阅读说明：本技术 共享晶体管的字线驱动器以及相关的存储器装置和系统 (Shared transistor wordline driver and related memory devices and systems ) 是由 T·H·金 于 2020-08-19 设计创作，主要内容包括：描述了共享晶体管的字线驱动器以及相关的存储器装置和系统。存储器装置包含耦合到第一字线的第一字线驱动器和耦合到第二字线的第二字线驱动器。所述存储器装置还包含晶体管,所述晶体管包括耦合到所述第一字线驱动器的输出端的第一端子,以及耦合到所述第二字线驱动器的输出端的第二端子。(Transistor-sharing wordline drivers and related memory devices and systems are described. The memory device includes a first word line driver coupled to a first word line and a second word line driver coupled to a second word line. The memory device also includes a transistor including a first terminal coupled to an output of the first wordline driver, and a second terminal coupled to an output of the second wordline driver.)

1. A memory device, the memory device comprising:

a first word line driver coupled to a first word line;

a second word line driver coupled to a second word line; and

a first transistor, the first transistor comprising:

a first terminal coupled to an output of the first word line driver; and

a second terminal coupled to an output of the second word line driver.

2. The memory device of claim 1, wherein the first transistor is a PMOS transistor.

3. The memory device of claim 1, wherein the first transistor further comprises a third terminal configured to receive a memory address signal.

4. The memory device of claim 1, wherein the first word line driver comprises:

a second transistor, the second transistor comprising:

a first terminal configured to receive a first memory address signal; and

a third transistor including:

a first terminal configured to receive a second memory address signal; and

a second terminal coupled to a second terminal of the second transistor.

5. The memory device of claim 4, wherein the second transistor further comprises a third terminal coupled to a voltage rail.

6. The memory device of claim 4, wherein the third transistor further comprises a third terminal configured to receive a second memory address signal that is the complement of a third memory address signal received at the third terminal of the first transistor.

7. The memory device according to claim 4, wherein the second transistor is a PMOS transistor and the third transistor is an NMOS transistor.

8. The memory device of claim 4, wherein the second word line driver comprises:

a fourth transistor comprising a first terminal configured to receive a second memory address signal; and

a fifth transistor including:

a first terminal configured to receive a third memory address signal; and

a second terminal coupled to a second terminal of the fourth transistor.

9. The memory device according to claim 8, wherein the fourth transistor is a PMOS transistor and the fifth transistor is an NMOS transistor.

10. A word line driver system, the word line driver system comprising:

a first PMOS transistor comprising:

a gate configured to receive a first memory address signal;

a source coupled to an output of a first word line driver; and

a drain coupled to an output of the second word line driver.

11. The word line driver system of claim 10, wherein the source of the first PMOS transistor is coupled to a drain of a second PMOS transistor of the first word line driver and a drain of a first NMOS transistor of the first word line driver.

12. The word line driver system of claim 11, wherein the drain of the first PMOS transistor is coupled to a drain of a third PMOS transistor of the second word line driver and a drain of a second NMOS transistor of the second word line driver.

13. The word line driver system of claim 10, further comprising:

a second PMOS transistor, the second PMOS transistor comprising:

a gate configured to receive a second memory address signal;

a source coupled to an output of a third word line driver; and

a drain coupled to an output of a fourth word line driver, wherein:

the first and third word line drivers are configured to receive a first input signal; and

the second and fourth word line drivers are configured to receive a second input signal different from the first input signal.

14. The word line driver system of claim 13, wherein the source of the second PMOS transistor is coupled to a drain of a third PMOS transistor of the third word line driver and a drain of a first NMOS transistor of the third word line driver.

15. The word line driver system of claim 14, wherein the drain of the second PMOS transistor is coupled to a drain of a fourth PMOS transistor of the fourth word line driver and a drain of a second NMOS transistor of the fourth word line driver.

16. An electronic system, the electronic system comprising:

at least one input device;

at least one output device;

at least one processor device operatively coupled to the input device and the output device; and

at least one memory device operatively coupled to the at least one processor device and comprising at least one pair of word line drivers, wherein:

one word line driver of the pair is coupled to a first word line, and an output of the one word line driver of the pair is coupled to a first terminal of a transistor; and

the other word line driver of the pair is coupled to a second word line, and an output of the other word line driver of the pair is coupled to a second terminal of the transistor.

17. The electronic system of claim 16, wherein a source of the transistor is operably coupled to the output of the one word line driver of the pair and a drain of the transistor is operably coupled to the output of the other word line driver of the pair.

18. The electronic system of claim 16, wherein the one word line driver comprises:

a PMOS transistor; and

an NMOS transistor comprising a drain operably coupled to the drain of the PMOS transistor.

19. The electronic system of claim 18, wherein the PMOS transistor is operably coupled to a voltage source.

20. The electronic system of claim 16, wherein the other word line driver comprises:

a PMOS transistor; and

an NMOS transistor comprising a drain operably coupled to the drain of the PMOS transistor.

Technical Field

Embodiments of the present disclosure relate to word line driver circuits. And more particularly to a word line driver circuit including at least two word line drivers sharing a transistor, and to related memory modules, memory devices, semiconductor devices, and systems.

Background

It is a continuing goal to improve the area efficiency of memory devices. The area efficiency of a memory device is the ratio of the memory area including the memory cells to the total area of the memory device including other peripheral circuits. Thus, the area efficiency can be improved by reducing the area of the peripheral circuit.

