阅读说明：本技术 包括可折叠显示器的电子装置 (Electronic device comprising a foldable display ) 是由 金基大 金正真 金钟润 白茂铉 刘重根 崔荣植 李旻星 于 2019-05-29 设计创作，主要内容包括：一种电子装置包括：可折叠壳体,包括可折叠地彼此连接并且一起形成凹部的第一壳体结构和第二壳体结构；以及柔性显示器,位于所述凹部中。所述柔性显示器包括：第一部件,位于所述凹部的第一区域中,并且在展开状态下与所述第二壳体结构的第一部分具有第一间隙,所述第一部件包括面向所述第二壳体结构的第一部分的第一外周部分；以及第二部件,位于所述凹部的第二区域中,并且与所述第二壳体结构的第二部分具有第二间隙,所述第二部件包括面向所述第二壳体结构的第二部分的第二外周部分,其中,在所述展开状态下,所述第二间隙小于所述第一间隙。(An electronic device includes: a foldable housing comprising a first housing structure and a second housing structure foldably connected to each other and together forming a recess; and a flexible display located in the recess. The flexible display includes: a first member located in a first region of the recess and having a first gap with a first portion of the second housing structure in an expanded state, the first member including a first outer peripheral portion facing the first portion of the second housing structure; and a second component located in a second region of the recess and having a second gap with a second portion of the second housing structure, the second component including a second outer peripheral portion facing the second portion of the second housing structure, wherein in the deployed state, the second gap is smaller than the first gap.)

1. An electronic device, comprising:

a foldable housing comprising a first housing structure and a second housing structure foldably connected to the first housing structure, wherein the first housing structure and the second housing structure together form a recess; and

a flexible display located in the recess,

wherein the first and second shell structures face each other in a folded state and are foldable towards each other with respect to a first axis extending in a first direction and form a planar structure in an unfolded state,

wherein the recess comprises, when viewed from above in the deployed state: a first region between the first portion of the first housing structure and the first portion of the second housing structure; and a second region between a second portion of the first housing structure and a second portion of the second housing structure, the first region having a first width extending in a second direction perpendicular to the first direction and the second region having a second width extending in the second direction, wherein the second width is longer than the first width, and the first portion of the second housing structure is closer to the first axis than the second portion of the second housing structure, and

wherein the flexible display comprises:

a first member located in the first region of the recess and having a first gap with a first portion of the second housing structure in the expanded state, the first member including a first outer peripheral portion facing the first portion of the second housing structure; and

a second component located in the second region of the recess and having a second gap with a second portion of the second housing structure, the second component including a second outer peripheral portion facing the second portion of the second housing structure, wherein in the deployed state, the second gap is smaller than the first gap.

2. The electronic device of claim 1, wherein the first portion of the second housing structure is closer to the first axis than the first portion of the first housing structure.

3. The electronic device of claim 1, wherein the flexible display comprises a plurality of layers stacked on top of each other, and

wherein the first and second outer peripheral portions form a stepped structure from the plurality of layers, respectively.

4. The electronic device of claim 1, wherein in the folded state, the first peripheral portion has a third gap with the first portion of the second housing structure, and the third gap is smaller than the first gap.

5. The electronic device of claim 4, wherein in the folded state, the second peripheral portion has a fourth gap with the second portion of the second housing structure, and the fourth gap is smaller than the second gap.

6. The electronic device of claim 5, wherein a first difference between the first gap and the third gap is greater than a second difference between the second gap and the fourth gap.

7. The electronic device of claim 5, wherein the third gap and the fourth gap are substantially identical to each other.

8. The electronic device of claim 1, wherein the second portion of the first housing structure or the second portion of the second housing structure comprises: a third portion having a third width from the first axis; and a fourth portion having a fourth width from the first axis,

wherein the third width is greater than the fourth width,

wherein the third portion is spaced apart from the second peripheral portion of the flexible display by a third gap and the fourth portion is spaced apart from the second peripheral portion of the flexible display by a fourth gap, and

wherein the third gap is smaller than the fourth gap.

9. The electronic device of claim 1, wherein the first portion and the second portion of one of the first housing structure or the second housing structure are connected parallel to the first direction,

wherein the other housing structure further comprises an extension extending from the first portion in the first direction, and

wherein a sensor is formed between the extension and the second portion.

10. An electronic device, comprising:

a flexible display folded with respect to a first axis extending along a first direction;

a support structure including a first support having a first surface on which at least a portion of the flexible display is disposed and a second support having a first surface on which at least a portion of the flexible display is disposed, the second support being disposed along a second direction perpendicular to the first direction of the first support;

a hinge structure including a folding axis perpendicular to the first direction and configured to connect the first bracket and the second bracket such that the first bracket and the second bracket are folded or unfolded with respect to the folding axis;

a hinge housing having an inner surface connected to the first surface of the first bracket and the first surface of the second bracket, the hinge structure being disposed in the hinge housing;

a substrate including a first substrate disposed on the second surface of the first support and a second substrate disposed on the second surface of the second support; and

a wiring member configured to electrically connect the first substrate and the second substrate,

wherein at least a portion of the wiring member extends on the first surface of the first bracket or the first surface of the second bracket.

11. The electronic device of claim 10, wherein at least a portion of the wiring member extends from the first surface of the first bracket or the first surface of the second bracket into the hinge housing.

12. The electronic device according to claim 11, wherein a first opening through which the first holder passes is formed in a first surface of the first holder, and

wherein the wiring member extends to the first surface of the first bracket through the first opening.

13. The electronic device according to claim 12, wherein a second opening symmetrical to the first opening with respect to the folding axis is formed in the first surface of the second bracket, and

wherein the wiring member passes through the first opening and the second opening and electrically connects the first substrate and the second substrate, and a portion of the wiring member located between the first opening and the second opening is located in the hinge housing.

14. The electronic device according to claim 10, wherein the wiring member extends along the second direction.

15. The electronic device according to claim 14, wherein the wiring member includes: a variable region in the hinge housing; and a fixed region extending from opposite sides of the variable region, at least a portion of the fixed region being attached to the first surface of the first bracket and the first surface of the second bracket,

wherein a length of the variable region in the second direction is longer than a length of the inner surface of the hinge housing, and

wherein the variable region is in contact with the inner surface of the hinge housing when the first and second brackets are unfolded, and is spaced apart from the inner surface of the hinge housing by a predetermined gap when the first and second brackets are folded.

Technical Field

The present disclosure relates to an electronic device, and more particularly, to an electronic device including a foldable display.

Background

With the development of display technology, electronic devices employing flexible displays have been widely used. For example, electronic devices including flat panel displays and curved displays extending from opposite or one side of the flat panel displays have been widely used.

Further, among electronic devices having a flat panel display, there are electronic devices such as notebook computers or flip phones that are foldable by a hinge structure. The electronic device having the folding structure may include a flat panel display disposed on an opposite side or one side of a hinge structure of the display.

The above information is presented merely as background information to aid in understanding the present disclosure. No determination has been made as to whether any of the above is applicable as prior art to the present disclosure, nor has any assertion been made.

Disclosure of Invention

Technical problem

A portable electronic device having a small size and an electronic device providing a large screen have a trade-off relationship. To provide both high portability and a large screen, flexible displays may be employed in foldable electronic devices.

The flexible display comprises a plurality of layers. Therefore, the flexible display may be deformed when the device is folded, and the design of the housing of the electronic device without considering the characteristics of the flexible display may cause deformation or damage of the display.

Further, the foldable electronic device may include a first part and a second part with respect to a folding axis, and the first part and the second part may be electrically connected by a wiring member. When the electronic device is folded, the wiring member may be deformed, and stress may be applied to the wiring member by repeating the folding. A design that does not take this into account may cause damage to the wiring member.

The foldable electronic device may comprise a housing in which the flexible display is displaced. The housing may be comprised of a first part and a second part relative to a folding axis, and the flexible display may be bent when the first part and the second part of the housing are folded. In order to enable the electronic device to perform such an operation, it is necessary to provide an assembly structure of the housing and the display.

Technical scheme

According to an aspect of the present disclosure, an electronic device includes: a foldable housing comprising a first housing structure and a second housing structure foldably connected to each other and together forming a recess; and a flexible display located in the recess. The first and second housing structures face each other in a folded state and are foldable towards each other relative to a first axis extending along a first direction and form a planar structure in an unfolded state. The recess includes, when viewed from above in the deployed state: a first region between the first portion of the first housing structure and the first portion of the second housing structure; and a second region located between a second portion of the first housing structure and a second portion of the second housing structure, the first region having a first width extending in a second direction perpendicular to the first direction, the second region having a second width extending in the second direction, wherein the second width is longer than the first width, and the first portion of the second housing structure is closer to the first axis than the second portion of the second housing structure. The flexible display includes: a first member located in the first region of the recess and having a first gap with a first portion of the second housing structure in the expanded state, the first member including a first outer peripheral portion facing the first portion of the second housing structure; and a second member located in the second region of the recess and having a second gap with a second portion of the second housing structure, the second member including a second outer peripheral portion facing the second portion of the second housing structure, wherein in the deployed state, the second gap is smaller than the first gap.

According to another aspect of the present disclosure, an electronic device includes: a foldable housing comprising a first housing structure and a second housing structure foldably connected to one another and forming a recess between a first portion of the first housing structure and a first portion of the second housing structure; and a flexible display located in the recess. The first and second housing structures face each other in a folded state and are foldable towards each other relative to a first axis extending along a first direction and form a planar structure in an unfolded state. The first portion of the first housing structure includes a recess having a first length on a first inner surface facing the recess, and the first portion of the second housing structure includes a recess having a second length on a second inner surface facing the recess. The flexible display includes: a first outer peripheral portion extending in the first direction and inserted into a recess having the first length; and a second outer peripheral portion extending along the first direction and inserted into the recess having the second length.

According to another aspect of the present disclosure, an electronic device includes: a flexible display comprising a first region, a second region, and a fold region disposed between the first region and the second region; and a housing including a first housing and a second housing, the first region and at least a portion of the folded region being disposed in the first housing, the second region and the remaining portion of the folded region being disposed in the second housing, the second housing being foldably connected to the first housing with respect to a folding axis extending in a first direction. The first housing includes: a first horizontal frame forming an outer circumference of the first housing and extending in a second direction perpendicular to the first direction; and a second horizontal frame facing the first horizontal frame in parallel. The second housing includes: a third horizontal frame forming an outer circumference of the second housing and extending in the second direction; and a fourth horizontal frame facing the third horizontal frame in parallel. A first groove, a second groove, a third groove, and a fourth groove extending in the second direction are formed in the first horizontal frame, the second horizontal frame, the third horizontal frame, and the fourth horizontal frame, respectively. The flexible display includes a peripheral portion including a first peripheral portion extending along a second direction and a second peripheral portion parallel to the first peripheral portion. The first outer peripheral portion is inserted into the first groove and the third groove, and the second outer peripheral portion is inserted into the second groove and the fourth groove.

According to another aspect of the present disclosure, an electronic device includes: a flexible display folded with respect to a first axis extending along a first direction; a support structure including a first support having a first surface on which at least a portion of the flexible display is disposed and a second support having a first surface on which at least a portion of the flexible display is disposed, the second support being disposed along a second direction perpendicular to the first direction of the first support; a hinge structure including a folding axis perpendicular to the first direction and connecting the first bracket and the second bracket such that the first bracket and the second bracket are folded or unfolded with respect to the folding axis; a hinge housing having an inner surface connected to the first surface of the first bracket and the first surface of the second bracket, the hinge structure being disposed in the hinge housing; a substrate including a first substrate disposed on the second surface of the first support and a second substrate disposed on the second surface of the second support; and a wiring member electrically connecting the first substrate and the second substrate. At least a portion of the wiring member extends on the first surface of the first bracket or the first surface of the second bracket.

Other aspects, advantages and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

Advantageous effects

According to various embodiments of the present disclosure, a foldable electronic device may be easily and stably assembled, damage to or durability of components affected when the foldable electronic device is folded is prevented, and a design in consideration of deformation of the components is produced.

In addition, the present disclosure may provide various effects of direct or indirect confirmation.

