimensional operation circuit board 102.

The display terminal may include a PC (personal computer) and a display, and is electrically connected to the three-dimensional operation circuit board 102 through a cable interface and a computer terminal, wherein the PC may be a common PC or an industrial computer according to the requirement of computing speed and the requirement of reliability of data storage, and when the requirement of data storage is high, a data server may be used or added. If the data is required to be uploaded to the control and management center in real time, the terminal data can be uploaded to the control and management center in real time by adopting network communication; the display screen is arranged at a position where an operator or a process commander can conveniently observe and operate, and data can be displayed on two or more display screens simultaneously in a split-screen display mode.

In addition, the device also comprises an external power supply device, an image acquisition external trigger control device, an exhaust fan power supply, a temperature sensor measuring and controlling circuit and an electrical control series device for automatically acquiring the operating parameters of the forging press, wherein the electrical control box receives and sends control signals through an I/O interface with the PC, and acquires the external temperature and the data of other auxiliary sensors in a serial port mode.

As shown in fig. 6 to 7, a measurement method based on the dynamic measurement apparatus for three-dimensional dimensions provided by the embodiments of the present application includes the following steps: and carrying out convolution matching operation on the plurality of two-dimensional images pairwise to obtain the edge of the object and the three-dimensional space coordinate position of the image characteristic point.

In addition, in the image acquisition process, the automatic exposure parameter adjustment can be performed according to the change of the image brightness caused by the change of the temperature of the forged piece, so that the definition of the image is kept unchanged, and meanwhile, other image acquisition parameters also need to be automatically set and adjusted, for example: white balance, high dynamic parameters, etc

Optionally, the method further comprises the following steps: establishing a spatial rectangular coordinate system of a plurality of image sensors 101; the origin of the rectangular spatial coordinate system of the plurality of image sensors 101 is disposed on the plane corresponding to the optical axis focus of the plurality of image sensors 101, and is located at the center point of the rectangular structure formed by the plurality of image sensors 101; so that a unique correspondence is formed between a group of pixel points in the plurality of image sensors 101 and a point on any object in space; the spatial position coordinates of a point on any object in space are derived from the spatial geometrical constraints and the image similarity matching functions on the plurality of image sensors 101.

Optionally, the step of having a group of pixel points in the plurality of image sensors 101 form a unique corresponding relationship with the point further includes: corresponding points corresponding to one point on any object in the space in the horizontal direction of the image sensors 101 are obtained, the corresponding points in the horizontal direction are located on the same horizontal scanning line, the corresponding points in the vertical direction are located on the same vertical scanning line, the corresponding points in the diagonal positions are located on the same diagonal line, and the plurality of pixel points simultaneously form a rectangle similar to the rectangle formed by the image sensors 101, so that the formed rectangle forms a matched space geometric constraint condition.

The image pixel matching conditions for the above four image sensors 101 are image similarity matching functions of the image itself relating to gray scale, texture, color, and relation to surrounding pixels.

Optionally, the image similarity matching function comprises: for the spatial position coordinates of a point P (X, Y, Z) on an arbitrary object in space, the calculation formula is as follows:

PN (PNx, PNy, PNz), wherein N is 1,2,3,4,5, … …

Where m and n are two adjacent side lengths of the matrix formed by the optical centers of the planar camera group 100, f is the focal length of the lens 200, and a, b, c, and d respectively represent the planes where the four image sensors 101 are located.

In this embodiment, when the planar camera set 100 is used to perform spatial three-dimensional operation, an fpga (field Programmable Gate array) chip may be used to implement the three-dimensional operation; when the three-dimensional operation circuit board 102 is adopted, due to the adoption of the FPGA chip, the original 64-bit serial operation on the CPU is changed into the parallel operation of the FPGA bus bandwidth, the operation speed can be improved, and the reliability of the system is improved; optionally, the three-dimensional operation software may complete the operation on the PC terminal, may also perform the operation on the three-dimensional operation circuit board 102 by using an FPGA chip, and may also complete the three-dimensional operation by adding an FPGA chip to the PC terminal.

When the three-dimensional operation circuit board 102 is adopted, three-dimensional image processing software is adopted, after the three-dimensional operation software obtains the space three-dimensional position coordinates of pixel points, various sizes of various forgings to be measured are automatically calculated, the algorithm relates to a general image processing algorithm and automatic object identification based on a neural network, the three-dimensional size of the edge of the forging is extracted, the forging is automatically tracked, the background is separated, the key size of the forging is automatically extracted, and the key size and the geometric characteristics of the forging include: center line, axis of symmetry, maximum or minimum outer diameter, perpendicularity, offset, tortuosity, and the like.

Optionally, after the acquisition and the calculation are completed, the data management software may be configured to perform classified storage, statistical calculation, data uploading, and the like on the acquired image, the three-dimensional data, and the measurement data. And important process parameters and working processes are subjected to data recording to form a product process data file, so that the product quality and quality can be conveniently analyzed afterwards.

According to the dynamic measurement method for the three-dimensional size, the three-dimensional outer contour size of the forge piece is dynamically measured at a high speed in a non-contact optical imaging mode, so that the size of the forge piece can be measured in the forging process, further, the forging technological parameters of each step can be determined, the forging position and the pressing depth of the forge piece are adjusted, the labor intensity of workers is reduced, the technological size can be recorded in each step of process, the processing quality of the forge piece can be greatly improved by obtaining the three-dimensional size data result, and the consistency of the processing size of the forge piece is improved.

The above description is only a preferred embodiment of the present application and is not configured to limit the present application, and various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Industrial applicability

According to the dynamic measurement device and the measurement method for the three-dimensional size, the planar camera set is used for dynamically measuring the three-dimensional size of the free forging, the processing quality of the forging can be improved, and the consistency of the processing size of the forging is improved.