阅读说明：本技术 一种通过温度步进应力来定义最大限度操作温度的方法 (Method for defining maximum operation temperature through temperature stepping stress ) 是由 胡焱 俞玉华 申伟坡 于 2020-10-30 设计创作，主要内容包括：本发明公开了一种通过温度步进应力来定义最大限度操作温度的方法,包括高温测试步骤和低温测试步骤；预先设定初始温度C、测试温度等级T、每一级温度变化值B以及检测停留时间；进行高温测试步骤时,基于初始温度C,逐步升高温度等级T,在每一级温度变化值B下停留设定的检测停留时间,期间和之后检查测试样品的功能是否正常,若是,则继续升高温度等级T,若否,则记录失效模式和当前温度；进行低温测试步骤时,逐步降低温度等级T,在每一级温度变化值B下停留设定的检测停留时间,期间和之后检查测试样品的功能是否正常,若是,则继续降低温度等级T,若否,则记录失效模式和当前温度；本发明最大限度节约时间,提高测试效率。(The invention discloses a method for defining maximum operating temperature through temperature stepping stress, which comprises a high-temperature testing step and a low-temperature testing step; presetting initial temperature C, test temperature grade T, temperature change value B of each grade and detection retention time; when the high-temperature testing step is carried out, the temperature grade T is gradually increased based on the initial temperature C, the set detection retention time is retained under each grade of temperature change value B, whether the function of the test sample is normal or not is checked during and after the retention time, if yes, the temperature grade T is continuously increased, and if not, the failure mode and the current temperature are recorded; when the low-temperature test step is carried out, the temperature grade T is gradually reduced, the set detection retention time is retained under the temperature change value B of each grade, whether the function of the test sample is normal or not is checked during and after the detection retention time, if yes, the temperature grade T is continuously reduced, and if not, the failure mode and the current temperature are recorded; the invention saves time to the utmost extent and improves the testing efficiency.)

1. A method of defining a maximum operating temperature by temperature step stress, characterized by: comprises a high-temperature testing step and a low-temperature testing step;

presetting initial temperature C, test temperature grade T, temperature change value B of each grade and detection retention time;

when the high-temperature testing step is carried out, the temperature grade T is gradually increased based on the initial temperature C, the set detection retention time is retained under each grade of temperature change value B, whether the function of the test sample is normal or not is checked during and after the retention time, if yes, the temperature grade T is continuously increased, and if not, the failure mode and the current temperature are recorded;

and when the low-temperature test step is carried out, the temperature grade T is gradually reduced based on the initial temperature C, the set detection retention time is retained under each grade of temperature change value B, whether the function of the test sample is normal or not is checked during and after the retention time, if yes, the temperature grade T is continuously reduced, and if not, the failure mode and the current temperature are recorded.

2. A method of defining a maximum operating temperature by temperature step stress as claimed in claim 1, wherein: the test temperature grade T is divided into 0 grade to N grade, namely T is more than or equal to 0.

3. A method of defining a maximum operating temperature by temperature step stress as claimed in claim 2, wherein: when the testing temperature grade T is 5 grades upwards, namely T is more than or equal to 5, the set detection retention time under the temperature change value B of each grade is 6 times of the detection retention time when the detection retention time is 0 grade to 4 grade.

4. A method of defining a maximum operating temperature by temperature step stress as claimed in any one of claims 1 to 3, wherein: in the high-temperature testing step, the current temperature in the failure mode is C + TB; in the low temperature test step, the current temperature in the failure mode is C-TB.

5. A method of defining a maximum operating temperature by temperature step stress as claimed in claim 4, wherein: the initial temperature C was 25 ℃ and the temperature change value B at each stage was 5 ℃.

6. A method of defining a maximum operating temperature by temperature step stress as claimed in claim 5, wherein: the detection residence time was 8 hours.

Technical Field

The invention relates to a method for defining maximum operation temperature through temperature stepping stress, belonging to the technical field of product detection.

Background

The environmental temperature limit test is a test performed to ensure that the product keeps normal function in all expected environments such as use, transportation or storage within a specified life span, and is to expose the product to artificial environmental conditions to undergo maximum temperature test, so as to evaluate the performance of the product under the environmental conditions of actual use, transportation and storage, and analyze and research the influence degree of environmental factors and the action mechanism thereof.

The existing environment test modes are more, but the use is more disordered, a proper mode cannot be correctly selected during actual test, and an error mode is easily selected only by personal estimation, so that unnecessary manpower, material resources and financial resources are wasted; sometimes, the tester is too confident to fully understand the test sample, and a problem is found but not discovered, thereby affecting the whole test item.

Disclosure of Invention

In view of the above technical problems, the present invention aims to: a method for defining maximum operation temperature by temperature step stress is provided, which seeks and finds the temperature maximum of the test sample by the gradual increase of the high temperature and low temperature stress of the device, thereby saving the time to the maximum and improving the test efficiency.

