阅读说明：本技术 一种用于集成电路芯片的可堆叠托盘 (Stackable tray for integrated circuit chips ) 是由 王海魁 于 2020-10-29 设计创作，主要内容包括：本发明公开了一种用于集成电路芯片的可堆叠托盘,包括上托盘以及下托盘,所述下托盘底部固定有数量为四组的堆叠柱,所述堆叠柱下侧插接有下托盘,所述上托盘内部安装有数量为多组的调整座,所述调整座内部一侧安装有第一活塞,所述第一活塞顶端固定有挤压杆,所述调整座内部远离第一活塞一侧安装有第二活塞,所述第二活塞顶部连接有顶杆,所述顶杆顶部固定有圆板,所述顶杆环形侧面套设有螺旋弹簧,所述上托盘一侧装配有风机,所述风机靠近上托盘一侧连接有输送管。本发明采用采用风压方式向下吹拂集成电路芯片,使集成电路芯片稳定的放置在摩擦系数大的圆板上,以借助液压的方式将集成电路芯片从托盘内升出,以便取用。(The invention discloses a stackable tray for integrated circuit chips, which comprises an upper tray and a lower tray, wherein four groups of stacking columns are fixed at the bottom of the lower tray, the lower sides of the stacking columns are spliced with the lower tray, a plurality of groups of adjusting seats are arranged in the upper tray, a first piston is arranged on one side in each adjusting seat, an extrusion rod is fixed at the top end of each first piston, a second piston is arranged on one side, far away from the first piston, in each adjusting seat, the top of each second piston is connected with a push rod, a circular plate is fixed at the top of each push rod, a spiral spring is sleeved on the annular side surface of each push rod, a fan is assembled on one side of the upper tray, and a conveying pipe is connected on one side, close to the upper tray, of each fan. The invention adopts the wind pressure mode to blow the integrated circuit chip downwards, so that the integrated circuit chip is stably placed on a circular plate with large friction coefficient, and the integrated circuit chip is lifted out of the tray by the hydraulic mode so as to be convenient for taking.)

1. A stackable tray for integrated circuit chips comprises an upper tray (1) and a lower tray (2), and is characterized in that four groups of stacking columns (3) are fixed at the bottom of the lower tray (2), the lower tray (2) is inserted into the lower side of each stacking column (3), a plurality of groups of adjusting seats (8) are installed inside the upper tray (1), a first piston (9) is installed on one side inside each adjusting seat (8), an extrusion rod (4) is fixed at the top end of each first piston (9), a second piston (10) is installed on one side, far away from the first piston (9), inside each adjusting seat (8), a push rod (12) is connected to the top of each second piston (10), a circular plate (6) is fixed at the top of each push rod (12), a spiral spring (11) is sleeved on the annular side face of each push rod (12), and a fan (16) is assembled on one side of the upper tray (1), fan (16) are close to tray (1) one side and are connected with conveyer pipe (13), conveyer pipe (13) bottom is connected with quantity and is play tuber pipe (15) of multiunit.

2. The stackable tray for ic chips as claimed in claim 1, wherein the upper tray (1) has four holes (7) formed therein, the lower tray (2) has four holes (7) formed therein, the bottom of the upper tray (1) has four sets of stacking columns (3) fixed thereto, and the holes (7) are adapted to the stacking columns (3).

3. The stackable pallet as claimed in claim 1, wherein the upper pallet (1) has the same specification as the lower pallet (2), the antistatic cloth (14) is fixed on the bottom of the upper pallet (1) and the bottom of the lower pallet (2), the fan (16), the duct (13) and the air outlet pipe (15) form air pressure components, and the air pressure components are provided in two groups, and the two groups of air pressure components are respectively arranged on one side of the upper pallet (1) and one side of the upper pallet (1).

4. The stackable tray for integrated circuit chips according to claim 1, wherein a plurality of sets of storage slots (101) are formed in the upper tray (1), an anti-drop frame (5) is fixed on the inner wall of each storage slot (101), the anti-drop frame (5) has the same height as that of a circular plate (6), the circular plate (6) has a height lower than the top height of the upper tray (1), a plurality of sets of storage slots (101), a plurality of sets of adjusting seats (8), a first piston (9), an extrusion rod (4), a second piston (10), an ejector rod (12), the circular plate (6), a coil spring (11), the storage slots (101) and the anti-drop frame (5) form storage assemblies, the storage assemblies are arranged in the upper tray (1) and the lower tray (2), and an air outlet pipe (15) at the bottom of the upper tray (1) is positioned right above the storage assemblies in the lower tray (2), the air outlet pipes (15) correspond to the storage assemblies one by one.

