阅读说明：本技术 一种用于载芯板软焊料封装芯片用的自动化压紧机构 (Automatic pressing mechanism for soft solder packaging chip of carrier core plate ) 是由 许伟波 林德辉 于 2020-08-04 设计创作，主要内容包括：本发明公布了一种用于载芯板软焊料封装芯片用的自动化压紧机构,属于芯片领域。一种用于载芯板软焊料封装芯片用的自动化压紧机构,包括驱动机构、进料机构和压紧机构所述驱动机构的输出端固定连接有连接杆,所述驱动机构能够带动连接杆做轴向前后运动和旋转运动。本发明通过驱动机构和进料机构的配合使用,能够使得进料机构推动载芯板做轴向前后运动,通过驱动机构和压紧机构的配合使用,能够使得驱动机构带动压紧机构运动从而压紧载芯板,在对芯片进行封装时,能够对载芯板进行压紧,保证了载芯板的平整度,避免芯片焊料出现偏差或者气泡,提高了芯片的良品率,本发明结构设计合理,使用方便快捷,具有很好的实用性。(The invention discloses an automatic pressing mechanism for a soft solder packaging chip of a carrier core plate, and belongs to the field of chips. The automatic pressing mechanism comprises a driving mechanism, a feeding mechanism and a pressing mechanism, wherein the output end of the driving mechanism is fixedly connected with a connecting rod, and the driving mechanism can drive the connecting rod to move axially back and forth and rotate. The feeding mechanism can push the carrier core plate to move axially back and forth by matching the driving mechanism with the feeding mechanism, the driving mechanism can drive the pressing mechanism to move to press the carrier core plate by matching the driving mechanism with the pressing mechanism, and the carrier core plate can be pressed when a chip is packaged, so that the flatness of the carrier core plate is ensured, the chip solder is prevented from generating deviation or bubbles, and the yield of the chip is improved.)

1. An automated hold-down mechanism for a die for soft solder package of a carrier sheet, comprising:

the output end of the driving mechanism is fixedly connected with a connecting rod (6), and the driving mechanism can drive the connecting rod (6) to axially move back and forth and rotate;

the feeding mechanism is used for pushing the core carrying plate to move back and forth in the axial direction, the feeding mechanism is arranged on the connecting rod (6), and the driving mechanism drives the feeding mechanism to move through the connecting rod (6);

the pressing mechanism is used for pressing the core carrying plate when soft solder is used for packaging the chip, the pressing mechanism is installed on the connecting rod (6), the driving mechanism drives the pressing mechanism to press the core carrying plate through the connecting rod (6), the pressing mechanism is matched with the feeding mechanism for use, and when the driving mechanism drives the feeding mechanism to push the core carrying plate to move back and forth in the axial direction through the connecting rod (6), the pressing mechanism is lifted.

2. The automated pressing mechanism for the soft solder package chip of the core carrier plate according to claim 1, further comprising a frame (1) and a core carrier plate placing box (11), wherein the core carrier plate placing box (11) is installed on the top of the frame (1), the core carrier plate is slidably disposed in the inner cavity of the core carrier plate placing box (11), the driving mechanism comprises a mounting seat (2), a first slide rail (3), a first slide block (4), a connecting rod (6), a motor (7), a first gear (9) and a second gear (10), the mounting seat (2) is installed on the frame (1), the first slide rail (3) is installed on the mounting seat (2), the first slide block (4) is slidably installed on the first slide rail (3), the bottom of the cylinder (5) is fixedly connected with the mounting seat (2), and the output end of the cylinder (5) is fixedly connected with the first slide block (4), one end of the connecting rod (6) is rotatably connected with the first sliding block (4), the second gear (10) is sleeved on the connecting rod (6), the motor (7) is installed on the first sliding block (4), the output end of the motor (7) is fixedly connected with the first gear (9), and the first gear (9) is meshed with the second gear (10).

3. The automated pressing mechanism for a chip-carrier soft solder package chip as claimed in claim 2, wherein the driving mechanism further comprises a protective cover (8), the protective cover (8) is fixed to the first slider (4), and the motor (7), the first gear (9) and the second gear (10) are all located in an inner cavity of the protective cover (8).

4. The automatic pressing mechanism for the soft solder package chip of the chip carrier board according to claim 1, wherein the feeding mechanism comprises a rotating arm (12), a fixed block (13) and a shifting piece (14), one end of the rotating arm (12) is fixedly connected with the connecting rod (6), the other end of the rotating arm (12) is fixedly connected with the fixed block (13), the shifting piece (14) is installed on the fixed block (13), a shifting hole (15) is formed in the top of the chip carrier board placing box (11), the bottom of the shifting piece (14) penetrates through the bottom of the shifting hole (15), and the shifting piece (14) is used for shifting the chip carrier board to move.

