阅读说明：本技术 用于结构的测量仪器的数据采集装置 (Data acquisition device for a structural measuring instrument ) 是由 吉斯兰·格雷罗 奥利维尔·平托 于 2019-04-19 设计创作，主要内容包括：本发明涉及一种数据采集装置(10),该数据采集装置包括限定腔体(20)的壳体(11)和适于堆叠在腔体(20)中的多个电子模块(12),每个电子模块(12)具有第一面和与第一面相对的第二面,并包括在第一面上延伸的第一组导电迹线和在第二面上行进的第二组导电迹线,第一组导电束包括至少一个用于传输数据信号的导电迹线,以及第二组导电迹线包括至少一个用于传输数据信号的导电迹线,使得无论电子模块(12)在腔体(20)中的堆叠顺序如何,都能够将数据信号从一个模块传播到整个堆叠中的另一个模块。(The invention relates to a data acquisition device (10) comprising a housing (11) defining a cavity (20) and a plurality of electronic modules (12) adapted to be stacked in the cavity (20), each electronic module (12) having a first face and a second face opposite to the first face and comprising a first set of conductive traces extending on the first face and a second set of conductive traces running on the second face, the first set of conductive bundles comprising at least one conductive trace for transmitting a data signal and the second set of conductive traces comprising at least one conductive trace for transmitting a data signal, such that a data signal can be propagated from one module to another module in the entire stack regardless of the stacking order of the electronic modules (12) in the cavity (20).)

1. A data acquisition device (10) comprising:

-a housing (11) comprising a side wall (17) delimiting a cavity (20);

-a plurality of electronic modules (12), the plurality of electronic modules (12) being stacked in a stacking direction in the cavity (20),

each electronic module (12) having a first face (29) and a second face (31) opposite to said first face and comprising a first set of conductive tracks (32) extending on said first face (29) and a second set of conductive tracks (33) extending on said second face (31), said first set of conductive tracks (32) comprising at least one conductive track (4-8) dedicated to the transmission of data signals, said second set of conductive tracks (33) comprising at least one conductive track (4-8) dedicated to the transmission of said data signals and electrically connected to said conductive tracks (4-8) dedicated to the transmission of said data signals of said first set of conductive tracks (32) via an electrical connection channel extending internally of said electronic module;

-one or more connector blocks (13), each connector block (13) being located between two adjacent electronic modules (12A, 12B) of the stack to establish an electrical connection between each trace (37) of the first set of conductive traces (32) of one of the electronic modules (12B) and a corresponding trace (38) of the second set of traces (33) of the other of the electronic modules (12A); and

-a pressing member (26) capable of exerting a compression force (F) on the electronic module (12) parallel to the stacking direction, which tends to deform each connector block (13) by increasing the dimension of the connector block (13) in a radial direction perpendicular to the stacking direction, so as to keep each connector block (13) supported against the side wall (17) of the housing (11).

2. The apparatus of claim 1, wherein the electrically conductive traces (4, 8) are arranged such that when the electronic modules (12) are stacked in the cavity (20), regardless of the stacking order of the electronic modules (12) in the cavity (20), in the stack the electrically conductive trace (4-8) dedicated to transmitting the data signal on the second side (31) of one of the modules (12A) faces the electrically conductive trace (4-8) dedicated to transmitting the data signal on the first side (29) of another adjacent module (12B) to propagate the data signal from one module to another module throughout the stack.

3. The device according to one of claims 1 and 2, wherein at least one of said electronic modules (12) is capable of generating said data signal.

4. The data acquisition device according to one of claims 1 to 3, wherein the first set of conductive tracks (32) comprises at least one conductive track (1,3) dedicated to transmitting synchronization signals and the second set of conductive tracks (33) comprises at least one conductive track (1,3) dedicated to transmitting synchronization signals and electrically connected to the conductive tracks (1,3) dedicated to transmitting synchronization signals of the first set of conductive tracks (32) via an electrical connection channel extending inside the electronic module, the tracks (1,3) being arranged so that, when the electronic module (12) is stacked in the cavity (20), the conductive tracks (1,3) dedicated to transmitting synchronization signals on the second face (31) of one of the modules (12A) face the conductive tracks (1,3) dedicated to transmitting synchronization signals on the first face (29) of the other module (12B) Of said conductive tracks (1, 3).

5. Acquisition apparatus according to one of claims 1 to 4, wherein the first set of electrically conductive tracks (32) comprises at least one electrically conductive track (2, 9) dedicated to the transmission of an electrical power signal and the second set of electrically conductive tracks (33) comprises at least one electrically conductive track (2, 9) dedicated to the transmission of the electrical power signal and electrically connected to the electrically conductive track (2, 9) dedicated to the transmission of the electrical power signal of the first set of electrically conductive tracks (32) via an electrical connection channel extending inside the electronic module, the tracks (2, 9) being arranged so that, when the electronic module (12) is stacked in the cavity (20), the electrically conductive track (2, 9) dedicated to the transmission of the electrical power signal on the second face (31) of one of the modules (12A) faces the electrically conductive track (2, 9) dedicated to the transmission of the electrical power signal on the first face (29) of the other of the modules (12B) The conductive tracks (2, 9).

