Electronic component and terminal equipment

文档序号:816219 发布日期:2021-03-26 浏览:3次 中文

阅读说明:本技术 一种电子组件及终端设备 (Electronic component and terminal equipment ) 是由 黄竹邻 于 2019-09-25 设计创作,主要内容包括:本发明实施例涉及电子设备技术领域,公开了一种电子组件,包括电磁模块、设置在所述电磁模块一侧的壳体,还包括设置在所述壳体上的热传导片,所述热传导片上开设有对应所述电磁模块的通孔、在厚度方向上贯穿所述热传导片并连通所述通孔与所述热传导片边缘的开槽。本发明还提供一种具有前述电子组件的终端设备。本发明提供的电子组件及终端设备,能兼顾均温与电磁传输性能。(The embodiment of the invention relates to the technical field of electronic equipment, and discloses an electronic assembly which comprises an electromagnetic module, a shell arranged on one side of the electromagnetic module, and a heat conduction sheet arranged on the shell, wherein the heat conduction sheet is provided with a through hole corresponding to the electromagnetic module, and a groove penetrating through the heat conduction sheet in the thickness direction and communicating the through hole with the edge of the heat conduction sheet. The invention also provides a terminal device with the electronic component. The electronic component and the terminal equipment provided by the invention can give consideration to temperature equalization and electromagnetic transmission performance.)

1. An electronic component comprises an electromagnetic module, a shell arranged on one side of the electromagnetic module, and a heat conduction sheet arranged on the shell, wherein the heat conduction sheet is provided with a through hole corresponding to the electromagnetic module, and a groove which penetrates through the heat conduction sheet in the thickness direction of the heat conduction sheet and is communicated with the through hole and the edge of the heat conduction sheet.

2. The electronic assembly of claim 1, wherein the electromagnetic module comprises a toroidal coil for generating an electromagnetic field, a geometric center of the coil facing a geometric center of the through-hole.

3. The electronic assembly of claim 2, wherein an orthographic projection of the through-hole on the housing falls within an orthographic projection of an inner edge of the coil on the housing.

4. The electronic assembly of claim 3, wherein an orthographic projection of an inner edge of the coil on the housing is tangential to an orthographic projection of an edge of the through-hole on the housing.

5. The electronic assembly of claim 2, wherein an orthographic projection of an outer edge of the coil on the housing falls within an orthographic projection of the thermally conductive sheet on the housing.

6. The electronic assembly of claim 1, wherein the through-hole is circular in shape.

7. The electronic assembly of claim 6, wherein the through-hole has a diameter in a range of 15 mm to 25 mm.

8. The electronic assembly of claim 7, wherein the through-hole has a diameter of 20 millimeters.

9. The electronic assembly of claim 1, wherein the housing includes an inner surface facing the electromagnetic module, an outer surface facing away from the electromagnetic module and disposed opposite the inner surface, the thermally conductive sheet being disposed on the inner surface.

10. The electronic assembly of claim 1, wherein the housing includes an inner surface facing the electromagnetic module, an outer surface facing away from the electromagnetic module and disposed opposite the inner surface, and the thermally conductive sheet is embedded within the housing between the inner surface and the outer surface.

11. The electronic assembly of claim 1, wherein the housing includes an inner surface facing the electromagnetic module, an outer surface facing away from the electromagnetic module and disposed opposite the inner surface, a portion of the thermally conductive sheet being embedded within the housing between the inner surface and the outer surface, and another portion of the thermally conductive sheet being between the inner surface and the electromagnetic module.

12. A terminal device comprising a battery and an electronic assembly according to any one of claims 1-11, said battery being electrically connected to said electromagnetic module, said housing being housed over said battery.

Technical Field

The embodiment of the invention relates to the technical field of electronic equipment, in particular to an electronic component and terminal equipment with the same.

Background

With the continuous development of electronic technologies, various terminal devices have more and more integrated functions, and as a common technology of wireless communication, Near Field Communication (NFC) is gradually popularized in various terminal devices on the market, and an NFC communication module integrated in the terminal devices realizes non-contact point-to-point data transmission between the electronic devices through electromagnetic field coupling.