Drawings

The above and other aspects, features and advantages of particular embodiments of the present disclosure will become more apparent from the following description when taken in conjunction with the accompanying drawings, in which:

fig. 1 shows a diagram of a flat state of an electronic device according to an embodiment;

fig. 2 shows a diagram of a folded state of an electronic device according to an embodiment;

FIG. 3 shows an exploded perspective view of an electronic device according to an embodiment;

FIG. 4 shows a plan view and a cross-sectional view of a display of an electronic device according to an embodiment;

FIG. 5 shows a diagram of a display unit of an electronic device according to an embodiment;

fig. 6 shows a diagram of a display unit of an electronic device according to an embodiment;

FIG. 7 shows a diagram of a portion of a cross section of a display and a plate when an electronic device is in a flat state, according to an embodiment;

FIG. 8 illustrates a perspective view of the display and the panel when the electronic device is in a folded state, in accordance with an embodiment;

FIG. 9 illustrates a diagram of a front surface and a back surface of a stand assembly of an electronic device, according to an embodiment;

FIG. 10 illustrates an exploded perspective view of a stand assembly of an electronic device according to an embodiment;

fig. 11a and 11b show a wiring member of an electronic device and a view of fixing the wiring member to a stand according to an embodiment;

12a, 12b and 12c show views of one embodiment of a hinge structure of the electronic device of FIGS. 9 and 10;

13a, 13b, 13c and 13d show diagrams of a wiring member of an electronic device according to various embodiments;

14a, 14b and 14c are diagrams illustrating a combination relationship of a stand assembly of an electronic device according to an embodiment;

15a, 15b and 15c show views of an assembly sequence of a rack assembly of an electronic device according to an embodiment;

fig. 16a and 16b are views illustrating a combined state of a stand assembly and a display unit of an electronic device according to an embodiment;

FIG. 17 shows a diagram of a foldable housing of an electronic device, according to an embodiment;

FIG. 18 illustrates a combined view of a foldable housing and a stand assembly of an electronic device, according to an embodiment;

fig. 19 shows a diagram of a sliding structure of an electronic device according to an embodiment;

FIG. 20 illustrates an assembled view of a foldable housing and stand assembly of an electronic device, according to an embodiment;

fig. 21 shows an exploded perspective view of a substrate and a rear cover of an electronic device according to an embodiment;

fig. 22 shows a diagram of a substrate of an electronic device according to an embodiment;

fig. 23 shows a diagram of a rear cover of an electronic device according to an embodiment;

FIG. 24 shows a diagram of a use state of an electronic device, in accordance with various embodiments;

fig. 25a and 25b show diagrams of a gap between a display and a housing and a cut-out of the display when an electronic device according to various embodiments is in a folded state;

26a, 26b and 26c show views of a cross-section of a partial area of the display and a gap between the display and the housing when the electronic device according to various embodiments is in a folded state; and

fig. 27a, 27b, and 27c illustrate diagrams of a front surface of an electronic device according to various embodiments.

Detailed Description

Before proceeding with the following detailed description, it may be advantageous to set forth definitions of certain words and phrases used throughout this patent document: the terms "include" and "comprise," as well as derivatives thereof, mean inclusion without limitation; the term "or" is inclusive, meaning and/or; the phrases "associated with … …" and "associated therewith," as well as derivatives thereof, may mean including, included within … …, interconnected with … …, containing, contained within … …, connected to … … or to … …, incorporated into … … or incorporated into … …, communicable with … …, cooperative with … …, interleaved, juxtaposed, proximate, bound to … … or bound with … …, having the properties of … …, and the like; and the term "controller" means any device, system or component thereof that controls at least one operation, such a device may be implemented in hardware, firmware or software, or some combination of at least two of the same. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether locally or remotely.

Fig. 1 shows a diagram of a flat state of an electronic device according to an embodiment. Fig. 2 shows a diagram of a folded state of an electronic device according to an embodiment. In embodiments, the electronic device 10 may have a flat state or an unfolded state shown in fig. 1, a folded state shown in fig. 2, and an intermediate state between the flat state and the folded state. As used herein, the term "folded state" refers to a "fully folded state" unless otherwise specifically stated, and a description of an intermediate state in which the electronic apparatus 10 is folded at a specific angle will be separately described.

Referring to fig. 1 and 2, in an embodiment, an electronic device 10 may include: a foldable housing 500; a hinge cover 530 covering a foldable portion of the foldable housing 500; and a flexible or foldable display 100 (hereinafter, simply referred to as "display 100") disposed in a space formed by the foldable housing 500. In the present disclosure, the surface on which the display 100 is disposed is defined as a first or front surface of the electronic device 10. The surface opposite the front surface is defined as a second or back surface of the electronic device 10. A surface surrounding a space between the front surface and the rear surface is defined as a third surface or a side surface of the electronic device 10.

In an embodiment, the foldable housing 500 may include: a first housing structure 510; a second housing structure 520 including a sensor region 524; a first rear cover 580; and a second rear cover 590. The foldable housing 500 of the electronic device 10 is not limited to the form and combination shown in fig. 1 and 2, and may be implemented by other shapes or combinations and/or combinations of components. For example, in another embodiment, the first housing structure 510 and the first back cover 580 may be integrally formed with each other, and the second housing structure 520 and the second back cover 590 may be integrally formed with each other.

In the illustrated embodiment, the first and second housing structures 510, 520 may be disposed on opposite sides of the fold axis (axis a) and may have a substantially symmetrical shape with respect to the fold axis a. As will be described below, the angle or distance between the first housing structure 510 and the second housing structure 520 may vary depending on whether the electronic device 10 is in a flat, folded, or intermediate state. In the illustrated embodiment, unlike the first housing structure 510, the second housing structure 520 may additionally include a sensor region 524 in which various sensors are disposed, but may have a symmetrical shape in other regions.

In an embodiment, as shown in fig. 1, the first case structure 510 and the second case structure 520 may together form a recess to accommodate the display 100. In the illustrated embodiment, the recess may have two or more different widths in a direction perpendicular to the fold axis a due to the sensor region 524.

For example, the recess may have (1) a first width w1 between a first portion 510a of the first housing structure 510 parallel to the fold axis a and a first portion 520a of the second housing structure 520 formed on the outer periphery of the sensor region 524 and (2) a second width w2 formed by a second portion 510b of the first housing structure 510 and a second portion 520b of the second housing structure 520 not corresponding to the sensor region 524 but parallel to the fold axis a. In this case, the second width w2 may be formed to be longer than the first width w 1. In other words, the first portion 510a of the first housing structure 510 and the first portion 520a of the second housing structure 520 having asymmetric shapes may form a first width w1 of the recess, and the second portion 510b of the first housing structure 510 and the second portion 520b of the second housing structure 520 having symmetric shapes may form a second width w2 of the recess. In embodiments, the first and second portions 520a, 520b of the second housing structure 520 may have different distances from the fold axis a. The width of the recess is not limited to the example shown. In various embodiments, the recess may have multiple widths, either in the form of the sensor region 524 or by having an asymmetrically shaped portion of the first housing structure 510 and a portion of the second housing structure 520.

In an embodiment, at least a portion of the first and second housing structures 510 and 520 may be formed using a metal or nonmetal having a strength selected to support the display 100.

In an embodiment, the sensor region 524 may be formed to have a predetermined region adjacent to one corner of the second housing structure 520. However, the arrangement, shape, and size of the sensor areas 524 are not limited to the illustrated example. For example, in another embodiment, the sensor region 524 may be disposed in another corner of the second housing structure 520, or in any region between the upper and lower corners of the second housing structure 520. In embodiments, components embedded in electronic device 10 to perform various functions may be exposed on a front surface of electronic device 10 through sensor area 524 or through one or more openings formed in sensor area 524. In various embodiments, the components may include various types of sensors. The sensor may comprise at least one of a front facing camera, a receiver, or a proximity sensor, for example.

The first rear cover 580 may be disposed on one side of the folding axis a on the rear surface of the electronic device 10, and may have a substantially rectangular outer periphery surrounded by the first housing structure 510, for example. Similarly, the second rear cover 590 may be disposed on the opposite side of the folding axis a on the rear surface of the electronic device 10, and may have an outer circumference surrounded by the second housing structure 520.

In the illustrated embodiment, the first and second rear covers 580 and 590 may have substantially symmetrical shapes with respect to the folding axis (axis a). However, the first and second rear covers 580 and 590 do not necessarily have a symmetrical shape, and in another embodiment, the electronic device 10 may include various shapes of the first and second rear covers 580 and 590. In another embodiment, the first rear cover 580 may be integrally formed with the first housing structure 510 and the second rear cover 590 may be integrally formed with the second housing structure 520.

In an embodiment, the first rear cover 580, the second rear cover 590, the first housing structure 510, and the second housing structure 520 may form a space in which various components of the electronic device 10 (e.g., a printed circuit board or a battery) are disposed. In embodiments, one or more components may be disposed on a rear surface of the electronic device 10 or visually exposed on a rear surface of the electronic device 10. For example, at least a portion of secondary display 190 may be visually exposed through first rear region 582 of first rear cover 580. In another embodiment, one or more components or sensors may be visually exposed through the second rear area 592 of the second rear cover 590. In various embodiments, the sensor may include a proximity sensor and/or a rear camera.

Referring to fig. 2, a hinge cover 530 may be disposed between the first and second housing structures 510 and 520 to conceal internal components (e.g., hinge structures). In an embodiment, the hinge cover 530 may be hidden by a portion of the first case structure 510 and a portion of the second case structure 520 or may be exposed to the outside according to a state (e.g., a flat state or a folded state) of the electronic device 10.

For example, when the electronic device 10 is in a flat state as shown in fig. 1, the hinge cover 530 may be hidden by the first and second housing structures 510 and 520 and thus may not be exposed. In another example, when the electronic device 10 is in a folded state (e.g., a fully folded state) as shown in fig. 2, the hinge cover 530 may be exposed to the outside between the first case structure 510 and the second case structure 520. In another example, the hinge cover 530 may be partially exposed to the outside between the first and second case structures 510 and 520 when the electronic device 10 is in an intermediate state in which the first and second case structures 510 and 520 are folded at a certain angle. In this case, however, the exposed area may be less than when the electronic device 10 is in the fully folded state. In an embodiment, the hinge cover 530 may include a curved surface.

The display 100 may be disposed in a space formed by the foldable housing 500. For example, the display 100 may be mounted in a recess formed by the foldable housing 500 and may form almost the entire front surface of the electronic device 10.

Accordingly, the front surface of the electronic device 10 may include the display 100 and a partial region of the first housing structure 510 and a partial region of the second housing structure 520 adjacent to the display 100. The rear surface of the electronic device 10 may include a first rear cover 580, a partial region of the first housing structure 510 adjacent to the first rear cover 580, a second rear cover 590, and a partial region of the second housing structure 520 adjacent to the second rear cover 590.

The display 100 may refer to a display of which at least a partial area can be transformed into a flat surface or a curved surface. In an embodiment, the display 100 may include a folding area 103, a first area 101 disposed on one side of the folding area 103 (on the left side of the folding area 103 shown in fig. 1), and a second area 102 disposed on the opposite side of the folding area 103 (on the right side of the folding area 103 shown in fig. 1).

The regions of the display 100 shown in fig. 1 are illustrative, and the display 100 may be divided into a plurality of (e.g., four or more, or two) regions according to the structure or function of the display 100. For example, in the embodiment shown in fig. 1, the regions of the display 100 may be divided from each other by the fold region 103 or by a fold axis (axis a) extending parallel to the y-axis. However, in another embodiment, the display 100 may be divided into a plurality of regions with respect to another folding region (e.g., a folding region parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis).

The first region 101 and the second region 102 may have substantially symmetrical shapes with respect to the folding region 103. However, unlike the first region 101, the second region 102 may include the notch 104 cut according to the presence of the sensor region 524, but in other regions, the second region 102 may be symmetrical to the first region 101. In other words, the first region 101 and the second region 102 may each include a portion having a symmetrical shape and a portion having an asymmetrical shape.

Hereinafter, operations of the first and second case structures 510 and 520 and the region of the display 100 according to the state (e.g., the flat state and the folded state) of the electronic device 10 will be described.

In an embodiment, when the electronic device 10 is in a flat state (e.g., fig. 1), the first and second housing structures 510 and 520 may be arranged to face in the same direction while forming an angle of 180 degrees. The surface of the first region 101 of the display 100 and the surface of the second region 102 thereof may face in the same direction (e.g., away from the front surface of the electronic device 10) while forming an angle of 180 degrees. The fold region 103 may form the same plane with the first region 101 and the second region 102.

In an embodiment, the first and second housing structures 510 and 520 may be arranged to face each other when the electronic device 10 is in a folded state (e.g., fig. 2). The surface of the first region 101 of the display 100 and the surface of the second region 102 thereof may face each other while forming a narrow angle (e.g., an angle between 0 and 10 degrees). At least a portion of the fold region 103 may form a curved surface having a predetermined curvature.

In an embodiment, the first housing structure 510 and the second housing structure 520 may be arranged with a particular angle therebetween when the electronic device 10 is in an intermediate state (e.g., fig. 2). The surface of the first region 101 of the display 100 and the surface of the second region 102 thereof may form an angle greater than that in the folded state and smaller than that in the flat state. At least a portion of the folded region 103 may form a curved surface having a predetermined curvature, and the curvature may be smaller than that in the folded state.

Fig. 3 shows an exploded perspective view of an electronic device according to an embodiment.

Referring to fig. 3, in an embodiment, the electronic device 10 may include a display unit 20, a stand assembly 30, a substrate 600, a first housing structure 510, a second housing structure 520, a first rear cover 580, and a second rear cover 590. In the present disclosure, the display unit 20 may be referred to as a display module or a display assembly.

