阅读说明：本技术 一种适于冷热交变的热电模块及其制作方法 (Thermoelectric module suitable for cold-hot alternation and manufacturing method thereof ) 是由 杨梅 于 2020-12-04 设计创作，主要内容包括：本发明提出一种适于冷热交变的热电模块,包括P型半导体、N型半导体和放热面基板,包括和吸热面基板,所述吸热面基板包括瓷片、粘结剂和吸热面导流片,所述瓷片与吸热面导流片通过粘结剂连接在一起,所述P型半导体和N型半导体串联后设置在放热面基板和吸热面基板之间,形成回路。本发明提供一种适于长期冷热交变应用的的热电模块,即在吸热面陶瓷和导流片之间增加一种特殊的粘结剂,当热电模块受到温度冲击发生形变时,粘结剂可吸收一定的热应力、缓冲变形,从而实现冷热交变作用。(The invention provides a thermoelectric module suitable for cold and hot alternation, which comprises a P-type semiconductor, an N-type semiconductor and a heat release surface substrate, and comprises a heat absorption surface substrate, wherein the heat absorption surface substrate comprises a ceramic chip, an adhesive and a heat absorption surface flow deflector, the ceramic chip and the heat absorption surface flow deflector are connected together through the adhesive, and the P-type semiconductor and the N-type semiconductor are connected in series and then arranged between the heat release surface substrate and the heat absorption surface substrate to form a loop. The invention provides a thermoelectric module suitable for long-term cold-hot alternation application, namely a special binder is added between heat absorption surface ceramics and a flow deflector, and when the thermoelectric module is deformed by temperature impact, the binder can absorb certain thermal stress and buffer deformation, thereby realizing cold-hot alternation.)

1. The thermoelectric module suitable for cold and hot alternation comprises a P-type semiconductor (1), an N-type semiconductor (2) and a heat release surface substrate (4), and is characterized by comprising a heat absorption surface substrate (5), wherein the heat absorption surface substrate (5) comprises ceramic tiles (6), an adhesive (8) and a heat absorption surface flow deflector (7), the ceramic tiles (6) and the heat absorption surface flow deflector (7) are connected together through the adhesive (8), and the P-type semiconductor (1) and the N-type semiconductor (2) are connected in series and then arranged between the heat release surface substrate (4) and the heat absorption surface substrate (5) to form a loop.

2. A thermoelectric module suitable for cold-hot alternation according to claim 1, wherein the adhesive (8) has a thermal conductivity of not less than 2W/(m-K).

3. A thermoelectric module suitable for cold-hot alternation according to claim 1, characterized in that the thickness of the adhesive (8) ranges from 0.02mm to 0.2 mm.

4. A thermoelectric module suitable for cold-hot alternation, as claimed in claim 1, wherein said tiles (6) have a plurality of receiving grooves (11) on the contact surface with the adhesive (8).

5. A thermoelectric module suitable for cold-hot alternation as claimed in claim 4, wherein the said expansion slots (11) are isosceles trapezoidal slots with their narrow mouths facing upwards.

6. A thermoelectric module suitable for cold-hot alternation according to claim 4 or 5, characterized in that the said expansion slots (11) are provided with transverse slots and longitudinal slots which are vertically staggered.

7. A method for manufacturing a thermoelectric module suitable for cold-hot alternation, which is applied to the thermoelectric module suitable for cold-hot alternation of claim 1, and is characterized by comprising the following steps:

s1, manufacturing a heat release surface substrate (4), wherein the base material is ceramic, and the heat release surface substrate is formed by sintering a copper sheet and the ceramic at high temperature in a high-temperature furnace;

s2, manufacturing a heat absorption surface substrate (5), putting the heat absorption surface substrate ceramic sheet (6) into a fixed mould, and coating a layer of adhesive (8) on the surface of the heat absorption surface substrate ceramic sheet; then a fixing jig of the heat absorption surface flow deflector (7) is placed, the heat absorption surface flow deflector (7) is poured into the jig and horizontally shaken until the heat absorption surface flow deflector (7) completely enters the jig hole, and finally a mould cover is covered and firmly pressed by a pressure rod until the heat absorption surface substrate (5) is solidified;

