阅读说明：本技术 一种环氧膜裁剪装置及其方法 (Epoxy film cutting device and method ) 是由 侯育增 臧子昂 杨宝平 魏刚剑 周峻霖 于 2020-09-25 设计创作，主要内容包括：本发明提供一种环氧膜裁剪装置及其方法,它包括数控裁纸机(1),通过数控裁纸机内CAD软件设计裁剪尺寸,而后在裁纸机(1)上设有底层(2),在底层(2)上设有吸附层(3),在吸附层(3)上放置环氧膜(4),而后启动数控裁纸机(1)进行裁切。本发明具有结构简单、操作方便,环氧膜裁切效率高,裁切精确等优点。(The invention provides an epoxy film cutting device and a method thereof, and the device comprises a numerical control paper cutter (1), wherein the cutting size is designed through CAD software in the numerical control paper cutter, then a bottom layer (2) is arranged on the paper cutter (1), an adsorption layer (3) is arranged on the bottom layer (2), an epoxy film (4) is placed on the adsorption layer (3), and then the numerical control paper cutter (1) is started to cut. The invention has the advantages of simple structure, convenient operation, high cutting efficiency of the epoxy film, accurate cutting and the like.)

1. The utility model provides an epoxy film cutting device, it includes numerical control's trimmer (1), its characterized in that: the paper cutting machine is characterized in that a bottom layer (2) is arranged on the paper cutting machine (1), an adsorption layer (3) is arranged on the bottom layer (2), and an epoxy film (4) is placed on the adsorption layer (3).

2. The epoxy film cutting device according to claim 1, wherein: the bottom layer (2) is a blue film or a transparent adhesive tape.

3. The epoxy film cutting device according to claim 1, wherein: the adsorption layer (3) is made of PF materials and has double-sided physical adsorption effect.

4. The epoxy film cutting method is characterized by comprising the following steps of: 1. placing the epoxy film at room temperature, and raising the temperature of the epoxy film to the room temperature; 2. bonding the bottom layer on the working surface of the numerical control paper cutter; 3. placing an adsorbent layer on the bottom layer; 4. an adsorption layer in which the epoxy film restored to room temperature is placed; 5, inputting the data of the graph to be cut, the size and the thickness of the epoxy film into the control software of the numerical control paper cutter; 6, starting a numerical control paper cutter, controlling a cutter head by software in the paper cutter, and according to a programmed graph, enabling the cutter head to pass through the surface of the epoxy film under a set pressure, thereby realizing automatic cutting of the epoxy film; 7. the cut epoxy film and the adsorption layer are taken down from the bottom layer together, and the epoxy film can be easily taken out from the surface of the adsorption layer for use by a method of picking up the epoxy film by tweezers.

The technical field is as follows:

the invention relates to the field of manufacturing of microelectronic products, in particular to an epoxy film cutting device and a method thereof.

Background art:

microelectronic technology is an important way to realize miniaturization, multifunction and high reliability of electronic systems, and has been widely used in various fields in recent years. The substrate assembly process is a basic assembly process of microelectronic products, and is characterized in that a specific bonding material is adopted to firmly bond a substrate and a shell base together so as to achieve the purpose of reliable assembly and connection.

The epoxy film used for substrate assembly is a special material, and the epoxy fixing glue is stored in a low-temperature environment of-40 ℃, is used at normal temperature and is cured at the temperature of over 75 ℃. Because the epoxy adhesive film material has some particularity, the following method can not be used for cutting operation:

1) the epoxy material can not be cut by laser due to the light transmission property of the epoxy material, and the epoxy material is easy to be cured by high-intensity laser after being heated, so that a laser cutting method can not be used; 2) because the epoxy glue is internally provided with a layer of special material with high toughness, the epoxy glue can not be normally cut off by a conventional paper cutter, and therefore, the epoxy glue can not be cut by the conventional paper cutter; 3) and because the epoxy material is stored in a low-temperature environment of-40 ℃, the material is relatively fragile when in use, and various rolling operations easily cause the colloid loss of the material.

Therefore, various package cutting methods for plastic films in the prior art are not suitable for cutting epoxy film materials in the microelectronic technology.