The display unit 20 may include a display 100 and at least one board or layer 140 on which the display 100 is mounted. In an embodiment, the plate 140 may be disposed between the display 100 and the stand assembly 30. The display 100 may be disposed on at least a portion of one surface (e.g., an upper surface with respect to fig. 3) of the plate 140. The plate 140 may be formed in a shape corresponding to the display 100. For example, a partial region of the plate 140 may be formed in a shape corresponding to the recess 104 of the display 100.

The bracket assembly 30 may include: a first bracket 410; a second bracket 420; a hinge structure 300 disposed between the first bracket 410 and the second bracket 420; a hinge cover 530 covering the hinge structure 300 when viewed from the outside; and a wiring member 430 (e.g., a Flexible Printed Circuit (FPC)) crossing the first and second brackets 410 and 420.

In an embodiment, the standoff assembly 30 may be disposed between the plate 140 and the base plate 600. For example, the first support 410 may be disposed between the first region 101 of the display 100 and the first substrate 610. The second bracket 420 may be disposed between the second region 102 of the display 100 and the second substrate 620.

In an embodiment, at least a portion of the wiring member 430 and the hinge structure 300 may be disposed inside the stand assembly 30. The wiring member 430 may be arranged in a direction (e.g., x-axis direction) crossing the first and second brackets 410 and 420. The wiring member 430 may be arranged along a direction (e.g., an x-axis direction) perpendicular to a folding axis (e.g., the y-axis or the folding axis a of fig. 1) of the folding region 103 of the electronic device 10.

As described above, the substrate 600 may include the first substrate 610 disposed at the first supporter 410 side and the second substrate 620 disposed at the second supporter 420 side. The first and second substrates 610 and 620 may be disposed in a space formed by the rack assembly 30, the first and second case structures 510 and 520, the first and second rear covers 580 and 590. Components for implementing various functions of the electronic device 10 may be mounted on the first substrate 610 and the second substrate 620.

The first and second housing structures 510 and 520 may be assembled to be coupled to opposite sides of the stand assembly 30 in a state in which the display unit 20 is coupled to the stand assembly 30. As will be described herein, the first and second housing structures 510, 520 can slide on opposite sides of the carriage assembly 30 and can be coupled with the carriage assembly 30.

In an embodiment, the first housing structure 510 may include a first rotational support surface 512 and the second housing structure 520 may include a second rotational support surface 522 corresponding to the first rotational support surface 512. The first and second rotation supporting surfaces 512 and 522 may include curved surfaces corresponding to curved surfaces included in the hinge cover 530.

In an embodiment, when the electronic device 10 is in a flat state (e.g., the electronic device 10 of fig. 1), the first and second rotational support surfaces 512 and 522 may cover the hinge cover 530 such that the hinge cover 530 is not exposed or minimally exposed on the rear surface of the electronic device 10. Further, when the electronic device 10 is in a folded state (e.g., the electronic device 10 of fig. 2), the first rotation supporting surface 512 and the second rotation supporting surface 522 may rotate along a curved surface included in the hinge cover 530 such that the hinge cover 530 is maximally exposed on the rear surface of the electronic device 10.

Fig. 4 shows a plan view and a cross-sectional view of a display of an electronic device according to an embodiment. In the illustrated embodiment, the display 100 may include a first region 101, a second region 102, and a fold region 103 (or also referred to as a third region) when viewed from above. When the electronic device 10 is in a folded state (e.g., fig. 2), the first region 101 and the second region 102 may face each other, and the folded region 103 may form a curved surface having a predetermined curvature. When the electronic device 10 is in a flat state (e.g., fig. 1), the first region 101 and the second region 102 may face in the same direction, and the fold region 103 may form a flat surface.

The display 100 may have a layer structure 120 comprising a plurality of layers 121, 122, 123 and 124. The layer structure 120 may include: a Polyimide (PI) layer 121 disposed to face a front surface of the electronic device 10; a display panel 122 including a plurality of light emitting elements (e.g., OLEDs); a wiring layer 123 electrically connected to the display panel 122; and a touch sensor layer 124 including a plurality of touch electrodes. In various embodiments, the layer structure 120 may also include a polarization layer and a buffer layer.

In an embodiment, at least a portion of the wiring layer 123 may be formed using a curved surface. The wiring layer 123 may be formed in the form of a thin film on which the wiring is printed. The wiring layer 123 may be formed by printing a wiring on the PI film having flexibility.

In various embodiments, the display panel 122 may include: a light emitting layer in which a light emitting element is arranged; an encapsulation layer covering the light emitting layer; and a thin film transistor layer including a thin film transistor connected to the light emitting element.

In an embodiment, the display 100 may include a first connection portion 130 extending to one side of the display 100 (e.g., in the x-axis direction) and connected with a display driver IC (e.g., the display driver IC 144 of fig. 5). One or more layers of the layer structure 120 of the display 100 may extend to form the first connection 130. The wiring layer 123 electrically connected to the display panel 122 may extend to form the first connection portion 130. The first connection portion 130 may be formed on a side end portion of the first region 101 and/or a side end portion of the second region 102.

In an embodiment, the first connection portion 130 may include a wiring layer 123 and a Bending Protection Layer (BPL)125 for protecting the wiring layer 123. At least a part of the wiring layer 123 may be formed using a curved surface. The bending protection layer 125 may be formed on one surface of the wiring layer 123, and may be formed using a bending surface corresponding to the wiring layer 123 to prevent damage to the wiring layer 123.

Fig. 5 and 6 show diagrams of a display unit of an electronic device according to an embodiment. Fig. 5 and 6 show views of the display unit 20 combining the display 100 and the board 140 of the electronic device 10 described above with reference to fig. 3. In the illustrated embodiment, the display unit 20 may include: a display 100; a board 140 on which the display 100 is disposed; a display driver IC 144 formed on the board 140; a first connection portion 130; a second connecting part 145; a fastening member; and a wiring film 143.

In an embodiment, display 100 may be mounted on a first surface (e.g., first surface 1401 of fig. 8) of panel 140, and stand assembly 30 (e.g., stand assembly 30 of fig. 3) may be disposed on a second surface 1402 of panel 140 opposite to the first surface (e.g., first surface 1401 of fig. 8) of panel 140.

The display driver IC 144 may be disposed on at least a portion of the second surface 1402 of the plate 140. The display driver IC 144 may be electrically connected with the display 100 through the first connection part 130, and may be electrically connected with a main control circuit (not shown) (e.g., at least one processor) formed on a substrate (e.g., the substrate 600 of fig. 3) of the electronic device 10 through the second connection part 145. The display driver IC 144 may drive the display 100 and may be controlled by a main control circuit (e.g., main chip 650 of FIG. 22) of the electronic device 10.

In an embodiment, at least a portion of the first connection portion 130 may include a curved surface having a predetermined curvature, and the curved surface may surround at least a portion of an end of the plate 140 (e.g., a left end of the plate 140 with respect to the front surface of fig. 5 and 6).

In an embodiment, the wiring film 143 may be formed on at least a portion of the second surface 1402 of the plate 140. The wiring film 143 may include a film on which a wiring for electrically connecting the first connection portion 130 and the display driver IC 144 is printed.

In an embodiment, the electronic device 10 may further include a first connector 147 connecting the wiring film 143 and the first connection portion 130, and a second connector 148 connecting the wiring film 143 and the display driver IC 144. The display 100 and the display driver IC 144 may be electrically connected through the wiring film 143, the first connector 147, and the second connector 148.

In an embodiment, the boss 146 may be formed on the second surface 1402 of the plate 140 and may engage with a corresponding boss (e.g., corresponding boss 490 of fig. 16a) formed on the cartridge assembly 30 (e.g., cartridge assembly 30 of fig. 3). The boss 146 and the corresponding boss may be formed in a protruding shape, and a space may be formed between the plate 140 and the bracket assembly 30 by the combination of the boss 146 and the corresponding boss. The display driver IC 144, the wiring film 143, the first connection portion 130, the second connection portion 145, the first connector 147, and the second connector 148, which have been described above, may be disposed in the space.

In an embodiment, the second connection part 145 may be disposed on an end of the second surface 1402 of the plate 140. The second connection member 145 can include a curved surface that surrounds a portion of an end of the rack assembly 30 (e.g., the rack assembly 30 of fig. 3) disposed on the second surface 1402 of the plate 140. For example, the second connection part 145 may be formed in a "U" or "_" shape. As shown in fig. 5, the second connection part 145 may be disposed at a lower side of the second surface 1402 of the plate 140. Further, as shown in fig. 6, the second connection part 145 may be disposed at an upper side of the second surface 1402 of the plate 140.

Fig. 7 shows a diagram of a portion of a cross-section of the display 100 and the plate 140 when an electronic device (e.g., the electronic devices shown in fig. 5 and 6) is in a flat state, according to an embodiment. Fig. 8 shows a perspective view of the display 100 and the board 140 when the electronic device is in a folded state according to an embodiment.

Referring to fig. 7, the plate 140 may include: a first plate 141 on which the first region 101 of the display 100 and a portion of the folding region 103 are disposed; and a second plate 142, the second region 102 of the display 100 and the rest of the folding region 103 being disposed on the second plate 142. The plate 140 may also include an adhesive layer 153 disposed between the plate 140 and the display 100.

In an embodiment, the adhesive layer 153 may include a double-sided adhesive layer 1531 and a single-sided adhesive layer 1532 disposed between the display 100 and the board 140. For example, the single-sided adhesive layer 1532 may be provided in at least a partial region between the folding region 103 and the first board 141 and/or the second board 142. The single-sided adhesive layer 1532 may be bonded to the folding region 103, but may not be bonded to the first board 141 and the second board 142 of the board 140.

In an embodiment, the adhesive layer 153 may be disposed only between at least a portion of the first plate 141 and the first region 101 of the display 100. For example, the single-sided adhesive layer 1532 may not be formed between the first board 141 and the folding region 103. The folding area 103 may not be combined with the first plate 141.

In an embodiment, the adhesive layer 153 may be disposed only between at least a portion of the second plate 142 and the second region 102 of the display 100. For example, the single-sided adhesive layer 1532 may not be formed between the second board 142 and the folding region 103. The fold region 103 may not be bonded to the second panel 142.

Referring to fig. 8, when the electronic device 10 is in a folded state (e.g., the electronic device of fig. 2), a portion of the first board 141 and a portion of the second board 142 may be separated from the display 100. The separated portions of the first and second boards 141 and 142 may be unbonded areas of the unbonded display 100 or single-sided adhesive 1532 bonded only to the folding area 103 of the display 100. The unbonded area or the single-sided adhesive layer 1532 may correspond to the folded area of the display 100.

Referring to fig. 8, the display 100 may include a first region 101, a second region 102 (not shown), and a folding region 103. When the electronic device 10 is in a folded state, at least a portion of the fold region 103 may form a curved surface, and the first region 101 and the second region 102 may be flat. The first surface 111 included in the first region 101 and the first surface 111 included in the second region 102 may face each other. The second surface 112 included in the first region 101 and the second surface 112 included in the second region 102 may face opposite directions.

Referring again to fig. 7, when the electronic device 10 is in a flat state (e.g., the electronic device of fig. 1), the first region 101, the second region 102, and the fold region 103 may be flat. In an embodiment, when the electronic device 10 is in a folded or intermediate state, at least a portion of the folded region 103 may form a curved surface, and the first region 101 and the second region 102 may be flat. The curvature of the fold region 103 may increase when the electronic device 10 moves from the flat state to the intermediate state.

Hereinafter, one embodiment of the bracket assembly 30 shown in fig. 3 will be described with reference to fig. 9 to 16. Fig. 9 illustrates a diagram of a front surface and a back surface of a stand assembly of an electronic device (e.g., electronic device 10), according to an embodiment. Fig. 10 illustrates an exploded perspective view of a stand assembly of an electronic device, according to an embodiment. Fig. 11a and 11b show a wiring member of an electronic device and a view of fixing the wiring member to a support according to an embodiment.

Referring to fig. 9, in an embodiment, the stand assembly 30 may include a hinge structure 300 and a stand 400 disposed inside a hinge cover 530. The bracket 400 may include a first bracket 410, a second bracket 420, a hinge cover 530 disposed between the first bracket 410 and the second bracket 420, a first hinge bracket 450 connecting the hinge structure 300 and the first bracket 410, a second hinge bracket 460 connecting the hinge structure 300 and the second bracket 420, and a wiring member 430.

In an embodiment, the first bracket 410 may include: a first surface 411, the plate 140 being disposed on the first surface 411; and a second surface 412 opposite to the first surface 411. The first bracket 410 may be connected to the hinge structure 300 by a first hinge bracket 450. The wiring member 430 may be disposed on the first surface 411 of the first bracket 410.

