阅读说明：本技术 用于控制流体的流量的阀组件和系统 (Valve assembly and system for controlling the flow of a fluid ) 是由 穆罕默德·萨利姆 阿伦·纳加良 丹尼尔·穆德 侯赛因·加潘基扎德 于 2020-09-14 设计创作，主要内容包括：一种用于控制流体流量的阀组件包括阀体、阀、传感器芯片封装件、和控制器接口。所述阀体具有上游储器、下游储器、和用于将流体从上游位置传送至下游位置的阀座。所述阀具有可移动构件。所述传感器芯片封装件具有与所述阀耦接的至少一个传感器。所述控制器接口可通信耦接至控制单元、所述阀、和所述传感器芯片封装件。所述控制器接口将由所述传感器芯片封装件提供的至少一个参数值发送至所述控制单元。所述控制器接口接收用于调节所述阀的阀冲程的控制信号。所述阀的控制信号是基于所述至少一个测得参数值和由流体处理系统提供的至少一个其他参数值确定的。(A valve assembly for controlling fluid flow includes a valve body, a valve, a sensor chip package, and a controller interface. The valve body has an upstream reservoir, a downstream reservoir, and a valve seat for conveying fluid from an upstream location to a downstream location. The valve has a movable member. The sensor chip package has at least one sensor coupled to the valve. The controller interface may be communicatively coupled to a control unit, the valve, and the sensor chip package. The controller interface sends at least one parameter value provided by the sensor chip package to the control unit. The controller interface receives a control signal for adjusting a valve stroke of the valve. The control signal for the valve is determined based on the at least one measured parameter value and at least one other parameter value provided by the fluid treatment system.)

1. A valve assembly for controlling fluid flow, the valve assembly comprising:

a valve body having an upstream reservoir, a downstream reservoir, and a valve seat for conveying fluid from an upstream location to a downstream location;

an independent valve having a movable member;

a sensor chip package having at least one sensor coupled to the independent valve; and

a controller interface for transmitting at least one measured parameter value provided by the at least one sensor and for receiving a control signal for adjusting a valve stroke of the independent valve, the control signal being determined based on the at least one measured parameter value.

2. The valve assembly of claim 1, wherein the control signal for the independent valve is determined based on the at least one measured parameter value and at least one other parameter value.

3. The valve assembly of claim 1, further comprising:

a control unit having an interface for communicating with a controller interface of the independent valve; and is

The control unit has a further interface for receiving at least one further parameter value; the at least one other parameter value is indicative of a pressure of at least one selected from the group consisting of at least one upstream pressure sensor positioned at a location upstream of the independent valve and at least one downstream pressure sensor positioned at a location downstream of the independent valve;

wherein the control unit generates a control signal for adjusting the valve stroke based on the at least one parameter value and the at least one further parameter value.

4. The valve assembly of claim 1, wherein the sensor chip package comprises a position sensor.

5. The valve assembly of claim 4, wherein the sensor chip package generates at least one parameter value indicative of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member.

6. The valve assembly of claim 4, wherein the sensor chip package further comprises:

at least one selected from the group consisting of: an upstream pressure sensor positioned in an upstream reservoir or upstream channel of the valve body; a downstream pressure sensor positioned in a downstream reservoir or downstream passage of the valve body; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and a temperature sensor positioned in at least one selected from the group consisting of the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and a valve seat.

7. The valve assembly of claim 6, wherein the sensor chip package generates at least one parameter value indicative of:

a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member; and

a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor.

8. The valve assembly of claim 6, wherein the sensor chip package generates at least one parameter value indicative of:

a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member;

a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; and

a temperature of at least one selected from the group consisting of the upstream reservoir, the upstream channel, the valve seat, the downstream reservoir, and the downstream channel.

9. A fluid handling system for use in a manufacturing facility, the fluid handling system comprising:

a valve body having an upstream reservoir, a downstream reservoir, and a valve seat for conveying fluid from an upstream location to a downstream location;

an independent valve having a movable member;

a sensor chip package having at least one sensor coupled with the valve;

an upstream fluid source fluidly coupled to the independent valve;

a downstream processing tool fluidly coupled to the independent valve; and

a control unit having an interface communicatively couplable to the independent valve and the sensor chip package;

wherein the control unit generates a control signal for controlling the stroke of the independent valve based on at least one parameter value from the sensor chip package.

10. The fluid treatment system defined in claim 9, wherein the interface is communicatively couplable with at least one selected from the group consisting of at least one upstream pressure sensor positioned at an upstream location and at least one downstream pressure sensor positioned at a downstream location; and is

An interface generates a control signal for controlling a stroke of the independent valve based on the at least one parameter value from the sensor chip package and at least one other parameter value from a group comprising at least one upstream pressure sensor positioned at an upstream location of the valve body and at least one downstream pressure sensor positioned at a downstream location of the valve body.

11. The fluid treatment system defined in claim 9, wherein the sensor chip package comprises a position sensor.

12. The fluid treatment system defined in claim 11, wherein the sensor chip package generates at least one parameter value indicative of at least one selected from the group consisting of a position of the movable member and an obstruction of the immovable member.

13. The fluid treatment system defined in claim 12, wherein the sensor chip package further comprises:

at least one selected from the group consisting of: an upstream pressure sensor positioned in an upstream reservoir of the valve body; a downstream pressure sensor positioned in a downstream reservoir of the valve body; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and a temperature sensor positioned in at least one selected from the group consisting of the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and a valve seat.

14. The fluid treatment system of claim 13, wherein the sensor chip package generates at least one parameter value indicative of:

a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member; and

a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor.