In the prior art, most cutting methods adopting manual cutting or punch forming exist, but the manual cutting efficiency is low, the precision is poor, and the loss of a die which cannot meet the requirement of batch processing is large; the manufacturing cost of the punch forming tool is high, which results in high processing cost of the epoxy film punch forming method.

The invention content is as follows:

the invention provides an epoxy film cutting device and method for overcoming the defects in the prior art.

The application provides the technical scheme that:

the utility model provides an epoxy film tailors device, it includes numerical control's trimmer, its characterized in that: the paper cutting machine is provided with a bottom layer, the bottom layer is provided with an adsorption layer, and an epoxy film is placed on the adsorption layer.

On the basis of the technical scheme, the following further technical scheme can be provided:

the bottom layer is a blue film or a transparent adhesive tape.

The adsorption layer is made of PF materials and has double-sided physical adsorption effect.

The epoxy film cutting method is characterized by comprising the following steps of: 1. placing the epoxy film at room temperature, and raising the temperature of the epoxy film to the room temperature; 2. bonding the bottom layer on the working surface of the numerical control paper cutter; 3. placing an adsorbent layer on the bottom layer; 4. an adsorption layer in which the epoxy film restored to room temperature is placed; 5, inputting the data of the graph to be cut, the size and the thickness of the epoxy film into the control software of the numerical control paper cutter; 6, starting a numerical control paper cutter, controlling a cutter head by software in the paper cutter, and according to a programmed graph, enabling the cutter head to pass through the surface of the epoxy film under a set pressure, thereby realizing automatic cutting of the epoxy film; 7. the cut epoxy film and the adsorption layer are taken down from the bottom layer together, and the epoxy film can be easily taken out from the surface of the adsorption layer for use by a method of picking up the epoxy film by tweezers.

The invention has the advantages that:

the automatic cutting machine is simple in structure and convenient to use, the special material is used as a medium, the automatic cutting of the epoxy film on the numerical control paper cutting machine is realized, the automatic cutting of the epoxy films with various sizes and shapes can be realized, and the processing efficiency and the processing convenience are obviously improved.

Particularly, compared with the conventional manual epoxy film cutting technology, the automatic cutting method has high efficiency and high precision; compared with a tool type blade cutting method, the processing efficiency is obviously improved, the automatic cutting of epoxy films in various sizes and shapes can be realized, and the processing convenience is obviously improved; compared with a punch forming method, the method does not need various dies, reduces the overall cost, can realize the automatic cutting of epoxy films with various sizes and shapes, and obviously improves the processing convenience.

Description of the drawings:

fig. 1 is a schematic structural view of the present invention.

The specific implementation mode is as follows:

as shown in fig. 1, the epoxy film cutting device comprises a numerical control paper cutter 1, wherein a bottom layer 2 is adhered to the working surface of the paper cutter 1, and the bottom layer 2 is a blue film. An adsorption layer 3 is arranged on the bottom layer 2, and the adsorption layer 3 is made of PF materials and has a double-sided physical adsorption effect. An epoxy film 4 to be cut is placed on the adsorption layer 3.

The following is a method of epoxy film cutting using the above apparatus:

the epoxy film cutting method is characterized by comprising the following steps of: 1. placing the epoxy film at room temperature, and raising the temperature of the epoxy film to the room temperature; 2. bonding the bottom layer on the working surface of the numerical control paper cutter, and eliminating air bubbles between the bottom layer and the working surface; 3. placing an adsorbent layer on the bottom layer; 4. an adsorption layer in which the epoxy film restored to room temperature is placed; 5, inputting the data of the graph to be cut, the size and the thickness of the epoxy film into the control software of the numerical control paper cutter; 6, starting the numerical control paper cutter 1, controlling a cutter head 1a by software in the paper cutter, and cutting the surface of the epoxy film by the cutter head under the set pressure according to the programmed graph, thereby realizing the automatic cutting of the epoxy film; 7. the cut epoxy film and the adsorption layer are taken down from the bottom layer together, and the epoxy film can be easily taken out from the surface of the adsorption layer for use by a method of picking up the epoxy film by tweezers.