In an embodiment, the second bracket 420 may include: a first surface 421, the plate 140 being disposed on the first surface 421; and a second surface 422 opposite to the first surface 421. The second bracket 420 may be connected to the hinge structure 300 by a second hinge bracket 460. The wiring member 430 may be disposed on the first surface 421 of the second supporter 420.

In an embodiment, the first bracket 410 and the second bracket 420 may be foldably connected together by a hinge structure 300 and hinge brackets 450 and 460, as will be described herein. When the electronic device 10 is in a folded state, the first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420 may face each other. When the electronic device 10 is in a flat state, the first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420 may face in the same direction.

In embodiments, the electronic device 10 may include one or more hinge structures 300. One or more hinge structures 300 may be disposed inside the hinge cover 530. One or more hinge structures 300 may be arranged along the y-axis direction. The hinge structure 300 may be fixedly located inside the hinge cover 530 and may be disposed in an area corresponding to the folding area 103 of the display 100. At least one wiring member 430 may be disposed between the hinge structures 300. As will be described herein, the hinge structure 300 may be connected with the stand 400 by hinge brackets 450 and 460, and the first stand 410 and the second stand 420 may be folded by the hinge structure 300. The details will be described below with reference to fig. 12.

Referring to fig. 10, in an embodiment, the stand assembly 30 may further include a first hinge bracket 450 coupled to the first bracket 410 and a second hinge bracket 460 coupled to the second bracket 420. The first hinge bracket 450 and the second hinge bracket 460 may connect the hinge structure 300 with the first bracket 410 and the second bracket 420, respectively.

In an embodiment, the first guide hole 451 and the third guide hole 453 may be formed in the first hinge bracket 450. A second guide hole 461 and a fourth guide hole 463 may be formed in the second hinge bracket 460. At least a portion of the wiring member 430 may be inserted into the guide holes 451, 453, 461, and 463. When the electronic device 10 is folded, the guide holes 451, 453, 461, and 463 may partially guide the movement of the wiring member 430. For example, at least a portion of the first wiring member 431 may be inserted into a first guide hole 451 formed in the first hinge bracket 450 and a second guide hole 461 formed in the second hinge bracket 460. At least a portion of the second wiring member 432 may be inserted into the third guide hole 453 formed in the first hinge bracket 453 and the fourth guide hole 463 formed in the second hinge bracket 460.

In an embodiment, the rack assembly 30 may include at least one routing member 430. The wiring member 430 may be arranged along a direction (e.g., x-axis direction) perpendicular to the folding axis (e.g., y-axis direction). The wiring member 430 may traverse the first bracket 410 and the second bracket 420 disposed at opposite sides of the hinge structure 300. The wiring member 430 may be made of a flexible conductive material, and thus may be prevented from being damaged according to the folding of the electronic device 10. In various embodiments, the extending direction of the wiring member 430 is not necessarily limited to a direction perpendicular to the folding axis (e.g., x-axis direction).

In an embodiment, the wiring member 430 may include a first wiring member 431 and a second wiring member 432. At least a portion of the first wiring member 431 may be exposed on the first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420 through the first and second guide holes 451 and 461. Likewise, at least a portion of the second wiring member 432 may be exposed on the first surface 411 of the first support 410 and the first surface 421 of the second support 420 through the third and fourth guide holes 453 and 463.

Referring again to fig. 9, in an embodiment, the first wiring member 431 may include third and fourth connectors 4311 and 4312 formed on opposite ends thereof, and the second wiring member 432 may include fifth and sixth connectors 4321 and 4322 formed on opposite ends thereof. The third connector 4311 and the fifth connector 4321 may be disposed on the second surface 412 of the first bracket 410, and the fourth connector 4312 and the sixth connector 4322 may be disposed on the second surface 422 of the second bracket 420. The connector may be electrically connected to a first substrate (e.g., first substrate 610 of fig. 3) disposed on second surface 412 of first support 410 and/or a second substrate (e.g., second substrate 620 of fig. 3) disposed on second surface 422 of second support 420.

Referring to fig. 9 and 11a, a first opening 413 may be formed in the first bracket 410, and a second opening 423 may be formed in the second bracket 420. The first and second openings 413 and 423 may be disposed in a direction (e.g., an x-axis direction) crossing the first and second brackets 410 and 420. The hinge structure 300 may be disposed between the first opening 413 and the second opening 423. The first wiring member 431 may extend from the second surface 412 of the first bracket 410 to the first surface 411 of the first bracket 410 through the first opening 413. The first wiring member 431 extending to the first surface 421 of the second supporter 420 may extend to the second surface 422 of the second supporter 420 through the second opening 423.

Referring to fig. 9 and 11a, a third opening 417 may be formed in the first bracket 410 and a fourth opening 427 may be formed in the second bracket 420. In various embodiments, the fourth opening 427 may be a slot formed in an end of the first bracket 410. The third and fourth openings 417 and 427 may be disposed in a direction (e.g., an x-axis direction) crossing the first and second cradles 410 and 420. The hinge structure 300 may be disposed between the third opening 417 and the fourth opening 427. The second wiring member 432 may extend from the second surface 412 of the first bracket 410 to the first surface 411 of the first bracket 410 through the third opening 417. The second wiring member 432 extended to the first surface 421 of the second support 420 may be extended to the second surface 422 of the second support 420 through the fourth opening 427.

Referring to fig. 11a and 11b, the first and second wiring members 431 and 432 may be fixed to the first surface 401 of the bracket 400. As described above, the first and second wiring members 431 and 432 may be fixed first by being inserted into the guide holes 451, 453, 461 and 463, and second by the position fixing hole 439a or the position fixing recess 439b formed in the wiring member 430 and the position fixing protrusion 428 formed on the bracket 400.

In an embodiment, the position fixing protrusions 428 inserted into the position fixing holes 439a or the position fixing recesses 439b may be formed on the first surface 401 of the bracket 400. The position fixing protrusion 428 may have a shape corresponding to the position fixing hole 439a or the position fixing recess 439 b.

In various embodiments, the position fixing recess 439b may be a semicircular recess, as shown on the left side of fig. 11 b. The position fixing protrusion 428, the position fixing recess 439b, or the position fixing hole 439a shown in the drawings are merely illustrative, and the fixing method is not limited to the shown fixing method. The present disclosure may include various fixing methods for fixing the wiring member 430 to the bracket 400.

Fig. 12a, 12b and 12c show diagrams of one embodiment of a hinge structure 300 of the electronic device of fig. 9 and 10. Referring to fig. 12a, 12b, and 12c, in an embodiment, each of the hinge structures 300 may include a first bracket housing 312, first housing washers 301 and 303, first elastic members 302, a first internal gear 320, a first gear washer 304, a first fixing bracket 332, a first folding shaft 340 (e.g., a spur gear), a first main gear 341, a first gear 342 (e.g., a spur gear), a second gear 352 (e.g., a spur gear), a second main gear 351, a second folding shaft 350 (e.g., a spur gear), a second fixing bracket 334, a second gear washer 309, a second internal gear 370, a second elastic member 307, second housing washers 306 and 308, and a second bracket housing 314. Here, a direction in which the first folding axis 340 and the second folding axis 350 extend is referred to as an axial direction. In the drawings, the left direction is referred to as a first axial direction (e.g., direction (r)), and the right direction is referred to as a second axial direction (e.g., direction (r)).

In an embodiment, the first main gear 341 may be formed on the first folding shaft 340. The first folding shaft 340 (or the first shaft) may pass through the first fixing bracket 332 in the first axial direction (in the left direction in the drawing) and may pass through the second fixing bracket 334 in the second axial direction (in the right direction in the drawing). The first main gear 341 formed on the first folding shaft 340 may be engaged with an internal gear of the first internal gear 320. The first folding shaft 340 may also extend in the first axial direction of the first inner gear 320, and may be combined with the first case washers 301 and 303 and the first elastic member 302. Further, the first folding shaft 340 may also extend in the second axial direction of the second fixing bracket 334, and may be combined with the second gear ring 309.

In an embodiment, the second main gear 351 may be formed on the second folding shaft 350. The second folding axis 350 (or the second axis) may pass through the first fixing bracket 332 in the first axial direction (in the left direction in the drawing) and may pass through the second fixing bracket 334 in the second axial direction (in the right direction in the drawing). The second main gear 351 formed on the second folding shaft 350 may be engaged with an internal gear of the second internal gear 370. The second folding shaft 350 may also extend in the second axial direction of the second internal gear 370, and may be coupled with the second case washers 306 and 308 and the second elastic member 307. In addition, the second folding shaft 340 may also extend in the first axial direction of the first fixing bracket 332 and may be coupled with the first gear washer 304.

In an embodiment, one side of the first gear 342 may be engaged with the first main gear 341 formed on the first folding shaft 340, and the opposite side thereof may be engaged with the second gear 352. Accordingly, when the first folding shaft 340 rotates, the first gear 342 may transmit torque to the second gear 352. The first gear 342 may be disposed in a cavity formed by combining the first and second fixed brackets 332 and 334.

In an embodiment, one side of the second gear 352 may be engaged with the second main gear 351 formed on the second folding shaft 350, and the opposite side thereof may be engaged with the first gear 342. When the second folding shaft 350 rotates, the second gear 352 may transmit torque to the first gear 342. The second gear 352 may be disposed in a cavity formed by combining the first and second fixing brackets 332 and 334. According to various embodiments, the size and number of idler gears (e.g., first gear 342 and second gear 352) may be varied to reduce the thickness of electronic device 10. Accordingly, the electronic device of the present disclosure (e.g., electronic device 10 of fig. 1) is not limited to the number and size of gears shown in the figures.

In an embodiment, the first carrier housing 312 may be disposed adjacent to the first internal gear 320 and may be fixed to the first internal gear 320. For example, the first bracket shell 312 may include at least one protrusion formed thereon in the second axial direction (in the right direction in the drawing), and the at least one protrusion may be fixedly inserted into a recess formed in the first inner gear 320. The first bracket case 312 may have a circular arc-shaped section with a predetermined central angle (e.g., a right angle).

In an embodiment, as will be described herein, the upper surface of the first bracket case 312 may be combined with the second hinge bracket 460 (e.g., screw combination), and the second hinge bracket 460 may be combined with the second bracket 420. Thus, when the electronic device 10 is folded, the first stand housing 312 can be folded together with the second housing structure 520. The bent portion of the first supporter case 312 may be formed to correspond to the inner surface of the hinge cover 530. The first bracket case 312 may preferably be made of a material (e.g., metal) having a predetermined strength. However, without being limited thereto, the first bracket housing 312 may be made using various materials.

In an embodiment, as will be described herein, the upper surface of the second bracket housing 314 may be combined with the first hinge bracket 450, and the first hinge bracket 450 may be combined with the first bracket 410. Thus, when the electronic device 10 is folded, the second stand housing 314 can be folded together with the first housing structure 510. The second cradle housing 314 may have substantially the same shape and material as the first cradle housing 312 and may be disposed on an opposite side of the first cradle housing 312. For example, the second carrier housing 314 may be fixed to one surface of the second inner gear 370 facing the second axial direction. The outer circumferential surface of the second bracket housing 314 may include a curved portion having a predetermined curvature, and the curved portion may correspond to the inner surface of the hinge cover 530.

In an embodiment, the first carrier case 312 may be coupled to one surface of the first internal gear 320 facing the first axial direction (left direction in the drawing), and the first fixed carrier 332 may be disposed in the second axial direction (right direction in the drawing) with respect to the first internal gear 320. The first inner gear 320 may be coupled to the first fixed carrier 332 to be rotatable with respect to the first fixed carrier 332. The first internal gear 320 and the first carrier case 312 coupled to the first internal gear 320 are rotatable along a side surface of the first fixed carrier 332. The first inner gear 320 may have a half elliptical shape, and an inner gear engaged with the first main gear 341 formed on the first folding shaft 340 may be included inside thereof. The inner gear may be formed in the shape of a semi-elliptical arc. The first main gear 341 formed on the first folding shaft 340 may be engaged with an internal gear. The first inner gear 320 may be made of metal having a predetermined strength. For example, the first inner gear 320 may be made of the same material as that of the first carrier housing 312. The material of the first inner gear 320 described in various embodiments is not limited to a specific material.

In an embodiment, the second inner gear 370 may be disposed between the second fixed carrier 334 and the second carrier housing 314. The shape and material of second inner gear 370 may be substantially the same as those of first inner gear 320 described above. For example, the second internal gear 370 may have a semi-elliptical shape having a size smaller than that of the second fixing bracket 334, and may include an internal gear in a predetermined region thereof, which is engaged with the second main gear 351 formed on the second folding shaft 350.

In an embodiment, the first fixed carrier 332 may be disposed between the first inner gear 320 and the second fixed carrier 334. The first fixed bracket 332 may have a semi-elliptical shape having a size greater than that of the first inner gear 320. The first fixing bracket 332 may include a hole 333 into which a portion of the first folding shaft 340 is inserted and a hole 335 into which a portion of the second folding shaft 350 is inserted. The first fixing bracket 332 may include a hole 331 vertically formed through the center thereof (from the center of the flat upper end of the semi-elliptical shape to the lower end thereof). A boss formed on the hinge cover 530 may be inserted into a hole 331 vertically formed through the first fixing bracket 332.