6. Acquisition apparatus according to one of claims 1 to 5, wherein the first set of electrically conductive tracks (32) comprises at least one electrically conductive track (4-8) dedicated to the transmission of the data signals, one electrically conductive track (1,3) dedicated to the transmission of the synchronization signals and one electrically conductive track (2, 9) dedicated to the transmission of the power signals, and the second set of electrically conductive tracks (33) comprises at least one electrically conductive track (4-8) dedicated to the transmission of the data signals, one electrically conductive track (1,3) dedicated to the transmission of the synchronization signals and one electrically conductive track (2, 9) dedicated to the transmission of the power signals, the electrically conductive tracks of the second set of electrically conductive tracks (33) being electrically connected to the electrically conductive tracks (32) of the first set, respectively, via electrical connection channels extending inside the electronic module from the first face (29) to the second face (31), respectively The conductive traces (4-8) that transmit the data signals, the conductive traces (1,3) dedicated to transmitting the synchronization signals, and the conductive traces (2, 9) dedicated to transmitting the power signals.

7. The data acquisition device according to one of claims 1 to 6, wherein the housing (11) has an opening, the acquisition device (10) further comprising:

-a cover (14), said cover (14) comprising a body (21) able to obstruct said opening of said housing (11); and

-a connector (25), said connector (25) extending through said main body (21) of said cover (14), said connector (25) being connectable to a communication cable for transmitting said data signals between one or more of said electronic modules (12) located inside said cavity (20) and a remote device located outside said housing (11).

8. Acquisition device according to claim 7, comprising a first end plate (23) located between the cover (14) and the stack, and wherein the first end plate (23) has a third face (39) and comprises a third set of conductive tracks extending on the third face (39), the tracks of the third set of conductive tracks being electrically connected to the connector (25) on the one hand and being electrically connectable to the tracks (37, 38) of the first set of conductive tracks (32) or of the second set of conductive tracks (33) of one of the electronic modules (12) on the other hand.

9. Acquisition device according to one of claims 1 to 8, wherein each connection element (13) comprises a piece of anisotropic conductive material having a high electrical conductivity in a first direction parallel to the direction of the compression force and a low electrical conductivity in a direction perpendicular to the direction of the compression force to establish the electrical connection between each trace of the first set of conductive traces of one of the electronic modules and the corresponding trace of the second set of conductive traces of the other electronic module.

10. The acquisition device of claim 9, wherein the anisotropic conductive material comprises a non-conductive matrix and a plurality of conductive elements dispersed in the matrix, the conductive elements capable of conducting electrical signals only in the first direction.

11. The device of claim 10, wherein the matrix is formed of an elastic material.

12. Acquisition apparatus as claimed in one of claims 1 to 11, wherein each electronic module (12) comprises: a first electronic board (28), said first electronic board (28) having said first face (29), said first set of conductive traces (32) extending on said first face (29); a second electronic board (30), said second electronic board (30) having said second face (31), said second set of conductive traces (33) extending on said second face (31); and one or more electronic components (34), said one or more electronic components (34) being located between said first electronic board (28) and said second electronic board (30) and being connected to one of said traces (37) of said first set of conductive traces (32) and one of said traces (38) of said second set of conductive traces (33).

13. Acquisition apparatus according to claim 11, wherein one of the electronic components (34) is able to receive an input electrical signal containing measurement data via the trace (37) of the first set of electrically conductive traces (32) connected to the component (34) for processing the measurement data and to generate an output electrical signal containing processed measurement data via the trace (38) of the second set of electrically conductive traces (33) connected to the electronic component (34).

14. Acquisition device according to one of claims 12 and 13, wherein one of the electronic components (34) is a battery able to generate a voltage between the track (37) of the first set of conductive tracks (32) connected to the electronic component (34) and the track (38) of the second set of conductive tracks (33) connected to the electronic component (34).

15. Acquisition apparatus according to one of claims 12 to 13, wherein one of the electronic components (34) is a sensor capable of generating an electrical measurement signal containing measurement data, such as a vibration sensor, an acceleration sensor, an acoustic sensor, a temperature sensor or a pressure sensor.

16. Acquisition device according to one of claims 12 to 15, wherein each electronic module (12) comprises a potting material (36), the potting material (36) being intended to fill the space between the assembly (34) and the electronic boards (28, 30).

17. Acquisition device according to one of claims 12 to 15, wherein each electronic module (12) comprises a side wall extending between the first electronic board (28) and the second electronic board (30) to define, with the first electronic board (28) and the second electronic board (30), a protective casing containing the electronic components (34).

