阅读说明：本技术 硅片清洗装置、硅片双面清洗设备及硅片的清洗方法 (Silicon wafer cleaning device, silicon wafer double-side cleaning equipment and silicon wafer cleaning method ) 是由 左国军 柯国英 李雄朋 于 2020-07-14 设计创作，主要内容包括：本发明公开了硅片清洗装置、硅片双面清洗设备及硅片的清洗方法,硅片清洗装置均包括传送机构、固定装置和清洗机构；固定装置为真空吸附装置,真空吸附装置包括真空吸附平台和真空发生装置；清洗机构包括喷淋结构、吹气烘干结构以及滚刷；滚刷包括转轴、驱动装置和控制器；硅片清洗装置还包括硅片检测装置；辅助传送装置包括第三传送机构和翻转轮；硅片双面清洗设备包括第一清洗装置、第二清洗装置和辅助传送装置。与现有技术比较,本发明大大增加了生产效率,减轻了人工成本。(The invention discloses a silicon wafer cleaning device, silicon wafer double-side cleaning equipment and a silicon wafer cleaning method, wherein the silicon wafer cleaning device comprises a conveying mechanism, a fixing device and a cleaning mechanism; the fixing device is a vacuum adsorption device which comprises a vacuum adsorption platform and a vacuum generating device; the cleaning mechanism comprises a spraying structure, a blowing and drying structure and a rolling brush; the rolling brush comprises a rotating shaft, a driving device and a controller; the silicon wafer cleaning device also comprises a silicon wafer detection device; the auxiliary conveying device comprises a third conveying mechanism and a turnover wheel; the silicon wafer double-side cleaning equipment comprises a first cleaning device, a second cleaning device and an auxiliary conveying device. Compared with the prior art, the invention greatly increases the production efficiency and lightens the labor cost.)

1. A silicon wafer cleaning apparatus, characterized by comprising: the silicon wafer cleaning device comprises a conveying mechanism, a fixing device and a cleaning mechanism, wherein the fixing device is arranged on the conveying mechanism in a transmission mode and used for limiting one surface of a silicon wafer, and the cleaning mechanism is used for cleaning the other surface of the silicon wafer.

2. The silicon wafer cleaning apparatus according to claim 1, wherein the fixing device is a vacuum suction device, and the vacuum suction device comprises a vacuum suction platform arranged on the conveying mechanism to move along with the conveying mechanism and a vacuum generating device connected with the vacuum suction platform.

3. The silicon wafer cleaning device according to claim 1, wherein the cleaning mechanism comprises a spraying structure, a blowing and drying structure and a rolling brush which is in contact with the surface of the silicon wafer.

4. The silicon wafer cleaning device according to claim 3, wherein the roller brush comprises a rotating shaft, the rotating shaft is connected with a driving device, the silicon wafer cleaning device further comprises a controller electrically connected with the driving device, and the driving device drives the roller brush to rotate reversely along the conveying direction of the silicon wafers.

5. The silicon wafer cleaning apparatus according to claim 3, further comprising: the silicon wafer detection devices are respectively arranged on the front side and the rear side of the spraying structure in the silicon wafer conveying direction, and the controller is electrically connected with the silicon wafer detection devices; the controller is electrically connected with the cleaning mechanism to control the cleaning mechanism to be opened or closed according to the detection signal of the silicon wafer detection device.

6. A silicon wafer double-side cleaning apparatus, characterized in that the silicon wafer comprises a first surface and a second surface, the silicon wafer double-side cleaning apparatus comprising:

two silicon wafer cleaning apparatuses according to any one of claims 1 to 5, a first cleaning apparatus for cleaning a first surface of a silicon wafer and a second cleaning apparatus for cleaning a second surface of the silicon wafer, respectively;

and the auxiliary conveying device is arranged between the first cleaning device and the second cleaning device and is used for assisting the silicon wafers to be conveyed from the first cleaning device to the second fixing device.

7. The silicon wafer double-sided cleaning apparatus according to claim 6, wherein the first cleaning device includes a first transfer mechanism, the second cleaning device includes a second transfer mechanism, and the auxiliary transfer device includes: locate third transport mechanism between first transport mechanism and the second transport mechanism, locate the upset wheel at third transport mechanism middle part, set up a plurality of slots that extend towards its radial direction on the circumference of upset wheel, the silicon chip inserts the slot, the upset wheel rotates and drives the silicon chip turn-over.