In an embodiment, the second fixed carrier 334 may be disposed between the first fixed carrier 332 and the second inner gear 370. The second fixed carrier 334 may have substantially the same shape as the first fixed carrier 332 (e.g., a semi-elliptical shape having a size greater than that of the second inner gear 370). The second fixing bracket 334 may include through holes 335 and 333, and the first folding shaft 340 and the second folding shaft 350 pass through the through holes 333 and 335. The second fixing bracket 334 may include a hole 331 vertically formed through the second fixing bracket 334 from an upper end to a lower end thereof, and a boss formed on the hinge cover 530 may be inserted into the hole 331.

In an embodiment, the first case washers 301 and 303 may be disposed between the first carrier case 312 and the first inner gear 320, and the first elastic member 302 may be disposed between the first case washers 301 and 303. The first case washers 301 and 303 and the first elastic member 302 may be mounted in a recess formed at one side of the first inner gear 320. A hole through the first inner gear 320 may be provided inside the recess. A portion of the first folding shaft 340 passing through the first and second fixing brackets 332 and 334 may be disposed in the hole.

In an embodiment, the second case washers 306 and 308 and the second elastic member 307 may be installed in a recess (or hole) formed at one side of the second inner gear 370 and may be coupled with the second folding shaft 350. The second elastic member 307 may be disposed between the second case washers 306 and 308 to apply elastic force to the second case washers 306 and 308 in the direction of the second folding axis 350.

In an embodiment, the first gear washer 304 may be disposed between the first inner gear 320 and the first fixed carrier 332. For example, the first gear washer 304 may be installed in a recess (or hole) formed on the first fixing bracket 332 while being coupled to the end of the second folding shaft 350. The second folding shaft 350 passing through the first and second fixing brackets 332 and 334 may be inserted into the first gear washer 304.

In an embodiment, the second gear washer 309 may be installed in a recess formed on the second fixing bracket 334 while being coupled to the end of the first folding shaft 340.

Referring to fig. 12b and 12c, in an embodiment, sides of the first and second fixing brackets 332 and 334 of the hinge structure 300 (e.g., a right side of the first fixing bracket 332 and a left side of the second fixing bracket 334 with respect to the drawings) may be disposed to face each other. The first folding shaft 340 may pass through a hole 333 that is positioned lower with respect to the drawing among holes formed in the first and second fixing brackets 332 and 334. The first main gear 341 formed on the first folding shaft 340 may be engaged with an internal gear of the first internal gear 320. The second folding shaft 350 may pass through a hole 335 located upward with respect to the drawing among holes formed in the first and second fixing brackets 332 and 335. The second main gear 351 formed on the second folding shaft 350 may be engaged with an internal gear of the second internal gear 370. The first carrier housing 312 may be coupled to a surface of the first internal gear 320 facing the first axial direction (left direction in the drawing), and the second carrier housing 314 may be coupled to a surface of the second internal gear 370 facing the second axial direction (right direction in the drawing).

In an embodiment, the first bracket housing 312 may be combined with the second hinge bracket 460, and the second bracket housing 314 may be combined with the first hinge bracket 450. The first hinge bracket 450 may be coupled to the first bracket 410, and the second hinge bracket 460 may be coupled to the second bracket 420.

In an embodiment, as shown in fig. 12c, when the electronic device 10 is in a folded state (e.g., the electronic device of fig. 2), the first carrier housing 312 and the first internal gear 320 may be disposed in a state rotated by a first angle (e.g., 90 degrees) in a first direction (e.g., CW direction in the drawing) with respect to the first fixed carrier 332 from an initial state. Likewise, the second carrier housing 314 and the second internal gear 370 may be disposed in a state of being rotated by a first angle (e.g., 90 degrees) in a second direction (e.g., CCW direction in the drawing) with respect to the second fixed carrier 334 from an initial state. The first direction and the second direction may be opposite to each other. Further, since the fixing bracket 330 is fixed to the hinge cover 530, the fixing bracket 330 does not rotate.

Fig. 13a, 13b, 13c and 13d show diagrams of a wiring member of an electronic device according to various embodiments. Fig. 13a shows a view of a wiring member provided in an inner space of a hinge cover. Fig. 13b is a cross-sectional view taken along line a-a' of fig. 9. Fig. 13c shows a diagram of layers constituting the wiring member. Hereinafter, the wiring member 430 and the mounting structure of the wiring member 430 will be described with reference to fig. 13a, 13b, and 13 c.

Referring to fig. 13a, 13b, and 13c, the wiring member 430 may extend from the first bracket 410 to the second bracket 420 across the hinge cover 530. At least a portion of the wiring member 430 may be disposed in the inner space 531 of the hinge cover 530. Referring to fig. 13a, the wiring member 430 disposed in the inner space 531 of the hinge cover 530 may extend to the first and second brackets 410 and 420 through the guide holes 451 and 461 and the openings 413 and 423.

Specifically, referring to fig. 13b, the wiring member 430 may extend from the second surface 412 of the first bracket 410 to the first surface 411 of the first bracket 410 through the first opening 413. The wiring member 430 extending to the first surface 411 of the first bracket 410 may extend to the inner space 531 of the hinge cover 530 through the first guide hole 451 of the first hinge bracket 450. The wiring member 430 extending into the hinge cover 530 may extend to the first surface 421 of the second bracket 420 through the second guide hole 461 of the second hinge bracket 460. The first wiring member 430 extending to the first surface 421 of the second supporter 420 may again extend to the second surface 422 through the second opening 423 of the second supporter 420. Accordingly, the wiring member 430 may electrically connect the circuit boards disposed on the second surface 412 of the first bracket 410 and the second surface 422 of the second bracket 420.

In an embodiment, as shown in fig. 13b, the wiring member 430 may include: a variable region 4301 accommodated in the hinge cover 530; a fixed region 4302 extending from an opposite side of the variable region 4301; and an extension region 4303 extending from the opposite side of the fixed region 4302. The fixed region 4302 may include a first fixed region 43021 fixed to the first support 410 and a second fixed region 43022 fixed to the second support 420.

In an embodiment, the first fixing area 43021 may be attached to a portion of the first surface 411 of the first bracket 410 between the first opening 413 formed in the first bracket 410 and the inner space 531 of the hinge cover 530. The second fixing area 43022 may be attached to a portion of the first surface 421 of the second bracket 420 between the second opening 423 formed in the second bracket 420 and the inner space 531 of the hinge cover 530.

Referring to fig. 13b, 13c and 13d, the variable region 4301 may be formed between a first fixed region 43021 attached to the first bracket 410 and a second fixed region 43022 attached to the second bracket 420. The variable region 4301 may be bent in the inner space 531 of the hinge cover 530 to have a predetermined curvature. When the electronic device 10 is in a flat state, the wiring member 430 may be disposed in contact with an inner surface of the hinge cover 530. When the electronic device 10 is in a folded state, the wiring member 430 may be spaced apart from the inner surface of the hinge cover 530 by a predetermined distance.

In an embodiment, the variable area 4301 may include a straight area 4304, at least a portion of the straight area 4304 being formed in a straight line. This can prevent the wiring member 430 from being damaged due to the hinge brackets 450 and 460 moving into the inner space 531 of the hinge cover 530 when the hinge structure 300 rotates.

In an embodiment, the extension region 4303 may be formed at an opposite side of the fixing region 4302 and may extend to a substrate disposed on a second surface of the first bracket 410 and/or the second bracket 420. At least a portion of the extension region 4303 may be disposed on the second surface 412 of the first support 410 and/or the second surface 422 of the second support 420.

Referring to fig. 13c, the wiring member 430 may include a protective layer 4331 and a first adhesive layer 4332 disposed between the wiring member 430 and the first surface 401 of the support 400. In an embodiment, first adhesive layer 4332 may comprise double-sided tape.

The fixing region 4302 of the wiring member 430 may include an attachment region 4302a attached to the first surface 401 of the support 400 by a first adhesive layer 4332 and a protection region 4302b protected by a protection layer 4331. The protective layer 4331 may be disposed under the fixing region 4302 of the wiring member 430. The protective layer 4331 may prevent the surface of the wiring member 430 from being damaged due to the hinge brackets 450 and 460 rotated to the inner space 531 of the hinge cover 530 when the hinge structure 300 performs the folding operation, or may prevent the surface of the wiring member 430 from being damaged due to the hinge cover 530.

In an embodiment, the protective layer 4331 may include a SUS material. However, without being limited thereto, the protective layer 4331 may include a material having strength sufficient to protect the wiring member 430.

In an embodiment, the wiring member 430 may include a plurality of wiring layers and a second adhesive layer 4333 disposed between the wiring layers. The second adhesive layer 4333 may also include a PP material.

Fig. 14a, 14b and 14c are diagrams illustrating a combination relationship of a cradle assembly of an electronic device according to an embodiment. Hereinafter, the combination of the hinge cover 530, the hinge structure 300, the first hinge bracket 450, the second hinge bracket 460, the first bracket 410, and the second bracket 420, which have been described above, will be described with reference to fig. 14a and 14 c.

Referring to fig. 14a, a plurality of hinge structures 300 may be disposed between a first bracket 410 and a second bracket 420. Each of the hinge structures 300 may include a fixing bracket 330 fixed to the hinge cover 530, and a first bracket case 312 and a second bracket case 314 disposed on opposite sides of the fixing bracket 330. With respect to the figures, the first bracket shell 312 may be adjacent to the second bracket 420 and the second bracket shell 314 may be adjacent to the first bracket 410.

In an embodiment, one or more first fastening holes 415 may be formed in the first bracket 410. In an embodiment, one or more second fastening holes 425 may be formed in the second bracket 420. In an embodiment, one or more fourth fastening holes 311 may be formed in the first bracket case 312 of the hinge structure 300. In an embodiment, one or more third fastening holes 313 may be formed in the second bracket case 314 of the hinge structure 300. In an embodiment, one or more fixing holes 331 may be formed in the fixing bracket 330 of the hinge structure 300.

Referring to fig. 14b, the first and second hinge brackets 450 and 460 may extend in a direction parallel to the folding axis (e.g., the y-axis, the first and second folding axes 340 and 350 of fig. 12 a). The first hinge bracket 450 may be combined with the first bracket 410 and the hinge structure 300, and the second hinge bracket 460 may be combined with the second bracket 420 and the hinge structure 300.

In an embodiment, a first corresponding fastening hole 455 corresponding to the first fastening hole 415 formed in the first bracket 410 may be formed in the first hinge bracket 450. A third corresponding fastening hole 457 corresponding to the third fastening hole 313 formed in the second bracket case 314 of the hinge structure 300 may be formed in the first hinge bracket 450. A second corresponding fastening hole 465 corresponding to the second fastening hole 425 formed in the second bracket 420 may be formed in the second hinge bracket 460. A fourth corresponding fastening hole 467 corresponding to the fourth fastening hole 311 formed in the first bracket case 312 of the hinge structure 300 may be formed in the second hinge bracket 460.

Referring to fig. 14c, in an embodiment, the second bracket 420 and the second hinge bracket 460 may be combined by a fastening member 480 (e.g., a screw) passing through the second fastening hole 425 and the second corresponding fastening hole 465. Likewise, the first bracket 410 and the first hinge bracket 450 may be coupled by a fastening member 480 (e.g., a screw) passing through the first fastening hole 415 and the first corresponding fastening hole 455. Further, in the embodiment, the second hinge bracket 460 and the first bracket case 312 may be combined by a fastening member 480 passing through the fourth fastening hole 311 and the fourth corresponding fastening hole 467. Likewise, the first hinge bracket 450 and the second bracket case 314 may be coupled by a fastening member 480 passing through the third fastening hole 313 and the third corresponding fastening hole 457.

Accordingly, the first and second stand housings 312 and 314 may be coupled to be rotatable about a folding axis (e.g., the first folding axis 340 of fig. 12a and/or the second folding axis 350 of fig. 12) in the hinge cover 530. Accordingly, the second hinge bracket 460 may rotate as the first bracket housing 312 rotates, and the second bracket 420 coupled to the second hinge bracket 460 may rotate together. In addition, the first hinge bracket 450 may rotate as the second bracket housing 314 rotates, and the first bracket 410 coupled to the first hinge bracket 450 may rotate together.

Fig. 15a, 15b and 15c show diagrams of an assembly sequence of a rack assembly of an electronic device according to an embodiment. In an embodiment, the stand assembly 30 may include a first stand 410, a second stand 420, a hinge cover 530 disposed between the first stand 410 and the second stand 420, and a hinge structure 300 disposed in the hinge cover 530.