18. A data acquisition system comprising:

-a plurality of acquisition devices (10) according to one of claims 1 to 17, the plurality of acquisition devices (10) being attachable to different locations of a structure on which a measurement instrument is to be mounted, and

-a data concentrator (50), the data concentrator (50) being connectable to different acquisition devices (10) via a communication cable (60) or via a wireless connection (70) to receive measurement data signals originating from different acquisition devices (10).

Technical Field

The present invention relates to a data acquisition device intended for a measuring instrument for vehicles (land vehicles, airplanes, railway vehicles) or industrial plants (power production plants).

Background

The measurement instrument includes sensors and onboard acquisition devices mounted on the vehicle or industrial equipment to be tested to perform measurements during testing or quality control. The data may be, for example, physical data (shock, vibration) or environmental data (temperature, humidity, pressure). The data acquisition device collects and formats data originating from different sensors.

Fig. 1 schematically shows a first example of a known acquisition device. The acquisition device comprises a rack and a series of electronic modules that can be inserted into the rack in a drawer-like manner. The chassis includes a side wall and a bottom wall defining an insertion opening. The side walls are provided with slide rails into which the electronic module can be inserted. The device further comprises an electronic board attached to the bottom wall inside the rack. The electronic board includes a series of connectors. Each electronic module is inserted into one of the slide rails and is electrically connected to the electronic board via one of the connectors. The device allows the assembly of different electronic modules, so as to be able to collect and process the signals originating from the different sensors as required.

One disadvantage of this device is that it is bulky and therefore it is often not possible to mount the device in the vicinity of the sensor. Therefore, cables must be installed to connect the various sensors to the acquisition device. Furthermore, the frame must be attached to the structure to which the measuring instrument is to be mounted by means of adapter plates and attachment screws. Therefore, the device is bulky and installation of the device requires the provision of cable channels and bores in the structure where the measuring instrument is to be installed for insertion of attachment screws. Thus, the device to be tested or the measuring instrument of the vehicle may substantially change the performance of the vehicle or device. The effect of the measuring instrument on the performance of the device under test or vehicle must usually be evaluated before the test in order to correct the obtained measurement results, if possible. Furthermore, once the measurement instrument has been installed on the device or vehicle to be tested, it is often not possible to easily modify the configuration of the sensors, the acquisition devices or the cables, for example when it is necessary to add sensors.

Fig. 2 schematically shows a second example of an acquisition device. The acquisition device comprises a series of electronic modules. Each module includes a separate housing. The module housings are assembled together to form a stack, and the electronic modules are connected together by connectors.

This type of device is generally not as bulky as the device shown in fig. 1. However, this device also has the disadvantage that it must be attached to the structure to which the measuring instrument is to be mounted by means of an adapter plate and attachment screws. Furthermore, cables must be installed to connect the different sensors to the acquisition device. Thus, as with the apparatus of fig. 1, the apparatus shown in fig. 2 does not allow the configuration of the sensors, acquisition devices and cables to be easily modified once the measurement instrument has been installed on the device or vehicle to be tested.

Disclosure of Invention

It is an object of the present invention to propose a data acquisition device which has a reduced volume, a reduced influence on the structure of the measuring instrument to be mounted and which can be used under severe environmental conditions.

This object is achieved within the scope of the invention to be attributed to a data acquisition device comprising:

-a housing comprising a side wall defining a cavity;

a plurality of electronic modules stackable in a stacking direction in the cavity,

each electronic module having a first face and a second face opposite the first face and comprising a first set of conductive traces extending on the first face and a second set of conductive traces extending on the second face, the first set of conductive traces comprising at least one conductive trace dedicated to transmitting data signals, the second set of conductive traces comprising at least one conductive trace dedicated to transmitting data signals and electrically connected to the conductive traces dedicated to transmitting data signals of the first set of conductive traces via an electrical connection channel extending internally within the electronic module;

-one or more connector blocks, each connector block being located between two adjacent electronic modules of the stack to establish an electrical connection between each trace of the first set of electrically conductive traces of one electronic module and a corresponding trace of the second set of traces of the other electronic module; and

-a pressing member capable of exerting a compressive force on the electronic module parallel to the stacking direction, which compressive force tends to deform each connector block by increasing its dimension in a radial direction perpendicular to the stacking direction, so as to keep each connector block supported against a side wall of the housing.

In this type of device, data transmission between the different electronic modules is possible by means of dedicated conductive tracks present on the face of each module. Thus, the electrical connection of the stacked electronic modules is ensured by the other modules, not by the electronic board or by specific cables.

The connector block secures the electronic module in the housing while the connector block remains supported against the side wall. Thus protecting the electronic module from vibration and shock. As a result, the acquisition device can be used to acquire data under harsh environmental conditions.

