阅读说明：本技术 一种用于氧传感器芯片的绝缘层及其制备方法 (Insulating layer for oxygen sensor chip and preparation method thereof ) 是由 谢光远 王晓宁 陈存华 张宇明 邱电荣 于 2020-07-27 设计创作，主要内容包括：本发明公开了一种用于氧传感器芯片的绝缘层及其制备方法,包括包括加热电极,所述加热电极与引脚相连接,且加热电极外部设置有流延绝缘片,所述流延绝缘片外部设置有流延基片,加热电极上下均设有流延绝缘片和流延基片,氧化铝粉和溶剂粒度小于1um,该用于氧传感器芯片的绝缘层制备方法,制作含有绝缘功能料的流延片,与上下基片预叠合,然后直接在预叠合的基片上印刷加热电极,这样的好处是烧成之后的加热电阻稳定性和一致性提高,同时因为是整体一层绝缘。(The invention discloses an insulating layer for an oxygen sensor chip and a preparation method thereof, wherein the insulating layer comprises a heating electrode, the heating electrode is connected with a pin, a casting insulating sheet is arranged outside the heating electrode, a casting substrate is arranged outside the casting insulating sheet, the casting insulating sheet and the casting substrate are arranged above and below the heating electrode, and the granularity of alumina powder and solvent is less than 1 um.)

1. An insulating layer for an oxygen sensor chip comprising a heating electrode (1), characterized in that: heating electrode (1) is connected with pin (3), and heating electrode (1) outside is provided with curtain coating insulating piece (2), curtain coating insulating piece (2) outside is provided with curtain coating substrate (4).

2. The insulating layer for an oxygen sensor chip according to claim 1, characterized in that: the heating electrode (1) is provided with a casting insulation sheet (2) and a casting substrate (4) from top to bottom.

3. The method of claim 1, wherein the method comprises the steps of: the casting substrate (4) is prepared from two kinds of alumina powder, a solvent and a casting adhesive in percentage by mass: 100 (30-50) and (20-40) are prepared and blended to form a slurry, and the slurry is cast on a casting machine.

4. The method of claim 3, wherein the method comprises the steps of: the casting glue is formed by dissolving polyvinyl butyral in ethanol and adding polyethylene glycol plasticizer, wherein the weight ratio of polyvinyl butyral: ethanol: the volume ratio of the polyethylene glycol plasticizer is as follows: 100: (50-100): (20 to 50).

5. The method of claim 4, wherein the method comprises the steps of: the granularity of the alumina powder and the solvent is less than 1 um.

Technical Field

The invention relates to the technical field of insulating layers, in particular to a preparation method of an insulating layer for an oxygen sensor chip.

Background

The flat plate type oxygen sensor chip is manufactured with a heating unit, and the upper and lower parts of the heating electrode are printed with insulating layers.

The existing printing insulating layer has the defect of influencing the stability of the resistance value of the heating electrode, because the heating electrode is continuously printed after the insulating layer is printed on the zirconia casting substrate, the two printing layers can be influenced mutually, so that the shrinkage matching is not good, the stability and the consistency of the resistance of the heating electrode are influenced, and the existing equipment is required to be improved aiming at the problems.

Disclosure of Invention

The invention aims to provide a preparation method of an insulating layer for an oxygen sensor chip, which aims to solve the problems that the stability of the resistance value of a heating electrode is influenced due to the fact that the stability and consistency of the resistance value of the heating electrode are influenced due to the fact that the heating electrode is continuously printed after the insulating layer is printed on a zirconia casting substrate, and two printing layers are affected with each other to cause poor shrinkage matching.

In order to achieve the purpose, the invention provides the following technical scheme: the preparation method of the insulating layer for the oxygen sensor chip comprises a heating electrode, wherein the heating electrode is connected with a pin, a casting insulating sheet is arranged outside the heating electrode, and a casting substrate is arranged outside the casting insulating sheet.

Preferably, the upper and lower sides of the heating electrode are provided with a casting insulation sheet and a casting substrate.

Preferably, the casting substrate is prepared from two kinds of alumina powder, a solvent and a casting glue according to the mass fraction ratio: 100 (30-50) and (20-40) are prepared and blended to form a slurry, and the slurry is cast on a casting machine.

Preferably, the casting compound is formed by dissolving polyvinyl butyral in ethanol and adding polyethylene glycol plasticizer, the ratio of polyvinyl butyral: ethanol: the volume ratio of the polyethylene glycol plasticizer is as follows: 100: (50-100): (20 to 50).

Preferably, the alumina powder and solvent particle size is less than 1 um.

Compared with the prior art, the invention has the beneficial effects that: the method for preparing the insulating layer for the oxygen sensor chip has the advantages that the stability and the consistency of heating resistance after sintering are improved, meanwhile, because the insulating layer is integrally formed, the pattern which covers the heating electrode part is not the same as the pattern which covers the printing insulating layer, and the substrate parts which are not covered with the insulating layer are directly overlapped up and down, although the overlapping strength is improved, if the heating electrode is not subjected to hole insulating treatment, the heating electrode is communicated with the substrate to cause electric leakage, and the insulating property of the oxygen sensor chip is improved.

Drawings

FIG. 1 is a schematic view of the structure of the present invention.

In the figure: 1. heating the electrode; 2. casting an insulating sheet; 3. a pin; 4. and casting the substrate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the present invention provides a technical solution: the preparation method of the insulating layer for the oxygen sensor chip comprises a heating electrode 1, wherein the heating electrode 1 is connected with a pin 3, a casting insulating sheet 2 is arranged outside the heating electrode 1, and a casting substrate 4 is arranged outside the casting insulating sheet 2.

The upper part and the lower part of the heating electrode 1 are provided with a casting insulation sheet 2 and a casting substrate 4.

The casting substrate 4 is prepared from two kinds of alumina powder, a solvent and casting glue according to the mass fraction ratio: 100 (30-50) and (20-40) are prepared and blended to form a slurry, and the slurry is cast on a casting machine.

The casting glue is formed by dissolving polyvinyl butyral in ethanol and adding polyethylene glycol plasticizer, wherein the weight ratio of polyvinyl butyral: ethanol: the volume ratio of the polyethylene glycol plasticizer is as follows: 100: (50-100): (20 to 50).

The alumina powder and the solvent have the granularity smaller than 1um, and the two kinds of alumina powder with the granularity smaller than 1um are used for realizing good particle matching, so that the casting insulation sheet and the zirconia substrate can be well matched.

The working principle is as follows: the method for preparing the insulating layer for the oxygen sensor chip has the advantages that the stability and the consistency of heating resistance after sintering are improved, meanwhile, because the insulating layer is integrally formed, the insulating layer is not a pattern covering a heating electrode part like a printing insulating layer, a plurality of substrate parts which are not covered by the insulating layer are directly overlapped up and down, although the overlapping strength is improved, if the heating electrode is not subjected to hole insulating treatment, the substrate is communicated with the heating electrode part to cause electric leakage, the insulating property of the oxygen sensor chip is improved, and the content which is not described in detail in the specification belongs to the prior art which is well known by a person skilled in the art.

The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for simplicity of description only and are not intended to indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operative in a particular orientation, and are not to be considered limiting of the claimed invention.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.