5. The automated pressing mechanism for the soft solder package chip of the chip carrier board according to claim 1, wherein the pressing mechanism comprises a rotating block (16), a pressing block (17), a pulley (18), a lever arm (19), a connecting plate (20), a second sliding block (21), a second sliding rail (22), a return spring (34) and a pressing plate, the rotating block (16) is fixedly connected to the connecting rod (6), the pressing block (17) is fixedly connected to the rotating block (16), the pressing block (17) is used for adjusting the height of the pulley (18), one end of the lever arm (19) is rotatably connected to the pulley (18), the top of the pulley (18) is in contact with the pressing block (17), the other end of the lever arm (19) is fixedly connected to the connecting plate (20), and the middle of the lever arm (19) is rotatably connected to the frame (1) through a rotating shaft, the top of reset spring (34) and the bottom fixed connection of lever arm (19), lever arm (19) are located the bottom of pulley (18), reset spring (34) are used for lever arm (19) to reset, the one end and second slider (21) fixed connection of connecting plate (20), second slider (21) slidable sets up on second slide rail (22), on second slide rail (22) fixed connection frame (1), the pressure strip detachable installs on second slider (21), the pressure strip is used for compressing tightly the carrier plate.

6. An automated hold-down mechanism for a chip-in-chip solder package as recited in claim 5, it is characterized in that the pressing plate comprises a swing arm (26), a connecting block (27), a bolt (28), a pressing plate (29) and a connecting groove (30), the connecting block (27) is detachably arranged at one end of the swing arm (26) through a bolt (28), the pressing plate (29) is fixedly connected to the connecting block (27), the connecting groove (30) is arranged at the other end of the swing arm (26), a supporting plate (23) is fixedly connected on the second sliding block (21), threaded rods (24) are fixedly connected on both sides of the top of the supporting plate (23), the threaded rod (24) penetrates through the connecting groove (30), the nut (25) is connected with the nut (25) in a threaded manner, the nut (25) is used for pressing the swing arm (26) and fixedly connecting the swing arm (26) to the second sliding block (21).

7. The automated pressing mechanism for the soft solder-encapsulated chip of the carrier plate as claimed in claim 6, wherein the carrier plate placing box (11) is provided with a movable hole (32) adapted to the pressing plate.

8. The automated clamping mechanism for a chip-on-chip solder package according to claim 7, wherein the top of the chip-on-chip placement box (11) is opened with solder holes (31), the solder holes (31) are used for inserting the chip-on-chip solder package into the chip-on-chip placement box (11) by a solder packaging device.

9. An automated clamping mechanism for a chip-carrier-board soft solder package chip as claimed in claim 1, characterized in that the other end of the connecting rod (6) is bearing-mounted to the frame (1).

10. The automated hold-down mechanism for a chip-in-chip solder package as recited in claim 6, wherein said hold-down mechanism is two in number.

Technical Field

The invention belongs to the technical field of chips, and particularly relates to an automatic pressing mechanism for a soft solder packaging chip of a carrier core plate.

Background

With the development of science and technology, more and more electronic devices are widely applied to daily life and work of people, bring great convenience to daily life and work of people, and become an indispensable important tool for people at present.

The main component of an electronic device that implements various functions is a chip. The whole chip manufacturing process includes several links, such as chip design, wafer manufacturing, package manufacturing, cost testing, etc., wherein the wafer manufacturing process is particularly complex.

The method comprises the steps of manufacturing a wafer, coating a film on the wafer, photoetching, developing and etching the wafer, wherein chemical substances sensitive to ultraviolet light are used in the process, the chemical substances become soft when meeting the ultraviolet light, and the appearance of a chip can be obtained by controlling the position of a light shield. The silicon wafer is coated with a photoresist such that it dissolves upon exposure to ultraviolet light, which may be accomplished by applying a first shade to cause the portion of the ultraviolet light directed to be dissolved, which dissolved portion may then be washed away with a solvent. The remaining part is then shaped like a shade, which is what we want, and this results in the desired silicon dioxide layer. The wafer is implanted with ions to produce P, N semiconductor, and the wafer is first exposed and then set inside chemical ion mixture liquid. This process will change the electrical mode of the doped regions so that each transistor can be turned on, off, or carry data, a simple chip can use only one layer, but a complex chip usually has many layers, this process is repeated continuously at this time, and the different layers can be connected through an open window, similar to the fabrication principle of the PCB board of the layers. More complex chips may require multiple silicon dioxide layers, which are realized by repeating the above processes, to form a three-dimensional structure, and then after the wafer test is performed through the above processes, lattice-shaped grains are formed on the wafer, and each grain is tested for electrical characteristics by means of probing. Generally, the number of dies owned by each chip is huge, and organizing the one-time pin test mode is a very complicated process. And finally, packaging, testing and packaging.