In one embodiment of the invention, the conductive traces are arranged such that when the electronic modules are stacked in the cavity, regardless of the stacking order of the electronic modules in the cavity, in the stack the conductive traces dedicated to transmitting data signals on the second face of one module face the conductive traces dedicated to transmitting data signals on the first face of another adjacent module to propagate data signals from one module to the other module in the entire stack.

Since the electronic modules can be stacked in the housing in any order without modifying the functionality of the electronic modules, the device can be easily reconfigured: it is sufficient to add and/or extract one or more electronic modules when necessary.

The proposed device may also have one of the following features:

-at least one electronic module capable of generating a data signal;

-the first set of electrically conductive tracks comprises at least one electrically conductive track dedicated to the transmission of synchronization signals, and the second set of electrically conductive tracks comprises at least one electrically conductive track dedicated to the transmission of synchronization signals and electrically connected to an electrically conductive track dedicated to the transmission of synchronization signals of the second set of electrically conductive tracks via an electrical connection channel extending inside the electronic module, the tracks being arranged such that, when the electronic modules are stacked in the cavity, the electrically conductive track dedicated to the transmission of synchronization signals on the second face of one module faces the electrically conductive track dedicated to the transmission of synchronization signals on the first face of the other module;

the first set of electrically conductive tracks comprises at least one electrically conductive track dedicated to transmitting electrical power signals, and the second set of electrically conductive tracks comprises at least one electrically conductive track dedicated to transmitting electrical power signals and electrically connected to the electrically conductive tracks dedicated to transmitting electrical power signals of the second set of tracks via electrical connection channels extending inside the electronic module, the tracks being arranged such that, when the electronic modules are stacked in the cavity, the electrically conductive tracks dedicated to transmitting electrical power signals on the second face of one module face the electrically conductive tracks dedicated to transmitting electrical power signals on the first face of the other module;

-the first set of electrically conductive tracks comprises at least one electrically conductive track dedicated to the transmission of data signals, one electrically conductive track dedicated to the transmission of synchronization signals and one electrically conductive track dedicated to the transmission of power signals, and the second set of electrically conductive tracks comprises at least one electrically conductive track dedicated to the transmission of data signals, one electrically conductive track dedicated to the transmission of synchronization signals and one electrically conductive track dedicated to the transmission of power signals, the electrically conductive tracks of the second set of electrically conductive tracks being electrically connected to the electrically conductive tracks dedicated to the transmission of data signals, the electrically conductive tracks dedicated to the transmission of synchronization signals and the electrically conductive tracks dedicated to the transmission of power signals, respectively, of the first set of electrically conductive tracks via electrical connection channels extending inside the electronic module from the first face to the second face;

the pressing member comprises an elastic return member, for example a compression spring;

the acquisition device comprises a first end plate, the pressing member being located between the body of the cover and the first end plate, so that the pressing member applies a compressive force to the electronic module via the first end plate;

the acquisition device comprises a second end plate, the electronic module being located between the first end plate and the second end plate;

the housing has an opening, the collecting device further comprising:

a cover including a main body capable of shielding the opening of the housing; and

a connector extending through the body of the cover, the connector being connectable to a communication cable to transmit data signals between one or more electronic modules located inside the cavity and a remote device located outside the housing;

the acquisition device comprises a first end plate located between the cover and the stack, and the first end plate has a third face and comprises a third set of conductive tracks extending on the third face, the tracks of the third set of conductive tracks being electrically connected on the one hand to the connector and on the other hand to the tracks of the first set of conductive tracks or of the second set of conductive tracks of one of the electronic modules;

the acquisition means comprise a flexible electrical connector cable connecting the traces of the third set of conductive traces to the connector;

each connector block is formed of an anisotropic conductive material having a high electrical conductivity (i.e. a low electrical resistance, typically less than 1 ohm, for example a few milliohms) in a first direction parallel to the stacking direction of the electronic modules and a low electrical conductivity (i.e. a high electrical resistance, typically more than 10) in a direction perpendicular to the stacking direction of the electronic modules⁹Ohms, e.g., on the order of several gigaohms) to establish an electrical connection between each trace of the first set of conductive traces of one electronic module and a corresponding trace of the second set of traces of another electronic module;

the anisotropic conductive material comprises a non-conductive matrix and a plurality of conductive elements dispersed in the matrix, the conductive elements being capable of conducting electrical signals only in a first direction;

-the substrate is composed of an elastic material;

-each electronic module comprises: a first electronic board having a first face with a first set of conductive traces extending thereon; a second electronic board having a second face with a second set of conductive traces extending thereon; and one or more electronic components located between the first electronic board and the second electronic board and connected to one of the first set of conductive traces and one of the second set of conductive traces;

-one of the electronic components is capable of receiving an input electrical signal containing measurement data via a trace of the first set of electrically conductive traces to which the electronic component is connected, to process the measurement data, and to generate an output electrical signal containing processed measurement data via a trace of the second set of electrically conductive traces to which the electronic component is connected;

