阅读说明：本技术 一种电子设备以及电子设备的温度检测装置的控制方法 (Electronic equipment and control method of temperature detection device of electronic equipment ) 是由 贾勇 于 2020-10-09 设计创作，主要内容包括：本申请实施例公开了一种电子设备以及电子设备的温度检测装置的控制方法。电子设备,包括：温度检测装置,包括热电堆传感器以及温度调节器,所述温度调节器用于对所述热电堆传感器的冷端的温度进行调节以使所述冷端保持在工作温度；主板,设置于所述温度检测装置的一侧；电池,连接所述主板,用于为所述主板供电；以及控制器,连接所述电池,用于根据所述电池的放电电流以及电压对所述温度调节器进行控制,以使所述冷端的温度保持在工作温度。本申请实施例通过增设温度调节器,能够通过温度调节器对冷端的温度进行控制以使冷端保持在工作温度。(The embodiment of the application discloses electronic equipment and a control method of a temperature detection device of the electronic equipment. An electronic device, comprising: the temperature detection device comprises a thermopile sensor and a temperature regulator, wherein the temperature regulator is used for regulating the temperature of the cold end of the thermopile sensor so as to keep the cold end at the working temperature; the mainboard is arranged on one side of the temperature detection device; the battery is connected with the mainboard and used for supplying power to the mainboard; and the controller is connected with the battery and is used for controlling the temperature regulator according to the discharge current and the voltage of the battery so as to keep the temperature of the cold end at the working temperature. This application embodiment can control the temperature of cold junction so that the cold junction keeps at operating temperature through temperature regulator through addding temperature regulator.)

1. An electronic device, comprising:

the temperature detection device comprises a thermopile sensor and a temperature regulator, wherein the temperature regulator is used for regulating the temperature of the cold end of the thermopile sensor so as to keep the cold end at the working temperature;

the mainboard is arranged on one side of the temperature detection device;

the battery is connected with the mainboard and used for supplying power to the mainboard; and

and the controller is connected with the battery and is used for controlling the temperature regulator according to the discharge current and the voltage of the battery so as to keep the temperature of the cold end at the working temperature.

2. The electronic device of claim 1, wherein the temperature regulator comprises:

the semiconductor refrigerator is arranged on one side of the thermopile sensor and comprises a refrigeration area corresponding to the cold end, and the controller is connected with the semiconductor refrigerator and is used for adjusting the temperature of the refrigeration area of the semiconductor refrigerator so as to keep the cold end at the working temperature.

3. The electronic device of claim 2, wherein the thermopile sensor further comprises a hot end for absorbing heat from an environment under test, the temperature sensing device further comprising:

the shielding cover and the thermopile sensor are located on the same side of the semiconductor refrigerator, the shielding cover is arranged on the periphery of the thermopile sensor in a winding mode, an optical window is arranged on the shielding cover, and light rays of the environment to be detected can reach the hot end through the optical window.

4. The electronic device of claim 3, wherein a projection of the shield on the semiconductor refrigerator is located within the refrigerated area.

5. The electronic device according to claim 3, wherein the temperature detection means further comprises:

and the optical filter is arranged on the shielding cover and covers the optical window, and the light of the environment to be measured reaches the hot end after being filtered by the optical filter.

6. The electronic device of claim 2, wherein the semiconductor refrigerator further comprises a heating area connected to the cooling area, and the heating area is located on one side of the cooling area or is arranged around the periphery of the cooling area.

7. The electronic device of claim 1, further comprising:

a cover plate;

the center is located one side of apron and with the apron is injectd jointly and is held the interval, temperature-detecting device the mainboard the battery and the controller all is located hold the interval in, temperature-detecting device is located the mainboard with between the apron.

8. A method for controlling a temperature detection device of an electronic apparatus, the temperature detection device including a thermopile sensor and a temperature regulator, the method comprising:

acquiring discharge current and voltage of a battery;

and adjusting the refrigerating power of the temperature regulator according to the discharge current and the voltage of the battery so as to keep the cold end of the thermopile sensor at the working temperature.