The technical solution of the invention is realized as follows: a method for defining maximum operation temperature by temperature step stress comprises a high temperature test step and a low temperature test step; presetting initial temperature C, test temperature grade T, temperature change value B of each grade and detection retention time;

when the high-temperature testing step is carried out, the temperature grade T is gradually increased based on the initial temperature C, the set detection retention time is retained under each grade of temperature change value B, whether the function of the test sample is normal or not is checked during and after the retention time, if yes, the temperature grade T is continuously increased, and if not, the failure mode and the current temperature are recorded;

and when the low-temperature test step is carried out, the temperature grade T is gradually reduced based on the initial temperature C, the set detection retention time is retained under each grade of temperature change value B, whether the function of the test sample is normal or not is checked during and after the retention time, if yes, the temperature grade T is continuously reduced, and if not, the failure mode and the current temperature are recorded.

Preferably, the test temperature grade T is divided into 0 grade to N grade, namely T is more than or equal to 0.

Preferably, when the test temperature level T is 5 levels up, namely T is more than or equal to 5, the set detection retention time is 6 times of the detection retention time when the retention time under each level of temperature change value B is 0 to 4 levels.

Preferably, in the high-temperature testing step, the current temperature in the failure mode is C + TB; in the low temperature test step, the current temperature in the failure mode is C-TB.

Preferably, the initial temperature C is 25 ℃ and the temperature change value B of each stage is 5 ℃.

Preferably, the detection residence time is 8 hours.

Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:

according to the method for defining the maximum operation temperature through the temperature stepping stress, the device is subjected to high-temperature testing and low-temperature testing, the high-temperature stress and the low-temperature stress of the device are gradually increased, the maximum temperature of a test sample is searched and found, resource waste is avoided, influences caused by problem modification are found more effectively, and therefore the testing efficiency is improved.

Drawings

The technical scheme of the invention is further explained by combining the accompanying drawings as follows:

FIG. 1 is a flow chart of the high temperature testing steps in a method of the present invention for defining maximum operating temperature by temperature step stress;

FIG. 2 is a flow chart of the low temperature testing steps in a method of the present invention for defining a maximum operating temperature by temperature step stress.

Detailed Description

The invention is described below with reference to the accompanying drawings.

The invention discloses a method for defining maximum operation temperature through temperature stepping stress, which comprises a high-temperature testing step and a low-temperature testing step;

presetting initial temperature C, test temperature grade T, temperature change value B of each grade and detection retention time;

when the high temperature testing step is carried out, the temperature grade T is gradually increased based on the initial temperature C, the set detection retention time is retained under each grade of temperature change value B, whether the function of the test sample is normal or not is checked during and after the retention time, if yes, the temperature grade T is continuously increased, and if not,

recording the failure mode and the current temperature;

and when the low-temperature test step is carried out, the temperature grade T is gradually reduced based on the initial temperature C, the set detection retention time is retained under each grade of temperature change value B, whether the function of the test sample is normal or not is checked during and after the retention time, if yes, the temperature grade T is continuously reduced, and if not, the failure mode and the current temperature are recorded.

Example one

The apparatus was tested at high temperature as shown in figure 1:

the high temperature test part was started and left at 25 ℃ for 8 hours;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 30 ℃ and staying for 8 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 35 ℃ and staying for 8 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 40 ℃ and staying for 8 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 45 ℃ and staying for 8 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 50 ℃ and staying for 48 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 55 ℃ and staying for 48 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 60 ℃ and staying for 48 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 65 ℃ and staying for 48 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 70 ℃ and staying for 48 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 75 ℃ and staying for 48 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, if so, heating to 80 ℃ and staying for 48 hours, and if not, recording the failure mode and the current temperature;

and (5) after the high-temperature test is finished, recording the current temperature and determining the highest limit temperature.

The apparatus was tested at low temperature as shown in figure 2:

the low temperature test part was started and left at 25 ℃ for 8 hours;

during and after the period, checking whether the function of the equipment is normal, if so, cooling to 20 ℃ and staying for 8 hours, and if not, recording the failure mode and the current temperature;

during and after the period, checking whether the function of the equipment is normal, if so, cooling to 15 ℃ and staying for 8 hours, and if not, recording the failure mode and the current temperature;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to 10 ℃ and staying for 8 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to 5 ℃ and staying for 8 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to 0 ℃ and staying for 48 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to-5 ℃ and staying for 48 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to-10 ℃ and staying for 48 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to-15 ℃ and staying for 48 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to-20 ℃ and staying for 48 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to-25 ℃ and staying for 48 hours;

during and after the process, checking whether the function of the equipment is normal, and if not, recording the failure mode and the current temperature; if yes, cooling to-30 ℃ and staying for 48 hours;

and (5) after the low-temperature test is finished, recording the current temperature and determining the lowest limit temperature.

And (4) integrating the high-temperature test and the low-temperature test to determine the highest limit temperature and the lowest limit temperature of the equipment sample.

According to the method for defining the maximum operation temperature through the temperature stepping stress, the device is subjected to high-temperature testing and low-temperature testing, the high-temperature stress and the low-temperature stress of the device are gradually increased, the maximum temperature of a test sample is searched and found, resource waste is avoided, influences caused by problem modification are found more effectively, and therefore the testing efficiency is improved.

The above-mentioned embodiments are merely illustrative of the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.