-one of the electronic components is a battery capable of generating a voltage between a trace of the first set of electrically conductive traces that is connected to the electronic component and a trace of the second set of electrically conductive traces that is connected to the electronic component;

one of the electronic components is a sensor capable of producing an electrical measurement signal containing measurement data, such as a vibration sensor, an acceleration sensor, an acoustic sensor, a temperature sensor or a pressure sensor;

-each electronic module comprises a potting material for filling the space between the assembly and the electronic board;

each module comprises a side wall extending between the first electronic board and the second electronic board to define, together with the first electronic board and the second electronic board, a protective casing containing electronic components;

-the tracks of the first set of electrically conductive tracks and the tracks of the second set of electrically conductive tracks are circular and arranged concentrically; and

the housing comprises a side wall having a shape of a cylinder of revolution surrounding the cavity.

The invention also relates to a data acquisition system comprising:

a plurality of acquisition devices as previously defined, which can be attached to different positions of the structure on which the measuring instrument is to be mounted; and

a data concentrator connectable to different acquisition devices via a communication cable or via a wireless connection to receive measurement data signals originating from the different acquisition devices.

In one embodiment of the invention, the acquisition system further comprises a plurality of sensors that can be attached to the structure on which the measuring instrument is to be mounted, each sensor being connected to one acquisition device for transmitting measurement data to the acquisition device.

Drawings

Other features and advantages will be disclosed by the following description, which is illustrative only and not limiting, and which must be read with reference to the accompanying drawings, in which:

fig. 1, already discussed, schematically shows a first example of a prior art data acquisition device;

fig. 2, already discussed, schematically shows a second example of a prior art data acquisition device;

figure 3 schematically shows a data acquisition device according to a possible embodiment of the invention;

figure 4 schematically shows a cover of the collecting device;

figure 5 schematically shows, in a cross-sectional view, an electronic module forming part of a data acquisition device;

figure 6 schematically shows a first face of an electronic module;

figure 7 schematically shows a second face of the electronic module;

figure 8 schematically shows a connector block located between two adjacent electronic modules;

fig. 9 schematically shows another connector block located between two adjacent electronic modules;

figures 10 to 14 schematically show different functions that can be performed by the electronic module;

figures 15 to 18 schematically illustrate different functions that can be performed by the end assembly of the cap comprising the collecting device; and

fig. 19 schematically shows a data acquisition system comprising a plurality of acquisition devices.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

In fig. 3, the data acquisition device 10 includes a housing 11, a plurality of electronic modules 12, and a plurality of connector blocks 13.

The housing 11 comprises two end caps 14, 15 and a main body 16. The body 16 comprises a side wall 17 having a substantially cylindrical shape, for example a rotating cylinder having an axis X. The side wall 17 has two free edges 18, 19 delimiting two end openings. Each of the covers 14, 15 can be introduced into one opening and attached to the body 16, for example by screwing or by any other means. The side walls 17 define a cavity 20 capable of accommodating the electronic module 12 and the connector block 13. The cavity 20 extends between two openings of the housing 11.

The electronic module 12 and the connector piece 13 can be introduced into the interior of the cavity 20 of the housing via one opening. Further, the electronic module 12 and the connector block 13 can be stacked in the cavity 20 in a stacking direction parallel to the axis X of the housing 11. More precisely, the electronic modules 12 and the connector blocks 13 are stacked alternately on top of each other, so that each electronic module 12 is located between two connector blocks 13 in the stack.

Each electronic module 12 is capable of providing functions specific to that electronic module. For example, the electronic module may include one or more sensors (e.g., such as an accelerometer or pressure sensor), a data processing component, a memory, and a battery.

The electronic modules 12 may also include intermediate modules, i.e. electronic modules that do not perform any specific function but are used to complete the stack in case the cavity 20 has a predetermined volume and the necessary number of electronic modules 12 cannot fill the entire volume of the cavity 20.

Each of the covers 14, 15 includes a shutter 21, 22 and an end plate 23, 24 that can be attached to the main body 16 to close one opening.

Once the covers 14, 15 are attached to the body 16, the stack of electrical module 12 and connector block 13 is located between the two end plates 23 and 24.

As shown in fig. 4, the cover 14 includes a connector 25 extending through the shielding portion 21 and a pressing member 26.

The pressing member 26 is located between the shielding portion 21 of the cover 14 and the end plate 23. The pressing member 26 is capable of applying a compressive force F to the stack parallel to the stacking direction to keep the electronic module 12 and the connector block 13 pressed against each other. The pressing member 26 applies a compressive force F to the electronic module 12 via the end plate 23.

As shown in fig. 4, the pressing member 26 may include a resilient return element, such as a compression spring.

The cover 14 also includes a flexible electrical connector cable 27, the flexible electrical connector cable 27 connecting the conductive traces of the end plate 23 to the connector 25.