s3, assembling thermoelectric modules:

respectively coating a layer of soldering tin on the inner side flow deflector of the heat release surface substrate (4) and the heat absorption surface flow deflector (7) of the heat absorption surface substrate (5); respectively placing the P-type semiconductor (1) and the N-type semiconductor (2) at corresponding positions of a heat absorption surface flow deflector (7) of a heat absorption surface substrate (5), and covering a heat release surface substrate (4);

the heat release surface substrate (4) and the heat absorption surface substrate (5) are firmly clamped by using a special jig, the heat release surface substrate and the heat absorption surface substrate are sent to heating equipment for heating, the component welding process is completed, and finally the welded thermoelectric module is placed on a cooling platform.

8. The method as claimed in claim 7, wherein the step S2 further includes a drying process: and (3) after the heat absorption surface substrate (5) is firmly pressed, putting the heat absorption surface substrate into an oven with a set temperature for drying, and curing according to a set time.

Technical Field

The invention relates to the technical field of thermoelectric modules, in particular to a thermoelectric module suitable for cold-hot alternation and a manufacturing method thereof.

Background

Referring to fig. 1, a conventional thermoelectric module structure generally comprises an upper substrate 3, a lower substrate 12, a conventional P-type semiconductor 9, and a conventional N-type semiconductor 10, wherein the upper and lower substrates are mainly formed by sintering copper current deflectors on ceramic sheets at a high temperature. Because the difference between the thermal expansion coefficients of the ceramic and the copper guide vane is large, when the copper guide vane is impacted by temperature and the thermal expansion coefficient of the copper guide vane is several times that of the ceramic in practical use, the product can be bent and deformed towards one side of the ceramic. Such repetition is likely to cause failure of the thermoelectric module. Particularly in the medical industry, cold and hot alternation is widely applied, and the thermoelectric module with the conventional structure can not meet the requirements of cold and hot alternation.

Disclosure of Invention

The invention aims to solve the limitation that the existing thermoelectric module cannot realize long-term cold-hot alternation, and provides a thermoelectric module suitable for long-term cold-hot alternation application.

In order to realize the purpose, the following technical scheme is provided:

a thermoelectric module suitable for cold and hot alternation comprises a P-type semiconductor, an N-type semiconductor and a heat release surface substrate, and comprises a heat absorption surface substrate, wherein the heat absorption surface substrate comprises a ceramic chip, an adhesive and a heat absorption surface flow deflector, the ceramic chip and the heat absorption surface flow deflector are connected together through the adhesive, and the P-type semiconductor and the N-type semiconductor are connected in series and then arranged between the heat release surface substrate and the heat absorption surface substrate to form a loop.

The substrate with adhesive is typically disposed on the side of the heat sink surface of the thermoelectric module. Because the object to be controlled needs to be cooled or heated, the thermoelectric module needs to be switched between cold and hot. When the thermoelectric module works, one side of the heat absorbing surface is tightly attached to an object to be controlled in temperature, the temperature of the heat emitting surface can be controlled due to the fact that the heat radiator is arranged on one side of the heat emitting surface, and when the thermoelectric module is switched to be heated, the temperature of the heat absorbing surface can be gradually increased due to the fact that the heat radiator is not arranged on one side of the heat absorbing surface, so that the temperature impact borne by one side of the heat absorbing surface is large, thermal deformation stress can be effectively buffered due to the fact that the adhesive is arranged on the heat absorbing surface.

Preferably, the binder has a thermal conductivity of not less than 2W/(m.K).

Preferably, the thickness of the adhesive ranges from 0.02mm to 0.2 mm.

Preferably, a plurality of expansion grooves are arranged on the contact surface of the ceramic tile and the adhesive. The function of setting up the dilatation groove is the area of contact of increase binder and the volume of binder, more effectively cushions thermal deformation stress to realize thermoelectric module's cold and hot alternating function.