9. The control method of claim 8, wherein said adjusting the cooling power of the temperature regulator according to the discharge current and the voltage of the battery to maintain the cold end of the thermopile sensor at an operating temperature comprises:

determining the temperature variation of the mainboard according to the discharge current and the voltage of the battery;

and adjusting the refrigerating power of the temperature regulator according to the temperature variation so as to keep the cold end of the thermopile sensor at the working temperature.

10. The control method of claim 9, wherein said adjusting a cooling power of said temperature regulator according to said temperature variation to maintain a cold end of said thermopile sensor at an operating temperature comprises:

if the temperature variation is larger than a first temperature value, controlling the refrigerating power of the temperature regulator to be increased so as to keep the cold end of the thermopile sensor at the working temperature; or

And if the temperature variation is smaller than a first temperature value, controlling the cooling power of the temperature regulator to be reduced so as to keep the cold end of the thermopile sensor at the working temperature.

11. The control method according to claim 9, wherein the determining the temperature change amount of the main board according to the discharge current and the voltage of the battery includes:

establishing a mapping relation between the discharge current and voltage of the battery and the temperature variation of the mainboard;

and determining the discharge current of the battery and the temperature variation of the mainboard corresponding to the voltage according to the mapping relation.

Technical Field

The present disclosure relates to temperature detection technologies, and particularly to an electronic device and a method for controlling a temperature detection apparatus of the electronic device.

Background

The thermopile sensor is a temperature measuring element, and the thermopile sensor includes hot junction and cold junction, and wherein the hot junction is used for absorbing the heat of the environment that awaits measuring, and the cold junction then is in operating temperature under, in the use of thermopile sensor, can calculate the temperature of the environment that awaits measuring according to the temperature difference between cold junction and the hot junction. However, in the related art, the cold end is easily interfered by the external environment, so that the cold end cannot be stably at the working temperature, and the accuracy of the calculated temperature of the environment to be measured is affected.

Disclosure of Invention

The embodiment of the application provides electronic equipment and a control method of a temperature detection device of the electronic equipment. The technical scheme is as follows:

in a first aspect, an embodiment of the present application provides an electronic device, including:

the temperature detection device comprises a thermopile sensor and a temperature regulator, wherein the temperature regulator is used for regulating the temperature of the cold end of the thermopile sensor so as to keep the cold end at the working temperature;

the mainboard is arranged on one side of the temperature detection device;

the battery is connected with the mainboard and used for supplying power to the mainboard; and

and the controller is connected with the battery and is used for controlling the temperature regulator according to the discharge current and the voltage of the battery so as to keep the temperature of the cold end at the working temperature.

In a second aspect, an embodiment of the present application provides a control method for a temperature detection device of an electronic device, where the temperature detection device includes a thermopile sensor and a temperature regulator, the control method including:

acquiring discharge current and voltage of a battery;

and adjusting the refrigerating power of the temperature regulator according to the discharge current and the voltage of the battery so as to keep the cold end of the thermopile sensor at the working temperature.

According to the electronic equipment and the control method of the temperature detection device of the electronic equipment, the temperature regulator is additionally arranged, so that the temperature of the cold end can be controlled through the temperature regulator to keep the cold end at the working temperature. Simultaneously, this application embodiment controls temperature regulator according to the discharge current and the voltage of battery, and then makes the cold junction of the thermopile sensor of temperature regulator effect can keep at operating temperature, compares in the direct temperature sensor that sets up on the cold junction among the correlation technique to detect the temperature of cold junction with the help of temperature sensor, need not to add temperature sensor, make electronic equipment's structure simplify more.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic partial structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of thermopile sensing in an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a functional block diagram of an electronic device provided by an embodiment of the present application;

