阅读说明：本技术 一种半导体芯片生产用接触式光刻机 (Contact photoetching machine for semiconductor chip production ) 是由 周杰 张琪 符友银 李俊毅 于 2020-12-02 设计创作，主要内容包括：本发明公开了一种半导体芯片生产用接触式光刻机,包括底座和固定座,固定座活动连接在底座的内部,底座内部两侧固定连接有第一固定板,第一固定板顶部固定连接有支撑板,支撑板一侧固定连接有连接板,连接板一侧固定连接有第二固定板,第二固定板一侧固定连接在底座的内壁上,支撑板之间活动连接有隔板,其中隔板底部固定连接有限位块,并且隔板底部两侧固定连接有减震板,减震板底部固定连接有气缸,气缸一端固定连接在底座的内壁上,隔板顶部固定连接有三个电动推杆。该种半导体芯片生产用接触式光刻机,解决了现有接触式光刻机无法调节高度,不便于工作人员使用的问题,同时具有良好的固定功能和减震功能。(The invention discloses a contact type photoetching machine for producing semiconductor chips, which comprises a base and a fixed seat, wherein the fixed seat is movably connected inside the base, two sides inside the base are fixedly connected with a first fixed plate, the top of the first fixed plate is fixedly connected with a supporting plate, one side of the supporting plate is fixedly connected with a connecting plate, one side of the connecting plate is fixedly connected with a second fixed plate, one side of the second fixed plate is fixedly connected on the inner wall of the base, a partition plate is movably connected between the supporting plates, the bottom of the partition plate is fixedly connected with a limiting block, two sides of the bottom of the partition plate are fixedly connected with damping plates, the bottom of the damping plates is fixedly connected with an air cylinder, one. This kind of contact lithography machine is used in semiconductor chip production has solved the unable height-adjusting of current contact lithography machine, the problem that the staff of being not convenient for used, has good fixed function and shock-absorbing function simultaneously.)

1. The contact type photoetching machine for producing the semiconductor chip is characterized by comprising a base (1) and a fixed seat (2), wherein the fixed seat (2) is movably connected inside the base (1), two sides of the inside of the base (1) are fixedly connected with a first fixed plate (7), the top of the first fixed plate (7) is fixedly connected with a supporting plate (11), one side of the supporting plate (11) is fixedly connected with a connecting plate (10), one side of the connecting plate (10) is fixedly connected with a second fixed plate (9), one side of the second fixed plate (9) is fixedly connected on the inner wall of the base (1), a partition plate (18) is movably connected between the supporting plates (11), the bottom of the partition plate (18) is fixedly connected with a limiting block (17), two sides of the bottom of the partition plate (18) are fixedly connected with a damping plate (16), and the bottom of the damping plate (16), one end of the air cylinder (19) is fixedly connected to the inner wall of the base (1).

2. The contact type photoetching machine for producing the semiconductor chip according to claim 1, wherein three electric push rods (14) are fixedly connected to the top of the partition plate (18), limiting springs (15) are fixedly arranged on the outer sides of the three electric push rods (14), a protective pad (13) is arranged between the electric push rods (14) and the fixed seat (2), and the protective pad (13) is fixedly connected to the bottom surface of the fixed seat (2).

3. The contact lithography machine for producing semiconductor chips according to claim 1, wherein a fastening bolt (8) is fixedly arranged on one side of each of the first fixing plate (7) and the second fixing plate (9).

4. The contact lithography machine for producing semiconductor chips according to claim 1, wherein the supporting plate (11) is provided inside with a limiting chute (21), the partition (18) is fixedly connected with limiting plates (22) at two sides, the limiting plates (22) are fixedly arranged inside the limiting chute (21), and the width of the limiting plates (22) is two thirds of the width of the partition (18).

5. The contact type photoetching machine for producing the semiconductor chip according to claim 1, wherein the top surface of the base (1) is provided with an open slot (12), and the gap between the open slot (12) and the outer wall of the fixed seat (2) is not more than 2 mm.

6. The contact lithography machine for semiconductor chip production according to claim 1, wherein a non-slip pad (20) is fixedly connected to the bottom of the base (1).

7. The contact type lithography machine for producing semiconductor chips according to claim 1, wherein a controller (3) is fixedly connected to one side of the top of the fixed base (2), a control panel (6) is fixedly connected to one side of the controller (3), a lithography machine body (4) is fixedly connected to the other side of the top of the fixed base (2), and a workbench (5) is fixedly connected to one side of the lithography machine body (4).