During this final packaging process, a packaging device is required to package the chip pairs. The chip is placed by the carrier plate acting carrier during packaging, a plurality of chip carrying areas for placing the chip are formed in the strip-shaped carrier plate, the carrier plate can be pushed to move forwards through the feeding mechanism, then the mechanical arm grabs the chip onto the carrier plate for packaging, the strip-shaped carrier plate is easy to shake or uneven due to high temperature in the process, inconvenience can be brought to the solder if the carrier plate is uneven or shakes when the solder chip is placed, deviation or bubbles can occur to the solder of the chip, and defective products are generated.

Disclosure of Invention

The invention aims to solve the problems, and provides an automatic pressing mechanism for a soft solder of a chip carrier plate to package a chip, which can press the chip carrier plate when the chip is packaged, so that the flatness of the chip carrier plate is ensured, the solder of the chip is prevented from generating deviation or bubbles, and the yield of the chip is improved.

In order to realize the purpose, the invention adopts the technical scheme that: an automated hold-down mechanism for a chip-in-chip soft solder package, comprising:

the output end of the driving mechanism is fixedly connected with a connecting rod, and the driving mechanism can drive the connecting rod to axially move back and forth and rotate;

the feeding mechanism is used for pushing the core carrying plate to move back and forth in the axial direction, the feeding mechanism is arranged on the connecting rod, and the driving mechanism drives the feeding mechanism to move through the connecting rod;

the pressing mechanism is used for pressing the core carrying plate when soft solder is used for packaging the chip, the pressing mechanism is installed on the connecting rod, the driving mechanism drives the pressing mechanism to press the core carrying plate through the connecting rod, the pressing mechanism is matched with the feeding mechanism for use, and the driving mechanism drives the feeding mechanism to push the core carrying plate to move back and forth in the axial direction through the connecting rod, and the pressing mechanism is lifted up.

Preferably, the device also comprises a frame and a core carrying plate placing box, the core carrying plate placing box is arranged at the top of the frame, the carrier plate is arranged in the inner cavity of the carrier plate placing box in a sliding way, the driving mechanism comprises a mounting seat, a first slide rail, a first slide block, a connecting rod, a motor, a first gear and a second gear, the mounting seat is arranged on the frame, the first slide rail is arranged on the mounting seat, the first slide block is slidably arranged on the first slide rail, the bottom of the cylinder is fixedly connected with the mounting seat, the output end of the cylinder is fixedly connected with the first sliding block, one end of the connecting rod is rotationally connected with the first sliding block, the second gear is sleeved on the connecting rod, the motor is installed on first slider, the output of motor and the fixed connection of first gear, first gear and the meshing of second gear.

Preferably, the driving mechanism further comprises a protective cover, the protective cover is fixed to the first sliding block, and the motor, the first gear and the second gear are located in an inner cavity of the protective cover.

Preferably, feed mechanism includes swinging boom, fixed block and plectrum, one end and connecting rod fixed connection of swinging boom, the other end and the fixed block fixed connection of swinging boom, the plectrum is installed on the fixed block, the top that the case was placed to the carrier core board has been seted up and has been dialled the hole, the bottom in dialling the hole is run through to the bottom of plectrum, the plectrum is used for stirring the carrier core board motion.

Preferably, the pressing mechanism comprises a rotating block, a pressing block, a pulley, a lever arm, a connecting plate, a second sliding block, a second sliding rail, a return spring and a pressing plate, the rotating block is fixedly connected to the connecting rod, the pressing block is fixedly connected to the rotating block and used for adjusting the height of the pulley, one end of the lever arm is rotatably connected to the pulley, the top of the pulley is in contact with the pressing block, the other end of the lever arm is fixedly connected to the connecting plate, the middle of the lever arm is rotatably connected to the frame through a rotating shaft, the top of the return spring is fixedly connected to the bottom of the lever arm, the lever arm is located at the bottom of the pulley, the return spring is used for returning the lever arm, one end of the connecting plate is fixedly connected to the second sliding block, the second sliding block is slidably arranged on the second sliding rail, and the second sliding, the pressure strip is detachably mounted on the second sliding block and used for pressing the core carrying plate.