One example of peripheral circuitry in a memory device is a word line driver. The memory device may include a plurality of word line drivers associated with a plurality of word lines (i.e., access lines) in a bank. The word line drivers selectively charge and discharge one or more word lines in the memory bank by selectively turning on/off transistors of the respective word line drivers. Thus, reducing the area of one or more word line drivers in a memory device may increase the area efficiency of the memory device.

Disclosure of Invention

One or more embodiments of the present disclosure include a memory device. The memory device includes a first word line driver coupled to a first word line, a second word line driver coupled to a second word line, and a first transistor. The first transistor includes a first terminal coupled to an output of the first word line driver and a second terminal coupled to an output of the second word line driver.

One or more embodiments of the present disclosure include a word line driver system. The word line driver system includes a first PMOS transistor including a gate configured to receive a first memory address signal, a source coupled to an output of the first word line driver, and a drain coupled to an output of the second word line driver.

One or more embodiments of the present disclosure include an electronic system including at least one input device, at least one output device, at least one processor device operably coupled to the input device and the output device, and at least one memory device operably coupled to the at least one processor device. The at least one memory device includes at least one pair of word line drivers, wherein one word line driver of the pair is coupled to a first word line and an output of the one word line driver of the pair is coupled to a first terminal of a transistor, and the other word line driver of the pair is coupled to a second word line and an output of the other word line driver of the pair is coupled to a second terminal of the transistor.

Drawings

FIG. 1 is a block diagram of a memory system including a plurality of memory devices, according to various embodiments of the present disclosure.

FIG. 2 is a block diagram of an example memory device, according to various embodiments of the present disclosure.

FIG. 3 is a block diagram of an example memory device, according to various embodiments of the present disclosure.

FIG. 4A is a schematic diagram of a conventional word line driver system.

Fig. 4B is a schematic diagram illustrating a transistor layout of the conventional word line driver system shown in fig. 4A.

FIG. 5 is a schematic diagram of an example wordline driver system, according to various embodiments of the present disclosure.

Fig. 6 is a logic table associated with the word line driver system of fig. 5 in accordance with various embodiments of the present disclosure.

Fig. 7 is a timing diagram associated with the word line driver system of fig. 5, in accordance with various embodiments of the present disclosure.

Fig. 8 is a schematic diagram illustrating a transistor layout of a word line driver system according to various embodiments of the present disclosure.

Fig. 9 is a simplified block diagram of a semiconductor device according to various embodiments of the present disclosure.

Fig. 10 is a simplified block diagram of an electronic system according to various embodiments of the present disclosure.

Detailed Description

As described above, the word line drivers selectively charge and discharge (e.g., activate/deactivate) one or more word lines in the memory bank by selectively turning on/off transistors of the respective word line drivers. As described above, reducing the area of one or more word line drivers in a memory device may increase the area efficiency of the memory device.

In various embodiments described herein, a memory device includes a first word line driver and a second word line driver that share a transistor. By sharing transistors (rather than the first and second word line drivers each containing additional dedicated transistors), the area efficiency of a memory device containing word line drivers is increased. More specifically, for example, the area efficiency of the throat layout region of the memory device may be increased. Typically, the throat layout region includes the word line drivers and memory sense amplifier control circuits described herein. In some embodiments, circuit cells (including word line drivers and memory sense amplifier control circuits) are assigned to control a memory sub-array cell that repeats a plurality of sub-array cells.

FIG. 1 illustrates a memory system 100 according to various embodiments of the present disclosure. Memory system 100 includes a plurality of memory devices 102, 103, 104, and 105 coupled to a communication bus 110 (e.g., a system bus). Each memory device 102-105 may include one or more memory dies, and in general, the memory devices 102-105 may be referred to as a memory module (e.g., a dual in-line memory module (DIMM)), a multi-chip package (MCP), or a package-on-package (POP).

The memory system 100 also includes a controller 112 coupled to each memory device 102 and 105 via a communication bus 110. The controller 112 may comprise a processor or any other suitable type of controller that may be configured to control and/or regulate various operations of the memory system 100, as well as provide interactivity with another device or system coupled to the memory system 100 via the interface 114.

The communication bus 110 may include one or more of an address bus 120, a data bus 122, and a control signal bus 124. In some embodiments, the memory device 102, the communication bus 110, and the controller 112 may be configured (e.g., physically disposed and mounted) on a Printed Circuit Board (PCB). In various embodiments, the memory system 100 may comprise a DIMM, and the one or more memory devices 102 and 105 may be a rank (or ranks) of DIMMs.

According to some embodiments of the present disclosure, at least some of the memory devices 102-105 may be coupled to the communication bus 110 via associated interfaces 121A-121D (collectively referred to as interfaces 121). For example, interface 121 (any of interfaces 121A-121D) may include one or more nodes (e.g., input/output (I/O) nodes) for coupling signal lines of an associated memory device to corresponding signal lines of communication bus 110. Further, the interface 121 may include one or more nodes coupled to one or more power supplies (not shown in fig. 1), such as a power supply and/or a reference potential. For example, each interface 121 may include an electromechanical type connection or a soldered wire connection to communication bus 110.