FIG. 4 is a top view of a semiconductor cooler in an electronic device according to an embodiment of the present disclosure;

fig. 5 is a schematic flowchart of a method for controlling a temperature detection device of an electronic device according to an embodiment of the present application;

fig. 6 is a schematic flowchart of another method for controlling a temperature detection device of an electronic device according to an embodiment of the present disclosure.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

The thermopile sensor is a temperature measuring element, and the thermopile sensor includes hot junction and cold junction, and wherein the hot junction is used for absorbing the heat of the environment that awaits measuring, and the cold junction then is in operating temperature under, in the use of thermopile sensor, can calculate the temperature of the environment that awaits measuring according to the temperature difference between cold junction and the hot junction. However, in the related art, the cold end is easily interfered by the external environment, so that the cold end cannot be stably at the working temperature, and the accuracy of the calculated temperature of the environment to be measured is affected. Based on this, the embodiments of the present application provide an electronic device and a method for controlling a temperature detection device of the electronic device, which aim to solve the above-mentioned drawbacks.

In a first aspect, an embodiment of the present application provides an electronic device 100. The electronic device 100 may be any device having a temperature detection function. For example, the electronic device 100 may include a mobile phone, a tablet computer, a notebook computer, a palm top computer, a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, a Digital TV, a desktop computer, and the like.

Specifically, referring to fig. 1 and 2, the electronic device 100 includes a temperature detection apparatus 110. In this embodiment, the temperature detecting device 110 may include a thermopile sensor 111, where the thermopile sensor 111 is formed by serially connecting a plurality of thermocouples, and obtains a temperature difference to be measured or a temperature to be measured by superimposing a thermoelectric force on each thermocouple and according to a corresponding relationship between the thermoelectric force and the temperature. The thermopile sensor 111 may include a silicon substrate 1113 with a recess 1114 disposed on the silicon substrate 1113. A thermocouple is arranged on the surface of the silicon substrate 1113 and crosses the groove 1114, and one end of the thermocouple on the silicon substrate is defined as a cold end 1111; the end of the thermocouple suspended on the groove is provided with a thin film material for inducing and absorbing the ambient heat, and the corresponding area of the thin film material is defined as a hot end 1112.

Furthermore, in order to prevent the cold end 1111 from being interfered by the external environment and being unable to be stably at the operating temperature, the temperature detecting device 110 of the embodiment of the present application may further include a temperature regulator 112. The temperature regulator 112 is used to regulate the temperature of the cold end 1111 of the thermopile sensor 111 to maintain the cold end 1111 at an operating temperature.

It will be appreciated, in conjunction with FIG. 3, that electronic device 100 may further include a controller 120, controller 120 being configured to control temperature regulator 112 to maintain the temperature of cold end 1111 at an operating temperature. In some embodiments, controller 120 may control thermostat 112 to maintain cold end 1111 at an operating temperature based on the particular temperature value of cold end 1111. Certainly, in order to obtain the specific temperature value of cold end 1111, still need add the temperature measurement module who is used for detecting cold end 1111 temperature in addition, on the one hand this device of temperature measurement module has been increased to electronic device 100 like this, and on the other hand temperature measurement module also can occupy electronic device 100's inner space, will put forward higher requirement to electronic device 100's space utilization. In order to control the temperature regulator 112 without changing the structure of the electronic device 100, the inventor has studied and found that when the main board 130 of the electronic device 100 is disposed on one side of the temperature detection device 110 and the battery 140 of the electronic device 100 is used to supply power to the main board 130, the temperature regulator 112 can be controlled based on the discharge current and voltage of the battery 140 so as to maintain the temperature of the cold end 1111 at the operating temperature.

The electronic device 100 of the embodiment of the present application controls the temperature regulator 112 according to the discharge current and the voltage of the battery 140, and then the cold end 1111 of the thermopile sensor 111 acting on the temperature regulator 112 can be kept at the working temperature, and compared with the related art in which the temperature sensor is directly arranged on the cold end 1111, and the temperature of the cold end 1111 is detected by the temperature sensor, the temperature sensor does not need to be added, so that the structure of the electronic device 100 is simplified.