Preferably, the pressure strip includes swing arm, connecting block, bolt, pressure strip and spread groove, and the connecting block passes through bolt demountable installation in the one end of swing arm, pressure strip fixed connection is on the connecting block, the other end at the swing arm is seted up to the spread groove, fixedly connected with backup pad on the second slider, the equal fixedly connected with threaded rod in both sides at backup pad top, the threaded rod passes the spread groove, threaded connection has the nut on the nut, the nut is used for compressing tightly the swing arm, with swing arm fixed connection on the second slider.

Preferably, the core carrying plate placing box is provided with a movable hole matched with the compression plate.

Preferably, the top of the chip carrier placing box is provided with solder holes, and the solder holes are used for soft solder packaging equipment to insert soft solder into the chip carrier placing box to package chips.

Preferably, the other end of the connecting rod is mounted on the frame through a bearing.

Preferably, the number of the pressing mechanisms is two.

The invention has the beneficial effects that: the feeding mechanism can push the core carrying plate to move back and forth in the axial direction by matching the driving mechanism with the feeding mechanism, the driving mechanism can drive the pressing mechanism to move to press the core carrying plate by matching the driving mechanism with the pressing mechanism, and the core carrying plate can be pressed when a chip is packaged, so that the flatness of the core carrying plate is ensured, the deviation or bubbles of a welding flux of the chip are avoided, and the yield of the chip is improved.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic perspective view of another embodiment of the present invention.

FIG. 3 is an enlarged view of A in FIG. 2 according to the present invention.

Fig. 4 is a schematic view of the connection structure of the feeding mechanism and the pressing mechanism of the present invention.

Fig. 5 is another perspective view schematically showing the connecting structure of the feeding mechanism and the pressing mechanism according to the present invention.

Fig. 6 is a schematic perspective view of the pressing plate of the present invention.

Fig. 7 is a schematic view of the connection structure of the feeding mechanism and the pressing mechanism of the present invention.

Fig. 8 is a schematic structural view of an embodiment of the pressing mechanism of the present invention having two pressing plates.

Fig. 9 is a schematic structural view of the carrier core board of the present invention.

The text labels in the figures are represented as: 1. a frame; 2. a mounting seat; 3. a first slide rail; 4. a first slider; 5. a cylinder; 6. a connecting rod; 7. a motor; 8. a protective cover; 9. a first gear; 10. a second gear; 11. a carrier board placing box; 12. a rotating arm; 13. a fixed block; 14. a shifting sheet; 15. poking holes; 16. rotating the block; 17. briquetting; 18. a pulley; 19. a lever arm; 20. a connecting plate; 21. a second slider; 22. a second slide rail; 23. a support plate; 24. a threaded rod; 25. a nut; 26. a swing arm; 27. connecting blocks; 28. a bolt; 29. a compression plate; 30. connecting grooves; 31. a solder hole; 32. a movable hole; 33. a carrier board; 34. a return spring.

Detailed Description

The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.

In order to prevent the carrier board from shaking when the chip is packaged, the present embodiment provides an automatic pressing mechanism for soft solder package chip on the carrier board, as shown in fig. 1 to 7, including:

the output end of the driving mechanism is fixedly connected with a connecting rod 6, and the driving mechanism can drive the connecting rod 6 to do axial front-back movement and rotary movement.

The feeding mechanism is used for pushing the carrier plate 33 to move back and forth in the axial direction, the feeding mechanism is installed on the connecting rod 6, and the driving mechanism drives the feeding mechanism to move through the connecting rod 6.

The pressing mechanism is used for pressing the carrier core plate 33 when soft solder is used for packaging the chip, the carrier core plate 33 is as shown in fig. 9, the pressing mechanism is installed on the connecting rod 6, the driving mechanism drives the pressing mechanism to press the carrier core plate 33 through the connecting rod 6, the pressing mechanism is matched with the feeding mechanism for use, and the driving mechanism drives the feeding mechanism to push the carrier core plate 33 to move back and forth in the axial direction through the connecting rod 6, and the pressing mechanism is lifted. The feeding mechanism can push the carrier plate 33 to move back and forth in the axial direction through the matching of the driving mechanism and the feeding mechanism, the driving mechanism can drive the pressing mechanism to move so as to press the carrier plate 33 through the matching of the driving mechanism and the pressing mechanism, and the carrier plate 33 can be pressed when a chip is packaged, so that the flatness of the carrier plate 33 is ensured, the chip solder is prevented from generating deviation or bubbles, and the yield of the chip is improved.