15. The fluid treatment system of claim 13, wherein the sensor chip package generates at least one parameter value indicative of:

a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member;

a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; and

a temperature of at least one selected from the group consisting of the upstream reservoir, the valve seat, and the downstream reservoir.

16. The fluid treatment system defined in claim 9, wherein the upstream fluid source comprises an upstream pressure sensor.

17. The fluid treatment system defined in claim 9, wherein the downstream treatment tool comprises a downstream pressure sensor.

18. A method of controlling fluid flow in a fluid treatment system using a valve assembly, the method comprising:

generating, at the valve assembly, a first parameter value indicative of a position of a movable member of an independent valve;

generating a second parameter value indicative of absolute pressure upstream of the valve assembly;

generating a third parameter value indicative of pressure downstream of the valve assembly and at a process tool; and

adjusting a position of a valve based on the first, second, third, and at least one other parameter value selected from the group consisting of a set point value, a current fluid flow, a fluid type, at least one other pressure, a temperature, and a differential pressure.

19. The method of claim 18, further comprising:

generating another parameter value indicative of pressure from an upstream location between a fluid source and the valve assembly; and

generating another parameter value indicative of pressure from an upstream location between the process tool and the valve assembly.

20. The method of claim 18, further comprising:

generating another parameter value indicative of pressure at an upstream inlet passage of the valve assembly; and

generating another parameter value indicative of pressure at a downstream outlet passage of the valve assembly.

Background

In order to maintain a desired product yield, equipment used in semiconductor wafer fabrication is required to operate with high precision. In the production of integrated circuits, semiconductor wafers are processed in a process chamber using certain chemicals. Mass Flow Controllers (MFCs) are used in a scheduled configuration to deliver these chemicals to a process chamber in a timely consistent manner and at a consistent flow rate. This can be very difficult because the MFC is required to maintain very tight accuracy, run at multiple set points, and be constantly shut down and restarted during the wafer fabrication process. To manage this accuracy, prior art MFCs are equipped with a processor-based control unit, a large number of sensors, and advanced diagnostic systems. However, these high-end MFCs are quite expensive and may well exceed the needs of the manufacturer.

Disclosure of Invention

A valve assembly for controlling fluid flow is presented herein. The valve assembly includes a valve body having an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from an upstream location to a downstream location. The valve assembly further includes a stand-alone valve having a movable member; a sensor chip package having at least one sensor coupled to the independent valve; and a controller interface. The controller interface transmits at least one measured parameter value provided by the at least one sensor and receives a control signal for adjusting a valve stroke of the independent valve. The control signal is determined based on the at least one measured parameter value.

In some embodiments, the control signal for the independent valve is determined based on the at least one measured parameter value and at least one other parameter value. In some embodiments, the valve assembly may further comprise a control unit having an interface for communicating with a controller interface of the independent valve. The control unit may further comprise a further interface for receiving at least one further parameter value. The at least one other parameter value is indicative of a pressure of at least one selected from the group consisting of at least one upstream pressure sensor positioned at a location upstream of the independent valve and at least one downstream pressure sensor positioned at a location downstream of the independent valve. The control unit may also generate a control signal for adjusting the valve stroke based on the at least one parameter value and the at least one other parameter value.

In some additional embodiments, the sensor chip package includes a position sensor. The sensor chip package generates at least one parameter value indicative of at least one selected from the group consisting of a position of the movable member and an obstruction of the immovable member. The sensor chip package may also include at least one upstream pressure sensor positioned in an upstream reservoir or upstream channel of the valve body. The sensor chip package may also include at least one downstream pressure sensor positioned in a downstream reservoir or downstream channel of the valve body. The sensor chip package may also include a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir. The sensor chip package may further include a temperature sensor positioned in at least one selected from the group consisting of an upstream reservoir, an upstream channel, a downstream reservoir, a downstream channel, and a valve seat.

In some embodiments, the sensor chip package may generate a parameter value indicative of a position of the movable member. The sensor package may also generate a parameter value indicative of an obstruction of the immovable member. The sensor chip package may also generate one or more parameter values indicative of a pressure of at least one selected from the group consisting of an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor positioned in the valve body. The sensor chip package may also generate a parameter value indicative of the heat.

In some other embodiments, the sensor chip package may generate a parameter value indicative of a position of the movable member. The sensor chip package may also generate a parameter value indicative of an obstruction of the immovable member. The sensor chip package may also generate a parameter value indicative of a pressure of at least one selected from the group consisting of an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor. The sensor chip package may also generate a parameter value indicative of a temperature of at least one selected from the group consisting of an upstream reservoir, an upstream channel, a valve seat, a downstream reservoir, and a downstream channel.

A fluid handling system for use in a manufacturing facility is also presented. The fluid treatment system includes a valve body, a stand-alone valve, an upstream fluid source fluidly coupled to the stand-alone valve, a downstream treatment tool fluidly coupled to the stand-alone valve, and a control unit. The valve body includes an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from an upstream location to a downstream location. The independent valve has a movable member and a sensor chip package having at least one sensor coupled to the valve. The control unit includes an interface communicably coupled to the independent valve and the sensor chip package. The control unit generates a control signal for controlling the stroke of the individual valve based on the at least one parameter value from the sensor chip package.

In some embodiments, the interface of the control unit may be communicatively coupled with at least one selected from the group consisting of at least one upstream pressure sensor positioned at an upstream location and at least one downstream pressure sensor positioned at a downstream location. In these embodiments, the interface generates a control signal for controlling the stroke of the independent valve based on the at least one parameter value and the at least one other parameter value from the sensor chip package. The other parameter value is indicative of a pressure from a group including at least one upstream pressure sensor positioned at an upstream location of the valve body and at least one downstream pressure sensor positioned at a downstream location of the valve body.