In the embodiment of the present application, the temperature regulator 112 may be any device capable of generating temperature variation. For example, the temperature regulator 112 may include a heating device, a semiconductor cooler 1121, and the like. The semiconductor refrigerator 1121 utilizes the peltier effect to refrigerate, and a pair of thermocouples made of N, P type materials generate heat absorption and heat release phenomena at the nodes of the thermocouples due to different introduction directions of direct current after the thermocouples introduce the direct current; wherein, the end with high heat is the heating area 1121b of the semiconductor cooler 1121, the end with low heat is the cooling area 1121a of the semiconductor cooler 1121, and a temperature gradient is formed between the heating area 1121b and the cooling area 1121a for energy transfer. Since the semiconductor cooler 1121 has the cooling region 1121a and the heating region 1121b, the cooling region 1121a of the semiconductor cooler 1121 can be used to regulate and control the temperature of the cold end 1111 of the thermopile sensor 111, and the heating region 1121b of the semiconductor cooler 1121 is used to dissipate heat, so that the overall temperature of the electronic device 100 is more balanced, and therefore the temperature regulator 112 in the embodiment of the present application may preferably include the semiconductor cooler 1121. Specifically, the semiconductor cooler 1121 may be disposed at one side of the thermopile sensor 111, the cooling region 1121a of the semiconductor cooler 1121 corresponds to the cold end 1111 of the thermopile sensor 111, and the controller 120 is connected to the semiconductor cooler 1121 and is configured to adjust the temperature of the cooling region 1121a of the semiconductor cooler 1121, so that the cold end 1111 is maintained at the operating temperature.

In some embodiments, to reduce the interference of the external environment to the temperature detection device 110, the temperature detection device 110 may further include a shielding case 113. The shield 113 may be located on the same side of the semiconductor cooler 1121 as the thermopile sensor 111, and the shield 113 may be provided around the outer circumference of the thermopile sensor 111. Of course, in order to allow the external ambient light to reach hot end 1112 of thermopile sensor 111, optical window 1131 may be disposed on shield 113, so that the ambient light to be measured can reach hot end 1112 through optical window 1131. Further, the projection of the shielding hood 113 on the semiconductor cooler 1121 may be located within the cooling region 1121 a. The projection of the shielding cover 113 on the semiconductor cooler 1121 is located in the cooling region 1121a, and may be that an outer boundary line of the projection of the shielding cover 113 on the semiconductor cooler 1121 coincides with a boundary line of the cooling region 1121a, or that an outer boundary line of the projection of the shielding cover 113 on the semiconductor cooler 1121 is located inside the boundary line of the cooling region 1121 a. In the above, the thermopile sensor 111 and the shield 113 wound around the periphery of the thermopile sensor 111 are both disposed in the range where the cooling region 1121a functions, so that the effect of the cooling region 1121a of the temperature regulator 112 on the cold end 1111 can be enhanced.

In some embodiments, the temperature detection device 110 may further include an optical filter 114. The optical filter 114 may be disposed on the shielding can 113 and cover the optical window 1131, and the optical filter 114 can filter the light of the environment to be measured and make the filtered light reach the hot end 1112. The filter 114 can filter out stray light, and enhance the detection accuracy of the temperature detection device 110.

In this embodiment, the arrangement positions of the heating region 1121b and the cooling region 1121a of the semiconductor cooler 1121 may be arbitrary, and it is only necessary to ensure that the cooling region 1121a corresponds to the cold end 1111 of the thermopile sensor 111. For example, the heating region 1121b of the semiconductor cooler 1121 may be located at one side of the cooling region 1121a, as shown in fig. 1; or around the periphery of the refrigeration zone 1121a, as shown in fig. 4. In practical use, the semiconductor cooler 1121 with the corresponding structure may be selected according to the heat generation condition of the electronic device 100.