However, with the application of various technologies and functions, the power consumption of the terminal device is also increasing, and during the use process, the local position of the casing of the terminal device is often too hot, thereby affecting the use experience of the user. In order to avoid local overheating of the terminal device casing, a heat conduction material such as a graphite sheet and a copper foil is generally attached to the casing, and the heat at the higher temperature position on the casing is dispersed to other areas of the casing by utilizing the good heat conduction performance of the heat conduction material, so that the temperature equalization effect is achieved. Although materials such as graphite flakes and copper foils can conduct heat well, the materials have a shielding effect on electromagnetic transmission of the NFC communication module, so that the design of the terminal equipment cannot give consideration to temperature equalization and electromagnetic transmission performance, and the problem of electronic technology development is solved.

Disclosure of Invention

An object of an embodiment of the present invention is to provide an electronic component and a terminal device, which can achieve both temperature equalization and electromagnetic transmission performance.

In order to solve the above technical problem, an embodiment of the present invention provides an electronic component, including an electromagnetic module, a housing disposed on one side of the electromagnetic module, and a heat conduction sheet disposed on the housing, wherein the heat conduction sheet is provided with a through hole corresponding to the electromagnetic module, and a slot penetrating through the heat conduction sheet in a thickness direction and communicating the through hole with an edge of the heat conduction sheet.

The embodiment of the invention also provides terminal equipment which comprises a battery and the electronic assembly, wherein the battery is electrically connected with the electromagnetic module, and the shell is covered above the battery.

Compared with the prior art, the electromagnetic module heat conduction sheet is provided with the through hole corresponding to the electromagnetic module and the slot communicating the through hole with the edge of the heat conduction sheet, the integrity of the heat conduction sheet is damaged, electromagnetic energy generated by the electromagnetic module can be gathered along the edges of the through hole and the slot to form a strong electromagnetic effect, and the electromagnetic transmission performance is ensured; in addition, the heat conduction sheet with the through holes and the slots can still cover a larger area of the shell, so that heat at a position with higher temperature on the shell is dispersed to a large part of the area of the shell, a better temperature equalization effect is achieved, and both temperature equalization and electromagnetic transmission performance are taken into consideration.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a schematic perspective view of an electronic assembly according to a first embodiment of the present invention;

fig. 2 is a schematic view of a thermally conductive sheet structure of an electronic component according to a first embodiment of the present invention;

fig. 3 is a schematic view of the coil shown in fig. 1 entirely covered with a thermally conductive sheet without through holes;

fig. 4 is a schematic view of the coil shown in fig. 1 entirely covered with a thermally conductive sheet having through holes;

fig. 5 is a schematic perspective view of an electronic assembly according to a second embodiment of the present invention;

fig. 6 is a block diagram showing the configuration of a terminal device according to a third embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

A first embodiment of the invention relates to an electronic assembly 10, as shown in fig. 1. The core of the present embodiment is that the electronic component 10 includes the electromagnetic module 11, the case 12 provided on the electromagnetic module 11 side, and the heat conductive sheet 13 provided on the case 12, and the heat conductive sheet 13 is provided with a through hole 130 corresponding to the electromagnetic module 11, and a groove 131 penetrating the heat conductive sheet 13 in the thickness direction of the heat conductive sheet 13 and communicating the through hole 130 and the edge of the heat conductive sheet 13. Here, the thermally conductive sheet 13 provided on the case 12 has a front surface adjacent to the case 12 and a back surface facing the front surface and relatively distant from the case 12, and the phrase "penetrating the thermally conductive sheet 13 in the thickness direction of the thermally conductive sheet 13" means that the open groove 131 communicates the front surface and the back surface of the thermally conductive sheet 13.

According to the electronic component, the through hole corresponding to the electromagnetic module and the slot communicating the through hole with the edge of the heat conduction sheet are arranged on the heat conduction sheet, so that the integrity of the heat conduction sheet is damaged, electromagnetic energy generated by the electromagnetic module can be gathered along the edges of the through hole and the slot to form a strong electromagnetic effect, and the electromagnetic transmission performance is ensured; in addition, the heat conduction sheet with the through holes and the slots can still cover a larger area of the shell, so that heat at a position with higher temperature on the shell is dispersed to a large part of the area of the shell, a better temperature equalization effect is achieved, and both temperature equalization and electromagnetic transmission performance are taken into consideration.

The following describes in detail the non-contact detection device according to the present embodiment, and the following is only provided for easy understanding and is not necessary to implement the present embodiment.