The sensor chip package includes a position sensor. The sensor chip package generates a parameter value indicative of at least one selected from the group consisting of a position of the movable member and an obstruction of the immovable member. In some embodiments, the sensor chip package may also include an upstream pressure sensor positioned in the upstream reservoir of the valve body. In some embodiments, the sensor chip package may also include a downstream pressure sensor positioned in the downstream reservoir of the valve body. In some embodiments, the sensor chip package may also include a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir. In some embodiments, the sensor chip package includes a temperature sensor positioned in at least one selected from the group consisting of an upstream reservoir, an upstream channel, a downstream reservoir, a downstream channel, and a valve seat.

The sensor chip package generates a parameter value indicative of a position of at least one selected from the group consisting of a position of the movable member and an obstruction of the immovable member. In some embodiments, the sensor chip package generates one or more parameter values indicative of a pressure selected from at least one of the group consisting of an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor. In some embodiments, the sensor chip package generates a parameter value indicative of a temperature of at least one selected from the group consisting of an upstream reservoir, a valve seat, and a downstream reservoir. In some embodiments, the upstream fluid source comprises an upstream pressure sensor. In some embodiments, the downstream processing tool includes a downstream pressure sensor.

Drawings

For a more complete understanding of the features and advantages of the present disclosure, reference is now made to the detailed description and to the accompanying drawings in which corresponding reference numerals in the different drawings represent corresponding parts, and in which:

1A-1C are illustrations of a valve assembly and fluid handling system for managing the proper delivery of fluids for performing manufacturing operations (such as semiconductor processing manufacturing operations), according to certain example embodiments;

FIG. 2 is an illustration of a flow chart of an algorithm for generating parameter values, communicating the parameter values, and controlling flow of the valve assembly based on the parameter values, in accordance with certain exemplary embodiments; and is

FIG. 3 is an illustration of a computing machine and system application module, according to some example embodiments.

Detailed Description

While the making and using of various embodiments of the present disclosure are discussed in detail below, it should be appreciated that the present disclosure provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely illustrative and do not limit the scope of the disclosure. In the interest of clarity, not all features of an actual implementation may be described in this disclosure. It will of course be appreciated that in the development of any such actual embodiment, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort might be complex and time-consuming, but would nevertheless be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure.

As previously mentioned, prior art and commercially available MFCs are quite expensive and may well exceed the needs of the manufacturer. Even if a particular MFC meets the needs of a particular manufacturer, in some cases, the manufacturer's manufacturing facility may already include its own processor-based control unit, sensors, and advanced diagnostic systems. As an example, a process chamber used to etch circuits on a semiconductor wafer in an etching process uses a separate control unit, sensor, and diagnostic system. In these particular cases, prior art and commercially available MFCs provide redundant hardware and functional services, thus increasing manufacturing costs. Therefore, there is a need for a valve assembly that can be integrated with a manufacturer's manufacturing operations and use the parameter variables provided in the operations to operate at multiple set points and maintain the mass flow of fluid with very strict accuracy as it is continually shut down and restarted during the manufacturing process.

As used herein, an upstream or upstream side refers to a location or side closest to a fluid source, e.g., after an upstream valve or before a downstream valve in a MFC. As used herein, the High Pressure (HP) or HP side of an MFC refers to the upstream or upstream side. As used herein, downstream or downstream side refers to the position or side furthest from the fluid source. As used herein, one or more position predetermined values refer to a priori variables including valve seat position values, which are based on variables including valve seat position values and fluid flow. As used herein, valve seat opening refers to the instantaneous position of the valve in the closed state or open state of the valve or any position between the closed state and the open state. As used herein, a volume is a reservoir of known volume that serves as a point in a fluid line for making pressure measurements of fluid flowing through the fluid line. As used herein, the term "parameter value" refers to a variable having a parameter and a value. As used herein, "control signal" indicates an encoded signal that may also be a variable.

Referring now to fig. 1A-1C, a valve assembly and fluid handling system for managing the proper delivery of fluids for performing manufacturing operations, such as semiconductor processing manufacturing operations, according to certain exemplary embodiments is illustrated. In essence, the fluid treatment system is a third party system. The valve assembly includes a valve 10 (piezoelectric or solenoid), a sensor chip package 12, and a valve body 14. The valve assembly may also include a control unit 20. However, the control unit 20 may be part of a fluid processor system to which the valve assemblies may be communicatively coupled. Additionally, the control unit 20 may be a processing unit provided with the valve assembly and a processing unit provided by an integrated fluid handling system to perform specific tasks. The fluid treatment system includes a fluid source 16 and a treatment tool 18. The control unit 20 controls the valve assembly in conjunction with feedback from the valve assembly and the fluid handling system to maintain a desired fluid flow of fluid communicated between the fluid source 16 in the upstream position and the processing tool 18 in the downstream position based on the read parameter values. In addition, any changes to the actual flow rate based on the desired flow rate are communicated to the process tool 18 in the form of at least one parameter value, such as an absolute pressure value.