Referring to fig. 15a, the first bracket 410 and the second bracket 420 may be disposed at opposite sides of the hinge cover 530. The first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420 may be disposed to face the same direction. The hinge cover 530 may be disposed such that the hinge structure 300 provided in the hinge cover 530 faces the same direction as the first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420. The hinge structure 300 may be fixed in the hinge cover 530. As described above, the fixing member (e.g., the fixing member 532 of fig. 10) vertically formed in the hinge cover 530 may be inserted into the fixing hole (e.g., the fixing hole 331 of fig. 12 b) formed in the fixing bracket (e.g., the fixing bracket 330 of fig. 10) of the hinge structure 300, and thus the hinge structure 300 may be fixed.

Referring to fig. 15b, the wiring member 430 may be mounted on an assembly including the first bracket 410, the second bracket 420, the hinge cover 530, and the hinge structure 300. The first wiring member 431 may be inserted into the first opening 413 formed in the first bracket 410 and the second opening 423 formed in the second bracket 420. Opposite ends of the first wiring member 431 may be disposed on the second surfaces (the second surfaces 412 and 422 of fig. 13 b) of the first and second brackets 410 and 420, and a portion between the opposite ends may be received in the hinge cover 530. The second wiring member 432 may be inserted into a third opening 417 formed in the first bracket 410 and a fourth opening 427 formed in the second bracket 420. Opposite ends of the second wiring member 432 may be disposed on the second surfaces (the second surfaces 412 and 422 of fig. 13 b) of the first and second brackets 410 and 420, and at least a portion between the opposite ends (e.g., the variable region 4301 of fig. 13 b) may be accommodated in the hinge cover 530. As described above with reference to fig. 13b, the wiring members 431 and 432 may be attached to the first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420 through a fixing region (e.g., the fixing region 4302 of fig. 13 b).

Referring to fig. 15c, the first hinge bracket 450 and the second hinge bracket 460 may be coupled to an assembly including the first bracket 410, the second bracket 420, the hinge cover 530, and the hinge structure 300.

In an embodiment, the first fastening hole 415 of the first bracket 410 and the first corresponding fastening hole 455 of the first hinge bracket 450 may be fastened together, and the third fastening hole 313 of the hinge structure 300 and the third corresponding fastening hole 457 of the first hinge bracket 450 may be fastened together. Accordingly, the first bracket 410 may be coupled to the hinge structure 300 to be rotatable.

In an embodiment, the second fastening hole 425 of the second bracket 420 and the second corresponding fastening hole 465 of the second hinge bracket 460 may be fastened together, and the fourth fastening hole 311 of the hinge structure 300 and the fourth corresponding fastening hole 467 of the second hinge bracket 460 may be fastened together. Accordingly, the second bracket 420 may be coupled to the hinge structure 300 to be rotatable.

As described above, the bonding may be performed by using the fastening member 480 passing through the fastening holes 415, 425, 311, and 313 and the corresponding fastening holes 455, 465, 467, and 457. However, this is merely illustrative, and the present disclosure may include various fastening methods between the bracket 400 and the hinge structure 300.

Fig. 16a and 16b are diagrams illustrating a combined state of a stand assembly (e.g., the stand assembly 30 of fig. 3) and a display module (e.g., the display unit 20 of fig. 3) of an electronic device according to an embodiment. Referring to fig. 16a and 16b, the stand assembly 30 may include a first stand 410, a second stand 420, a hinge cover 530, a hinge structure (e.g., the hinge structure 300 of fig. 12 a), and hinge stands 450 and 460. In addition, the display module 20 may include a display 100 and a board 140.

Referring to fig. 16a, in an embodiment, the display module 20 may be disposed on one surface of the first bracket 410 and one surface of the second bracket 420. The first bracket 410 and the second bracket 420 may be coupled to the plate 140 of the display module 20 by boss fastening. For example, one or more corresponding bosses 490 may be formed on the first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420, and the boss 146 may be formed on the second surface 1402 of the plate 140 facing the first surface 411 of the first bracket 410 and the first surface 421 of the second bracket 420. One of the boss 146 and the corresponding boss 490 may be a protrusion, and the other may be a concave member into which the protrusion is inserted.

In an embodiment, the first bracket 410 and the second bracket 420 may have a sidewall 404, the sidewall 404 surrounding at least a portion of the board 140 on which the display 100 is mounted. The sidewall 404 may be formed on at least a portion of the outer circumference of the first bracket 410 and the second bracket 420. A recess 403 corresponding to the recess 104 of the display 100 may be formed in the second bracket 420. The sidewall 404 may not be formed on the recess 403, and a sensor region (e.g., the sensor region 524 of fig. 1) of a housing (e.g., the second housing structure 520 of fig. 1) may be disposed on the recess 403.

Fig. 16b shows a cross-section of a partial area of an assembly in which the bracket assembly 30 and the display module 20 are combined in an embodiment. In the present disclosure, the display module may be referred to as a display unit (e.g., the display unit 20 of fig. 3). Referring to the upper portion 1610 shown in fig. 16b, the display 100 may include a plurality of layers, and the plurality of layers may include a PI layer 121 forming the first surface 111 of the display 100. The sidewall 404 and the display 100 may be spaced apart from each other by a first gap L1. Referring to the lower portion 1620 as shown in FIG. 16b, the sidewalls 404 and the display 100 may be spaced apart from each other by a second gap L2. Referring to side 1630 shown in fig. 16b, sidewall 404 and display 100 may be spaced apart from each other by a third gap L3.

In various embodiments, the first, second, and third gaps L1, L2, L3 may include assembly tolerances. Assembly tolerances may mean allowable errors when assembling the components within the limits that preserve the functionality of the components and the assembly.

In various embodiments, the third gap L3 may be greater than the first gap L1 and/or the second gap L2. For example, the third gap L3 may also include a cropping correction for the display 100.

When the electronic device 10 is changed to the folded state, a cut-out of the display 100 may be created as the flat folded region 103 is transformed into a curved surface. In particular, because the display 100 includes a plurality of stacked layers, the stacked layers may be deformed into curved surfaces having different radii of curvature. That is, the layer adjacent to the first surface 111 may have a smaller radius of curvature than the layer adjacent to the second surface 112, and thus may move further toward the sidewall 404. Accordingly, the third gap L3 may be greater than the first gap L1 or the second gap L2. Preferably, the third gap L3 may be larger than the first gap L1 or the second gap L2 even when the electronic device 10 is in a folded state (e.g., the fully folded state shown in fig. 2) such that the layers located on the first surface 111 of the display 100 do not contact the sidewall 404. In various embodiments, when the electronic device 10 becomes a folded state, the third gap L3 may be parallel to a direction of stress applied to the plurality of layers, and a shear displacement according to the applied stress may also be included in the third gap L3 including an assembly tolerance.

In contrast, the first and second gaps L1 and L2 may not include shear correction. For example, because the display 100 is not folded in a direction parallel to the folding axis (axis a), there may be no difference in radius of curvature between the stacked layers. Accordingly, the first and second gaps L1 and L2 may not include shear correction and may include only assembly tolerances. In various embodiments, the first and second gaps L1 and L2 may be equal to each other.

Fig. 17 shows a diagram of a foldable housing of an electronic device according to an embodiment.

In an embodiment, the foldable housing 500 may include a first housing structure 510 and a second housing structure 520. The first and second housing structures 510 and 520 may include frames 501, 502, 503, and 504. The frame may include a first horizontal frame 501, a second horizontal frame 502, a first vertical frame 503, and a second vertical frame 504. The first horizontal frame 501 and the second horizontal frame 502 may extend in a direction perpendicular to the folding axis a, and the first vertical frame 503 and the second vertical frame 504 may extend in a direction parallel to the folding axis a.

In an embodiment, the first housing structure 510 can include a first horizontal frame 5011, a second horizontal frame 5021, a first vertical frame 5031, and a second vertical frame 5041. The first and second vertical frames 5031 and 5041 may connect the first and second horizontal frames 5011 and 5021.

In an embodiment, the second housing structure 520 can include a first horizontal frame 5012, a second horizontal frame 5022, a first vertical frame 5032, and a second vertical frame 5042. The first and second vertical frames 5032, 5042 may connect the first and second horizontal frames 5012, 5022.

In an embodiment, the first interior space S1 may be formed in the first housing structure 510 by the first horizontal frame 5011, the second horizontal frame 5021, the first vertical frame 5031 and the second vertical frame 5041. In the present disclosure, the first inner space S1 may be referred to as a recess.

In an embodiment, the second interior space S2 may be formed in the second housing structure 520 by the first horizontal frame 5012, the second horizontal frame 5022, the first vertical frame 5032 and the second vertical frame 5042. In the present disclosure, the second inner space S2 may be referred to as a recess.

In an embodiment, as shown in fig. 17, the sensor region 524 may be formed on the second housing structure 520. The sensor region 524 may be positioned to correspond to a notch (e.g., notch 403 of fig. 16a) formed in a bracket (e.g., second bracket 420 of fig. 15 c). One or more openings may be formed in the sensor area 524, and some sensors disposed in the electronic device 10 may be visually exposed to the outside of the electronic device 10 through the openings.

In an embodiment, referring to fig. 17, the first and second housing structures 510 and 520 can include a mounting surface 542, and a bracket assembly (e.g., the bracket assembly 30 of fig. 15 c) is mounted on the mounting surface 542. One or more mounting surfaces 542 may be formed. The mounting surface 542 may be formed in a frame that constitutes the first housing structure 510 and/or the second housing structure 520. In an embodiment, the mounting surface 542 may extend from the frames 501, 402, 503, and 504 toward the inner spaces S1 and S2.

In an embodiment, the first and second housing structures 510 and 520 may include first and second rotational support surfaces 512 and 522, respectively, for supporting a hinge cover (e.g., hinge cover 530 of fig. 18). The first rotation supporting surface 512 and the second rotation supporting surface 522 may correspond to each other with the hinge cover therebetween.

FIG. 18 illustrates a combined pictorial view of a foldable housing and stand assembly of an electronic device, in accordance with an embodiment. Fig. 19 shows a diagram of a sliding structure of an electronic device according to an embodiment. Fig. 20 illustrates an assembled view of a foldable housing and stand assembly of an electronic device, according to an embodiment.

Hereinafter, the assembly of the stand assembly 30 and the foldable housing 500 will be described with reference to fig. 18 and 19. As described above (see fig. 16a), the stand assembly 30, on which the display 100 is mounted, may be combined with the first housing structure 510 and the second housing structure 520.

Referring to fig. 18, in an embodiment, the first and second housing structures 510 and 520 may be disposed on opposite sides of the rack assembly 30. The first housing structure 510 may be disposed adjacent to the first bracket 410 and the second housing structure 520 may be disposed adjacent to the second bracket 420. The first and second housing structures 510, 520 are slidable toward the carriage assembly 30 and are engageable with the carriage assembly 30.

In an embodiment, the first housing structure 510 and/or the second housing structure 520 may further include a cover surface 533 that forms a portion of a front surface of the electronic device 10. The cover surface 544 may be formed on at least one of the first horizontal frame 501, the second horizontal frame 502, the first vertical frame 503, and the second vertical frame 504 that make up the first housing structure 510 and/or the second housing structure 520. The cover surface 544 may extend from the frame toward the interior spaces S1 and S2. The cover surface 544 may cover gaps (e.g., L1, L2, and L3 of fig. 16 b) between the display 100 and the side walls 404 of the stand 400 such that the gaps are not exposed on the front surface of the electronic device 10. In an embodiment, the cover surface 544 formed on the first and/or second housing structures 510, 520, along with the mounting surface 542, may form a recess into which the cartridge assembly 30 slides.

In an embodiment, at least a portion of the outer perimeter of the first bracket 410 may be inserted into a recess formed between the mounting surface 542 and the cover surface 544 of the first housing structure 510. At least a portion of the outer periphery of the second bracket 420 may be inserted into a recess formed between the mounting surface 542 and the cover surface 544 of the second housing structure 520. Accordingly, the first bracket 410 may be disposed in the first inner space S1, and the second bracket 420 may be disposed in the second inner space S2.

Referring to fig. 19, the electronic device 10 according to the embodiment may include a sliding structure 550. The sliding structure 550 may include: a slide groove 555 formed in the first horizontal frames 5011 and 5012 located at the upper side among the frames constituting the first and second housing structures 510 and 520; and a sliding member 554 including upper and lower ends of the first and second brackets 410 and 420. For example, the sliding member 554 may include side walls (e.g., side walls 404 of fig. 16a) formed on upper and lower ends of the first and second brackets 410 and 420.

Referring to the sectional view of fig. 19, the slide groove 555 may be formed by a first surface 551 facing the slide member 554, a second surface 552 on which the slide member 554 is seated and extending from the first surface 551, and a third surface 553 facing the second surface 552. For example, the second surface 552 may include a mounting surface 542 formed in the first horizontal frames 5011 and 5012 or the second horizontal frames 5021 and 5022, and the third surface 553 may include a covering surface 544 formed in the first horizontal frames 5011 and 5012 or the second horizontal frames 5021 and 5022.