The driving mechanism, the feeding mechanism and the pressing mechanism have the following specific structures:

in the embodiment, the device further comprises a rack 1 and a core board placing box 11, the core board placing box 11 is installed at the top of the rack 1, and the core board 33 is slidably disposed in an inner cavity of the core board placing box 11, wherein the driving mechanism comprises an installation seat 2, a first slide rail 3, a first slide block 4, a connecting rod 6, a motor 7, a first gear 9 and a second gear 10, the installation seat 2 is installed on the rack 1, the first slide rail 3 is installed on the installation seat 2, the first slide block 4 is slidably installed on the first slide rail 3, the bottom of the cylinder 5 is fixedly connected with the installation seat 2, the output end of the cylinder 5 is fixedly connected with the first slide block 4, one end of the connecting rod 6 is rotatably connected with the first slide block 4, the second gear 10 is sleeved on the connecting rod 6, the motor 7 is installed on the first slide block 4, the output end of the motor 7 is fixedly connected with the first gear 9, the first gear 9 meshes with the second gear 10. The driving mechanism further comprises a protective cover 8, the protective cover 8 is fixed with the first sliding block 4, and the motor 7, the first gear 9 and the second gear 10 are located in an inner cavity of the protective cover 8. When the device is used, the cylinder 5 is opened, the output end of the cylinder 5 drives the first sliding block 4 to slide on the first sliding rail 3, the first sliding block 4 drives the connecting rod 6 on the first sliding block, the motor 7 and the protective cover 8 move together, the connecting rod 6 can be pushed to move axially, the connecting rod 6 can drive the feeding mechanism and the pressing mechanism to move axially as the connecting rod 6, in order to enable the connecting rod 6 to rotate, the feeding mechanism and the pressing mechanism are further driven to move rotationally, the motor 7 is opened, the output end of the motor 7 drives the first gear 9 to rotate, the first gear 9 is meshed with the second gear 10, the second gear 10 drives the connecting rod 6 to rotate, and the connecting rod 6 can drive the feeding mechanism and the pressing mechanism to move rotationally.

In addition, in this embodiment, the feeding mechanism includes a rotating arm 12, a fixed block 13 and a shifting piece 14, one end of the rotating arm 12 is fixedly connected with the connecting rod 6, the other end of the rotating arm 12 is fixedly connected with the fixed block 13, the shifting piece 14 is installed on the fixed block 13, a shifting hole 15 is formed in the top of the core board placing box 11, the bottom of the shifting piece 14 penetrates through the bottom of the shifting hole 15, and the shifting piece 14 is used for shifting the core board 33 to move. When the carrier core plate 33 is pushed forward in use, the connecting rod 6 drives the rotating arm 12 to rotate, the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to rotate, so that the bottom of the shifting piece 14 rotates to the opening of the carrier core plate 33, then the connecting rod 6 drives the rotating arm 12 to move axially (forward), so that the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to move axially (forward), the shifting piece 14 pulls the carrier core plate 33 to move forward, then the connecting rod 6 drives the rotating arm 12 to rotate, the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to rotate, so that the bottom of the shifting piece 14 rotates out of the opening of the carrier core plate 33, then the connecting rod 6 drives the rotating arm 12 to move axially (backward), so that the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to move axially (backward), the connecting rod 6 drives the rotating arm 12 to rotate, so that the bottom of the shifting piece 14, the above-mentioned steps are repeated, so that the carrier plate 33 can continuously move forward intermittently.

