阅读说明：本技术 一种用于氧传感器芯片的带过渡层绝缘层及其制备方法 (Transition layer-containing insulating layer for oxygen sensor chip and preparation method thereof ) 是由 谢光远 王晓宁 邱电荣 张宇明 陈存华 于 2020-07-27 设计创作，主要内容包括：本发明公开了一种用于氧传感器芯片的带过渡层绝缘层及其制备方法,包括加热电极,所述加热电极与引脚相连接,且加热电极外部设置有流延绝缘片,所述流延绝缘片外部有流延过渡片,且流延过渡片外部设置有流延基片,优选的,过渡层包括流延绝缘片、流延过渡片和流延基片,优选的,加热电极上下均设有过渡层,该用于氧传感器芯片的带过渡层绝缘层制备方法,好处是氧传感器芯片的绝缘性能提高,在绝缘层和基片之间增加过渡层的好处是减少了绝缘层与基片之间的热应力失配,能够提高氧传感器芯片耐热冲击的能力。(The invention discloses an insulating layer with a transition layer for an oxygen sensor chip and a preparation method thereof, wherein the insulating layer with the transition layer comprises a heating electrode, the heating electrode is connected with a pin, a casting insulating sheet is arranged outside the heating electrode, a casting transition sheet is arranged outside the casting insulating sheet, a casting substrate is arranged outside the casting transition sheet, preferably, the transition layer comprises the casting insulating sheet, the casting transition sheet and the casting substrate, and preferably, transition layers are arranged above and below the heating electrode.)

1. A transition layer-carrying insulating layer for an oxygen sensor chip, comprising a heater electrode (5), characterized in that: heating electrode (5) are connected with pin (6), and heating electrode (5) outside is provided with curtain coating insulating piece (2), there is curtain coating transition piece (3) curtain coating insulating piece (2) outside, and curtain coating transition piece (3) outside is provided with curtain coating substrate (4).

2. The insulating layer with a transition layer for an oxygen sensor chip according to claim 1, wherein: the transition layer (1) comprises a casting insulation sheet (2), a casting transition sheet (3) and a casting substrate (4).

3. The insulating layer with a transition layer for an oxygen sensor chip according to claim 1, wherein: transition layers (1) are arranged on the upper and lower sides of the heating electrode (5).

4. The method for preparing an insulating layer with a transition layer for an oxygen sensor chip according to claim 1, wherein: the casting substrate (4) is prepared from two powders of alumina and zirconia with the granularity smaller than 1um, a solvent and a casting glue according to the mass fraction ratio: 100 (30-50) and (20-40) are prepared and blended to form a slurry, and the slurry is cast on a casting machine.

5. The method for preparing an insulating layer with a transition layer for an oxygen sensor chip according to claim 4, wherein: the casting glue is formed by dissolving polyvinyl butyral in ethanol and adding polyethylene glycol plasticizer, wherein the weight ratio of polyvinyl butyral: ethanol: the volume ratio of the polyethylene glycol plasticizer is as follows: 100: (50-100): (20 to 50).

6. The method for preparing an insulating layer with a transition layer for an oxygen sensor chip according to claim 4, wherein: the mass ratio of the alumina powder to the zirconia powder is 1:1, and the granularity is less than 1 um.

Technical Field

The invention relates to the technical field of insulating layers, in particular to an insulating layer with a transition layer for an oxygen sensor chip and a preparation method thereof.

Background

The flat plate type oxygen sensor chip is manufactured with a heating unit, and the upper and lower parts of the heating electrode are printed with insulating layers.

The existing printing insulating layer has the defect of influencing the stability of the resistance value of the heating electrode, because the heating electrode is continuously printed after the insulating layer is printed on the zirconia casting substrate, the two printing layers can be influenced mutually, so that the shrinkage matching is not good, the stability and the consistency of the resistance of the heating electrode are influenced, and the existing equipment is required to be improved aiming at the problems.

Disclosure of Invention

The invention aims to provide a preparation method of an insulating layer with a transition layer for an oxygen sensor chip, which aims to solve the problems that the stability of the resistance value of a heating electrode is influenced by the defects of the existing printed insulating layer proposed in the background technology, and the stability and consistency of the resistance value of the heating electrode are influenced because the two printed layers are influenced by each other due to the fact that the heating electrode is continuously printed after the insulating layer is printed on a zirconium oxide casting substrate, so that the shrinkage matching is not good.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a take transition layer insulating layer preparation method for oxygen sensor chip, includes heating electrode, heating electrode is connected with the pin, and the heating electrode outside is provided with the curtain coating insulating piece, there is the curtain coating transition piece curtain coating insulating piece outside the curtain coating insulating piece, and curtain coating transition piece outside is provided with the curtain coating substrate.

