Uncapping mechanism and semiconductor processing equipment
阅读说明:本技术 开盖机构及半导体加工设备 (Uncapping mechanism and semiconductor processing equipment ) 是由 冯思达 于 2019-04-26 设计创作,主要内容包括:本发明提供一种开盖机构及半导体加工设备,该开盖机构包括:导向件,竖直设置在上电极机构的一侧,且与腔室固定连接;第一定位结构,用于限制所述导向件与所述腔室的相对位置和旋转自由度;滑动件,与所述导向件滑动配合,且与所述上电极机构固定连接;第二定位结构,用于限制所述滑动件与所述上电极机构的相对位置和旋转自由度;驱动装置,用于驱动所述上电极机构和/或所述滑动件相对于所述腔室作升降运动。(The invention provides a cover opening mechanism and semiconductor processing equipment, wherein the cover opening mechanism comprises: the guide piece is vertically arranged on one side of the upper electrode mechanism and is fixedly connected with the cavity; a first positioning structure for limiting the relative position and rotational freedom of the guide and the chamber; the sliding part is in sliding fit with the guide part and is fixedly connected with the upper electrode mechanism; a second positioning structure for limiting the relative position and rotational degree of freedom of the slide member and the upper electrode mechanism; and the driving device is used for driving the upper electrode mechanism and/or the sliding piece to do lifting motion relative to the chamber.)
1. A lid opening mechanism, comprising:
The guide piece is vertically arranged on one side of the upper electrode mechanism and is fixedly connected with the cavity;
a first positioning structure for limiting the relative position and rotational freedom of the guide and the chamber;
the sliding part is in sliding fit with the guide part and is fixedly connected with the upper electrode mechanism;
a second positioning structure for limiting the relative position and rotational degree of freedom of the slide member and the upper electrode mechanism;
and the driving device is used for driving the upper electrode mechanism and/or the sliding piece to do lifting motion relative to the chamber.
2. The door release mechanism according to claim 1, wherein the guide member includes an optical axis; the sliding part is provided with a through hole, the sliding part is sleeved on the optical axis through the through hole, and the through hole is in sliding fit with the optical axis.
3. The door release mechanism according to claim 1 or 2, wherein the first positioning structure comprises: a first positioning hole and a first positioning pin;
a first matching part is arranged on the guide piece, the first matching part is positioned in the first positioning hole, and the peripheral wall of the first matching part is matched with the hole wall of the first positioning hole;
And a second positioning hole and a third positioning hole are correspondingly and respectively arranged on the hole wall of the first positioning hole and the peripheral wall of the first matching part, and the first positioning pin is arranged in the second positioning hole and the third positioning hole in a penetrating manner and used for limiting the rotation freedom degree of the guide piece in the horizontal plane.
4. The cap opening mechanism according to claim 3, wherein the first positioning hole comprises a first sub-hole and a second sub-hole which are coaxially arranged from top to bottom, and the diameter of the first sub-hole is larger than that of the second sub-hole;
the first matching part comprises a first sub-part and a second sub-part which are arranged from top to bottom in sequence and are coaxial, and the outer diameter of the first sub-part is larger than that of the second sub-part; wherein the first sub-part is positioned in the first sub-hole, the lower end surface of the first sub-part is matched with the upper end surface of the second sub-hole, and the outer diameter of the first sub-part is smaller than the diameter of the first sub-hole; the second sub-portion is located in the second sub-hole, and the peripheral wall of the second sub-portion is matched with the hole wall of the second sub-hole.
5. The door opening mechanism according to claim 1 or 2, wherein the second positioning structure comprises a positioning through hole provided on a bottom plate of the upper electrode mechanism and penetrating the bottom plate in a vertical direction; the outer peripheral wall of the sliding piece is matched with the hole wall of the positioning through hole;
The orthographic projection shape of the peripheral wall of the sliding piece and the hole wall of the positioning through hole on the horizontal plane is non-circular so as to limit the rotation freedom degree of the sliding piece in the horizontal plane.
6. The door release mechanism according to claim 1 or 2, wherein the second positioning structure comprises:
the positioning through hole is arranged on the bottom plate of the upper electrode mechanism and penetrates through the bottom plate along the vertical direction, and the peripheral wall of the sliding piece is matched with the hole wall of the positioning through hole;
and the rotary positioning structure is used for limiting the rotary freedom degree of the sliding piece in the horizontal plane.