5. Stackable pallet for integrated circuit chips according to claim 1, characterized in that the adjustment seat (8) is filled with a buffer, the adjustment seat (8) is a biconvex structure, the first piston (9) and the second piston (10) are both rubber members, the first piston (9) and the second piston (10) are fitted to the convex part of the adjustment seat (8) with the biconvex structure, and the original height of the first piston (9) is the same as the original height of the second piston (10).

6. The stackable pallet of claim 1, wherein the height of the squeeze bar (4) is higher than the top height of the upper pallet (1), the height of the squeeze bar (4) is less than the height of the stacking column (3), the upper squeeze bar (4) is provided with a movable hole at the joint with the upper pallet (1), and the lower squeeze bar (4) is provided with a movable hole at the joint with the lower pallet (2).

7. Stackable pallet for integrated circuit chips according to claim 1, characterized in that the lowest height of the air outlet duct (15) is higher than the original height of the extrusion stem (4), the length of the ejector stem (12) is smaller than the length of the extrusion stem (4), and the lowest height of the air outlet duct (15) is higher than the highest height of the ejector stem (12) and the circular plate (6).

8. The stackable pallet of claim 1, wherein a flared hood is mounted at the bottom of the vent pipe (15), and the circular plate (6) is made of silicone.

Technical Field

The present invention relates to the field of integrated circuit technology, and more particularly to a stackable tray for integrated circuit chips.

Background

The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring. The circuit is formed on the silicon substrate and is provided with at least one output/input pad. The fixed seal ring is formed on the silicon substrate and surrounds the circuit and the input/output pad. The grounding ring is formed between the silicon substrate and the input/output pad and is electrically connected with the fixed seal ring. The protective ring is arranged on the silicon substrate and surrounds the output/input pad for being electrically connected with the fixed seal ring.

After the integrated circuit chip is produced, the size is small, the tray is prevented from being lost and is required to be used for storing in batches, the tray is required to be stacked when the tray is used for storing in batches, however, static electricity is easy to rub when the tray is stacked, the static electricity can lead the integrated circuit chip stored on the lower tray to be adsorbed to the bottom of the upper tray, not only can the lost false image be caused and also the lost false image be difficult to take down, the integrated circuit chip can be damaged by forced taking down, if the integrated circuit chip is clamped in the tray in order to prevent the phenomenon, the integrated circuit chip can be difficult to take out after being firmly clamped in the tray, and the integrated circuit chip can be damaged by forced taking out, so that technical personnel in the field provide a stackable tray for the integrated circuit chip to solve the problem brought forward in the background technology.

Disclosure of Invention

In order to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a stackable tray for ic chips, which is advantageous in that the ic chips are blown downward by wind pressure to be stably placed on a circular plate having a large friction coefficient, so that the ic chips are lifted out of the tray by hydraulic pressure for taking.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a can pile tray for integrated circuit chip, includes tray and lower tray, tray bottom is fixed with quantity and is the pile post of four groups down, it has lower tray to peg graft to pile post downside, it has the adjustment seat that quantity is the multiunit to go up tray internally mounted, first piston is installed to the inside one side of adjustment seat, first piston top is fixed with the stripper bar, the inside first piston one side of keeping away from of adjustment seat is installed the second piston, second piston top is connected with the ejector pin, the ejector pin top is fixed with the plectane, ejector pin annular side cover is equipped with coil spring, it is equipped with the fan to go up tray one side, the fan is close to last tray one side and is connected with the conveyer pipe, conveyer pipe bottom is connected with quantity and is the play tuber pipe of multiunit.

As a still further scheme of the invention: the improved tray is characterized in that jacks are formed in the upper tray, jacks are formed in the lower tray, four groups of stacking columns are fixed at the bottom of the upper tray, and the jacks are matched with the stacking columns.

As a still further scheme of the invention: go up the tray specification and be the same with lower tray specification, go up tray bottom and tray bottom down and all be fixed with antistatic cloth, fan, conveyer pipe and play tuber pipe constitute the wind pressure subassembly, the wind pressure subassembly is provided with two sets ofly, and is two sets of the wind pressure subassembly sets up respectively in last tray one side and last tray one side.