A memory device (e.g., memory device 102) may be in an active mode in response to selecting the memory device to drive the data bus 122 to a particular state, such as in response to performing a read operation in the memory device. Further, a memory device (e.g., memory device 102) may be in an inactive mode when another memory device (e.g., memory device 104) is selected to drive data bus 122 to a particular state, such as in response to performing a read operation in another memory device (e.g., memory device 104).

FIG. 2 illustrates a memory device 200 according to various embodiments of the present disclosure. The memory device 200 may be part of the memory system 100 of fig. 1, which may comprise, for example, dynamic DRAM (dynamic random access memory), SRAM (static random access memory), SDRAM (synchronous dynamic random access memory), DDR SDRAM (double data rate DRAM, e.g., DDR4 SDRAM, etc.), or SGRAM (synchronous graphics random access memory). For example, the memory device 200 may comprise one of the memory devices 102 and 105 of FIG. 1. The memory device 200 may be integrated on a semiconductor chip and may include a memory array 202.

In the embodiment of FIG. 2, memory array 202 is shown to include eight memory BANKs, BANK 0-7. More or fewer banks may be included in memory array 202 in other embodiments. Each bank includes a plurality of access lines (word lines WL), a plurality of data lines (bit lines BL) and/BL, and a plurality of memory cells MC arranged at intersections of the plurality of word lines WL and the plurality of bit lines BL and/BL. Selection of word lines WL may be performed by a row decoder 204 and selection of bit lines BL and/BL may be performed by a column decoder 206. In the embodiment of FIG. 1, row decoder 204 may comprise a respective row decoder for each of memory BANKs BANK 0-7 and column decoder 206 may comprise a respective column decoder for each of memory BANKs BANK 0-7.

The bit lines BL and/BL are coupled to respective sense amplifiers SAMP. Data read from the bit line BL or/BL may be amplified by the sense amplifier SAMP and transferred to the read/write amplifier 207 through the complementary local data line (LIOT/B), the Transfer Gate (TG), and the complementary main data line (MIOT/B). In contrast, write data output from the read/write amplifier 207 may be transferred to the sense amplifier SAMP through the complementary main data line MIOT/B, the transfer gate TG, and the complementary local data line LIOT/B, and write the memory cell MC coupled to the bit line BL or/BL.

Memory device 200 may generally be configured to receive various inputs (e.g., from an external controller) via various terminals, such as address terminal 210, command terminal 212, clock terminal 214, data terminal 216, and data mask terminal 218. Memory device 200 may contain additional terminals, such as power terminals 220 and 222.

During intended operation, one or more command signals COM received via the command terminal 212 may be transmitted to the command decoder 250 via the command input circuit 252. The command decoder 250 may include circuitry configured to generate various internal commands by decoding one or more command signals COM. Examples of the internal command include an active signal ACT and a read/write signal R/W.

Further, one or more address signals ADD received via the address terminal 210 may be transferred to the address decoder 230 via the address input circuit 232. The address decoder 230 may be configured to provide a row address XADD to the row decoder 204 and a column address YADD to the column decoder 206.

The active signal ACT may contain a pulse signal that is activated in response to a command signal COM (e.g., an active command) indicating a row access. In response to the active signal ACT, the row decoder 204 specifying the bank address may be activated. As a result, the word line WL designated by the row address XADD can be selected and activated.

The read/write signal R/W may contain a pulse signal that is activated in response to a command signal COM (e.g., a read command or a write command) indicating a column access. In response to the read/write signal R/W, the column decoder 206 may be activated, and the bit line BL specified by the column address YADD may be selected.

In response to the active signal ACT, the read signal, the row address XADD, and the column address YADD, data may be read from the memory cell MC specified by the row address XADD and the column address YADD. The read data may be output via the sense amplifier SAMP, the transfer gate TG, the read/write amplifier 207, the input/output circuit 262, and the data terminal 216. Further, in response to an active signal ACT, a write signal, a row address XADD, and a column address YADD, write data may be provided to the memory array 202 via the data terminal 216, the input/output circuit 262, the read/write amplifier 207, the transmission gate TG, and the sense amplifier SAMP. Write data can be written to the memory cell MC specified by the row address XADD and the column address YADD.

The clock signals CK and/CK may be received through the clock terminal 214. The clock input circuit 270 may generate the internal clock signal ICLK based on the clock signals CK and/CK. The internal clock signal ICLK may be communicated to various components of the memory device 200, such as the command decoder 250 and the internal clock generator 272. The internal clock generator 272 may generate an internal clock signal LCLK, which may be communicated to the input/output circuit 262 (e.g., to control the operational timing of the input/output circuit 262). Further, the data mask terminal 218 may receive one or more data mask signals DM. When the data mask signal DM is activated, overwriting of corresponding data may be disabled.

Fig. 3 illustrates a memory device 300 according to various embodiments of the present disclosure. Memory device 300, which may be part of memory device 200 of fig. 2, may include a word line driver circuit that includes a word line driver 345 and a driver control circuit 365. Memory device 300 includes a portion of a storage circuit 310 in which two memory cells 312 are arranged side-by-side. It should be understood that memory circuit 310 (e.g., memory cell array 202 in fig. 2) typically includes a plurality of memory cells arranged in rows and columns, but for simplicity only two such memory cells are shown here. Memory circuit 310 includes word lines 340 and bit lines 350 disposed adjacent rows and columns of memory cells 312. It should be understood that memory circuit 310 typically contains multiple word lines and bit lines, but for simplicity only two word lines and one bit line are shown here. In various embodiments, each memory cell 312 includes a pass-gate transistor 314 having its gate connected to a wordline 340, its drain connected to a bitline 350, and its source connected to a capacitor 316. each wordline 340 is driven by a wordline driver 345, and each bitline 350 is driven by a bitline driver 355.