The connector 25 is connectable to a communication cable to transmit signals between one or more electronic components 12 located inside the cavity 20 and a remote device located outside the housing 11.

Fig. 5 to 7 schematically show the electronic module 12. The electronic module 12 has the shape of a cylindrical chip.

In the example shown in fig. 5, the electronic module 12 comprises a first electronic board 28 having a first plane 29 and a second electronic board 30 having a second plane 31 opposite to the first plane 29. The planes 29 and 31 extend perpendicular to the stacking direction. The electronic module 12 further includes a first set of conductive traces 32 extending on the first side 29 and a second set of conductive traces 33 extending on the second side 31.

The electronic module 12 further comprises a plurality of electrical connectors 42 located between the two electronic boards 28 and 30, each extending from the first face 29 to the second face 31 to connect the traces 32 and 33 two by two. The electronic module 12 also includes a plurality of electronic components 34 located between the two electronic boards 28 and 30 and connected to some electrical connector 42. The electronic module 12 may also include one or more cross boards 35 located between the first and second electronic boards 28, 30 and supporting the electronic components 34. The electronic module 12 further comprises a potting material 36 filling the spaces between the assembly 34 and the electronic boards 28, 30, 35. In this way, the electrical connection 42 and the electronic component 34 are protected from mechanical loads (vibrations, shocks, pressure changes) of the potting material 36 and from environmental humidity. Further, the potting material 36 may be selected so that the electronic module 12 is hermetic.

Alternatively, each module 12 may comprise a side wall extending between the first electronic board 28 and the second electronic board 30 so as to define, together with the first electronic board and the second electronic board, a protective enclosure containing the electrical connectors 42 and the electronic components 34.

As shown in fig. 6, the first set of conductive traces 32 includes a plurality of circular conductive traces 37 concentrically arranged according to a first pattern.

As shown in fig. 7, the second set of conductive traces 33 includes a plurality of circular conductive traces 38 concentrically arranged according to a second pattern. The second pattern is the same as the first pattern.

From one electronic module 12 to another electronic module 12, their first set of traces 32 are identical. Likewise, their second set of traces 33 are identical from one electronic module 12 to another electronic module 12.

In addition, in the examples shown in fig. 6 and 7, the first set of traces 32 is symmetrical to the second set of traces 33. More specifically, in this example, the first set of traces 32 is identical to the second set of traces 33.

Each of the first set of traces 32 and the second set of traces 33 may include 3 to 10 traces.

In the examples shown in fig. 7 and 8, the first set of traces 32 and the second set of traces 33 each include 9 different traces numbered 1 through 9. Each trace is dedicated to transmitting a predetermined signal.

In the examples shown in fig. 6 and 7, traces numbered 1 and 3 are dedicated to transmitting synchronization signals (referred to as "CLK" and "FSYNC"), traces numbered 2 and 9 are dedicated to transmitting power supply signals (referred to as "VCC" and "GND), and traces numbered 4 through 8 are dedicated to transmitting data signals (referred to as" SCLK "," D _ AOUT "," D _ AIN "," I2C _ SCL ", and" I2C _ SDA ").

Thus, the conductive traces 37 and 38 are arranged such that when the electronic modules 12 are stacked in the cavity 20, each of the conductive traces numbered 1 to 9 of the second face 31 of the electronic module faces a corresponding conductive trace numbered 1 to 9 of the first face 29 of an adjacent electronic module in the stack. In this manner, signals propagate from one electronic module 12 to another electronic module 12 in the stack regardless of the stacking order of the electronic modules 12 in the cavity 20.

Furthermore, the first end plate 23 has a first support face 39 directed towards the stack. The first end plate 23 comprises a third set of conductive tracks extending over the first support surface 39. The third set of conductive traces is the same as the second set of conductive traces 33 shown in fig. 7. A flexible electrical connector cable 27 connects the traces in the third set of conductive traces to the connector 25. Thus, the conductive traces are arranged such that when the electronic modules 12 are stacked in the cavity 20, each of the conductive traces numbered 1 to 9 of the first face 29 of the electronic module 12 at the first end of the stack faces a corresponding conductive trace numbered 1 to 9 of the first support face 39 of the first end plate 23. The traces of the third set of conductive traces are thus electrically connected to the connector 25 on the one hand and to the traces 37 of the first set of conductive traces 32 of the electronic module 12 located at the first end of the stack on the other hand.

Likewise, the second end plate 24 has a second support surface 40 directed towards the stack. The second end plate 24 includes a fourth set of conductive traces extending on the second support surface 40. The fourth set of conductive traces is identical to the first set of conductive traces 32. Thus, the conductive traces are arranged such that when the electronic modules 12 are stacked in the cavity 20, each of the conductive traces numbered 1 to 9 of the second face 31 of the electronic module 12 at the second end of the stack faces a corresponding conductive trace numbered 1 to 9 of the second support face 40. Thus, the traces of the fourth set of conductive traces are connected to the traces 38 of the second set of conductive traces 33 of the electronic module 12 at a second end of the stack, which is opposite the first end of the stack.