Referring to fig. 1, an electronic component 10 according to the present embodiment includes an electromagnetic module 11 provided in a housing 14, a case 12, and a thermally conductive sheet 13. The frame 14 is generally a middle frame of an electronic device (such as a mobile phone, a computer, a tablet, etc.), the frame 14 is provided with a processor, a controller, a circuit board, etc., and the electronic module 11 located on the frame 14 can be connected to the controller, the processor, etc. through the circuit board.

The electromagnetic module 11 is configured to emit electromagnetic energy, so as to implement a non-contact radio frequency identification function of the electronic component 10. In the present embodiment, the electromagnetic module 11 includes a loop coil 110, i.e., an NFC coil, for generating an electromagnetic field to implement near field communication. Generally, the NFC coil has different shapes and specifications, the shape may be a circle, a rectangle, or the like, the area enclosed by the NFC coil is generally 400 square millimeters to 1000 square millimeters, and in an actual production process, the shape and specification of the coil 110 may be flexibly selected according to different structural and parameter design requirements without specific limitations. In the present embodiment, the coil 110 shown in fig. 1 has a rectangular shape.

The housing 12 covers and protects the electromagnetic module 11, and the material of the housing 12 may be plastic, resin, or metal. In order to ensure that the local heat can be diffused quickly and the temperature equalization effect is achieved, in this embodiment, the housing 12 is a metal housing. The housing 12 has an inner surface 120 facing the su electromagnetic module 11, an outer surface 121 facing away from the electromagnetic module 11 and disposed opposite the inner surface 120.

The heat conductive sheet 13 is disposed on the inner surface 120 of the housing 12, and since the inner surface 120 of the housing 12 is adjacent to the heat generating unit such as a battery or an electronic component in a typical electronic assembly structure, the heat conductive sheet 13 is disposed closer to the heat source, which is beneficial to directly receiving heat and rapidly dispersing the heat to various positions of the housing 12. It should be noted that the heat conductive sheet 13 may be disposed on the housing 12 in various ways, such as: attached to the inner surface 120, or fixed to the inner surface 120 by a snap-fit structure, etc., as long as the heat conductive sheet 13 can be fixed to the housing 12 without easily falling off.

The heat conductive sheet 13 may be a graphite sheet or a copper foil, which has good heat conductivity, so that it can receive heat and rapidly conduct the received heat to various positions of the case 12, thereby achieving a uniform temperature effect. Referring to fig. 2, the heat conductive sheet 13 is provided with a through hole 130 corresponding to the electromagnetic module 11 and a slot 131 communicating the through hole 130 with the edge of the heat conductive sheet 13, and the slot 131 penetrates the heat conductive sheet 13 in the thickness direction.

Since the through holes 130 and the slots 131 destroy the integrity of the thermally conductive sheet 13, the electromagnetic energy generated by the coil 110 can be gathered along the edges of the through holes 130 and the slots 131 to form a strong electromagnetic effect, thereby ensuring that the electromagnetic transmission performance is not affected. In addition, the heat conducting sheet 13 with the through holes 130 and the slots 131 can still cover a larger area of the casing 12, so that heat at a higher temperature position on the casing 12 is dispersed to most other areas of the casing 12, a better temperature equalizing effect is achieved, and the temperature equalizing performance and the electromagnetic transmission performance are considered at the same time.

It should be noted that the through hole 130 may be square, circular, oval, etc., in this embodiment, the through hole 130 is circular, and compared with the through hole with oval, polygonal, or other shapes, the circular through hole cut on the heat conductive sheet 13 can avoid the fracture of the heat conductive sheet caused by excessive stress, thereby improving the life and reliability of the heat conductive sheet. It should be noted that, the larger the size of the through hole 130 is, the better the electromagnetic transmission performance is, but the temperature equalization effect is correspondingly deteriorated, so the size of the through hole 130 can be set appropriately according to the size of the electronic component 10, the requirement of the electromagnetic transmission performance, and the requirement of the temperature equalization effect. In the present embodiment, the diameter of the through hole 130 is 15 mm to 25 mm, and preferably, the diameter of the through hole is 20 mm.