Preferably, the expansion groove is an isosceles trapezoid groove, and the narrow opening of the isosceles trapezoid groove faces upwards. The isosceles trapezoid grooves are arranged to enlarge the contact area between the ceramic chip and the adhesive as much as possible, so that the heat conduction effect is better.

Preferably, the expansion slot is provided with a transverse slot and a longitudinal slot which are vertically staggered. The transverse grooves and the longitudinal grooves are interwoven into the net grooves, so that more binders can be stored, and thermal deformation stress can be buffered more effectively.

The manufacturing method of the thermoelectric module suitable for cold and hot alternation is suitable for the thermoelectric module suitable for cold and hot alternation and comprises the following steps:

s1, manufacturing a heat release surface substrate, wherein the base material is ceramic, and the copper sheet and the ceramic are sintered at high temperature in a high-temperature furnace to form the heat release surface substrate;

s2, manufacturing a heat absorption surface substrate, putting the heat absorption surface substrate ceramic chip into a fixed mould, and coating a layer of adhesive on the surface of the heat absorption surface substrate ceramic chip; placing a fixing jig for the heat absorption surface flow deflector, pouring the heat absorption surface flow deflector into the jig, horizontally shaking until the heat absorption surface flow deflector completely enters the jig hole, and finally covering the mold cover and firmly pressing the mold cover by using a pressing rod until the heat absorption surface substrate is solidified;

s3, assembling thermoelectric modules:

respectively coating a layer of soldering tin on the inner side flow deflector of the heat release surface substrate and the heat absorption surface flow deflector of the heat absorption surface substrate;

respectively placing the P-type semiconductor and the N-type semiconductor at corresponding positions of a heat absorption surface flow deflector of the heat absorption surface substrate, and covering the heat release surface substrate;

the special jig is utilized to firmly clamp the heat release surface substrate and the heat absorption surface substrate, the heat release surface substrate and the heat absorption surface substrate are sent to the heating equipment for heating, the component welding process is completed, and finally the welded thermoelectric module is placed on the cooling platform.

Preferably, the step S2 further includes a drying process: and (3) after the heat absorption surface substrate is firmly pressed, putting the heat absorption surface substrate into a drying oven with a set temperature for drying, and curing according to a set time.

The invention has the beneficial effects that: the special adhesive is added between the heat absorbing surface ceramic and the flow deflector, and when the thermoelectric module is deformed by high-low temperature impact, the adhesive can absorb certain thermal stress and buffer deformation, so that the alternating action of cold and heat is realized.

Drawings

FIG. 1 is a schematic diagram of a conventional configuration of a thermoelectric module;

FIG. 2 is a schematic diagram of an embodiment of the present invention;

fig. 3 is a schematic arrangement view of heat absorption flow deflectors of the heat absorption surface substrate of the present invention;

FIG. 4 is a cross-sectional view of the expansion tank of the present invention;

FIG. 5 is a schematic side view of a heat absorbing surface according to the present invention;

wherein: 1. the heat-absorbing plate comprises a P-type semiconductor 2, an N-type semiconductor 3, an upper substrate 4, a heat-radiating surface substrate 5, a heat-absorbing surface substrate 6, a ceramic sheet 7, a heat-absorbing surface deflector 8, an adhesive 9, an existing P-type semiconductor 10, an existing N-type semiconductor 11 and an expansion tank.

Detailed Description

Example (b):