The valve 10 is coupled to a valve body 14. The valve 10 includes a movable member such as a valve stem 10A and a valve disk 10B. The valve body 14 includes passages including an upstream inlet passage 14A, a downstream outlet passage 14B, an upstream reservoir 14C, a valve seat 14D, and a downstream reservoir 14E. Any flow path between the fluid source 16 and the process tool 18 has a known volume and may be used by the control unit 20 in conjunction with the parameter values described herein to control the position of the valve stem 10A or valve disc 10B. The valve stem 10A and the valve disc 10B respond to commands from the control unit 20A. The stroke of the valve 10 is represented by the valve stem 10A and the valve disc 10B when the valve stem 10A and the valve disc 10B are fully open, fully closed, or between fully open and fully closed. When the valve disc 10B is flush with the valve seat 14C, the valve 10 is fully closed. In response to the opening operation, fluid is delivered from the upstream channel 14A into the upstream reservoir 14C, past the valve seat 14D, past the downstream reservoir 14E, and past the downstream exit channel 14B at a flow rate defined by the degree of opening of the valve seat 14C. Obviously, the degree of opening of the valve seat 14C is based on several parameter values, such as set point value, fluid type, position of the movable member, current flow rate, temperature, and pressure.

In an embodiment, the valve assembly comprises only a single valve 10 and sensor chip package 12, wherein the sensor chip package 12 has a position sensor. In another embodiment, the sensor chip package 12 includes a position sensor, and at least one selected from the group consisting of an absolute pressure sensor and a differential pressure sensor. In other words, the sensor chip package 12 may include a position sensor, and at least one absolute pressure sensor or at least one differential pressure sensor, or a combination of one or more absolute pressure sensors and one or more differential pressure sensors. In some embodiments, the sensor chip package 12 may include a Differential Pressure (DP) sensor or a temperature sensor or both. These sensors may be positioned in any flow path of the valve body 14, such as the inlet passage 14A, the outlet passage 14B, the upstream reservoir 14C, the valve seat 14D, and the downstream reservoir 14E.

In FIG. 1A, the manufacturer's fluid handling system includes a universal gas box as the fluid source 16, and the process tool 18 includes a process chamber 18A and a gas manifold 18B. In FIG. 1B, the manufacturer's fluid treatment system includes a fluid source 16 from an upstream process, and the process tool 18 includes a process chamber 18A. In this example, the process gas supply is provided to the process chamber by positioning the valve between the common gas box and the process chamber 18A and closer to the chamber lid. In fig. 1C, the fluid source 16 is helium gas and the process tool 18 includes a wafer chuck 18C. In the embodiment of fig. 1A, 1B, and 1C, a pressure sensor 30 is positioned at a location upstream of the valve assembly to measure the pressure at volume 1(V1) and generate a parameter value P1. Further to this embodiment, a pressure sensor 32 is positioned at a location downstream of the valve assembly to measure the pressure at volume 2(V2) and generate a parameter value P2. However, depending on the configuration of the valve assembly, the pressure sensors 30 and 32 may not be required. Further with respect to the embodiment of fig. 1A and 1C, sensors integrated into the manufacturer's fluid source 16 and processing tool 18 are used to measure pressure and generate parameter values P0 and P3, respectively. In the embodiment of FIG. 1B, another sensor 34 is positioned between fluid source 16 and V1 for measuring pressure and generating a parameter value P0. The pressure sensors 30 and 32 may be gauge pressure sensors, differential pressure sensors, or absolute pressure sensors, or any combination thereof.

Further to each embodiment, the sensor chip package 12 communicates the position of the valve stem 10A and/or valve disc 10B, or other movable flow restriction mechanism (such as a ball on a valve seat) to the control unit 20 for reading and processing. A priori information describing the stroke of the valve stem 10A and/or valve disc 10B (e.g., position 0 is valve closed, position 10 is fully open), and various variables describing various positions between closed and open may be stored in a memory or hard disk associated with the control unit 20 and associated with the stored flow value. In some of these embodiments, the sensor chip package 12 includes, in addition to a position sensor, an upstream absolute pressure sensor, e.g., positioned in the upstream inlet passage 14A, for measuring absolute pressure and communicating a parameter value P1. In some of these embodiments, the sensor chip package 12 may include, in addition to a position sensor, a downstream absolute pressure sensor, e.g., positioned in the downstream outlet channel 14B, for measuring absolute pressure and communicating the parameter value P2. In some of these embodiments, the sensor chip package 12 may include both upstream and downstream absolute pressure sensors in addition to the position sensor for measuring absolute pressure and communicating parameter values P1 and P2. In some embodiments, the sensor chip package 12 may include a differential pressure sensor in addition to a position sensor for measuring Differential Pressure (DP). In some embodiments, the sensor chip package 12 may include a differential pressure sensor, and one or both of an upstream absolute pressure sensor and a downstream absolute pressure sensor, in addition to a position sensor, for measuring pressure and generating parameter values DP and either P1 or P2 or both. In some embodiments, the sensor chip package 12 may include a temperature sensor in addition to the position sensor for measuring the temperature of the orifice and the reservoir 14C. In some embodiments, the sensor chip package 12 may include a temperature sensor in addition to a position sensor. In some embodiments, the sensor chip package 12 may include a temperature sensor in addition to the position sensor, and at least one selected from the group consisting of: the group includes a differential pressure sensor, an upstream absolute pressure sensor, and a downstream absolute pressure sensor. It is apparent that the sensor chip package 12 included with the valve assembly may depend on the sensor configuration of the fluid handling system of the manufacturer.