It is understood that when the heat generation degree of the region of the electronic device 100 around the cold end 1111 is similar, the semiconductor cooler 1121 may be disposed around the heating region 1121b at the periphery of the cooling region 1121a to dissipate the heat via the region of the electronic device 100 around the cold end 1111. When the heat generation level of the region of the electronic device 100 located on the side of the cold end 1111 is low and the heat generation levels of other regions are relatively severe, the semiconductor cooler 1121 may be further configured to locate the heating region 1121b on the side of the cooling region 1121a, and the heating region 1121b may correspond to the region of the electronic device 100 with the low heat generation level, so as to dissipate the heat through the region of the electronic device 100 with the low heat generation level. The shape of the refrigeration zone 1121a may be circular, as shown in fig. 4, or the shape of the refrigeration zone 1121a may be square, etc.

The electronic device 100 may further include a cover plate 150 and a middle frame 160, the middle frame 160 is located at one side of the cover plate 150 and defines an accommodation region together with the cover plate 150, the temperature detection device 110, the motherboard 130, the battery 140 and the controller 120 may all be located in the accommodation region, and the temperature detection device 110 may be located between the motherboard 130 and the cover plate 150. The cover plate 150 may be a front panel of the electronic device 100 or a rear panel of the electronic device 100. When the cover 150 is a front panel of the electronic device 100, the heating region 1121b of the semiconductor cooler 1121 may dissipate heat by means of the display screen of the electronic device 100, the cover 150, and the like. When the cover plate 150 is a rear panel of the electronic device 100, the electronic device 100 may dissipate heat by means of the cover plate 150 of the electronic device 100. Since the electronic device 100 pursues the full-screen technology, the temperature detection device 110 disposed near the front panel occupies a certain screen space, which hinders the development of the electronic device 100 toward the full-screen trend, and therefore, the cover plate 150 is preferably the rear panel of the electronic device 100 in the embodiment of the present invention.

In a second aspect, an embodiment of the present application provides a method for controlling the temperature detection device 110 of the electronic device 100. Wherein the temperature detecting device 110 includes a thermopile sensor 111 and a temperature regulator 112, referring to fig. 5, the control method includes:

in step S502, the discharge current and voltage of the battery 140 are acquired.

The temperature detecting device 110 is mainly installed near the motherboard 130 when being installed, and since the motherboard 130 heats up seriously during the use of the electronic device 100, the working state of the cold end 1111 of the thermopile sensor 111 is affected. The temperature rise of motherboard 130 can be known through the detection of the discharge current and the voltage of battery 140, and then the influence degree that cold end 1111 receives motherboard 130 can be known.

In step S504, the cooling power of the temperature regulator 112 is adjusted according to the discharge current and voltage of the battery 140, so that the cold end 1111 of the thermopile sensor 111 is maintained at the operating temperature.

The cooling power of temperature regulator 112 is adjusted by the discharge current and voltage of battery 140, and the discharge current and voltage of battery 140 can be obtained by an electricity meter in electronic device 100, and it is not necessary to add a temperature measurement module for detecting the temperature of cold end 1111, so that the structure of electronic device 100 can be simplified.

The control method of the temperature detection device 110 of the electronic device 100 according to the embodiment of the application controls the temperature regulator 112 according to the discharge current and the voltage of the battery 140, so that the cold end 1111 of the thermopile sensor 111, which is operated by the temperature regulator 112, can be kept at the working temperature, and compared with the related art in which a temperature sensor is directly arranged on the cold end 1111 and the temperature of the cold end 1111 is detected by the temperature sensor, the temperature sensor does not need to be additionally arranged, so that the structure of the electronic device 100 is more simplified.

In some embodiments, referring to fig. 6, the method for controlling the temperature detection device 110 of the electronic apparatus 100 may include:

in step S602, the discharge current and voltage of the battery 140 are acquired.