As a still further scheme of the invention: go up the inside storage tank that sets up quantity of tray and be the multiunit, the storage tank inner wall is fixed with the anticreep frame, the anticreep frame height is the same with the plectane height, the plectane height is less than tray top height, multiunit storage tank, multiunit adjustment seat, first piston, lifter, second piston, ejector pin, plectane, coil spring, storage tank and anticreep frame constitute and deposit the subassembly, go up inside and the tray inside down of tray and deposit the subassembly, go up the play tuber pipe of tray bottom and be in under the inside subassembly of depositing of tray directly over, go out the tuber pipe and deposit the subassembly one-to-one.

As a still further scheme of the invention: the buffer solution is filled in the adjusting seat, the adjusting seat is of a biconvex structure, the first piston and the second piston are rubber components, the first piston and the second piston are matched with a convex part of the adjusting seat of the biconvex structure, and the original height of the first piston is the same as that of the second piston.

As a still further scheme of the invention: the extrusion pole height is higher than last tray top height, the extrusion pole height is less than the pile post height, the upside the extrusion pole has seted up the activity hole with last tray junction, the downside the extrusion pole has seted up the activity hole with lower tray junction.

As a still further scheme of the invention: the lowest height of the air outlet pipe is higher than the original height of the extrusion rod, the length of the ejector rod is smaller than that of the extrusion rod, and the lowest height of the air outlet pipe is higher than the added highest height of the ejector rod and the circular plate.

As a still further scheme of the invention: the air outlet pipe bottom is provided with a horn-shaped air outlet cover, and the circular plate is made of silica gel.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention utilizes the same specification of the upper tray and the lower tray, the bottom of the upper tray and the bottom of the lower tray are both fixed with antistatic cloth, a fan, a conveying pipe and an air outlet pipe form air pressure components, the air pressure components are provided with two groups, the two groups of air pressure components are respectively arranged on one side of the upper tray and one side of the upper tray, the antistatic cloth prevents static electricity generated by stacking friction of the upper tray and the lower tray from adsorbing an integrated circuit chip to cause the appearance of false appearance of the loss of the integrated circuit chip, and the air pressure components always blow the integrated circuit chip below, so that the integrated circuit chip is always stabilized on a circular plate;

2. the integrated circuit chip lifting device comprises an adjusting seat, a first piston, a second piston, a buffer solution, a first piston, a second piston, a buffer solution and a circular plate, wherein the adjusting seat is of a biconvex structure, the first piston and the second piston are both rubber components, the first piston and the second piston are matched with a convex part of the adjusting seat of the biconvex structure, the original height of the first piston is the same as that of the second piston, the sealing effect of the rubber is utilized to match with the buffer solution to form hydraulic motion, the first piston, the buffer solution and the second piston are driven by applying external force on an extrusion rod to drive the ejector rod and the circular plate to move;

3. the inner part of the upper tray is provided with a plurality of groups of storage grooves, the inner wall of each storage groove is fixed with an anti-falling frame, the height of the anti-falling frame is the same as that of the circular plate, the height of the circular plate is lower than that of the top of the upper tray, the storage grooves, the plurality of groups of adjusting seats, the first piston, the extrusion rod, the second piston, the ejector rod, the circular plate, the spiral spring, the storage grooves and the anti-falling frame form storage assemblies, the storage assemblies are arranged in the upper tray and the lower tray, air outlet pipes at the bottom of the upper tray are positioned right above the storage assemblies in the lower tray, the air outlet pipes are in one-to-one correspondence with the storage, the air discharged downwards by the air outlet pipe blows to ensure that the integrated circuit chip is always stabilized in the storage tank, thereby avoiding moving and losing;

4. the height of the extrusion rod is higher than the top height of the upper tray, the height of the extrusion rod is less than the height of the stacking column, a movable hole is formed at the joint of the upper extrusion rod and the upper tray, and a movable hole is formed at the joint of the lower extrusion rod and the lower tray, so that sufficient space is provided for the movement of the extrusion rod after the upper tray and the lower tray are stacked conveniently;

5. the lowest height of the air outlet pipe is higher than the original height of the extrusion rod, the length of the ejector rod is smaller than that of the extrusion rod, the lowest height of the air outlet pipe is higher than the highest height of the ejector rod and the circular plate, the circular plate is still positioned below the air outlet pipe after being lifted by the ejector rod, and the air blown downwards by the air outlet pipe is always blown on the integrated circuit chip and is kept stable;

6. the horn-shaped air outlet cover is mounted at the bottom of the air outlet pipe, the circular plate is made of silica gel, the area of air increased by the horn-shaped air outlet cover is better blown to the circular plate below the horn-shaped air outlet cover, the friction coefficient of the circular plate made of the silica gel is large, and the placing stability of the integrated circuit chip is improved.