As shown in fig. 8, each connector block 13 has a disc shape and can be located between two adjacent electronic modules 12 in a stack. More specifically, the connector block 13 shown in fig. 8 is located between the second face 31 of the first electronic module 12A and the first face 29 of the second electronic module 12B located facing the second face 31. The connector block is capable of establishing an electrical connection between each trace 37 of the first set of conductive traces 32 of the first electronic module 12A and a corresponding trace 38 of the second set of traces 33 of the second electronic module 12B.

Each connector block 13 is formed of an anisotropic conductive material having a high electrical conductivity (i.e. a low electrical resistance, about 1 ohm) in a first direction parallel to the stacking direction of the electronic modules 12 (i.e. the direction parallel to the axis X) and a low electrical conductivity (i.e. a high electrical resistance, for example about 10 ohms) in a direction perpendicular to the stacking direction of the electronic modules 12¹²Ohms) to establish an electrical connection between each trace 37 of the first set of conductive traces 32 of electronic module 12b and a corresponding trace 38 of the second set of traces 33 of electronic module 12A.

The anisotropic conductive material may include a non-conductive matrix formed, for example, of an elastic material, and a plurality of conductive elements dispersed in the matrix, the conductive elements being capable of conducting signals only in the stacking direction.

When the connector piece 13 is subjected to a compressive force, the connector piece 13 has a tendency to deform. More specifically, the thickness of the connector block 13 measured in the stacking direction tends to decrease, while the radius of the connector block 13 measured in the radial direction perpendicular to the stacking direction tends to increase. Thus, the connector block 13 occupies the space between the electronic module 13 and the end plates 23 and 24, and is supported against the side wall 17 of the housing 11. In this way, the connector block 13 secures the electronic module 12 in the housing 11, protecting the electronic module 12 from vibrations and shocks.

Each connector piece 13 has an annular outer surface. As shown in fig. 3, each connector piece 13 is dimensioned such that under the influence of the compressive force F, the connector piece 13 undergoes radial expansion. This has the effect of pressing the outer annular surface of the connector block 13 against the inner cylindrical surface of the side wall 17. The material of the connector piece 13 is pressed against the inner surface of the side wall 17. In this way, the connector block 13 separates the electronic modules 13 in an airtight manner. Moisture or contaminants are prevented from penetrating into the cavity 20 and the electronic module 12 is thus protected.

Further, the connector block 13 may be formed of a material that allows heat that may be generated by the electronic module 12 to be conducted to the side wall of the housing so as to radiate the heat to the outside. To further improve heat dissipation, the housing 11 may include fins disposed on the outer surface of the side wall 17.

Fig. 9 schematically shows another example of a connector block 13 that may be located between two adjacent electronic modules 12. The connector piece 13 has an annular shape. The acquisition device further comprises a connector 41 located in the center of the connector block 13.

Due to the arrangement of the conductive traces 37 and 38 on the surface of the electronic modules 12, electrical signals, such as synchronization signals, power signals, and data signals, are transmitted from one module 12 to another module 12 in the stack, regardless of the order in which the electronic modules 12 are stacked.

Each electronic module 12 may propagate data signals, synchronization signals, or power signals in the following manner.

The electronic module 12 transmits the signal between the trace 37 of the first set of conductive traces 32 and the corresponding trace 38 of the second set of conductive traces 33, but does not use or process the signal;

the electronic module 12 transmits signals between the traces 37 of the first set of conductive traces 32 and the corresponding traces 38 of the second set of conductive traces 33, while using the signals to make its electronic components active.

Fig. 10-14 schematically illustrate different examples of functions that may be performed by the electronic module 12.

In fig. 10, the electronic module 12 is a sensor module.

The electronic module includes a sensor (e.g., an accelerometer or a pressure sensor) capable of generating a data signal including measurement data. The electronic module transmits a data signal between one trace of the first set of conductive traces and a trace of the second set of conductive traces. The electronic module uses the synchronization signal to synchronize the electronic components (typically analog/digital conversion components) that require the synchronization signal while still transmitting the synchronization signal between the traces of the first set of conductive traces and the corresponding traces of the second set of conductive traces. Likewise, the electronic module uses the power signal to power its electronic components while transmitting the power signal between the traces of the first set of conductive traces and the corresponding traces of the second set of conductive traces.

In fig. 11, the electronic module 12 is a data recording module.

The electronic module includes a memory configured to record data from the data signal. The electronic module transmits data signals between traces of the first set of conductive traces and corresponding traces of the second set of conductive traces. The electronic module uses the power signal to power its electronic components while still transmitting the power signal between the traces of the first set of conductive traces and the corresponding traces of the second set of conductive traces. Further, the electronic module transmits the synchronization signal between the traces of the first set of conductive traces and the corresponding traces of the second set of conductive traces, but does not use or process the signal.