In the present embodiment, the geometric center of the through hole 130 and the geometric center of the coil 110 are opposite to each other, that is, the orthogonal projection of the geometric center of the through hole 130 on the housing 12 and the orthogonal projection of the geometric center of the coil 110 on the housing 12 coincide with each other. So set up for through-hole 130 can just to the center of the electromagnetic field that coil 110 produced, makes the electromagnetic field intensity of gathering at the through-hole 130 edge more even, promotes the electromagnetic transmission performance.

Preferably, the orthographic projection of the through hole 130 on the housing 12 falls within the orthographic projection of the inner edge of the coil 110 on the housing 12. With this arrangement, the size (area) of the through hole 130 can be ensured to be smaller than the size (area surrounded by the outer edge of the coil) of the coil 110, and the area of the heat conductive sheet 13 can be kept as large as possible (the smaller the through hole 130 is, the larger the area of the heat conductive sheet 13 is) on the premise of ensuring that the electromagnetic transmission performance is not greatly affected, thereby obtaining a better temperature equalization effect.

As shown in fig. 1, the coil 110 has an outer edge 1101 and an inner edge 1102. More preferably, the orthographic projection of the inner edge 1102 of the coil 110 on the housing 12 is tangent to the orthographic projection of the edge of the through hole 130 on the housing, that is, the orthographic projection of the inner edge 1102 of the coil 110 on the housing 12 is tangent to the orthographic projection of the edge of the through hole 130 on the housing 12, and in the case that the two are tangent, the balance between the electromagnetic transmission performance and the temperature equalization effect can be better considered. In one practical embodiment, the area of the thermally conductive sheet 13 is large enough to cover the entire coil 110, i.e., the orthographic projection of the outer edge 1101 of the coil 110 on the housing 12 falls within the orthographic projection of the thermally conductive sheet 13 on the housing 12 (not shown).

Since the case 12 houses the electromagnetic module 11 having the coil 110, the thermally conductive sheet 13 provided on the inner surface 120 of the case 12 also covers the coil 110. Note that, the degree of attenuation of the NFC electromagnetic field signal generated by the coil 110 is related to the size of the area of the heat conductive sheet 13 covering the coil 110: when the thermally conductive sheet 13 covering the entire coil 110 and having no through-hole 130 as shown in fig. 3 is used, the performance index of NFC is substantially reduced to 0; after the thermally conductive sheet 13 covering the entire coil 110 and having the through holes 130 as shown in fig. 4 is used, the presence of the through holes 130 allows electromagnetic energy to pass through, so that the electromagnetic field energy of NFC is instantaneously enhanced with the electromagnetic field coupling capability of an external NFC device, and the operating state of NFC is equivalent to that before the thermally conductive sheet 13 is absent.

A second embodiment of the present invention relates to another electronic component 20, and referring to fig. 5, the electronic component 20 according to the second embodiment is substantially the same as the electronic component 10 according to the first embodiment, and the electronic component 20 according to the second embodiment also includes an electromagnetic module 11, a case 12, and a thermally conductive sheet 13. Except that the thermally conductive sheet 13 (shown by a dotted line) of the second embodiment is embedded in the case 12 between the inner surface 120 and the outer surface 121.

Thus, the heat conductive sheet 13 is integrated with the housing 12, and the appearance integrity is good. Moreover, the strength of the shell 12 can be improved by the embedded heat conduction sheet 13, the compression resistance and bending resistance of the shell 12 are improved, and the service life is prolonged.

It should be noted that the design schemes of the structures, materials, and the like of the components provided in the first embodiment of the present invention can also be applied to the electronic assembly 20 provided in the second embodiment, and are not described herein again. The thermally conductive sheet 13 is not limited to being entirely fitted into the case 12, and for example, in the modified embodiment, a part of the thermally conductive sheet 13 is fitted into the case 12 and positioned between the inner surface 120 and the outer surface 121, and another part of the thermally conductive sheet 13 leaks out of the inner surface 120 and is positioned between the electromagnetic module 11 and the inner surface 120.

The third embodiment of the present invention also relates to a terminal device 30 as shown in fig. 6, which includes a battery 31, and the electronic component 10 as described in the foregoing first embodiment or the electronic component 20 as described in the foregoing second embodiment, wherein the battery 31 is electrically connected to the electromagnetic module 11, and a housing of the electronic component 10 or the electronic component 20 is covered over the battery 31.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.

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