Drawings

FIG. 1 is a schematic diagram of a stackable tray for integrated circuit chips in accordance with the present invention;

FIG. 2 is a front cross-sectional view of an upper tray and a lower tray of a stackable tray for integrated circuit chips in accordance with the present invention;

FIG. 3 is an enlarged view of A in FIG. 1;

FIG. 4 is an enlarged view of B in FIG. 2;

fig. 5 is an enlarged view of C in fig. 2.

In the figure: 1. an upper tray; 2. a lower tray; 3. stacking the columns; 4. an extrusion stem; 5. an anti-drop frame; 6. a circular plate; 7. a jack; 8. an adjusting seat; 9. a first piston; 10. a second piston; 11. a coil spring; 12. a top rod; 13. a delivery pipe; 14. an antistatic cloth; 15. an air outlet pipe; 16. a fan; 101. and (7) a storage tank.

Detailed Description

The invention is described in further detail below with reference to the accompanying drawings

Referring to fig. 1 to 5, in an embodiment of the present invention, a stackable tray for an integrated circuit chip includes an upper tray 1 and a lower tray 2, four groups of stacking columns 3 are fixed at the bottom of the lower tray 2, the lower sides of the stacking columns 3 are inserted with the lower tray 2, a plurality of groups of adjusting seats 8 are installed inside the upper tray 1, a first piston 9 is installed at one side inside the adjusting seat 8, an extruding rod 4 is fixed at the top end of the first piston 9, a second piston 10 is installed at one side of the adjusting seat 8 far from the first piston 9, a top rod 12 is connected to the top of the second piston 10, a circular plate 6 is fixed at the top of the top rod 12, a coil spring 11 is sleeved on the annular side surface of the top rod 12, a fan 16 is installed at one side of the upper tray 1, a conveying pipe 13 is connected to the fan 16, and a plurality of groups of air outlet pipes 15 are connected.

Referring to fig. 1, 2 and 4, the upper tray 1 is provided with a jack 7 therein, the lower tray 2 is provided with a jack 7 therein, the bottom of the upper tray 1 is fixed with four sets of stacking columns 3, the jacks 7 are matched with the stacking columns 3, so that the upper tray 1 is stacked with the lower tray 2 through the stacking columns 3 and the jacks 7, and a plurality of other sets of upper trays 1 and lower trays 2 are stacked by using the stacking columns 3 and the jacks 7.

Referring to fig. 1, 2 and 5, the specification of the upper tray 1 is the same as that of the lower tray 2, the bottom of the upper tray 1 and the bottom of the lower tray 2 are both fixed with antistatic cloth 14, a fan 16, a conveying pipe 13 and an air outlet pipe 15 form air pressure components, the air pressure components are provided with two groups, the two groups of air pressure components are respectively arranged on one side of the upper tray 1 and one side of the upper tray 1, the antistatic cloth 14 prevents the integrated circuit chip from being adsorbed by static generated by the stacking friction of the upper tray 1 and the lower tray 2, which leads to the appearance of false appearance of the integrated circuit chip loss, and the air pressure components always blow the integrated circuit chip below, so that the integrated circuit chip is always stabilized on the circular plate 6.

Referring to fig. 1-5, a plurality of sets of storage grooves 101 are formed in an upper tray 1, an anti-falling frame 5 is fixed on the inner wall of the storage groove 101, the height of the anti-falling frame 5 is the same as that of a circular plate 6, the height of the circular plate 6 is lower than that of the top of the upper tray 1, a plurality of sets of storage grooves 101, a plurality of sets of adjusting seats 8, a first piston 9, an extrusion rod 4, a second piston 10, an ejector rod 12, the circular plate 6, a coil spring 11, the storage grooves 101 and the anti-falling frame 5 form a storage assembly, the storage assemblies are arranged in the upper tray 1 and the lower tray 2, an air outlet pipe 15 at the bottom of the upper tray 1 is positioned right above the storage assembly in the lower tray 2, the air outlet pipes 15 correspond to the storage assemblies one by one, the storage grooves 101 and the anti-falling frame 5 are matched with the circular plate 6 to facilitate stable placement of integrated circuit chips, the air discharged downwards from the air outlet pipe 15 blows to make the integrated circuit chip always stable in the storage tank 101, so that the integrated circuit chip is prevented from moving and losing.