7. The door opening mechanism according to claim 6, wherein the rotary positioning structure comprises a concave portion and a convex portion respectively provided on the outer peripheral wall of the slider and the hole wall of the positioning through hole, the concave portion and the convex portion being engaged; alternatively, the first and second electrodes may be,
the rotary positioning structure comprises a fourth positioning hole and a fifth positioning hole which are correspondingly and respectively arranged on the peripheral wall of the sliding part and the hole wall of the positioning through hole, and a second positioning pin which is arranged in the fourth positioning hole and the fifth positioning hole in a penetrating mode.
8. The door release mechanism according to claim 1, further comprising an upper electrode positioning structure for limiting a relative position and a rotational degree of freedom of the upper electrode mechanism and the chamber.
9. The door opening mechanism according to claim 8, wherein the upper electrode positioning structure comprises a positioning convex part and a positioning concave part which are respectively arranged at the bottom of the upper electrode mechanism and the top of the chamber and are positioned at the edge of the chamber, and the positioning convex part and the positioning concave part are mutually matched when the upper electrode mechanism is positioned at the cover closing position.
10. The lid opening mechanism according to claim 8, wherein the upper electrode positioning structure comprises a positioning chute and a positioning pulley which are respectively arranged at the bottom of the upper electrode mechanism and the top of the chamber and are located at the edge of the chamber, and the positioning chute and the positioning pulley are mutually matched when the upper electrode mechanism is located at the lid closing position.
11. The door release mechanism according to claim 1, wherein the driving means comprises a linear electric cylinder, a linear air cylinder, or a linear hydraulic cylinder.
12. A semiconductor processing apparatus comprising a reaction chamber, an upper electrode mechanism and a lid opening mechanism, wherein the lid opening mechanism is configured to drive the upper electrode mechanism to perform an elevating movement with respect to the reaction chamber, and is characterized in that the lid opening mechanism is the lid opening mechanism according to any one of claims 1 to 11.
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a cover opening mechanism and semiconductor processing equipment.
Background
An Inductively Coupled Plasma (ICP) etching apparatus generally includes functional modules such as a reaction chamber 1, an upper electrode mechanism 2, and a lid opening mechanism 3, as shown in fig. 1. Wherein, the reaction chamber 1 is used for providing a vacuum environment and radio frequency power; the upper electrode mechanism 2 is used for providing process gas and upper radio frequency power; the cover opening mechanism 3 is used for driving the upper electrode mechanism 2 to move up and down relative to the reaction chamber 1 so as to provide a convenient window for maintenance inside the reaction chamber 1.
The existing uncovering mechanism mainly comprises main functional modules such as a linear module, a linear module bracket and a driving source. However, the existing cap opening mechanism has the following problems in practical application:
firstly, the linear module is in threaded connection with the linear module support through the oblong holes and the screws arranged on the linear module, and the positioning accuracy of the connection mode is poor, so that the positioning accuracy of the upper electrode mechanism is influenced.
Secondly, the linear module bracket and the reaction chamber as well as the adapter of the linear module and the upper electrode mechanism are fixedly connected in a threaded connection mode, so that the positioning accuracy is poor, the limitation of the degree of freedom is incomplete, and the positioning accuracy of the upper electrode mechanism can be affected.
Disclosure of Invention
The invention aims to at least solve one technical problem in the prior art, and provides a cover opening mechanism and semiconductor processing equipment, which can improve the positioning precision of an upper electrode mechanism.
To achieve the object of the present invention, there is provided a door opening mechanism including:
the guide piece is vertically arranged on one side of the upper electrode mechanism and is fixedly connected with the cavity;
a first positioning structure for limiting the relative position and rotational freedom of the guide and the chamber;
The sliding part is in sliding fit with the guide part and is fixedly connected with the upper electrode mechanism;
a second positioning structure for limiting the relative position and rotational degree of freedom of the slide member and the upper electrode mechanism;
and the driving device is used for driving the upper electrode mechanism and/or the sliding piece to do lifting motion relative to the chamber.
Optionally, the guide comprises an optical axis; the sliding part is provided with a through hole, the sliding part is sleeved on the optical axis through the through hole, and the through hole is in sliding fit with the optical axis.
Optionally, the first positioning structure includes: a first positioning hole and a first positioning pin;
a first matching part is arranged on the guide piece, the first matching part is positioned in the first positioning hole, and the peripheral wall of the first matching part is matched with the hole wall of the first positioning hole;
and a second positioning hole and a third positioning hole are correspondingly and respectively arranged on the hole wall of the first positioning hole and the peripheral wall of the first matching part, and the first positioning pin is arranged in the second positioning hole and the third positioning hole in a penetrating manner and used for limiting the rotation freedom degree of the guide piece in the horizontal plane.