A row decoder 360 and a column decoder 370 decode address signals on address lines 361 to access memory cells 312. Data may be provided to memory cells 312 via data input path 382 and retrieved from memory cells 312 via data output path 384. Data to and from data input path 382 and data output path 384 may be carried on data lines 380.

Each word line driver 345 may be controlled by a driver control circuit 365. The driver control circuit 365 receives signals from the row decoder 360 indicating which word line drivers 345 apply activation voltages and which word line drivers 345 apply deactivation voltages to the word lines 340. The signal provided by the control circuit 365 to the word line drivers 345 is a decoded signal, referred to as DOUT 366 (also referred to herein as a pre-decoded signal).

In one embodiment, when control circuit 365 passes high (e.g., a logic state high) DOUT 366 to the word line drivers, word line drivers 345 apply an activation voltage to the word line or word lines that it is driving. Activation voltage (e.g. V)_ccOr V_ccp) May be provided by a high voltage source 390 connected to a word line driver 345. An activation voltage is applied to word line 340 to perform a memory access function (e.g., a read or write function) on a particular memory cell 312. The activation voltage activates pass gate transistor 314 (i.e., turns on pass gate transistor 314) to enable data transfer between memory cell 312 and data paths 382 and 384.

When a memory access function is not being performed (e.g., standby mode), word line driver 345 may apply a deactivation voltage to word line 340. The deactivation voltage (e.g., ground or negative) may be provided by a low voltage source 392 connected to word line driver 345. Application of the deactivation voltage turns off pass gate transistor 314, thereby preventing any memory access function from being performed on memory cell 312.

Alternatively, in some embodiments, DOUT 366 instructs the word line drivers to apply the activation voltage provided by low voltage source 392. In this way, the activation voltage (e.g., ground or negative) activates pass gate transistor 314 (e.g., a PMOS transistor) to enable data transfer between memory cell 312 and data paths 382 and 384. Additionally, in some embodiments, DOUT 366 instructs the word line drivers to apply a deactivation voltage that may be provided by high voltage source 390. Thus, the deactivation voltage (e.g., V)_ccp) Pass gate transistor 314 (e.g., a PMOS transistor) is turned off, preventing any memory access function from being performed on memory cell 312.

FIG. 4A is a schematic diagram of a conventional word line driver system 400A. The word line driver system 400A includes a word line driver 410 coupled to a word line 419, a word line driver 420 coupled to a word line 429, a word line driver 430 coupled to a word line 439, and a word line driver 440 coupled to a word line 449. As depicted in fig. 4A, the wordline driver is a master wordline driver.

Each wordline driver shown in fig. 4A includes three transistors that are selectively turned on/off, which results in a desired output signal (e.g., voltage signal) for the corresponding wordline driver to activate or deactivate the corresponding wordline. In various embodiments, word line driver 410 drives an output voltage (e.g., ARMWLF <0>) to activate/deactivate word line 419, word line driver 420 drives an output voltage (e.g., ARMWLF <1>) to activate/deactivate word line 429, word line driver 430 drives an output voltage (e.g., ARMWLF <2>) to activate/deactivate word line 439, and word line driver 440 drives an output voltage (e.g., ARMWLF <3>) to activate/deactivate word line 449.

It should be understood that each of the word line drivers shown in FIG. 4A includes the same circuitry. For example, the word line driver 410 includes a transistor 411, a transistor 412, and a transistor 413. The word line driver 420 includes a transistor 421, a transistor 422, and a transistor 423. The word line driver 430 includes a transistor 431, a transistor 432, and a transistor 433. The word line driver 430 includes a transistor 441, a transistor 442, and a transistor 443.

At the word line driver 410, a drain of a transistor 411 (e.g., an NMOS transistor) is coupled to a drain of a transistor 412 (e.g., a PMOS transistor). Respective drains of the transistor 411 and the transistor 412 are coupled to a word line 419. In addition, a drain of transistor 413 (e.g., a PMOS transistor) is also coupled to word line 419, and a source of transistor 413 is coupled to power supply 414 (e.g., V_ccp)。

At the word line driver 420, a drain of a transistor 421 (e.g., an NMOS transistor) is coupled to a drain of a transistor 422 (e.g., a PMOS transistor). Respective drains of the transistor 421 and the transistor 422 are coupled to a word line 429. In addition, the drain of transistor 423 (e.g., a PMOS transistor) is also coupled to word line 429, and the source of transistor 423 is coupled to a power supply (e.g., V)_ccp)。

At word line driver 430, a drain of transistor 431 (e.g., an NMOS transistor) is coupled to a drain of transistor 432 (e.g., a PMOS transistor). Respective drains of the transistor 431 and the transistor 432 are coupled to a word line 439. In addition, the drain of transistor 433 (e.g., a PMOS transistor) is also coupled to word line 439, and the source of transistor 433 is coupled to a power supply (e.g., V)_ccp)。