The temperature detecting device 110 is mainly installed near the motherboard 130 when being installed, and since the motherboard 130 heats up seriously during the use of the electronic device 100, the working state of the cold end 1111 of the thermopile sensor 111 is affected. The temperature rise of motherboard 130 can be known through the detection of the discharge current and the voltage of battery 140, and then the influence degree that cold end 1111 receives motherboard 130 can be known.

In step S604, a mapping relationship between the discharge current and voltage of the battery 140 and the temperature variation of the motherboard 130 is established.

In order to obtain the temperature variation of the motherboard 130 after the system detects the discharge current and the voltage of the battery 140, a mapping relationship between the discharge current and the voltage of the battery 140 and the temperature variation of the motherboard 130 may be established in advance. In some embodiments, several sets of discharge current data and discharge voltage data of the battery 140 and temperature variation data of the motherboard 130 corresponding to the discharge current data and the discharge voltage data in the actual usage scene may be collected in advance, and then a conditional expression between the discharge current and the voltage of the battery 140 and the temperature variation of the motherboard 130 is fitted based on the data by combining a least square method and the like, and the conditional expression is used as a mapping relation between the discharge current and the voltage of the battery 140 and the temperature variation of the motherboard 130. In some embodiments, enough discharge current data and discharge voltage data of the battery 140 and the temperature variation data of the motherboard 130 corresponding to the discharge current data and the discharge voltage data can be collected and stored as a mapping relationship.

Step S606, determining the discharge current of the battery 140 and the temperature variation of the motherboard 130 corresponding to the voltage according to the mapping relationship.

When the mapping relationship is a conditional expression between the discharging current and voltage of the battery 140 and the temperature variation of the motherboard 130, the detected discharging current and voltage of the battery 140 can be directly substituted into the conditional expression, so as to obtain the corresponding temperature variation of the motherboard 130. When the mapping relationship is a sufficient number of stored data sets, the temperature variation of the main board 130 corresponding to the detected discharge current and voltage can be directly found in the stored data.

Step S608, if the temperature variation is greater than a first temperature value, controlling the cooling power of the temperature regulator 112 to increase so that the cold end 1111 of the thermopile sensor 111 is maintained at an operating temperature; or, if the temperature variation amount is less than the first temperature value, controlling the cooling power of the temperature regulator 112 to be reduced so that the cold end 1111 of the thermopile sensor 111 is maintained at the operating temperature.

The first temperature value may be preset, and it may be defined that when the temperature variation of the main board 130 is within the range of the first temperature value, the influence of the temperature variation of the main board 130 on the cooling region 1121a of the thermostat 112 is negligible. When the temperature variation of mainboard 130 is greater than first temperature value, it is more serious to show that mainboard 130 generates heat, can cause the temperature of cold junction 1111 to rise seriously after influencing cold junction 1111 of thermopile sensor 111, consequently steerable temperature regulator 112's refrigeration power increase this moment to can make cold junction 1111 can keep at operating temperature through cooling district 1121a of temperature regulator 112 to cool down cold junction 1111. When the temperature variation of mainboard 130 is less than first temperature value, it is more serious to show that mainboard 130 cooling is more serious, can cause the temperature of cold junction 1111 to seriously descend after influencing cold junction 1111 of thermopile sensor 111, consequently steerable temperature regulator 112's refrigeration power reduces this moment to can heat up cold junction 1111 through refrigeration district 1121a of temperature regulator 112 and make cold junction 1111 can keep at operating temperature.

The control method of the temperature detection device 110 of the electronic device 100 according to the embodiment of the application controls the temperature regulator 112 according to the discharge current and the voltage of the battery 140, so that the cold end 1111 of the thermopile sensor 111, which is operated by the temperature regulator 112, can be kept at the working temperature, and compared with the related art in which a temperature sensor is directly arranged on the cold end 1111 and the temperature of the cold end 1111 is detected by the temperature sensor, the temperature sensor does not need to be additionally arranged, so that the structure of the electronic device 100 is more simplified.

In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.