In each of the embodiments described above, the position of the valve stem 10A and/or valve disc 10B and the parametric values for absolute pressure P0-P3 are communicated to the control unit 20 and read by the control unit 20 to control operation of the valve assembly. In some embodiments, at least one of the position of the valve stem 10A and/or valve disc 10B, the parametric values for absolute pressure P0-P3, and the parametric values selected from the group of parametric values including DP and temperature, are communicated to the control unit 20 and read by the control unit 20 to control operation of the valve assembly. Further, if P3 is updated, the updated P3 is provided to the process tool 18 for use in adjusting the operation of the process chamber 18A or wafer chuck 18B. In some embodiments, the valve assembly may be incorporated into the process tool 18, for example in the gas manifold 18B or atop the process chamber 18A.

Referring now to FIG. 2, a flowchart, generally designated 60, of an algorithm for generating parameter values, communicating the parameter values, and controlling flow of the valve assembly based on the parameter values is illustrated, in accordance with certain exemplary embodiments. At the valve assembly, the algorithm 60 begins at block 62, where the algorithm generates at least one parameter value. The generated parameter value is indicative of the position of the valve stem 10A or the valve disc 10B, or both. In addition to the parameter value indicative of the position of valve stem 10A or valve disc 10B, the algorithm may generate at least one other parameter value indicative of the absolute pressure from at least one selected from the group consisting of an upstream absolute pressure sensor and at least one downstream absolute pressure sensor. Other parameter values generated may include DP and temperature.

In an embodiment, a fluid treatment system may include one or more upstream absolute pressure sensors positioned at one or more upstream locations of a valve assembly. The one or more downstream absolute pressure sensors may be positioned at a location downstream of the valve assembly. Essentially, an absolute pressure sensor measures pressure, and algorithm 60 generates P0 and P3. In some embodiments, pressure is measured using sensor 30 or sensor 32 or both, depending on the manufacturer's facility, and algorithm 60 generates P1 and P2 in addition to P0 and P3.

In an embodiment, the sensor chip package 12 may include at least one selected from the group consisting of an upstream absolute pressure sensor positioned in the upstream inlet channel 14A of the valve body 14 and a downstream absolute pressure sensor positioned in the downstream outlet channel 14B of the valve body 14. Further, the sensor chip package 12 of the valve 10 may include a differential pressure sensor for measuring differential pressure. Additionally, the sensor chip package 12 of the valve 10 may include a temperature sensor for measuring temperature. More specifically, a sensor chip package 12 having a particular sensor configuration may be coupled with the valve 10 based on the particular sensor configuration of the fluid handling system.

The algorithm 60 generates at least a parameter value indicative of the position of the valve stem 10A or valve disc 10B, parameter values P0 and P3 indicative of the absolute pressures at the fluid source 16 and the process tool 18, and at least one selected from the group consisting of parameter values P1 and P2 indicative of the absolute pressures upstream and downstream of a position in or outside of the valve assembly. In some embodiments, a parameter value indicative of the Differential Pressure (DP) is generated. In some embodiments, a parameter value indicative of a temperature is generated. In some embodiments, parametric values for DP and temperature are generated.

At block 64, the algorithm 60 communicates parameter values generated from the sensor chip package 12 and other sensors from the fluid handling system for further processing. At block 66, the communicated parameter values (including the position of the valve stem 10A or valve disc 10B, absolute pressure, and optionally differential pressure and temperature) are read and processed and used with stored a priori information to determine the desired flow rate. The desired flow rate may be based on a set point value, fluid type, position of valve stem 10A and/or valve disc 10B, current flow rate, temperature, and pressure (absolute and differential). At block 68, the positions of valve stem 10A and valve disc 10B are adjusted using the determined flow rates and the associated, stored variables describing the respective positions of valve stem 10A and valve disc 10B. At block 70, at least one parameter value, such as any adjustments to P3, are communicated to the processing tool 18.

Referring now to FIG. 3, a computing machine 100 and system application module 200 are illustrated, according to an example embodiment. The computing machine 100 may correspond to any of the various computers, mobile devices, laptops, internet of things (IoT), servers, embedded systems, or computing systems presented herein. Module 200 may include one or more hardware or software elements, such as other OS applications and user and kernel space applications, designed to facilitate the execution of the various methods and processing functions presented herein by computing machine 100. The computing machine 100 may include various internal or attached components, such as a processor 110, a system bus 120, a system memory 130, a storage medium 140, an input/output interface 150, a network interface 160 for communicating with a network 170 (e.g., cellular/GPS, bluetooth, WIFI, or Devicenet, EtherCAT, Analog, RS485, etc.), and one or more sensors 180.

The computing machine may be implemented as a conventional computer system, an embedded controller, a laptop computer, a server, a mobile device, a smartphone, a wearable computer, a custom machine, any other hardware platform, or any combination or group thereof. The computing machine may be a distributed system configured to function with multiple computing machines interconnected via a data network or bus system.

The processor 110 may be designed to execute code instructions to perform the operations and functions described herein, to manage request flow and address mapping, and to perform computations and generate commands. The processor 110 may be configured to monitor and control the operation of components in the computing machine. The processor 110 may be a general purpose processor, a processor core, a multiprocessor, a reconfigurable processor, a microcontroller, a digital signal processor ("DSP"), an application specific integrated circuit ("ASIC"), a controller, a state machine, gating logic, discrete hardware components, any other processing unit, or any combination or group thereof. Processor 110 may be a single processing unit, multiple processing units, a single processing core, multiple processing cores, a dedicated processing core, a coprocessor, or any combination thereof. According to some embodiments, the processor 110, as well as other components of the computing machine 100, may be a software-based or hardware-based virtual computing machine executing in one or more other computing machines.