At word line driver 440, a drain of transistor 441 (e.g., an NMOS transistor) is coupled to a drain of transistor 442 (e.g., a PMOS transistor). Respective drains of the transistors 441 and 442 are coupled to a word line 449. In addition, the drain of transistor 443 (e.g., a PMOS transistor) is also coupled to word line 449, and the source of transistor 443 is coupled to a power supply (e.g., V)_ccp)。

Each word line driver receives an input signal (e.g., a predecode signal) to selectively turn on/off a corresponding transistor. Examples of predecoded signals are ARMWL, RF3, and RF 3F. Referring to word line driver 410, the gate of transistor 411 and the gate of transistor 412 each receive ARMWL <0>, and the gate of transistor 413 receives RF3<0 >. At word line driver 420, the gate of transistor 421 and the gate of transistor 422 each receive ARMWL <0>, and the gate of transistor 423 receives RF3<1 >. At word line driver 430, the gate of transistor 431 and the gate of transistor 432 each receive ARMWL <1>, and the gate of transistor 433 receives RF3<0 >. At word line driver 440, the gate of transistor 441 and the gate of transistor 442 each receive ARMWL <1>, and the gate of transistor 443 receives RF3<1 >.

Each source of the transistor is operably coupled to receive an input voltage (e.g., a supply voltage or a predecode signal). This pulls the corresponding drain to either a high voltage or a low voltage (when the corresponding transistor is turned on). For example, at word line driver 410, the source of transistor 412 and the source of transistor 413 are operably coupled to a supply voltage, e.g., V_ccp(e.g., 3.2V). The source of transistor 411 is configured to receive RF3F<0>. RF3F is the complement of RF 3. For example, if RF3 is high (e.g., 3.2V), RF3F is low (e.g., 0V). Similarly, if RF3 is low (e.g., 0V), RF3F is high (e.g., 3.2V).

At word line 420, the source of transistor 422 and the source of transistor 423 are operably coupled to a supply voltage, e.g., V_ccp. The source of transistor 421 is configured to receive RF3F<1>. At word line 430, the source of transistor 432 and the source of transistor 433 are operably coupled to a supply voltage, e.g., V_ccp. A source of transistor 431 is configured to receive RF3F<0>. At word line 440, the source of transistor 442 and the source of transistor 443 are operably coupled to a supply voltage, e.g., V_ccp. The source of transistor 441 is configured to receive RF3F<1>。

Fig. 4B is a diagram illustrating a transistor layout of a conventional word line driver system 400B. The word line driver system 400B includes 16 word line drivers. For example, the word line driver system 400B includes four word line driver systems 400A (see FIG. 4A). The word line driver system 400B includes 16 PMOS transistors 450, 16 PMOS transistors 460, and 16 NMOS transistors 470. The transistor layout of the word line driver system 400B shows the active regions (e.g., the source and drain of each transistor) and the gates of the corresponding transistors. For example, PMOS transistor 450 includes an active region 452 (e.g., sources and drains of 16 PMOS transistors) and a gate 454 (e.g., gates of 16 PMOS transistors).

Fig. 5 is a diagram of a wordline driver system 500, according to various embodiments of the present disclosure. The word line driver system 500 includes a plurality of word line drivers coupled to respective word lines of the memory array. For example, each word line driver of the word line driver system 500 includes two transistors (e.g., an NMOS transistor and a PMOS transistor) coupled at their respective drains, similar to the word line driver system 400A of fig. 4A. In contrast to the word line driver system 400A, however, a pair of word line drivers (e.g., word line driver 510 and word line driver 530) of the word line driver system 500 share transistors. More specifically, the word line driver 510 and the word line driver 530 share transistors, and the word line driver 520 and the word line driver 540 share transistors. Thus, in various embodiments, each word line driver of the word line driver system 500 includes two dedicated transistors (i.e., instead of three dedicated transistors). As a result, the area efficiency of the word line drivers in the word line driver system 500 is increased as compared to the area efficiency of conventional word line drivers (e.g., the word line driver system 400A of fig. 4A).

The word line driver system 500 includes a word line driver 510 coupled to a word line 519, a word line driver 520 coupled to a word line 529, a word line driver 530 coupled to a word line 539, and a word line driver 540 coupled to a word line 549.

Each wordline driver includes two transistors that are selectively turned on/off (in addition to the shared transistor that is also selectively turned on/off), which results in a desired output signal (e.g., a voltage signal, referred to as ARMWLF) for the corresponding wordline driver to activate or deactivate the corresponding wordline. It should be understood that each word line driver includes the same (or similar) circuitry. For example, word line driver 510 includes transistor 511 and transistor 512. The word line driver 520 includes a transistor 521 and a transistor 522. The word line driver 530 includes a transistor 531 and a transistor 532. The word line driver 540 includes a transistor 541 and a transistor 542.

In addition, a pair of word line drivers in word line driver system 500 share a transistor. For example, word line driver 510 and word line driver 530 share transistor 505, and word line driver 520 and word line driver 540 share transistor 506. It is understood that transistor 505 replaces transistor 413 of word line driver 410 and transistor 433 of word line driver 430 (see fig. 4A), and transistor 506 replaces transistor 423 of word line driver 420 and transistor 443 of word line driver 440 (see fig. 4A).

