阅读说明：本技术 一种可变形研抛盘 (Deformable grinding and polishing disc ) 是由 刘振宇 罗霄 王孝坤 张学军 于 2020-12-07 设计创作，主要内容包括：本发明提供一种可变形研抛盘,包括：由1个圆形研抛盘和至少1个圆环状研抛盘组成的研抛盘组、与研抛盘组连接的压力元件组；通过改变与研抛盘组连接的压力元件组施加的压力,控制研抛盘组整体形状。本发明通过分隔现有研抛盘底部为同心环,并加入压力元件进行调节,使研抛盘曲率半径在一定范围内可调,在非球面光学元件加工过程中保证了研抛盘与光学元件的吻合性。本发明还通过主动调节可变形研抛盘改变去除函数,实现了不同频率误差的有效收敛,从材料去除稳定性,面形收敛效率两方面提升了非球面光学元件的加工效率,增加了研抛盘的适用性。本发明原理清晰,结构简单,相比复杂的机械结构或计算机实时运算处理,能有效降低成本。(The invention provides a deformable polishing disc, comprising: the polishing device comprises a polishing disc group consisting of 1 circular polishing disc and at least 1 circular polishing disc, and a pressure element group connected with the polishing disc group; the overall shape of the polishing disk group is controlled by changing the pressure applied by the pressure element group connected with the polishing disk group. The bottom of the existing polishing disk is divided into the concentric rings, and the pressure element is added for adjustment, so that the curvature radius of the polishing disk is adjustable within a certain range, and the coincidence between the polishing disk and the optical element is ensured in the processing process of the aspheric optical element. The invention also changes the removal function by actively adjusting the deformable polishing disk, realizes the effective convergence of different frequency errors, improves the processing efficiency of the aspheric optical element from two aspects of material removal stability and surface convergence efficiency, and increases the applicability of the polishing disk. The invention has clear principle and simple structure, and can effectively reduce the cost compared with a complex mechanical structure or computer real-time operation processing.)

1. A deformable polishing pad, comprising: the polishing device comprises a polishing disc group consisting of 1 circular polishing disc and at least 1 circular polishing disc, and a pressure element group connected with the polishing disc group; and the overall shape of the polishing disk group is controlled by changing the pressure applied by the pressure element group connected with the polishing disk group.

2. The deformable polishing disk of claim 1 wherein said circular polishing disk comprises: round base, round base grinding ball group; the upper surface of the circular base is connected with the pressure element group, and the lower surface of the circular base is connected with the circular base grinding head group.

3. The deformable polishing disk of claim 1 wherein said annular polishing disk comprises: the annular substrate and the annular substrate are ground into a shot blast sheet set; the upper surface of the circular base is connected with the pressure element group, and the lower surface of the circular base is connected with the circular base grinding head group.

4. The deformable polishing disk of claim 1 wherein said set of pressure elements comprises pressure element structures in one-to-one correspondence with and connected to said circular polishing disk and said annular polishing disk; the pressure element structure connected with the circular polishing disc comprises 1 pressure element, and the pressure element structure connected with the circular polishing disc comprises at least 3 pressure elements; the upper surface of the pressure element is connected with the rigid substrate, the lower surface of the pressure element is connected with the circular polishing disk or the circular polishing disk, the pressure element and the circular polishing disk are uniformly distributed in the circumference according to angles, pressure adjusting action is synchronously performed, and pressure applied to the connected polishing disks is jointly adjusted.

5. The deformable polishing pad of claim 4 wherein said pressure element is an air cylinder, spring or hydraulic cylinder.

6. The deformable polishing pad of any one of claims 2-4 wherein the material of said circular base, said annular base and said rigid base is an aluminum alloy.

Technical Field

The invention relates to the field of processing of aspheric optical elements, in particular to a deformable grinding and polishing disc.

Background

The aspheric optical element can effectively improve the imaging quality and simplify the structure, so the aspheric optical element is widely applied to modern optical systems. With the continuous development of optical technology, the index requirements of modern optical systems on aspheric optical elements are continuously improved, and the aperture of aspheric optical elements is continuously increased in order to further improve the resolution of optical systems. Meanwhile, higher requirements are provided for improving the imaging quality of the system and the surface shape accuracy index of the optical element. To meet these requirements, the aspheric optical element processing efficiency needs to be further improved.

The processing difficulty of the large-caliber aspheric optical element mainly has two aspects:

1. the curvature radius of each part of the surface of the aspheric optical element is different, the large-caliber grinding and polishing disc is difficult to be matched with the aspheric surface, the convergence efficiency is poor, the material removal efficiency of the small-caliber grinding and polishing disc is low, and the processing efficiency is influenced.