Referring to fig. 20, a first housing structure 510 may surround at least a portion of the outer circumference of the first bracket 410, and a second housing structure 520 may surround at least a portion of the outer circumference of the second bracket 420. At least a portion of the first bracket 410 may be disposed in a first inner space (e.g., the first inner space S1 of fig. 17), and at least a portion of the second bracket 420 may be disposed in a second inner space (e.g., the second inner space S2 of fig. 17).

In an embodiment, one or more coupling holes 543 may be formed in the frames 501, 502, 503, and 504. A first substrate (e.g., the first substrate 610 of fig. 22) and/or a second substrate (e.g., the second substrate 620 of fig. 22) may be mounted on at least some of the bonding holes 543. A first rear cover (e.g., the first rear cover 580 of fig. 23) and/or a second rear cover (e.g., the second rear cover 590 of fig. 23) may be mounted on at least some of the coupling holes 543.

In an embodiment, the first and second housing structures 510 and 520 may include rotational support surfaces 512 and 522 formed in the second vertical frames 5041 and 5042. The rotation supporting surfaces 512 and 522 may be formed as curved surfaces corresponding to the hinge cover 530. When the electronic device 10 is changed from a flat state (e.g., the electronic device of fig. 1) to a folded state (e.g., the electronic device of fig. 2), the first and second housing structures 510 and 520 that are rotated relative to each other may be supported by the rotation support surfaces 512 and 522.

Fig. 21 illustrates an exploded perspective view of a substrate and a rear cover of an electronic device according to an embodiment. Fig. 22 shows a diagram of a substrate of an electronic device according to an embodiment. Fig. 23 shows a diagram of a back cover of an electronic device according to an embodiment.

Hereinafter, the substrate 600 and the rear covers 580 and 590 will be described with reference to fig. 21, 22, and 23.

As shown in fig. 21, in an embodiment, an electronic device may include a substrate 600, a first battery 612, and a second battery 622. The substrate 600 may include a first substrate 610, a second substrate 620, and one or more electrical components mounted on the first substrate 610 and the second substrate 620. The cover may include a first rear cover 580, a second rear cover 590, a sub-display 190 viewed through the first rear cover 580, and a wireless charger module 594 disposed on the second rear cover 590.

Referring to fig. 21 and 22, a first substrate 610 may be disposed on a second surface (e.g., the second surface 412 of fig. 18) of the first support 410, and a second substrate 620 may be disposed on a second surface (e.g., the second surface 422 of fig. 18) of the second support 420. The first battery 612 may be disposed on the first support 410 and the second battery 622 may be disposed on the second support 420. In an embodiment, a recess 613 in which the first cell 612 is located may be formed in the substrate 610, and a recess 623 in which the second cell 622 is located may be formed in the second substrate 620.

In an embodiment, the first substrate 610 and the second substrate 620 may be connected by the wiring members 431 and 432. The wiring members 431 and 432 may cross the inside of the hinge cover 530 to electrically connect the first and second substrates 610 and 620. The wiring member 430 may include a first wiring member 431 and a second wiring member 432. The first connector 4311 and the second connector 4312 may be formed on opposite ends of the first wiring member 431, and the third connector 4321 and the fourth connector 4322 may be formed on opposite ends of the second wiring member 432. The connectors may be electrically connected with the substrates 610 and 620.

In an embodiment, the substrate 600 may include one or more electrical elements. The electrical components may include, for example, a receiver 641, a first speaker 642, a memory receptacle 643, a second speaker 645, a vibration motor 644, a front camera 646, a rear camera 649, a first microphone 652, a second microphone 647, a host chip 650, and a USB module 651. For example, the receptacle 641, the first speaker 642, the memory receptacle 643, the second speaker 645, and the vibration motor 644 may be mounted or disposed on the first substrate 610. A front sensor connection part 648 connected to a sensor region 524 formed in the second case structure 520 may be provided on the second substrate 620. For example, the front camera 646, the rear camera 649, the first microphone 652, the second microphone 647, the main chip 650, the USB module 651, and the front sensor connecting part 648 may be mounted or disposed on the second substrate 620. The types, arrangements, and numbers of electrical elements shown in the drawings are merely illustrative, and the scope of the present disclosure is not limited by the drawings.

Referring to fig. 23, rear covers 580 and 590 may be combined with the case 500. The back cover may include a first back cover 580 coupled to the first housing structure 580 and a second back cover 590 coupled to the second housing structure 520.

In an embodiment, sub-display 190 may be disposed between first rear cover 580 and first substrate 610. Subdisplay 190 may be electrically connected to first substrate 610 through subdisplay attachment components 191. In various embodiments, secondary display 190 may further comprise a display panel and a touch screen panel disposed on the display panel. The touch screen panel may be disposed between the display panel and the first rear cover 580.

In an embodiment, the first rear cover 580 may form a rear surface of the electronic device 10. Referring to fig. 21, the first rear cover 580 may include a first rear region 582 formed in the rear surface of the electronic device 10. The first rear region 582 may be formed at a position corresponding to the position of the sub-display 190. The first rear region 582 may be formed using a transparent material through which light can pass. Light emitted from secondary display 190 may be delivered to a user through first rear region 582.

In an embodiment, the second back cover 590 may form a back surface of the electronic device 10. Referring to fig. 21, the second rear cover 590 may include a second rear region 592 formed in the rear surface of the electronic device 10. The second rear region 592 may be formed at a position corresponding to the position of the rear camera 649. The second rear region 592 may be formed using a transparent material through which light can pass. External light may be incident on the rear camera 649 through the second region 592.

Referring to fig. 23, a first rear cover 580 may be coupled to the first housing structure 510. The first rear cover 580 may be disposed between the first horizontal frame 5011, the second horizontal frame 5021, the first vertical frame 5031, and the second vertical frame 5041. As described above, the coupling hole 543 may be formed in the frame. The first rear cover 580 may include a coupling protrusion formed on a surface facing the first substrate 610 and inserted into the coupling hole 543. The coupling protrusion may be formed at a position corresponding to the coupling hole 543. The coupling protrusion may be formed along the outer circumference of the first rear cover 580. The coupling protrusion may be inserted or press-fitted into the coupling hole 543.

In an embodiment, the second back cover 590 may be coupled to the second housing structure 520. The second rear cover 590 may be disposed between the first horizontal frame 5012, the second horizontal frame 5022, the first vertical frame 5032, and the second vertical frame 5042. As described above, the coupling hole 543 may be formed in the frame. The second rear cover 590 may include a coupling protrusion formed on a surface facing the second substrate 620 and inserted into the coupling hole 543. The coupling protrusion may be formed at a position corresponding to the coupling hole 543. The coupling protrusion may be formed along the outer circumference of the second rear cover 590. The coupling protrusion may be inserted or press-fitted into the coupling hole 543.

In various embodiments, the housing structures 510 and 520 and the back covers 580 and 590 may be made using various materials. For example, the housing structures 510 and 520 may be made using a material comprising metal. For example, the rear covers 580 and 590 may be made using a material including glass.

In various embodiments, the housing structures 510 and 520 and the back covers 580 and 590 may be integral with each other and may be formed using the same material. For example, the housing structures 510 and 520 and the back covers 580 and 590 may be made using a material including metal, but may be integrated with each other. At least one of the first and second back covers 580 and 590 may be integrally formed with the housing structures 510 and 520.

FIG. 24 shows a diagram of a usage state of an electronic device, in accordance with various embodiments. Referring to fig. 24, the electronic device 10 is between a folded state and a flat state.

In an embodiment, the electronic device 10 may comprise a main region 11 and a sub-region 12. When the electronic device 10 changes from the flat state to the folded state, the main area 11 may refer to an area where a user is fixed, and the sub area 12 may refer to an area rotated with respect to the main area 11.

A first region (e.g., the first region 101 of fig. 20) of the above-described display (e.g., the display 100 of fig. 2) may be included in the sub region 12, and a second region (e.g., the second region 102 of fig. 20) may be included in the main region 11.

In an embodiment, the main region 11 may be fixed by a hand of a user and the sub-region 12 may be tilted at a predetermined angle with respect to the main region 11 when the electronic device 10 is in the folded state or changes from the flat state to the folded state.

In an embodiment, the sub-region 12 may be arranged on the rear surface in a flat state and may be arranged on the front surface in a folded state.

In various embodiments, a receiver (e.g., receiver 641 of fig. 22), a proximity sensor, and a sub-display (e.g., sub-display 190 of fig. 23) may further be included in sub-region 12 of electronic device 10. The purpose is to ensure usability of the electronic device 10 when the electronic device 10 is in a folded state (e.g., the electronic device of fig. 2). When the electronic device 10 is in a folded state (e.g., the electronic device of fig. 2), the sub-region 12 may be disposed on a front surface of the electronic device 10.

For example, a sub-display (e.g., sub-display 190 of fig. 2) included in sub-area 12 may be disposed on a front surface of electronic device 10 when electronic device 10 is in a folded state. Accordingly, even if the electronic device 10 is in a folded state (e.g., the electronic device of fig. 2), visual information may be provided to the user through a sub-display (e.g., the sub-display 190 of fig. 2) provided on a front surface of the electronic device 10.

Likewise, when the electronic device 10 is in a folded state (e.g., the electronic device of fig. 2), the receivers (e.g., the receivers 641 of fig. 22) or proximity sensors included in the sub-area 12 may be disposed on a front surface of the electronic device 10. Accordingly, even if the electronic device 10 is in a folded state (e.g., the electronic device of fig. 2), the user input may be received through a receiver (e.g., the receiver 641 of fig. 22) or a proximity sensor provided on the front surface of the electronic device 10.

In an embodiment, the wireless charger module 594 may be disposed in the main area 11. When the electronic device 10 is charged by the wireless charger module 594, the user may place the main area 11 on the wireless charger. Further, even during wireless charging, by folding the sub-area 12 at a predetermined angle with respect to the main area 11, visual information can be provided through a display included in the sub-area 12. In various embodiments, the wireless charger module 594 may be disposed in the sub-area 12 instead of the main area 11, or may be disposed in both the main area 11 and the sub-area 12.

Fig. 25a and 25b show diagrams of a gap between a display and a housing and a cutout of the display when an electronic device according to various embodiments is in a folded state. For example, fig. 25a and 25b show views of the display 100, a gap between the display 100 and the case 500, and a cut-out of the display 100 when the electronic device 10 according to the embodiment shown in fig. 1, 2, and 3 is in a folded state.

Fig. 26a, 26b and 26c show a cross-section of a partial area of the display and a view of a gap between the display and the housing when the electronic device according to various embodiments is in a folded state. For example, fig. 26a, 26b, and 26c illustrate diagrams of a section of a partial area of the display 100 disposed on the front surface of the electronic device and a gap between the display and the case when the electronic device according to the embodiment illustrated in fig. 1, 2, and 3 is in a folded state. A cross-sectional view of the first end surface 1061 and the second end surface 1062 in a second direction is shown in fig. 26a, 26b and 26 c. The second direction may be a direction perpendicular to the folding area 103 or the folding axis of the electronic device 10.

Referring to fig. 25a, a display 100 including a plurality of layers may include a first layer 1201 forming a first surface 111 of the display 100 and a second layer 1202 forming a second surface 112 of the display 100 opposite the first surface 111. When the display 100 is folded as shown, each layer may be pushed a predetermined displacement in one direction. The one direction may be an x-axis direction perpendicular to the fold axis in the fold region 103 (y-axis direction in fig. 25 a) and away from the fold region 103.

As shown in fig. 25a, at least a portion of the fold region 103 of the display 100 may form a curved surface with the electronic device 10 in a folded state. Thus, the layers of the display 100 may be bent to have different radii of curvature in the fold region 103. In a state where a portion of the display 100 is bent, the first layer 1201 on the first surface 111 may have a smaller radius than the second layer 1202 on the second surface 112. In this state, since the first layer 1201 and the second layer 1202 have the same length in one direction (x-axis direction), the end of the first layer 1201 that is less bent in the folding region 103 may be further pushed and displaced in the one direction than the end of the second layer 1202 that is greatly bent in the folding region 103. That is, the layer (e.g., the first layer 1201) adjacent to the first surface 111 of the display 100 may be moved further along the one direction than the layer (e.g., the second layer 1202) adjacent to the second surface 112 of the display 100. Thus, in the illustrated embodiment, the ends of the layers may form a step structure when the display 100 is folded.

As described above, there may be a displacement difference between the ends of the layers of the display 100. The displacement difference may be defined as "degree of shear". The degree of shear may increase with increasing displacement difference. The "degree of shear" may be defined as the angle formed by the cross-section of the layer. The "degree of shear" may increase as the angle decreases. The shearing degree may be 0 in the flat state and may have a maximum value in the folded state.