The transistor 505 (e.g., a PMOS transistor) includes a source (coupled to the word line 519) coupled to an output of the word line driver 510 and a drain (coupled to the word line 539) coupled to an output of the word line driver 530. Similarly, a transistor 506 (e.g., a PMOS transistor) includes a source coupled to an output of the word line driver 520 (coupled to the word line 529) and a drain coupled to an output of the word line driver 540 (coupled to the word line 549).

At word line driver 510, a drain of transistor 511 (e.g., an NMOS transistor) is coupled to a drain of transistor 512 (e.g., a PMOS transistor). Respective drains of the transistor 511 and the transistor 512 are coupled to a word line 519. At word line driver 520, a drain of transistor 521 (e.g., an NMOS transistor) is coupled to a drain of transistor 522 (e.g., a PMOS transistor). Respective drains of the transistor 521 and the transistor 522 are coupled to a word line 529. At word line driver 530, a drain of transistor 531 (e.g., an NMOS transistor) is coupled to a drain of transistor 532 (e.g., a PMOS transistor). The respective drains of transistor 531 and transistor 532 are coupled to a word line 539. At the word line driver 540, a drain of a transistor 541 (e.g., an NMOS transistor) is coupled to a drain of a transistor 542 (e.g., a PMOS transistor). Respective drains of the transistor 541 and the transistor 542 are coupled to a word line 549.

Each word line driver (and shared transistors) receives an input signal (e.g., a predecode signal) to selectively turn on/off the corresponding transistor. Examples of input signals (e.g., predecode signals) are ARMWL, RF3, and RF3F (similar to word line driver system 400A). At word line driver 510, the respective gates of transistor 511 and transistor 512 each receive ARMWL <0 >. At word line driver 520, the respective gates of transistors 521 and 522 receive ARMWL <0 >. At word line driver 530, the respective gates of transistors 531 and 532 receive ARMWL <1 >. At word line driver 540, respective gate transistors 541 and 542 receive ARMWL <1 >. In addition, the gate of transistor 505 receives RF3<0> (similar to transistor 413 and transistor 433, see fig. 4A), and the gate of transistor 506 receives RF3<1> (similar to transistors 423 and 443, see fig. 4A).

Each source of a transistor is operably coupled to receive an input voltage (e.g., a supply voltage or a predecode signal) to pull the voltage at the drain to a high voltage or a low voltage (when the corresponding transistor is on). For example, at the word line driver 510, the source of the transistor 512 is operably coupled to a power supply 514, e.g., V_ccp(e.g., 3.2V). The source of transistor 511 is configured to receive RF3F<0>. At the word line driver 520, the source of the transistor 522 is operably coupled to a power supply 524, e.g., V_ccp. The source of transistor 521 is configured to receive RF3F<1>. At the word line driver 530, the source of the transistor 532 is operably coupled to a power supply 534, e.g., V_ccp. The source of transistor 531 is configured to receive RF3F<0>. At the word line driver 540, the source of the transistor 542 is operably coupled to a power supply 544, e.g., V_ccp. A source of transistor 541 is configured to receive RF3F<1>。

Additionally, a source of transistor 505 is coupled to an output of word line driver 510 (e.g., an output of transistor 511 or transistor 512), and a drain of transistor 505 is coupled to an output of word line driver 530. Thus, in some embodiments, the output voltage of the transistor 505 may be configured to provide an activation voltage and/or a deactivation voltage to the word line 539.

Similarly, the source of transistor 506 is coupled to an output of word line driver 520 (e.g., an output of transistor 521 or transistor 522), and the drain of transistor 506 is coupled to an output of word line driver 540. Thus, in some embodiments, the output voltage of the transistor 506 may be configured to provide an activation voltage and/or a deactivation voltage to the wordline 549.

In various embodiments, the wordline drivers in the wordline driver system 500 are master wordline drivers (also referred to as global wordline drivers). However, in various embodiments, the word line drivers in the word line driver system are sub-word line drivers (also referred to as local word line drivers). In general, each of the word lines extending through the memory array may be relatively long and, as a result, may have a substantial capacitance. In addition, the word lines may be made of polysilicon, which may have a relatively high resistance. The combination of the relatively high capacitance and the relatively high resistance of the word lines may make it difficult for the global word line driver to quickly switch the signal level on the word lines, particularly in portions of the memory cell array that are further away from the global word line driver. To alleviate this problem, memory cell arrays are typically divided into smaller memory cell arrays, and local word line drivers are fabricated between at least some of these smaller memory cell arrays. The local word line drivers may receive substantially the same signals that are used to control the global word line drivers to drive the word lines so that they may apply the same level to the word lines that the global word line drivers apply to the word lines.

As described above, the wordline driver system 500 includes transistors that are selectively turned on/off, which results in activating or deactivating the desired output signal (e.g., the ARMWLF signal) for the corresponding wordline. FIG. 6 illustrates a logic table 600 associated with the word line drivers of the word line driver system 500 of FIG. 5. For example, the logic table 600 shows high/low voltages (e.g., logic on/off) that enable the transistors of the word line driver system 500 to be selectively turned on/off. As a result, the desired output signal (e.g., the ARMWLF signal) activates or deactivates the corresponding wordline.