2. The large-caliber aspheric optical element has a long processing period, surface error frequency comprises low-order, medium-frequency and high-frequency errors, and the large-caliber aspheric optical element is difficult to correct by using a single-caliber grinding head. The large-caliber grinding head has poor effect of removing the medium and high frequency errors, and the small-caliber grinding head has low efficiency of processing the low-order surface type.

In the prior art, the stress disc processing technology is a main method for solving the problem of non-curved surface non-coincidence. The technology uses a force driver to control the shape of a polishing disk, so that the polishing disk can keep fit at different positions of an aspheric optical surface.

The stress disc machining technology has two main limitations:

1. the deformation of the stress disc requires the use of force actuators or similar structures and is therefore complicated. And a control system is required to be added to realize real-time deformation, so that the cost is high.

2. Because control elements such as a force driver and the like need to be installed, the stress disc is generally large in size, poor in control capability on small-scale medium-high frequency surface shape errors and needs to be matched with a small-caliber grinding and polishing disc.

Disclosure of Invention

The invention provides the following deformable polishing disc for solving the problems that a large-caliber polishing disc is not matched with the surface of an aspheric optical element and the surface shape error control capability of a single-caliber polishing disc to different frequencies is insufficient.

In order to achieve the purpose, the invention adopts the following specific technical scheme:

a deformable polishing pad comprising: the polishing device comprises a polishing disc group consisting of 1 circular polishing disc and at least 1 circular polishing disc, and a pressure element group connected with the polishing disc group; the overall shape of the polishing disk group is controlled by changing the pressure applied by the pressure element group connected with the polishing disk group.

Preferably, the circular polishing disk includes: round base, round base grinding ball group; the upper surface of the circular base is connected with the pressure element group, and the lower surface of the circular base is connected with the circular base grinding head group.

Preferably, the circular polishing disk includes: the annular substrate and the annular substrate are ground into a shot blast sheet set; the upper surface of the circular base is connected with the pressure element group, and the lower surface is connected with the circular base grinding head group.

Preferably, the pressure element group comprises pressure element structures which correspond to the circular polishing disc and the circular polishing disc one by one and are connected with the circular polishing disc; the pressure element structure connected with the circular polishing disk comprises 1 pressure element, and the pressure element structure connected with the circular polishing disk comprises at least 3 pressure elements; the upper surface of the pressure element is connected with the rigid substrate, the lower surface of the pressure element is connected with the circular polishing disk or the circular polishing disk, the pressure element and the circular polishing disk are uniformly distributed in the circumference according to angles, pressure adjusting action is synchronously performed, and pressure applied to the connected polishing disks is jointly adjusted.

Preferably, the pressure element is a pneumatic, spring or hydraulic cylinder.

Preferably, the material of the circular base, the annular base and the rigid base is an aluminum alloy.

The invention can obtain the following technical effects:

(1) the bottom of the existing polishing disk is divided into concentric rings, and a pressure element is added for adjustment, so that the curvature radius of the polishing disk is adjustable within a certain range, and the matching between the polishing disk and an optical element is ensured in the processing process of an aspheric optical element.

(2) The removal function is changed by actively adjusting the deformable polishing disc, so that effective convergence of different frequency errors is realized, the processing efficiency of the aspheric optical element is improved from two aspects of material removal stability and surface shape convergence efficiency, and the applicability of the polishing disc is improved.

(3) The structure principle is clear, simple structure compares complicated mechanical structure or computer real-time operation processing, can effectively reduce cost.

Drawings

FIG. 1 is a front view of a simplified block diagram according to an embodiment of the present invention;

fig. 2 is a bottom view of a simplified structure according to an embodiment of the present invention.

Wherein the reference numerals include: the polishing device comprises a circular polishing disk 11, a first circular polishing disk 12, a second circular polishing disk 13, a pressure element 21, a first pressure element mechanism 22, a second pressure element structure 23, a rigid base 3, a circular base 111, a first circular base 121, a second circular base 131, a circular base polishing head group 112, a first circular base polishing head group 122 and a second circular base polishing head group 132.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention.

As shown in fig. 1, the deformable polishing disk provided in the embodiment of the present invention includes a polishing disk group including a circular polishing disk 11, a first circular polishing disk 12, and a second circular polishing disk 13, where the circular polishing disk 11, the first circular polishing disk 12, and the second circular polishing disk 13 have centers of circles coinciding with each other and have different diameters; the grinding and polishing device also comprises a pressure element 21, a first pressure element mechanism 22 and a second pressure element structure 23 which are respectively connected with the circular grinding and polishing disk 11, the first circular grinding and polishing disk 12 and the second circular grinding and polishing disk 13; the shapes of the circular polishing and polishing disk 11, the first annular polishing and polishing disk 12 and the second annular polishing and polishing disk 13 can be controlled by changing the pressure applied by the pressure element 21, the first pressure element mechanism 22 and the second pressure element mechanism 23.