System memory 130 may include non-volatile memory, such as read only memory ("ROM"), programmable read only memory ("PROM"), erasable programmable read only memory ("EPROM"), flash memory, or any other device capable of storing program instructions or data with or without the application of power. The system memory 130 may also include volatile memory such as random access memory ("RAM"), static random access memory ("SRAM"), dynamic random access memory ("DRAM"), and synchronous dynamic random access memory ("SDRAM"). Other types of RAM may also be used to implement system memory 130. System memory 130 may be implemented using a single memory module or multiple memory modules. Although the system memory 130 is depicted as part of the computing machine, those skilled in the art will recognize that the system memory 130 may be separate from the computing machine 100 without departing from the scope of the present technology. It should also be appreciated that system memory 130 may include or operate in conjunction with non-volatile storage, such as storage media 140.

Storage medium 140 may include a hard disk, a floppy disk, a compact disk read only memory ("CD-ROM"), a digital versatile disk ("DVD"), a blu-ray disk, a magnetic tape, a flash memory, other non-volatile memory devices, a solid state drive ("SSD"), any magnetic storage device, any optical storage device, any electrical storage device, any semiconductor storage device, any physical-based storage device, any other data storage device, or any combination or group thereof. Storage media 140 may store one or more operating systems, application programs and program modules, data, or any other information. The storage medium 140 may be part of or connected to a computing machine. The storage medium 140 may also be part of one or more other computing machines in communication with the computing machine (e.g., a server, a database server, a cloud storage, a network-attached storage, etc.).

Application module 200 and other OS application modules may include one or more hardware or software elements configured to facilitate the computing machine in performing the various methods and processing functions presented herein. Application module 200 and other OS application modules may include one or more algorithms or sequences of instructions stored as software or firmware associated with system memory 130, storage media 140, or both. Thus, the storage medium 140 may represent an example of a machine or computer-readable medium on which instructions or code for execution by the processor 110 may be stored. A machine or computer readable medium may generally refer to any medium or media used to provide instructions to processor 110. Such machine or computer readable media associated with application module 200 and other OS application modules may comprise a computer software product. It should be appreciated that the computer software product including the application module 200 and the other OS application modules may also be associated with one or more processes or methods for delivering the application module 200 and the other OS application modules to a computing machine via a network, any signal bearing medium, or any other communication or delivery technique. Application module 200 and other OS application modules may also include hardware circuitry or information for configuring hardware circuitry, such as microcode or configuration information for an FPGA or other PLD. In one exemplary embodiment, the application module 200 and other OS application modules may include algorithms capable of performing the functional operations described in the computer system flow diagrams (modes of operation) presented herein.

Input/output ("I/O") interface 150 may be configured to couple to one or more external devices to receive data from and transmit data to the one or more external devices. Such external devices, along with various internal devices, may also be referred to as peripheral devices. The I/O interface 150 may include both electrical and physical connections for coupling various peripheral devices to the computing machine or processor 110. The I/O interface 150 may be configured to transfer data, address and control signals between peripheral devices, computing machines or processors 110. The I/O interface 150 may be configured to implement any standard interface, such as small computer system interface ("SCSI"), serial attached SCSI ("SAS"), fibre channel, peripheral component interconnect ("PCI"), PCI Express (PCIe), serial bus, parallel bus, advanced technology attachment ("ATA"), serial ATA ("SATA"), universal serial bus ("USB"), Thunderbolt, FireWire, various video buses, and the like. The I/O interface 150 may be configured to implement only one interface or bus technology. Alternatively, I/O interface 150 may be configured to implement a variety of interface or bus technologies. The I/O interface 150 may be configured to operate as part of the system bus 120, all or in conjunction with the system bus 120. I/O interface 150 may include one or more buffers for buffering transmissions between one or more external devices, internal devices, computing machines, or processors 120.

The I/O interface 120 may couple the computing machine to various input devices, including a mouse, touch screen, scanner, electronic digitizer, sensor, receiver, touchpad, trackball, camera, microphone, keyboard, any other pointing device, or any combination thereof. The I/O interface 120 may couple the computing machine to various output devices, including video displays, speakers, printers, projectors, haptic feedback devices, automation controls, robotic components, actuators, motors, fans, solenoid valves, pumps, transmitters, signal transmitters, lights, and so forth.

The computing machine 100 may operate in a networked environment using logical connections through the NIC 160 to one or more other systems or computing machines on the network. The network may include a Wide Area Network (WAN), a Local Area Network (LAN), an intranet, the internet, a wireless access network, a wired network, a mobile network, a telephone network, an optical network, or a combination thereof. The network may be a packet switched network, a circuit switched network of any topology and may use any communication protocol. The communication links within the network may involve various digital or analog communication media such as fiber optic cables, free-space optics, waveguides, electrical conductors, wireless links, antennas, radio frequency communications, and so forth.

The one or more sensors 180 may be a position sensor and a pressure sensor. The pressure sensor may be an absolute pressure (P) sensor or a Differential Pressure (DP) sensor. The position sensor may be a capacitive sensor, an optical sensor, a strain gauge sensor, or a magnetic sensor. The sensor 180 may be a conventional sensor or a semiconductor-based sensor.

The processor 110 may be connected to other elements of the computing machine or various peripheral devices discussed herein by a system bus 120. It should be appreciated that the system bus 120 may be internal to the processor 110, external to the processor 110, or both. According to some embodiments, the processor 110, other elements of the computing machine, or any of the various peripheral devices discussed herein may be integrated into a single device, such as a system on a chip ("SOC"), a system on package ("SOP"), or an ASIC device.