Logic table 600 contains values of input signals 610, e.g., the pre-decoded signal ARML signal and the RF3 signal. The pre-decoded signal RF3F is not shown because, as described above, RF3F is the complement of RF 3. Logic table 600 also contains values of output signals 620, e.g., ARMWLF signals that activate or deactivate corresponding wordlines. In one embodiment, the activation signal may be a low voltage signal (e.g., 0V) and the deactivation signal may be a high voltage signal (e.g., 3.2V). Alternatively, in other embodiments, the deactivation signal may be a low voltage signal (e.g., 0V) and the activation signal may be a high voltage signal (e.g., 3.2V).

Row 601 of logic table 600 corresponds to each word line in word line driver system 500 in a standby state. That is, each word line (e.g., word lines 519, 529, 539, and 549) is driven by a high voltage signal (e.g., a deactivation voltage of 3.2V). Specifically, the output signal ARMWLF <0> corresponding to the output of word line driver 510 is 3.2V, the output signal ARMWLF <1> corresponding to the output of word line driver 520 is 3.2V, the output signal ARMWLF <2> corresponding to the output of word line driver 530 is 3.2V, and the output signal ARMWLF <3> corresponding to the output of word line driver 540 is 3.2V.

Row 602 of the logic table 600 corresponds to the wordline 519 of the wordline driver system 500 being in an active state (and wordlines 529, 539, and 549 being in a deactivated/standby state). Specifically, the output signal ARMWLF <0> corresponding to the word line driver 510 is 0V, and the output signals ARMWLF <1>, ARMWLF <2>, ARMWLF <3> are 3.2V.

Row 603 of logic table 600 corresponds to word line 529 of word line driver system 500 being in an active state because ARMWLF <1> is 0V (and word lines 519, 539, and 549 are in a disabled/standby state). Row 604 of logic table 600 corresponds to word line 539 of word line driver system 500 being in an active state because ARMWLF <2> is 0V (and word lines 519, 529, and 549 are in a deactivated/standby state). Row 605 of logic table 600 corresponds to wordline 549 of wordline driver system 500 in the active state because ARMWLF <3> is 0V (and wordlines 519, 529, and 539 are in the deactivated/standby state).

As described above, the output voltage of the transistor 505 may be used to provide an activation voltage or a deactivation voltage for the word line 539. For example, at word line driver 530, the drains of transistors 531 and 532 are 0V. However, when transistor 505 is on and the source of transistor 505 is 3.2V (e.g., the output of word line driver 510 is 3.2V), word line 539 is pulled to 3.2V. Thus, word line 539 is pulled to 3.2V (while the drains of transistors 531 and 532 are 0V). This example may be provided by the input signals depicted in row 605 of logic table 600. In a similar manner, the output voltage of the transistor 506 may be used to provide an activation voltage and/or a deactivation voltage for the wordline 549.

Fig. 7 illustrates a timing diagram 700 of signals associated with the wordline driver system 500 of fig. 5. In particular, signal timing diagram 700 includes the timing of input signal 610 and output signal 620 corresponding to row 602 (see FIG. 6). Signal timing diagram 700 contains graph 710 showing output signal ARMWLs, graph 720 showing predecode signal ARMWL, and graph 730 showing predecode signals RF3 and RF 3F.

Referring to fig. 5, 6, and 7, at time t0, word lines 519, 529, 539, and 549 are in a standby state. That is, ARMWLF <0> to ARMWLF <3> are high voltages, for example, 3.2V. As such, wordlines 519, 529, 539, and 549 are in a standby/deactivated state. Based on the responses ARMWL <0> of 0V, ARMWL <1> of 0V, RF3<0> of 0V and RF3<1> of 0V, the wordlines 519 to 549 are in a standby state.

At time t1, ARMWLF <0> is at a low voltage, e.g., 0V. Thus, word line 519 is active (while word lines 529, 539, and 549 remain in a standby state). Referring to logic table 600 (see FIG. 6) and signal timing diagram 700 (see FIG. 7), ARMWL <0> is in an activated state (and ARMWL <1> to ARMWL <3> are in a deactivated state) based on ARMWL <0> being 3.2V, ARMWL <1> being 0V, RF3<0> being 3.2V and RF3<1> being 0V.

At time t2, ARMWLF <0> through ARMWLF <3> are high voltage, e.g., 3.2V. As such, wordlines 519, 529, 539, and 549 are in a standby/deactivated state. For example, ARMWL <0> becomes 0V (from 3.2V), RF3<0> becomes 0V (from 3.2V), and RF3F <0> becomes 3.2V (from 0V).

Fig. 8 is a diagram illustrating a transistor layout of a word line driver system 800 according to various embodiments of the present disclosure. The word line driver system 800 includes 16 word line drivers (including shared transistors). For example, the word line driver system 800 includes four word line driver systems 500. The word line driver system 800 includes 8 PMOS transistors 850, 16 PMOS transistors 860, and 16 NMOS transistors 870. In particular, the word line driver system 800 includes fewer PMOS transistors (e.g., 8 PMOS transistors 850 compared to 16 PMOS transistors 450) than the word line driver system 400B of fig. 4B. As such, the word line driver system 800 has greater area efficiency than the word line driver system 400B.