Technical Field

The invention relates to the technical field of contact type photoetching machines, in particular to a contact type photoetching machine for producing semiconductor chips.

Background

Lithography machines are also known as: a mask alignment exposure machine, an exposure system, a photolithography system, etc., are core equipment for manufacturing a chip. It adopts the technology similar to photo development to print the fine pattern on the mask plate on the silicon chip by the exposure of light,

a contact lithography machine is one type of lithography machine in which a mask is pressed against a substrate wafer of photoresist during exposure, and has the major advantage that smaller feature sizes can be manufactured using less expensive equipment. Contact lithography and deep submicron sources have achieved feature sizes of less than 0.1 gm, with a typical source resolution of around 0.5 gm. The reticle of a contact lithography machine includes all of the chip array patterns to be replicated onto the substrate. The substrate was coated with photoresist and mounted on a manually controlled stage that allowed X, y orientation and rotation control. The reticle and substrate wafer need to be viewed simultaneously through separate field of view microscopes so that the operator can manually control the positioning stage to align the reticle pattern with the pattern on the substrate wafer. After exposure to ultraviolet light, the pattern is transferred to the photoresist by passing light through the transparent portion of the reticle. The main disadvantage of contact lithography machines is that they rely on human operation, which can cause defects due to contact between the wafer coated with photoresist and the mask, each contact process causing certain defects on both the wafer and the mask. Therefore, contact lithography machines are commonly used in device research and other applications where higher defect levels can be tolerated.

At present, the existing contact photoetching machine cannot adjust the height, is inconvenient for workers to use, and does not have good fixing and damping functions, so that the contact photoetching machine for producing semiconductor chips is improved.

Disclosure of Invention

In order to solve the technical problems, the invention provides the following technical scheme:

the invention relates to a contact type photoetching machine for producing semiconductor chips, which comprises a base and a fixed seat, wherein the fixed seat is movably connected inside the base, two sides inside the base are fixedly connected with a first fixed plate, the top of the first fixed plate is fixedly connected with a supporting plate, one side of the supporting plate is fixedly connected with a connecting plate, one side of the connecting plate is fixedly connected with a second fixed plate, one side of the second fixed plate is fixedly connected with the inner wall of the base, a partition plate is movably connected between the supporting plates, the bottom of the partition plate is fixedly connected with a limiting block, two sides of the bottom of the partition plate are fixedly connected with damping plates, the bottom of the damping plates is fixedly connected with a cylinder.

As a preferred technical scheme of the invention, the top of the partition plate is fixedly connected with three electric push rods, the outer sides of the three electric push rods are fixedly provided with limiting springs, a protective pad is arranged between the electric push rods and the fixed seat, and the protective pad is fixedly connected to the bottom surface of the fixed seat.

As a preferable technical solution of the present invention, fastening bolts are fixedly provided at both sides of the first fixing plate and the second fixing plate.

According to a preferable technical scheme of the invention, a limiting chute is arranged inside the supporting plate, limiting plates are fixedly connected to two sides of the partition plate, the limiting plates are fixedly arranged inside the limiting chute, and the width of each limiting plate is two thirds of the width of the partition plate.

As a preferable technical scheme of the invention, the top surface of the base is provided with an open slot, and a gap between the open slot and the outer wall of the fixed seat is not more than 2 mm.

As a preferred technical scheme of the invention, the bottom of the base is fixedly connected with an anti-skid pad.

As a preferred technical scheme of the invention, one side of the top of the fixed seat is fixedly connected with a controller, one side of the controller is fixedly connected with a control panel, the other side of the top of the fixed seat is fixedly connected with a photoetching machine body, and one side of the photoetching machine body is fixedly connected with a workbench.

The invention has the beneficial effects that:

the utility model provides a, this kind of contact lithography machine is used in semiconductor chip production, through the cooperation of limiting plate and spacing spout, can start the cylinder that sets up and promote the baffle and go up and down, when the limiting plate contacts spacing spout top surface, can rethread electric putter further with fixing base jack-up, reach the purpose of secondary regulation, solved the unable height-adjusting of current contact lithography machine, the staff's of not being convenient for problem of using.