Referring again to fig. 25a and 25b, in the folded state of the electronic device 10, there may be a displacement difference between the layers of the display 100 depending on the position from the folding area 103. In the illustrated embodiment, the difference between the displacement of the first layer 1201 on the first surface 111 and the displacement of the second layer 1202 on the second surface 112 may decrease with increasing distance from the fold region 103. That is, the degree of cropping of the display 100 may increase as the fold region 103 is approached.

For example, referring to fig. 25a, when the electronic device 10 is in the folded state, the displacement difference DA in the notch region 104 (e.g., in the first end surface 1061) located near the folded region 103 may be greater than the displacement difference DB in the side end region (e.g., the second end surface 1062) located far from the folded region 103.

In embodiments, the storage modulus of the layer may affect the displacement of the layer when the display 100 is folded. For example, the layers of display 100 may be bonded together by an adhesive material having a predetermined adhesion. For example, each layer of the display 100 may have a predetermined elastic force by the material from which the layer is made, and may have a unique modulus. Accordingly, adhesion to adjacent layers and/or elasticity of each layer may be applied to the layer. The storage modulus may be a variable reflecting the external force applied to the layer and/or the properties of the layer itself.

Fig. 25b shows shear displacement reflecting storage modulus as a function of distance from the fold region (e.g., 103 of fig. 25 a) or fold axis in the folded state. Graph "a" shows the shear displacement as a function of distance from the fold axis of the layer reflecting the storage modulus. Graph "B" shows the shear displacement as a function of distance from the fold axis of the virtual layer that does not reflect the storage modulus.

Here, the "shear displacement" or the "maximum shear displacement" may be defined as a displacement of a layer that moves the longest distance among a plurality of layers in a predetermined area of the display 100 when the electronic device 10 is in a folded state. The distance from the fold axis (the horizontal axis of the graph) may be the distance from the fold region 103.

Referring to graph B, when the storage modulus is not reflected, the display 100 may have a constant shear regardless of the distance from the folding region 103. Conversely, it can be seen that shear decreases with increasing distance from fold region 103 (graph a) when the storage modulus is reflected. For example, the shear stress of adjacent layers may be applied to regions of any layer. The layer having elasticity may absorb part of the shear stress, and thus the shear may decrease with increasing distance from the folding region 103.

Fig. 25b illustrates a first gap G1, a second gap G2, and a third gap G3 between the side surface of the display 100 and the side wall of the recess of the case 500. The first gap G1 may be a gap in a direction parallel to the fold axis (e.g., y-axis direction), and the second gap G2 and the third gap G2 may be gaps in a direction perpendicular to the fold axis (e.g., x-axis direction). In an embodiment, the second gap G2 and the third gap G3 may be selected to accommodate shear displacement according to differences in radii of curvature between the multiple layers of the display 100. In contrast, since the first gap G1 is a gap in a direction parallel to the folding axis (e.g., y-axis direction), no shearing according to the folding of the display 100 occurs. Accordingly, the second gap G2 and/or the third gap G3 may be greater than the first gap G1.

The structure related to the notch region and the side end region (section B-B') of the display 100 will be described with reference to fig. 26a, 26B, and 26 c. Fig. 26a, 26b, and 26c show gaps LA1, LA2, and LA3 between the display 100 and the sensor region 524 in the first region 2601, and gaps LB1, LB2, and LB3 between the display 100 and the side wall 404 in the second region 2602. The first region 2601 can be referred to as a first portion (e.g., the first portion 520a of fig. 1) of the second housing structure 520. The illustrated gap may mean a distance in a direction perpendicular to the folding axis and may be configured to accommodate a shear displacement according to the folding of the display 100.

In an embodiment, the display 100 may be spaced apart from the inner surface 546 of the sensor region 524 in the first region 2601 of the electronic device 10 in the flat state by a predetermined gap LA 1. The display 100 may be spaced apart from the sidewall 404 of the stand 400 by a predetermined gap LB1 in the second region 2602 of the electronic device 10 in the flat state.

The predetermined gap may be determined such that the layer having the largest shear displacement in the folded state (e.g., the first layer 1201 on the first surface 111) is located inside the second housing structure 520 or the side wall 404 of the stand 400. Accordingly, the predetermined gap may be formed to be greater than a maximum shear displacement of the corresponding region (e.g., displacement of the first layer 1201 located on the first surface 111), and thus the display 100 may not contact the inner surface 546 of the sensor region 524 or the sidewall 404 of the stand 400 in the folded state.

Specifically, with the electronic device in the folded state, the predetermined gap in the first region 2601 (e.g., cross-section a-a ') may be greater than a maximum shear displacement (e.g., shear displacement of the first layer 1201 forming the first surface 111) formed when the display of the first region 2601 (e.g., cross-section a-a') is pushed. The maximum shear displacement in the first region 2601 (e.g., cross-section a-a') may be equal to the difference LA1-LA3 between LA1 shown in fig. 26a and LA3 shown in fig. 26c, and may be less than the first gap LA 1. Thus, even when the electronic device 10 is folded, the layers of the display 100 do not contact the inner surface 546 of the sensor region 524.

Further, with the electronic device in the folded state, the predetermined gap in the second region 2602 (e.g., section B-B ') may be greater than a maximum shear displacement (e.g., shear displacement of the first layer 1201 forming the first surface 111) formed when the display of the second region 2602 (e.g., section B-B') is pushed. The maximum shear displacement in the second region 2602 (e.g., section B-B') may be equal to the difference LB1-LB3 between LB1 shown in fig. 26a and LB3 shown in fig. 26c, and may be less than the first gap LB 1. Thus, even when the electronic device 10 is folded, the layers of the display 100 do not contact the sidewalls 404 of the stand 400.

Hereinafter, the gap in the first region 2601 (e.g., the section a-a ') of fig. 26a in the flat state may be referred to as a first gap LA1, and the gap in the second region 2602 (e.g., the section B-B') of fig. 26a in the flat state may be referred to as a second gap LB 1. The gap in the first region 2601 (e.g., section a-a ') of fig. 26B in the intermediate state may be referred to as a third gap LA2, and the gap in the second region 2602 (e.g., section B-B') of fig. 26B may be referred to as a fourth gap LB 2. The gap in the first region 2601 (e.g., section a-a ') of fig. 26c in the folded state may be referred to as a fifth gap LA3, and the gap in the second region 2602 (e.g., section B-B') of fig. 26c may be referred to as a sixth gap LB 3. In various embodiments, the first through sixth gaps may also include assembly tolerances.

Referring to fig. 26a, when the electronic device 10 is in the flat state, the first gap LA1 may be greater than the second gap LB 1. Referring to fig. 26b, when the electronic device 10 is in the neutral state, the third gap LA2 may be greater than the fourth gap LB 2. Referring to fig. 26c, the fifth gap LA3 may be greater than the sixth gap LB3 when the electronic device 10 is in the folded state. That is, the gaps (the first gap, the third gap, and the fifth gap) in the first region near the folding region may be larger than the gaps (the second gap, the fourth gap, and the sixth gap) in the second region.

If the layers of the display are formed using a rigid body, gaps (first, third, and fifth gaps) in the first region 2601 and gaps (second, fourth, and sixth gaps) in the second region 2602 may be equal to each other according to the state of the electronic device. As described above, since the actual layer of the display 100 has a predetermined elastic modulus and absorbs a part of the stress caused by the adjacent layer, the shear in the second region 2602 distant from the folding region 103 may be smaller than the shear in the first region 2601, and the gap in the second region 2602 may be set smaller than the gap in the first region 2601. In various embodiments, the fifth gap LA3 and the sixth gap LB3 shown in fig. 26c may be assembly tolerances.

In another embodiment, unlike the first region 2601 shown in fig. 26c, the sidewall 404 can be formed between the inner surface 546 of the sensor region 524 and the display 100. In this case, the gap between the display 100 and the sidewall 404 may be smaller than the fifth gap LA3 shown in fig. 26c, and the gap may be equal to or similar to the gap between the display 100 and the sidewall 404 in the side end region (section B-B').

In embodiments, the gap between the display 100 and the inner surface 546 of the sensor region 524 or the side wall 404 of the stand 400 may vary depending on the folded state of the electronic device 10. For example, with respect to the first region 2601, the gap may be the largest in the flat state (first gap LA1) and the smallest in the folded state (fifth gap LA 3). For example, with respect to the second region 2602, the gap may be the largest in the flat state (the second gap LB1) and the smallest in the folded state (the sixth gap LB 3).

Referring to fig. 26b, when the electronic device is in the intermediate state, the first layer 1201 and the second layer 1202 in the first region 2601 may have a displacement difference DA 2. In the second region, the first layer 1201 and the second layer 1202 may have a displacement difference DB 2. In the illustrated embodiment, the DA2 may be larger than the DB2 because the degree of cropping of the display increases with decreasing distance from the fold region.

Referring to fig. 26c, when the electronic device is in a folded state, the first layer 1201 and the second layer 1202 in the first region 2601 may have a displacement difference DA 3. In the second region, the first layer 1201 and the second layer 1202 may have a displacement difference DB 3. As described above, the DA3 may be larger than the DB3 because the degree of cropping of the display increases with decreasing distance from the fold region.

The display 100 can be changed according to the folding state of the electronic device 10The displacement difference between the layers in the predetermined area (e.g.,DA3 orDB 3). When the folding operation is performed, the difference in the radius of curvature between the layers of the display may increase, and thus a layer closer to the first surface 111 of the display 100 among the plurality of layers may move a longer distance (absolute displacement).

In various embodiments, the first region 2601 (cross-section a-a') can exist in various positions in various shapes depending on the shape or position of the sensor region 524. For example, when the sensor region 524 is closer to the folding region 103 (or the folding axis (y-axis)) than the sensor region 524 shown in the drawings, the gaps (the first gap, the third gap, and the fifth gap) of the first region 2601 may become wider.

Fig. 27a, 27b, and 27c illustrate diagrams of a front surface of an electronic device according to various embodiments.

In an embodiment, referring to fig. 27a, electronic device 27 (e.g., electronic device 10 of fig. 1) may include a first region 2701, the first region 2701 including a first boundary 271 forming a portion of the outer perimeter of sensor region 524 and parallel to the direction of the fold axis (axis a). In an embodiment, the electronic device 27 may include a second region 2702, the second region 2702 including a direction parallel to the folding axis (axis a) and forming a second boundary 272 of an end of the first housing structure 510 or the second housing structure 520 in which the sensor region 524 is formed.

In an embodiment, the first region 2701 may be disposed closer to the folding axis (axis a) than the second region 2702. In an embodiment, the gap formed by the first boundary 271 and the display 100 in the first region 2701 may be larger than the gap formed by the second boundary 272 and the display 100 in the second region 2702.

Referring to fig. 27b, because the first region 2701 of the electronic device 27 (e.g., the electronic device 10 of fig. 1) is disposed closer to the folding axis (axis a) than the second region 2702, the gap formed by the first boundary 271 and the display 100 in the first region 2701 may be larger than the gap formed by the second boundary 272 and the display 100 in the second region 2702.

Referring to fig. 27c, because the first region 2701 of the electronic device 27 (e.g., the electronic device 10 of fig. 1) is disposed closer to the folding axis (axis a) than the second region 2702, the gap formed by the first boundary 271 and the display 100 in the first region 2701 may be larger than the gap formed by the second boundary 272 and the display 100 in the second region 2702.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may comprise, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to the embodiments of the present disclosure, the electronic device is not limited to those described above.

It is to be understood that the various embodiments of the present disclosure and terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents, or substitutions for the respective embodiments. With respect to the description of the figures, like reference numerals may be used to refer to like or related elements. It should be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context clearly dictates otherwise. As used herein, each of such words as "a or B," "at least one of a and B," "at least one of a or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any or all possible combinations of the items enumerated together in the respective one of the phrases. As used herein, terms such as "first" and "second" may be used merely to distinguish the respective component from other components, and do not otherwise limit the components (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "operably" or "communicatively" coupled "to another element (e.g., a second element), connected" to another element (e.g., a second element), or "communicatively connected" to another element (e.g., a second element), it can be directly (e.g., wired), wirelessly, or coupled to the other element via a third element.

As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuitry"). A module may be a single, integral component or a minimal unit or component thereof adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

Various embodiments as set forth herein may be implemented as software (e.g., a program) comprising one or more instructions stored in a storage medium (e.g., internal memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., processor) of a machine (e.g., an electronic device) may call at least one of the one or more instructions stored in the storage medium and execute it with or without one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Where the term "non-transitory" simply means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), the term does not distinguish between where data is semi-permanently stored in the storage medium and where data is temporarily stored in the storage medium.

According to embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be used as a product for conducting transactions between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or distributed online (e.g., downloaded or uploaded) via an application store (e.g., playstore (tm)) or directly between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, a server of an application store, or a memory of a relay server).

According to various embodiments, each of the above-described components (e.g., modules or programs) may comprise a single entity or multiple entities. According to embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such cases, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as the respective one of the multiple components performed prior to integration, in accordance with various embodiments. Operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added, depending on the embodiment.