In order to match with the intermittent continuously forward-moving core carrying plate 33 and facilitate the compression of the core carrying plate 33, in the embodiment, the compression mechanism comprises a rotating block 16, a pressing block 17, a pulley 18, a lever arm 19, a connecting plate 20, a second sliding block 21, a second sliding rail 22, a return spring 34 and a compression plate, the lever arm 19 has a lever effect, the rotating block 16 is fixedly connected to the connecting rod 6, the pressing block 17 is fixedly connected to the rotating block 16, the pressing block 17 is used for adjusting the height of the pulley 18, one end of the lever arm 19 is rotatably connected with the pulley 18, the top of the pulley 18 is contacted with the pressing block 17, the other end of the lever arm 19 is fixedly connected with the connecting plate 20, the middle part of the lever arm 19 is rotatably connected with the frame 1 through a rotating shaft, the top of the return spring 34 is fixedly connected with the bottom of the lever arm 19, the lever arm, one end of the connecting plate 20 is fixedly connected with the second sliding block 21, the second sliding block 21 is slidably arranged on the second sliding rail 22, the second sliding rail 22 is fixedly connected with the rack 1, the pressing plate is detachably arranged on the second sliding block 21, and the pressing plate is used for pressing the carrier core plate 33. When the core carrying plate 33 is pulled by the poking piece 14 to move forwards in use, the connecting rod 6 drives the rotating arm 12 to rotate at the moment, the rotating arm 12 drives the fixed block 13 and the poking piece 14 to rotate, so that the bottom of the poking piece 14 rotates to the opening of the core carrying plate 33, synchronously, the connecting rod 6 drives the rotating block 16 and the pressing block 17 to rotate, the pressing block 17 rotates to press the pulley 18 downwards, the pulley 18 lowers one end of the lever arm 19, meanwhile, the return spring 34 is compressed at the end, the other end of the lever arm 19 rises, the lever arm 19 drives the connecting plate 20 to rise, the connecting plate 20 drives the second sliding block 21 to slide on the second sliding rail 22 and rise, the second sliding rail 22 drives the pressing plate to rise, so that the bottom of the pressing plate is separated from the core carrying plate 33, the feeding mechanism can further facilitate the core carrying plate 33 to move forwards, after the forward movement is finished, the connecting rod 6 drives the rotating, at this time, the pressing block 17 rises, the return spring 34 extends, the return spring 34 pushes the lower end of the lever arm 19 to return, the dead weight of the second sliding block 21 drives the pressing plate to descend, and the higher end of the lever arm 19 also descends, so that the pressing plate presses the core carrying plate 33. And then the purpose of pressing the carrier plate 33 by the pressing mechanism in cooperation with the feeding mechanism is achieved. The carrier core plate 33 is pressed while the solder is applied, so that the use is very quick and stable. The flatness of the carrier plate 33 is ensured, deviation or bubbles of chip solder are avoided, and the yield of the chip is improved.

The present invention further provides a specific structure of the pressing plate in this embodiment, as shown in fig. 6, the pressing plate includes a swing arm 26, a connecting block 27, a bolt 28, a pressing plate 29 and a connecting groove 30, the connecting block 27 is detachably mounted at one end of the swing arm 26 through the bolt 28, a user can unscrew the bolt 28 to separate the connecting block 27 from the swing arm 26, the pressing plate 29 is fixedly connected to the connecting block 27, the connecting groove 30 is formed at the other end of the swing arm 26, a supporting plate 23 is fixedly connected to the second slider 21, threaded rods 24 are fixedly connected to both sides of the top of the supporting plate 23, the threaded rods 24 pass through the connecting groove 30, nuts 25 are threadedly connected to the nuts 25, the nuts 25 are used for pressing the swing arm 26, and the swing arm 26 is fixedly. When the swing arm device is installed, the threaded rod 24 penetrates through the connecting groove 30, the nut 25 is screwed on the threaded rod 24, the nut 25 compresses and fixes the swing arm 26, the swing arm 26 is fixed on the supporting plate 23, the swing arm 26 is connected with the second sliding block 21, the second sliding block 21 can drive the swing arm 26 to move, and the swing arm 26 can drive the pressing plate 29 to compress the core carrying plate 33. In this embodiment, the core board placing box 11 is provided with a movable hole 32 adapted to the pressing plate, so that the swing arm 26 can move on the core board placing box 11 conveniently, the top of the core board placing box 11 is provided with a solder hole 31, and the solder hole 31 is used for inserting soft solder packaging equipment into a soft solder packaging chip in the core board placing box 11. In other embodiments, two pressing plates may be provided, and are respectively provided on two sides of the solder hole 31, as shown in fig. 8, to enhance the effect of pressing the carrier board 33.

In conclusion, the feeding mechanism can push the carrier core plate 33 to move back and forth in the axial direction through the matching use of the driving mechanism and the feeding mechanism, the driving mechanism can drive the pressing mechanism to move through the matching use of the driving mechanism and the pressing mechanism so as to press the carrier core plate 33, the carrier core plate 33 can be pressed when a chip is packaged, the flatness of the carrier core plate 33 is ensured, deviation or bubbles of a chip solder are avoided, and the yield of the chip is improved.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be practiced otherwise than as specifically described.