Two, this kind of contact lithography machine is used in semiconductor chip production, be provided with spacing spring, when electric putter is out of work, spacing spring highly can be higher than electric putter's height, supporting the fixing base, at first play absorbing effect, and the shock attenuation board of baffle bottom can further play the cushioning effect, and the backup pad can firmly be fixed on the inner wall of base through first fixed plate, second fixed plate and fastening bolt's cooperation simultaneously, and then effectually plays the fixed action to the fixing base.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a perspective view of a contact lithography machine for semiconductor chip production in accordance with the present invention;

FIG. 2 is a cross-sectional view of a base of a contact lithography machine for semiconductor chip production according to the present invention;

FIG. 3 is a cross-sectional view of a support plate of a contact lithography machine for semiconductor chip production in accordance with the present invention.

In the figure: 1. a base; 2. a fixed seat; 3. a control machine; 4. a lithography machine body; 5. a work table; 6. a control panel; 7. a first fixing plate; 8. fastening a bolt; 9. a second fixing plate; 10. a connecting plate; 11. a support plate; 12. an open slot; 13. a protective pad; 14. an electric push rod; 15. a limiting spring; 16. a damper plate; 17. a limiting block; 18. a partition plate; 19. a cylinder; 20. a non-slip mat; 21. a limiting chute; 22. and a limiting plate.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

Example (b): as shown in FIGS. 1-3, the contact lithography machine for semiconductor chip production of the present invention comprises a base 1 and a fixed seat 2, wherein the fixed seat 2 is movably connected inside the base 1, two sides inside the base 1 are fixedly connected with a first fixed plate 7, the top of the first fixed plate 7 is fixedly connected with a supporting plate 11, one side of the supporting plate 11 is fixedly connected with a connecting plate 10, one side of the connecting plate 10 is fixedly connected with a second fixed plate 9, one side of the second fixed plate 9 is fixedly connected on the inner wall of the base 1, a partition plate 18 is movably connected between the supporting plates 11, wherein the bottom of the clapboard 18 is fixedly connected with a limiting block 17, the limiting block 17 can be used for supporting the clapboard 18 when the cylinder 19 does not work, the cylinder 19 is prevented from being stressed for a long time to cause damage, and both sides of the bottom of the partition plate 18 are fixedly connected with a damping plate 16, the bottom of the damping plate 16 is fixedly connected with a cylinder 19, and one end of the cylinder 19 is fixedly connected on the inner wall of the base 1.

Wherein, 18 three electric putter 14 of top fixedly connected with of baffle, the fixed spacing spring 15 that is provided with in the outside of three electric putter 14, be provided with between electric putter 14 and the fixing base 2 and protect and fill up 13, protect and fill up 13 fixed connection in the bottom surface of fixing base 2, protect and fill up 13 and play the wall effect, avoid haring electric putter 14's top or the bottom surface of fixing base 2.

Wherein, first fixed plate 7 and second fixed plate 9 one side all are fixed and are provided with fastening bolt 8 for fix first fixed plate 7 and second fixed plate 9 on the inner wall of base 1.

Wherein, the inside of backup pad 11 is provided with spacing spout 21, 18 both sides fixedly connected with limiting plate 22 of baffle, and limiting plate 22 is fixed to be set up in the inside of spacing spout 21 to limiting plate 22's width is two-thirds of 18 widths of baffle.

Wherein, the top surface of base 1 is provided with open slot 12, and the gap between open slot 12 and the 2 outer walls of fixing base must not be greater than 2 mm.

Wherein, the bottom of the base 1 is fixedly connected with an anti-slip pad 20, so as to prevent the base 1 from moving when the photoetching machine body 4 works.

Wherein, 2 top one sides fixedly connected with controllers 3 of fixing base, 3 one sides fixedly connected with control panel 6 of controllers, the opposite side fixedly connected with photoetching machine body 4 at 2 tops of fixing base, 4 one sides fixedly connected with workstation 5 of photoetching machine body.

The working principle is as follows: when the height of the fixing seat 2 needs to be adjusted, one end of the fixing seat 2 rises by starting the air cylinder 19, the limiting plates 22 are fixedly connected to the two sides of the partition plate 18, the limiting plates 22 are arranged inside the limiting sliding grooves 21, the air cylinder 19 further pushes the partition plate 18 upwards, if the limiting plates 22 contact the top surfaces of the limiting sliding grooves 21, the lifting height is still insufficient, the electric push rod 14 can be started again, the electric push rod pushes the protection pad 13 to further push the fixing seat 2 to move upwards, when the lifting is needed to be noticed, the bottom surface of the fixing seat 2 cannot exceed the top surface of the supporting plate 11, and therefore the supporting plate 11 cannot play a limiting and fixing role on the fixing seat.

Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.