a thermoelectric module suitable for cold and hot alternation refers to fig. 2 and 3, and comprises a P-type semiconductor 1, an N-type semiconductor 2 and a heat release surface substrate 4, wherein the heat release surface substrate 5 comprises a heat absorption surface substrate 5, and referring to fig. 5, the heat absorption surface substrate 5 comprises ceramic tiles 6, an adhesive 8 and a heat absorption surface flow deflector 7, the ceramic tiles 6 and the heat absorption surface flow deflector 7 are connected together through the adhesive 8, and the P-type semiconductor 1 and the N-type semiconductor 2 are connected in series and then arranged between the heat release surface substrate 4 and the heat absorption surface substrate 5 to form a loop. The binder 8 has a certain thermal conductivity, and its thermal conductivity is not less than 2W/(mK). The thickness of the adhesive 8 ranges from 0.02mm to 0.2 mm. The tiles 6 are provided with a plurality of receiving recesses 11 in the contact surface with the adhesive 8. Referring to fig. 4, the function of the expansion groove is to increase the contact area of the adhesive and the volume of the adhesive, and to buffer the thermal deformation stress more effectively, thereby implementing the alternating function of cold and heat of the thermoelectric module. The expansion groove 11 is an isosceles trapezoid groove with a narrow opening facing upwards. The isosceles trapezoid-shaped groove is arranged to enlarge the contact area between the ceramic tiles 6 and the adhesive 8 as much as possible, so that the heat conduction effect is better. The capacity expansion groove 11 is provided with a transverse groove and a longitudinal groove which are vertically staggered. The transverse grooves and the longitudinal grooves are interwoven into the net grooves, so that more binders can be stored, and thermal deformation stress can be buffered more effectively.

The substrate with adhesive is typically disposed on the side of the heat sink surface of the thermoelectric module. Because the object to be controlled needs to be cooled or heated, the thermoelectric module needs to be switched between cold and hot. When the thermoelectric module works, one side of the heat absorbing surface is tightly attached to an object to be controlled in temperature, the temperature of the heat emitting surface can be controlled due to the fact that the heat radiator is arranged on one side of the heat emitting surface, and when the thermoelectric module is switched to be heated, the temperature of the heat absorbing surface can be gradually increased due to the fact that the heat radiator is not arranged on one side of the heat absorbing surface, so that the temperature impact borne by one side of the heat absorbing surface is large, thermal deformation stress can be effectively buffered due to the fact that the adhesive is arranged on the heat absorbing surface.

The manufacturing method of the thermoelectric module suitable for cold and hot alternation is suitable for the thermoelectric module suitable for cold and hot alternation and comprises the following steps:

s1, manufacturing a heat release surface substrate 4, wherein the base material is ceramic, and the copper sheet and the ceramic are sintered at high temperature in a high-temperature furnace to form the heat release surface substrate;

s2, manufacturing a heat absorption surface substrate 5, putting the heat absorption surface substrate ceramic sheet 6 into a fixed mould, and coating a layer of adhesive 8 on the surface of the heat absorption surface substrate ceramic sheet; placing a fixing jig of the heat absorption surface flow guide sheet 7, pouring the heat absorption surface flow guide sheet 7 into the jig, horizontally shaking until the heat absorption surface flow guide sheet 7 completely enters a jig hole, finally covering a mould cover and firmly pressing by using a pressing rod, placing the heat absorption surface substrate 5 into a drying oven with a set temperature after being firmly pressed, drying the heat absorption surface substrate 5, and solidifying the heat absorption surface substrate 5 according to a set time until the heat absorption surface substrate 5 is solidified and then taking out the heat absorption surface substrate;

s3, assembling thermoelectric modules:

respectively coating a layer of soldering tin on the inner side flow deflector of the heat release surface substrate 4 and the heat absorption surface flow deflector 7 of the heat absorption surface substrate 5;

respectively placing the P-type semiconductor 1 and the N-type semiconductor 2 at corresponding positions of a heat absorption surface flow deflector 7 of a heat absorption surface substrate 5, and covering a heat release surface substrate 4;

the heat release surface substrate 4 and the heat absorption surface substrate 5 are firmly clamped by using a special jig, and are sent to heating equipment for heating, so that the component welding process is completed, and finally, the welded thermoelectric module is placed on a cooling platform.

The invention has the following advantages: the special adhesive is added between the heat absorbing surface ceramic and the flow deflector, and when the thermoelectric module is deformed by high-low temperature impact, the adhesive can absorb certain thermal stress and buffer deformation, so that the alternating action of cold and heat is realized.