8. The silicon wafer double-sided cleaning apparatus according to claim 6, wherein the first cleaning device includes a first transfer mechanism and a first fixing device, the second cleaning device includes a second transfer mechanism and a second fixing device, the first fixing device and the second fixing device are vacuum suction devices, the second transfer mechanism is disposed in parallel on one side of the first transfer mechanism, the first fixing device is disposed below the silicon wafer, the second fixing device is disposed above the silicon wafer, and the auxiliary transfer device includes a third transfer mechanism that transfers the silicon wafer from the first transfer mechanism to the second transfer mechanism.

9. A method for cleaning a silicon wafer, characterized in that the surface of the silicon wafer is cleaned by using the silicon wafer double-sided cleaning apparatus as claimed in any one of claims 6 to 8, comprising at least the steps of:

the first cleaning device cleans the first surface of the silicon wafer;

the auxiliary conveying device conveys the silicon wafer from the first cleaning device to the second cleaning device;

and the second cleaning device cleans the second surface of the silicon wafer.

Technical Field

The invention relates to the field of silicon wafer cleaning, in particular to a silicon wafer cleaning device after silicon rod slicing, silicon wafer double-side cleaning equipment and a silicon wafer cleaning method.

Background

Silicon wafers obtained by slicing silicon rods usually have various impurities on the surfaces, the impurities generally come from metal particles generated by abrasion of cutting wires and the silicon wafers, residues of cutting fluid, dust, fingerprints and the like in the process of transportation, and the existence of the impurities can influence the later processing process, so that the silicon wafer cleaning process is very important in the preparation process of solar cells. However, the existing silicon wafer cleaning device generally adopts a tank type cleaning device with an ultrasonic generating device for processing, but the tank type cleaning device is generally provided with a large basket, so that the automation degree of the silicon wafer cleaning is low, and the productivity is further severely restricted.

Disclosure of Invention

The invention provides a silicon wafer cleaning device, silicon wafer double-side cleaning equipment and a silicon wafer cleaning method, aiming at solving the problem of low silicon wafer cleaning automation degree in the prior art.

The technical scheme provided by the invention is as follows: a silicon wafer cleaning apparatus, comprising: the silicon wafer cleaning device comprises a conveying mechanism, a fixing device and a cleaning mechanism, wherein the fixing device is arranged on the conveying mechanism in a transmission mode and used for limiting one surface of a silicon wafer, and the cleaning mechanism is used for cleaning the other surface of the silicon wafer (wherein one surface and the other surface of the silicon wafer are two opposite surfaces of the silicon wafer, and for convenience of description, the two opposite surfaces of the silicon wafer are respectively referred to as a first surface and a second surface in the following partial contents).

Further, the fixing device is a vacuum adsorption device, and the vacuum adsorption device comprises a vacuum adsorption platform and a vacuum generation device, wherein the vacuum adsorption platform is arranged on the conveying mechanism and moves along with the conveying mechanism, and the vacuum generation device is connected with the vacuum adsorption platform.

Further, the cleaning mechanism comprises a spraying structure, a blowing and drying structure and a rolling brush contacted with the surface of the silicon wafer.

Further, the round brush includes the pivot, drive arrangement is connected to the pivot, silicon chip belt cleaning device still include with the controller that drive arrangement electricity is connected, drive arrangement drive the round brush is followed the direction of transfer antiport of silicon chip.

Further, the silicon wafer cleaning device further comprises: the silicon wafer detection devices are respectively arranged on the front side and the rear side of the spraying structure in the silicon wafer conveying direction, and the controller is electrically connected with the silicon wafer detection devices; the controller is electrically connected with the cleaning mechanism to control the cleaning mechanism to be opened or closed according to the detection signal of the silicon wafer detection device.

A silicon wafer double-sided cleaning apparatus, the silicon wafer comprising a first surface and a second surface, the silicon wafer double-sided cleaning apparatus comprising: the two silicon wafer cleaning devices are respectively a first cleaning device for cleaning a first surface of a silicon wafer and a second cleaning device for cleaning a second surface of the silicon wafer; and the auxiliary conveying device is arranged between the first cleaning device and the second cleaning device and is used for assisting the silicon wafers to be conveyed from the first cleaning device to the second fixing device.