Embodiments may include a computer program embodying the functionality described and illustrated herein, wherein the computer program is embodied in a computer system comprising instructions stored in a machine-readable medium and a processor executing the instructions. It should be apparent, however, that there are many different ways in which embodiments may be implemented in computer programming, and the embodiments should not be construed as limited to any one set of computer program instructions, unless otherwise disclosed with respect to this exemplary embodiment. Moreover, a skilled programmer would be able to write such a computer program to implement certain of the disclosed embodiments based on the flow charts, algorithms, and associated descriptions appended in the application text. Therefore, the particular set of program code instructions disclosed is not to be taken as an exhaustive understanding of how the embodiments may be made and used. Furthermore, those skilled in the art will appreciate that one or more aspects of the embodiments described herein may be performed by hardware, software, or a combination thereof, as may be embodied in one or more computing systems. Moreover, any reference to an action being performed by a computer should not be construed as being performed by a single computer, as more than one computer may perform the action.

The exemplary embodiments described herein may be used with computer hardware and software that performs the previously described methods and processing functions. The systems, methods, and processes described herein may be embodied in a programmable computer, computer-executable software, or digital circuitry. The software may be stored on a computer readable medium. For example, the computer readable medium may include a floppy disk, a RAM, a ROM, a hard disk, a removable media, a flash memory, a memory stick, an optical media, a magneto-optical media, a CD-ROM, and the like. The digital circuitry may include integrated circuits, gate arrays, building block logic, Field Programmable Gate Arrays (FPGAs), etc.

The exemplary systems, methods, and acts described in the foregoing embodiments are illustrative, and in alternative embodiments, certain acts may be performed in a different order, performed in parallel with each other, omitted entirely, and/or combined between different exemplary embodiments, and/or certain additional acts may be performed, without departing from the scope and spirit of the various embodiments. Accordingly, such alternative embodiments are included in the description herein.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. As used herein, phrases such as "between X and Y" and "between about X and Y" should be interpreted to include X and Y. As used herein, phrases such as "between about X and Y" and the like refer to "between about X and Y about". As used herein, phrases such as "from about X to Y" and the like refer to "from about X to about Y".

As used herein, "hardware" may include a combination of discrete components, integrated circuits, application specific integrated circuits, field programmable gate arrays, or other suitable hardware. As used herein, "software" may include one or more objects, agents, threads, lines of code, subroutines, separate software applications, two or more lines of code or other suitable software structures operating in two or more software applications on one or more processors (where a processor includes one or more microcomputers or other suitable data processing units, memory devices, input output devices, displays, data input devices such as keyboards or mice, peripheral devices such as printers and speakers, associated drivers, control cards, power supplies, network devices, docking devices, or other suitable devices operating in conjunction with a processor or other device under control of a software system), or other suitable software structures. In an exemplary embodiment, the software may include one or more lines of code or other suitable software structures operating in a general-purpose software application, such as an operating system, and one or more lines of code or other suitable software structures operating in a specific-purpose software application. As used herein, the term "coupled" and its cognate terms (such as "coupled" and "coupled") may include physical connections (such as copper conductors), virtual connections (such as through randomly assigned memory locations of a data storage device), logical connections (such as through logic gates of a semiconductor device), other suitable connections, or suitable combinations of such connections. The term "data" may refer to suitable structures for using, transmitting, or storing data, such as data fields, data buffers, data messages having a data value and sender/receiver address data, control messages having a data value and one or more operation commands that cause a receiving system or component to perform a function using the data, or other suitable hardware or software components for electronic processing of the data.

Generally, a software system is a system operating on a processor to perform a predetermined function in response to a predetermined data field. For example, a system may be defined by the functions it performs and the data fields in which it performs the functions. As used herein, a NAME system (where NAME is typically the NAME of a general function performed by a system) refers to a software system configured to operate on a processor and perform the disclosed function on the disclosed data fields. Unless a specific algorithm is disclosed, any suitable algorithm for performing a function using associated data fields that would be known to one of ordinary skill in the art is within the scope of the present disclosure. For example, a messaging system that generates a message including a sender address field, a receiver address field, and a message field would encompass software operating on a processor that can retrieve the sender address field, the receiver address field, and the message field from a suitable system or device of the processor, such as a caching device or caching system, can combine the sender address field, the receiver address field, and the message field into a suitable electronic message format (such as an electronic mail message, a TCP/IP message, or any other suitable message format having a sender address field, a receiver address field, and a message field), and can send the electronic message over a communication medium, such as a network, using the electronic messaging system and device of the processor. Those of ordinary skill in the art will be able to provide specific coding for specific applications based on the foregoing disclosure, which is intended to set forth exemplary embodiments of the present disclosure, rather than provide a teaching to those skilled in the art, such as those not familiar with programming a processor in a suitable programming language. The particular algorithms for performing the functions may be provided in flow chart form or other suitable format wherein the data fields and associated functions may be set forth in an exemplary sequence of operations, which sequence may be rearranged as appropriate and are not intended to be limiting unless explicitly stated as limiting.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. As used herein, phrases such as "between X and Y" and "between about X and Y" should be interpreted to include X and Y. As used herein, phrases such as "between about X and Y" and the like refer to "between about X and about Y. As used herein, phrases such as "from about X to Y" and the like refer to "from about X to about Y".