In one embodiment of the invention, the circular polishing disk 11 comprises: the device comprises a circular base 111 and a circular base grinding head set 112, wherein the upper surface of the circular base 111 is connected with a pressure element 21, and the lower surface of the circular base 111 is connected with the circular base grinding head set 112; the first annular polishing disk 12 includes: the first annular substrate 121 and the first annular substrate grinding head set 122 are arranged, the upper surface of the first annular substrate 121 is connected with the first pressure element mechanism 22, and the lower surface of the first annular substrate 121 is connected with the first annular substrate grinding head set 122; annular grinding and polishing disk No. two 13 includes: the upper surface of the second annular substrate 131 is connected with the second pressure element structure 23, and the lower surface of the second annular substrate 131 is connected with the second annular substrate grinding impeller group 132; the grinding and polishing assembly is convenient to replace by adopting a separable structure of the base and the grinding and polishing pill group, and compared with an integrated grinding and polishing disk, the cost for replacing the grinding and polishing assembly can be reduced, and the replacement efficiency of the grinding and polishing assembly is improved.

It should be noted that the present embodiment is only illustrative with respect to the number of polishing disks included in the polishing disk group and the number of pressure element structures, and any combination arrangement including four or more of the above elements is within the protection scope of the present invention.

In one embodiment of the present invention, both the pressure element mechanism # one 22 and the pressure element mechanism # two 23 comprise at least 3 identical pressure elements; the upper surface of the pressure element is connected with the rigid substrate 3, the lower surface of the pressure element is connected with the polishing disc, the pressure element and the polishing disc are uniformly distributed in the circumference according to angles, pressure regulation action is synchronously carried out, and pressure applied to the connected polishing discs is jointly regulated; each pressure element structure connected with the circular grinding and polishing disc comprises at least 3 same pressure elements, the grinding and polishing disc can be stably connected, inclination is prevented, and the pressure elements are uniformly distributed to ensure uniform stress of the grinding and polishing disc.

In one embodiment of the invention, the pressure element is a cylinder, which can provide a stable constant pressure that is easy to adjust.

In an alternative embodiment of the invention, instead of the cylinder, other pressure elements are used, such as springs, which are used as pressure elements, which can be adjusted slowly, reducing the impact of the adjusting pressure on the element to be machined, or hydraulic cylinders, which provide a more precise, constant pressure and have a certain cooling effect.

In one embodiment of the invention, the material of the polishing disk substrate and the rigid substrate 3 is aluminum alloy; the aluminum alloy material is selected, so that the base has certain mechanical strength and the weight of the equipment is reduced.

The invention is described in detail below with reference to fig. 1:

in this embodiment, a polishing disc with a radius of 150mm is selected, and the polishing disc is divided into:

circular polishing disk 11: a circle with the radius of 50 mm; first circular polishing disk 12: a ring with the radius of 60-100 mm; second circular grinding and polishing disk 13: radius 110-.

The circular polishing disc 11 is positioned in the center of the polishing disc, the upper part of the circular polishing disc is connected with 1 cylinder, the upper part of the cylinder is connected with the rigid substrate 3, and the position of the cylinder is positioned in the center of the rigid substrate 3;

the upper part of the first circular grinding and polishing disc 12 is connected with 3 cylinders, the upper part of each cylinder is connected with the rigid substrate 3, and the positions of the cylinders are positioned at the position with the radius of 80mm and are uniformly distributed at 120 degrees;

the upper part of the second circular grinding and polishing disc 13 is connected with 3 cylinders, the cylinders are connected with the upper rigid substrate 3, the positions of the cylinders are located at the position with the radius of 130mm, and the cylinders are uniformly distributed at 120 degrees.

For the polishing disk, an SMC CQ2A16-20 cylinder was used. The inner diameter of the cylinder is 16mm, and 20N pressure can be provided by 0.1MPa pressure, so that the processing requirement can be met.

In the actual processing process, the pressure of each part of circular ring is controlled to be consistent through the air cylinder aiming at the large-scale surface shape error of the surface of the aspheric optical element, and uniform material removal is realized. Aiming at the surface shape error of medium and high frequency in small size, the pressure intensity of the outer ring can be reduced, and the material removal with higher peak value and narrower half width is obtained.

The invention has simple structure and lower cost. The problem of unstable material removal amount caused by the fact that the surface of the grinding and polishing disc is not matched with the surface of the element to be processed in the processing process of the aspheric optical element can be effectively solved, meanwhile, the adaptability of the grinding and polishing disc to different frequency surface shapes can be improved, and high-efficiency processing of the aspheric optical element can be achieved.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

While embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be taken as limiting the invention. Variations, modifications, substitutions and alterations of the above-described embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.

The above embodiments of the present invention should not be construed as limiting the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.