In fig. 12, the electronic module 12 is a processing module.

The electronic module is configured to process the data signal it receives and generate a processed data signal. The electronic module uses the power signal and the synchronization signal to power its electronic components while still transmitting the power signal and the synchronization signal between the traces of the first set of conductive traces and the traces of the second set of conductive traces.

In fig. 13, the electronic module 12 is a power module, and one of the components of the power module is a battery.

The electronic module is configured to generate a power supply signal. The electronic module transmits data signals between the traces of the first set of conductive traces and the corresponding traces of the second set of conductive traces, but does not use or process the signals. Likewise, the electronic module transmits the synchronization signal between the traces of the first set of conductive traces and the corresponding traces of the second set of conductive traces, but does not use or process the signal.

In fig. 14, the electronic module 12 is an interleaved module.

In this case, the electronic module does not perform any specific function, other than adapting the overall dimensions of the stack to the desired dimensions. The electronic module transmits data signals, synchronization signals, and power signals between respective ones of the first set of conductive traces and corresponding respective ones of the second set of conductive traces, but does not use or process the signals.

Fig. 15-18 schematically illustrate different functions that may be performed by one of the covers 14 or 15.

In fig. 15, the cover 14 is a passive cover, i.e. the cover 14 does not perform any specific function.

In this case, the traces of the third set of conductive traces are electrically connected to the connector. Thus, the connector receives a data signal, a synchronization signal, and a power signal. These signals may be transmitted via a wireless network or a communications cable connected to a remote device located outside the housing of the apparatus.

Fig. 16 to 18 show an embodiment of the cover, wherein the cover is active, i.e. the cover performs its own function.

In fig. 16, the cover 14 includes a conversion assembly capable of converting data signals propagating through different modules of the stack in a first format to data signals having a second format different from the first format. The data signal in the second format can be propagated over a communications cable or by a wireless connection to a remote device located outside the housing of the apparatus. The conversion component is also capable of performing an inverse conversion, i.e. converting the data signal in the second format into the data signal in the first format.

In fig. 17, the cover 14 includes a conversion component capable of converting synchronization signals propagating through different modules of the stack in a first format to synchronization signals having a second format different from the first format. The synchronization signal in the second format can be propagated over a communications cable or over a wireless network connected to a remote device located outside the housing of the apparatus. The conversion component is also capable of performing an inverse conversion, i.e. converting the synchronization signal in the second format into the synchronization signal in the first format.

In fig. 18, the cover 14 includes a conversion component capable of converting a power signal propagating through different modules of the stack in a first format (e.g., a first voltage level) to a signal having a second format (e.g., a second voltage level) different from the first format. The power signal in the second format can propagate over the communication cable to a remote device located outside the housing of the apparatus. The conversion component is also capable of performing a reverse conversion, i.e., converting the power supply signal in the second format to the power supply signal in the first format.

Of course, covers that perform several of the three functions shown in fig. 16-18 may be considered.

Figure 19 schematically shows a data acquisition system.

The data acquisition system includes a plurality of data acquisition devices 10 and a data concentrator 50.

The data acquisition system includes a plurality of sensors attached to different locations of a structure on which the measurement instrument is to be mounted. Among these sensors, some may be separate sensors 110 different from the data acquisition device 10. In this case, each sensor 110 is attached to the structure on which the measuring instrument is to be mounted and is connected to the associated data acquisition device 10. The sensors 110 are connected to the associated acquisition devices via communication cables or wireless connections in order to transmit the measurement data generated by the sensors 110 to the associated data acquisition devices 10. Among the sensors, other sensors may be integrated into the data acquisition device 10. In this case, the sensors are part of the electronics module of the data acquisition device 10.

The data acquisition device 10 can be attached to the structure (e.g., a cable bundle or pipe) to which the measurement instrument is to be mounted, simply by a hose clamp or a self-locking cable clamp (e.g., plastic or metal hose clamps commonly referred to as "tyraps"), without the need for screws or drilling. The assembly and disassembly of each harvesting device 10 can be accomplished without tools, so that the harvesting assembly can be rearranged as desired.

Each data acquisition device 10 is connected to another data acquisition device 10 or data concentrator 50 via a communication cable 60 or by a wireless connection 70 (e.g., a radio frequency connection).

The data concentrator 50 may also be connected to other data acquisition devices 80.

The data concentrator 50 is configured to receive data signals originating from different acquisition devices 10 and 80 and to aggregate (aggregate with its own data acquired locally), filter (i.e., select data among the data it receives), record the data in the recording medium 90 and/or transmit the data to other equipment, such as to a ground station via the transmission link 100 when the acquisition assembly is installed on an aircraft.