The embodiments of the foregoing disclosure have been presented for purposes of illustration and to enable one of ordinary skill in the art to practice the disclosure, but are not intended to be exhaustive or limited to the disclosure in the form disclosed. Numerous insubstantial modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the claims is intended to broadly cover the disclosed embodiments and any such modifications. Furthermore, the following clauses represent additional embodiments of the present disclosure and are to be considered within the scope of the present disclosure:

clause 1, a valve assembly for controlling fluid flow, the valve assembly comprising: a valve body having an upstream reservoir, a downstream reservoir, and a valve seat for conveying fluid from an upstream location to a downstream location; an independent valve having a movable member; a sensor chip package having at least one sensor coupled to the independent valve; and a controller interface for transmitting at least one measured parameter value provided by the at least one sensor and for receiving a control signal for adjusting a valve stroke of the independent valve, the control signal being determined based on the at least one measured parameter value;

clause 2, the valve assembly of clause 1, wherein the control signal for the independent valve is determined based on the at least one measured parameter value and at least one other parameter value;

clause 3, the valve assembly of clause 1, further comprising: a control unit having an interface for communicating with a controller interface of the independent valve; and the control unit has a further interface for receiving at least one further parameter value; the at least one other parameter value is indicative of a pressure of at least one selected from the group consisting of at least one upstream pressure sensor positioned at a location upstream of the independent valve and at least one downstream pressure sensor positioned at a location downstream of the independent valve; wherein the control unit generates a control signal for adjusting the valve stroke based on the at least one parameter value and the at least one further parameter value;

clause 4, the valve assembly of clause 1, wherein the sensor chip package includes a position sensor;

clause 5, the valve assembly of clause 4, wherein the sensor chip package generates at least one parameter value indicative of at least one selected from the group consisting of a position of the movable member and an obstruction of the immovable member;

clause 6, the valve assembly of clause 4, wherein the sensor chip package further comprises: at least one selected from the group consisting of: an upstream pressure sensor positioned in an upstream reservoir or upstream channel of the valve body; a downstream pressure sensor positioned in a downstream reservoir or downstream passage of the valve body; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and a temperature sensor positioned in at least one selected from the group consisting of the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and a valve seat;

clause 7, the valve assembly of clause 6, wherein the sensor chip package generates at least one parameter value indicative of: a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member; and a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor;

clause 8, the valve assembly of clause 6, wherein the sensor chip package generates at least one parameter value indicative of: a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member; a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; and a temperature of at least one selected from the group consisting of the upstream reservoir, the valve seat, and the downstream reservoir;

clause 9, a fluid treatment system for use in a manufacturing facility, the fluid treatment system comprising: a valve body having an upstream reservoir, a downstream reservoir, and a valve seat for conveying fluid from an upstream location to a downstream location; an independent valve having a movable member; a sensor chip package having at least one sensor coupled to the valve; an upstream fluid source fluidly coupled to the independent valve; a downstream processing tool fluidly coupled to the independent valve; and a control unit having an interface communicatively couplable to the independent valve and the sensor chip package; wherein the control unit generates a control signal for controlling the stroke of the independent valve based on at least one parameter value from the sensor chip package;

clause 10, the fluid treatment system of claim 9, wherein the interface is communicatively couplable to at least one selected from the group consisting of at least one upstream pressure sensor positioned at an upstream location and at least one downstream pressure sensor positioned at a downstream location; and an interface to generate a control signal for controlling a stroke of the independent valve based on the at least one parameter value from the sensor chip package and at least one other parameter value from a group comprising at least one upstream pressure sensor positioned at an upstream location of the valve body and at least one downstream pressure sensor positioned at a downstream location of the valve body;

clause 11, the fluid treatment system of clause 9, wherein the sensor chip package comprises a position sensor;

clause 12, the fluid treatment system of clause 11, wherein the sensor chip package generates at least one parameter value indicative of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member;

clause 13, the fluid treatment system of clause 12, wherein the sensor chip package further comprises: at least one selected from the group consisting of: an upstream pressure sensor positioned in an upstream reservoir of the valve body; a downstream pressure sensor positioned in a downstream reservoir of the valve body; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and a temperature sensor positioned in at least one selected from the group consisting of the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and a valve seat;

clause 14, the fluid treatment system of clause 13, wherein the sensor chip package generates at least one parameter value indicative of: a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member; and a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor;

clause 15, the fluid treatment system of clause 13, wherein the sensor chip package generates at least one parameter value indicative of: a position of at least one selected from the group consisting of a position of the movable member and an obstruction of a non-movable member; a pressure selected from at least one of the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; and a temperature of at least one selected from the group consisting of the upstream reservoir, the valve seat, and the downstream reservoir;

clause 16, the fluid treatment system of clause 9, wherein the upstream fluid source comprises the at least one upstream pressure sensor;

clause 17, the fluid treatment system of clause 9, wherein the downstream treatment tool comprises a downstream pressure sensor;

clause 18, a method of controlling fluid flow in a fluid treatment system using a valve assembly, the method comprising: generating, at the valve assembly, a first parameter value indicative of a position of a movable member of an independent valve; generating a second parameter value indicative of absolute pressure upstream of the valve assembly; generating a third parameter value indicative of pressure downstream of the valve assembly and at a process tool; and adjusting a position of the valve based on the first, second, third, and at least one other parameter value selected from the group consisting of a set point value, a current fluid flow, a fluid type, at least one other pressure, a temperature, and a differential pressure;

clause 19, the method of clause 18, further comprising: generating another parameter value indicative of pressure from an upstream location between a fluid source and the valve assembly; and generating another parameter value indicative of pressure from an upstream location between the process tool and the valve assembly; and

clause 20, the method of clause 18, further comprising: generating another parameter value indicative of pressure at an upstream inlet passage of the valve assembly; and generating another parameter value indicative of pressure at a downstream outlet passage of the valve assembly.