Referring to fig. 2 and 4, a buffer solution is filled in the adjusting seat 8, the adjusting seat 8 is of a biconvex structure, the first piston 9 and the second piston 10 are rubber members, the first piston 9 and the second piston 10 are matched with a protruding part of the adjusting seat 8 of the biconvex structure, the original height of the first piston 9 is the same as the original height of the second piston 10, a hydraulic motion is formed by matching the sealing effect of the rubber with the buffer solution, the first piston 9, the buffer solution and the second piston 10 are matched by applying an external force to the extrusion rod 4 to drive the ejector rod 12 and the circular plate 6 to move upwards, and the integrated circuit chip is lifted out of the storage tank 101 in a hydraulic mode so as to be taken out.

Referring to fig. 2 and 3, the height of the extrusion rod 4 is higher than the height of the top of the upper tray 1, the height of the extrusion rod 4 is less than the height of the stacking column 3, the joint of the upper extrusion rod 4 and the upper tray 1 is provided with a movable hole, the joint of the lower extrusion rod 4 and the lower tray 2 is provided with a movable hole, and the upper tray 1 and the lower tray 2 are conveniently stacked and then provide enough space for the movement of the extrusion rod 4.

Referring to fig. 2, 4 and 5, the lowest height of the air outlet pipe 15 is higher than the original height of the extrusion rod 4, the length of the ejector rod 12 is smaller than that of the extrusion rod 4, the lowest height of the air outlet pipe 15 is higher than the added highest height of the ejector rod 12 and the circular plate 6, the circular plate 6 is still positioned below the air outlet pipe 15 after being lifted by the ejector rod 12, and the air blown downwards by the air outlet pipe 15 is always blown onto the integrated circuit chip and is kept stable.

Referring to fig. 2 and 5, the trumpet-shaped air outlet cover is mounted at the bottom of the air outlet pipe 15, the circular plate 6 is made of silica gel, the trumpet-shaped air outlet cover increases the air area and better blows on the circular plate 6 below, the friction coefficient of the circular plate 6 made of the silica gel is large, and the placing stability of the integrated circuit chip is improved.

The working principle of the invention is as follows: when an integrated circuit chip is placed into an upper tray 1 and a lower tray 2 for storage, the integrated circuit chip is clamped and moved into a storage groove 101, the integrated circuit chip is placed on a circular plate 6 with a large friction coefficient and is kept stable by using an anti-dropping frame 5, when the upper tray 1 and the lower tray 2 are stacked, the upper tray 1 is inserted into a jack 7 by using a stacking column 3, a fan 16 is powered on, the fan 16 transmits wind to a wind outlet pipe 15 through a conveying pipe 13, the wind outlet pipe 15 blows the wind on the integrated circuit chip by using a wind outlet cover to form wind pressure on the integrated circuit chip, and the anti-static cloth 14 prevents static electricity generated between the upper tray 1 and the lower tray 2 from upwards adsorbing the integrated circuit chip at the bottom of the upper tray 1, so that the integrated circuit chip is always blown downwards onto the circular plate 6;

when the integrated circuit chip needs to be removed, firstly, the extrusion rod 4 is pressed downwards, the extrusion rod 4 drives the first piston 9 to extrude the buffer solution downwards, the buffer solution is extruded to move towards the second piston 10 in the adjusting seat 8, the second piston 10 is extruded by the buffer solution to move upwards, the second piston 10 drives the ejector rod 12 to drive the integrated circuit chip to move upwards by using the circular plate 6, the spiral spring 11 is extruded by the second piston 10 to generate deformation and accumulate the elastic potential energy, at the moment, the integrated circuit chip is moved out of the storage tank 101 and the anti-falling frame 5, the integrated circuit chip is convenient for a worker to take out and use, the phenomenon that the integrated circuit chip is damaged due to the fact that the integrated circuit chip is forcibly taken out from the storage tank 101 is avoided, after the integrated circuit chip is taken out, the elastic potential energy generated by the spiral spring 11 drives the second piston 10 to slowly recover to the original position, so that the first piston 9 drives the extrusion rod 4 to restore the original position, and the storage of the next integrated circuit chip is convenient.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.