Optionally, the first positioning hole includes a first sub-hole and a second sub-hole which are arranged from top to bottom and are coaxial, and a diameter of the first sub-hole is larger than a diameter of the second sub-hole;
the first matching part comprises a first sub-part and a second sub-part which are arranged from top to bottom in sequence and are coaxial, and the outer diameter of the first sub-part is larger than that of the second sub-part; wherein the first sub-part is positioned in the first sub-hole, the lower end surface of the first sub-part is matched with the upper end surface of the second sub-hole, and the outer diameter of the first sub-part is smaller than the diameter of the first sub-hole; the second sub-portion is located in the second sub-hole, and the peripheral wall of the second sub-portion is matched with the hole wall of the second sub-hole.
Optionally, the second positioning structure includes a positioning through hole disposed on the bottom plate of the upper electrode mechanism and penetrating through the bottom plate in a vertical direction; the outer peripheral wall of the sliding piece is matched with the hole wall of the positioning through hole;
the orthographic projection shape of the peripheral wall of the sliding piece and the hole wall of the positioning through hole on the horizontal plane is non-circular so as to limit the rotation freedom degree of the sliding piece in the horizontal plane.
Optionally, the second positioning structure includes:
the positioning through hole is arranged on the bottom plate of the upper electrode mechanism and penetrates through the bottom plate along the vertical direction, and the peripheral wall of the sliding piece is matched with the hole wall of the positioning through hole;
and the rotary positioning structure is used for limiting the rotary freedom degree of the sliding piece in the horizontal plane.
Optionally, the rotary positioning structure includes a concave portion and a convex portion correspondingly and respectively disposed on the peripheral wall of the sliding member and the wall of the positioning through hole, and the concave portion and the convex portion are matched with each other; alternatively, the first and second electrodes may be,
the rotary positioning structure comprises a fourth positioning hole and a fifth positioning hole which are correspondingly and respectively arranged on the peripheral wall of the sliding part and the hole wall of the positioning through hole, and a second positioning pin which is arranged in the fourth positioning hole and the fifth positioning hole in a penetrating mode.
Optionally, the lid opening mechanism further includes an upper electrode positioning structure for limiting relative positions and rotational degrees of freedom of the upper electrode mechanism and the chamber.
Optionally, the upper electrode positioning structure includes a positioning convex portion and a positioning concave portion, which are correspondingly disposed at the bottom of the upper electrode mechanism and the top of the chamber, respectively, and located at the edge of the chamber, and the positioning convex portion and the positioning concave portion are mutually matched when the upper electrode mechanism is located at the cover closing position.
Optionally, the upper electrode positioning structure includes a positioning chute and a positioning pulley, which are correspondingly and respectively disposed at the bottom of the upper electrode mechanism and the top of the cavity, and are located at the edge of the cavity, and the positioning chute and the positioning pulley are mutually matched when the upper electrode mechanism is located at the cover closing position.
Optionally, the driving device comprises a linear electric cylinder, a linear air cylinder or a linear hydraulic cylinder.
As another technical scheme, the invention further provides semiconductor processing equipment which comprises a reaction chamber, an upper electrode mechanism and a cover opening mechanism, wherein the cover opening mechanism is used for driving the upper electrode mechanism to move up and down relative to the reaction chamber, and the cover opening mechanism adopts the cover opening mechanism provided by the invention.
The invention has the following beneficial effects:
according to the cover opening mechanism provided by the invention, the relative position and the rotational freedom degree of the guide piece and the cavity are limited by utilizing the first positioning structure, so that the position precision of the guide piece can be ensured, and the rotational freedom degree of the guide piece is limited, so that the guide piece can be prevented from rotating; meanwhile, the relative position and the rotational freedom degree of the sliding piece and the upper electrode mechanism are limited through the second positioning structure, the position precision of the sliding piece can be ensured, and the rotational freedom degree of the sliding piece is limited at the same time, so that the sliding piece can be prevented from rotating. Therefore, the cover opening mechanism provided by the invention can improve the positioning precision of the upper electrode mechanism.
According to the semiconductor processing equipment provided by the invention, the cover opening mechanism provided by the invention is adopted, so that the positioning precision of the upper electrode mechanism can be improved.