Fig. 9 is a simplified block diagram of a memory system 900 implemented in accordance with one or more embodiments described herein. Memory system 900 includes a memory module that includes a plurality of memory devices 902 and a control logic component 904. For example, the memory device 902 may include the memory device 102 of FIG. 1, the memory device 200, the memory device 300, the word line driver system 500 of FIG. 5, and/or the word line driver system 800 of FIG. 8, and the control logic component 904 may include the controller 112 of FIG. 1. The control logic component 904 is operably coupled with the memory device 902 to read, write, or refresh any or all memory cells within the memory device 902.

An electronic system is also disclosed. An electronic system may include a memory system including a plurality of memory devices. Fig. 10 is a simplified block diagram of an electronic system 1000 implemented in accordance with one or more embodiments described herein. The electronic system 1000 includes at least one input device 1002. The input device 1002 may be a keyboard, mouse, or touch screen. The electronic system 1000 also includes at least one output device 1004. The output device 1004 may be a monitor, a touch screen, or a speaker. The input device 1002 and the output device 1004 do not have to be separate from each other. The electronic system 1000 also includes a memory device 1006. An input device 1002, an output device 1004, and a storage device 1006 are coupled to the processor 1008.

The electronic system 1000 also includes a memory system 1010 coupled to the processor 1008. The memory system 1010, which may include the memory system 100 of FIG. 1, includes the memory device (e.g., the memory device 102 and 105 of FIG. 1), the memory device 200 of FIG. 2, the memory device 300 of FIG. 3, the word line driver system 500 of FIG. 5, and/or the word line driver system 800 of FIG. 8. Electronic system 1000 may comprise a computing, processing, industrial, or consumer product. For example, but not limited to, electronic system 1000 may include a personal computer or computer hardware component, a server or other network hardware component, a handheld device, a tablet computer, an electronic notebook, a camera, a telephone, a music player, a wireless device, a display, a chipset, a game, a vehicle, or other known system.

One or more embodiments of the present disclosure include a memory device. The memory device includes a first word line driver coupled to a first word line, a second word line driver coupled to a second word line, and a first transistor. The first transistor includes a first terminal coupled to an output of the first word line driver and a second terminal coupled to an output of the second word line driver.

One or more embodiments of the present disclosure include a word line driver system. The word line driver system includes a first PMOS transistor including a gate configured to receive a first memory address signal, a source coupled to an output of the first word line driver, and a drain coupled to an output of the second word line driver.

One or more embodiments of the present disclosure include an electronic system including at least one input device, at least one output device, at least one processor device operably coupled to the input device and the output device, and at least one memory device operably coupled to the at least one processor device. The at least one memory device includes at least one pair of word line drivers, wherein one word line driver of the pair is coupled to a first word line and an output of the one word line driver of the pair is coupled to a first terminal of a transistor, and the other word line driver of the pair is coupled to a second word line and an output of the other word line driver of the pair is coupled to a second terminal of the transistor.

In accordance with common practice, the various features shown in the drawings may not be drawn to scale. The illustrations presented in this disclosure are not meant to be actual views of any particular apparatus (e.g., device, system, etc.) or method, but are merely idealized representations which are employed to describe various embodiments of the present disclosure. Accordingly, the dimensions of the various elements may be arbitrarily expanded or reduced for clarity. Furthermore, some of the drawings may be simplified for clarity. Accordingly, the drawings may not depict all of the components of a given apparatus (e.g., device) or all of the operations of a particular method.

Terms used herein, particularly in the appended claims (e.g., bodies of the appended claims), are generally intended as "open" terms (e.g., the term "including" should be interpreted as "including but not limited to," the term "having" should be interpreted as "having at least," the term "includes" should be interpreted as "includes but is not limited to," etc.).

In addition, if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases "at least one" and "one or more" to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles "a" or "an" limits any particular claim containing such introduced claim recitation to embodiments containing only one such recitation, even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an" (e.g., "a" and/or "an" should be interpreted to mean "at least one" or "one or more"); the same holds true for the use of indefinite articles used to introduce claim recitations. As used herein, "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, even if a specific number of an introduced claim recitation is explicitly recited, it should be understood that such recitation should be interpreted to mean at least the recited number (e.g., the bare recitation of "two recitations," without other modifiers, means at least two recitations, or two or more recitations). Further, in those instances where convention analogous to "at least one of A, B and C, etc." or "one or more of A, B and C, etc." is used herein, in general, such structure is intended to encompass a alone, B alone, C, A and B together, a and C together, B and C together, or A, B and C together, etc. For example, use of the term "and/or" is intended to be interpreted in this manner.

Further, any disjunctive word or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase "a or B" should be understood to include the possibility of "a" or "B" or "a and B".

In addition, the use of the terms first, second, third, etc. herein are not necessarily intended to imply a particular order or number of elements. Generally, the terms "first," "second," "third," and the like are used for different elements to distinguish as common identifiers. If the terms "first," "second," "third," etc. do not imply a particular order, these terms should not be construed as to imply a particular order. Moreover, if the terms "first," "second," "third," etc. are not intended to imply a particular number of elements, these terms should not be taken to imply a particular number of elements.

The embodiments of the present disclosure described above and illustrated in the drawings do not limit the scope of the disclosure, which is encompassed by the scope of the appended claims and their legal equivalents. Any equivalent embodiments are within the scope of the present disclosure. Indeed, various modifications of the disclosure, e.g., alternative useful combinations of the elements described, in addition to those shown and described herein will become apparent to those skilled in the art from the description. Such modifications and embodiments are also within the scope of the appended claims and equivalents.