Preferably, the transition layer comprises a cast insulation sheet, a cast transition sheet and a cast base sheet,

preferably, transition layers are arranged on the upper and the lower parts of the heating electrode,

preferably, the casting substrate is prepared from two powders of alumina and zirconia with the particle size of less than 1um, a solvent and a casting glue according to the mass fraction ratio: 100 (30-50) and (20-40) are prepared and blended to form a slurry casting machine,

preferably, the casting compound is formed by dissolving polyvinyl butyral in ethanol and adding polyethylene glycol plasticizer, the ratio of polyvinyl butyral: ethanol: the volume ratio of the polyethylene glycol plasticizer is as follows: 100: (50-100): (20 to 50) of the total amount of the organic solvent,

preferably, the mass ratio of the alumina powder to the zirconia powder is 1:1, the particle size is less than 1um,

compared with the prior art, the invention has the beneficial effects that: the preparation method of the insulating layer with the transition layer for the oxygen sensor chip has the advantages that the stability and the consistency of heating resistance after sintering are improved, meanwhile, because the insulating layer is integrally formed, the insulating layer is not a pattern covering the heating electrode part like a printing insulating layer, a plurality of substrate parts which are not covered with the insulating layer are directly overlapped up and down, although the overlapping strength is improved, if the heating electrode is not subjected to hole insulating treatment, the heating electrode is communicated with the substrate to cause electric leakage, and the insulating property of the oxygen sensor chip is improved. The advantage of adding the transition layer between the insulating layer and the substrate is that the thermal stress mismatch between the insulating layer and the substrate is reduced, which can improve the thermal shock resistance of the oxygen sensor chip.

Drawings

FIG. 1 is a schematic view of the structure of the present invention.

In the figure: 1. a transition layer; 2. casting an insulating sheet; 3. casting a transition piece; 4. casting a substrate; 5. heating the electrode; 6. and (7) a pin.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the present invention provides a technical solution: the utility model provides a take transition layer insulating layer preparation method for oxygen sensor chip, includes transition layer 1, curtain coating insulating piece 2, curtain coating transition piece 3, curtain coating substrate 4, heating electrode 5 and pin 6, and heating electrode 5 is connected with pin 6, and 5 outsides of heating electrode are provided with curtain coating insulating piece 2, and 2 outsides of curtain coating insulating piece have curtain coating transition piece 3, and 3 outsides of curtain coating transition piece are provided with curtain coating substrate 4.

The transition layer 1 includes a casting insulation sheet 2, a casting transition sheet 3 and a casting base sheet 4.

The upper part and the lower part of the heating electrode 5 are both provided with transition layers 1.

The casting substrate 4 is prepared from two powders of alumina and zirconia with the granularity less than 1um, a solvent and a casting glue according to the mass fraction ratio: 100 (30-50) and (20-40) are prepared and blended to form a slurry, and the slurry is cast on a casting machine.

The casting glue is formed by dissolving polyvinyl butyral in ethanol and adding polyethylene glycol plasticizer, wherein the weight ratio of polyvinyl butyral: ethanol: the volume ratio of the polyethylene glycol plasticizer is as follows: 100: (50-100): (20 to 50).

The mass ratio of the alumina powder to the zirconia powder is 1:1, and the granularity is less than 1 um.

The working principle is as follows: the casting sheet containing the insulating functional material is firstly manufactured, the transition layer casting sheet is pre-laminated with the upper substrate and the lower substrate, and then the heating electrode is directly printed on the pre-laminated substrate, so that the advantage is that the stability and the consistency of the heating resistance after being fired are improved, meanwhile, because the whole layer of insulation is not a pattern covering the heating electrode part like a printing insulation layer, and a plurality of substrate parts which are not covered with the insulation layer are directly laminated up and down, although the lamination strength is improved, if the heating electrode is not subjected to hole insulation treatment, the part is communicated with the substrate to cause electric leakage, and the other advantage of the whole layer of insulation is that the insulation performance of the oxygen sensor chip is improved. The advantage of adding a transition layer between the insulating layer and the substrate is that the thermal stress mismatch between the insulating layer and the substrate is reduced, the thermal shock resistance of the oxygen sensor chip can be improved, and this is done throughout, and what is not described in detail in this specification is well within the skill of the art known to those skilled in the art.

The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for simplicity of description only and are not intended to indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operative in a particular orientation, and are not to be considered limiting of the claimed invention.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.