Drawings
FIG. 1 is a schematic diagram of a prior ICP etching apparatus;
fig. 2 is a structural view of a door opening mechanism provided in the embodiment of the present invention;
FIG. 3 is a cross-sectional view of a first positioning structure employed in an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a second indexing arrangement used in accordance with an embodiment of the present invention;
FIG. 5 is another cross-sectional view of a second indexing feature used in accordance with an embodiment of the present invention;
FIG. 6 is a block diagram of an electrode positioning structure used in embodiments of the present invention;
fig. 7 is another structural view of an electrode positioning structure employed in the embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the cover opening mechanism and the semiconductor processing apparatus provided by the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 2 to 4, the cover opening mechanism according to the embodiment of the present invention is used for driving the upper electrode mechanism 5 to move up and down relative to the chamber 4, so as to provide a convenient window for maintenance inside the chamber 4. Specifically, the lid opening mechanism includes a
Wherein, the
In the present embodiment, as shown in fig. 3, the first positioning structure 8 includes a
Optionally, the
Further, a second positioning hole and a third positioning hole are provided correspondingly on the hole wall of the
It should be noted that, in the present embodiment, the
Optionally, the
The sliding
Optionally, the
The second positioning structure is for restricting the relative position and rotational freedom of the
Alternatively, the above-mentioned rotation positioning structure includes a
The rotational positioning structure is not limited to the above structure of the present embodiment, and any other structure capable of restricting the degree of freedom of rotation of the
In practical applications, the rotational positioning structure may be omitted, and the orthogonal projection shape of the outer peripheral wall of the
For example, as shown in fig. 5, the second positioning structure includes a positioning through hole 54 'provided on the bottom plate 51 of the upper electrode mechanism 5 and penetrating through the bottom plate 51 in the vertical direction, and an orthogonal projection shape of a hole wall of the positioning through hole 54' on a horizontal plane is rectangular; the orthogonal projection of the outer peripheral wall of the slider 7 'in the horizontal plane is also rectangular in shape and fits the hole wall of the positioning through hole 54'. By designing the orthogonal projection shape of the outer peripheral wall of the
The cover opening mechanism provided by the invention can respectively ensure the position precision and the rotation freedom degree of the
Preferably, the lid opening mechanism further comprises an upper electrode positioning structure for limiting the relative position and rotational freedom of the upper electrode mechanism 5 and the chamber 4. By means of the upper electrode positioning structure, the upper electrode mechanism 5 can reach the cover engaging position abutting against the chamber 4 every time the lowering movement is performed, without deflection or offset, so that the repetition accuracy of the movement of the upper electrode mechanism 5 can be improved.
In this embodiment, as shown in fig. 6, the upper electrode positioning structure includes a positioning chute 42 and a positioning pulley 52, which are correspondingly and respectively disposed at the bottom of the upper electrode mechanism 5 and the top of the chamber 4 and located at the edge of the chamber 4, and the positioning chute 42 and the positioning pulley 52 are mutually matched when the upper electrode mechanism 5 is located at the cover closing position, so that the upper electrode mechanism 5 does not deflect or shift, and further the motion repetition precision of the upper electrode mechanism 5 can be improved. Meanwhile, since the positioning pulley 52 is in sliding contact with the positioning chute 42, the friction force therebetween can be reduced, and thus the resistance to the movement of the upper electrode mechanism 5 can be reduced. It should be noted that the positioning pulley 52 may be disposed at the bottom of the upper electrode mechanism 5 or at the top of the chamber 4, and correspondingly, the positioning chute 42 may be disposed at the top of the chamber 4 or at the bottom of the upper electrode mechanism 5.
Of course, in practical applications, the upper electrode positioning structure may also adopt any other structure as long as the upper electrode mechanism 5 can not deflect or shift. For example, as shown in fig. 7, the upper electrode positioning structure includes a positioning protrusion 53 and a positioning recess 43 respectively disposed at the bottom of the upper electrode mechanism 5 and the top of the chamber 4 and located at the edge of the chamber 4, and the positioning protrusion 53 and the positioning recess 43 are engaged with each other when the upper electrode mechanism 5 is located at the cover closing position. It should be noted that the positioning convex portion 53 may be disposed at the bottom of the upper electrode mechanism 5 or the top of the chamber 4, and correspondingly, the positioning concave portion 43 may be disposed at the top of the chamber 4 or the bottom of the upper electrode mechanism 5.
The driving device 9 is used for driving the upper electrode mechanism 5 and/or the sliding
In practical applications, the driving device may employ a linear driving source, such as a linear electric cylinder, a linear air cylinder, or a linear hydraulic cylinder.
As another technical solution, an embodiment of the present invention further provides a semiconductor processing apparatus, which includes a reaction chamber, an upper electrode mechanism, and a lid opening mechanism, where the lid opening mechanism is used to drive the upper electrode mechanism to perform a lifting motion with respect to the reaction chamber, and the lid opening mechanism adopts the lid opening mechanism provided in the embodiment of the present invention.
The semiconductor processing equipment can be ICP etching equipment and the like.
According to the semiconductor processing equipment provided by the embodiment of the invention, the cover opening mechanism provided by the embodiment of the invention is adopted, so that the positioning precision of the upper electrode mechanism can be improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
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