Preferably, the first cleaning device comprises a first transfer mechanism, the second cleaning device comprises a second transfer mechanism, and the auxiliary transfer device comprises: locate third transport mechanism between first transport mechanism and the second transport mechanism, locate the upset wheel at third transport mechanism middle part, set up a plurality of slots that extend towards its radial direction on the circumference of upset wheel, the silicon chip inserts the slot, the upset wheel rotates and drives the silicon chip turn-over.

Preferably, the first cleaning device comprises a first conveying mechanism and a first fixing device, the second cleaning device comprises a second conveying mechanism and a second fixing device, the first fixing device and the second fixing device are vacuum adsorption devices, the second conveying mechanism is arranged on one side of the first conveying mechanism in parallel, the first fixing device is arranged below the silicon wafer, the second fixing device is arranged above the silicon wafer, and the auxiliary conveying device comprises a third conveying mechanism for conveying the silicon wafer from the first conveying mechanism to the second conveying mechanism.

A method for cleaning a silicon wafer uses the silicon wafer double-sided cleaning equipment to clean the surface of the silicon wafer, and at least comprises the following steps: the first cleaning device cleans the first surface of the silicon wafer; the auxiliary conveying device conveys the silicon wafer from the first cleaning device to the second cleaning device; and the second cleaning device cleans the second surface of the silicon wafer.

Compared with the prior art, the silicon wafer cleaning device disclosed by the invention has the advantages that when the silicon wafer is cleaned, the second surface of the silicon wafer is contacted with the fixing device for limiting and fixing, the conveying device conveys the silicon wafer and cleans the first surface of the silicon wafer through the cleaning mechanism in the conveying process, and the second surface can be cleaned in the same way; the automatic degree of silicon wafer cleaning is improved through the equipment, so that the cleaning efficiency of the silicon wafer in the industry is doubled or multiplied, the production efficiency is greatly increased, and the labor cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a schematic structural view of a silicon wafer cleaning apparatus according to the present invention;

FIG. 2 is a schematic view showing the structure of a first embodiment of an apparatus for double-side cleaning of silicon wafers according to the present invention;

FIG. 3 is a schematic view showing the structure of a silicon wafer double-side cleaning apparatus according to a second embodiment of the present invention.

1. First cleaning device 2, second cleaning device 3, auxiliary conveying device

11. First conveying mechanism 12 and first fixing device

13. First cleaning mechanism 14, silicon wafer detection device 21 and second conveying mechanism

22. Second fixing device 23, second cleaning mechanism 31, and third transfer mechanism

32. Overturning wheel 111, transmission motor 112 and belt

121. Vacuum adsorption platform 122, vacuum generating device 131 and spraying structure

132. Air blowing and drying structure 133, rolling brush 134 and driving device

321. Slot 231, second spray structure 232, second air blowing and drying structure

233. And a second rolling brush.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The principles and construction of the present invention will be described in detail below with reference to the drawings and examples.

The invention provides a silicon wafer cleaning device and silicon wafer double-side cleaning equipment, wherein the silicon wafer double-side cleaning equipment comprises two silicon wafer cleaning devices and an auxiliary conveying device 3, the two silicon wafer cleaning devices are respectively a first cleaning device 1 and a second cleaning device 2, a first fixing device on the first cleaning device 1 is in contact limit with a second surface of a silicon wafer, and the first surface of the silicon wafer is cleaned; the second cleaning device 2 is arranged on the subsequent process of the first cleaning device 1, and the second cleaning device 2 is contacted with the first surface (the cleaning surface in the first cleaning device 1) of the silicon wafer for limiting and is used for cleaning the second surface (the limiting surface in the first cleaning device 1) of the silicon wafer; and an auxiliary transfer device 3 is disposed between the first cleaning device 1 and the second cleaning device 2, and assists the silicon wafer to be transferred from the first cleaning device 1 to the second cleaning device 2.

The first cleaning device 1 and the second cleaning device 2 in the invention adopt the same structural design scheme, and except that the installation positions of the first cleaning device and the second cleaning device are different, the structures for conveying and cleaning the silicon wafers in the first cleaning device and the second cleaning device are the same.

Specifically, as shown in fig. 1, a first cleaning device 1 is taken as an example for description in the present application, and a second cleaning device 2 can refer to the first cleaning device 1; the first cleaning device 1 comprises a first conveying mechanism 11, a first fixing device 12 and a first cleaning mechanism 13, the first conveying mechanism 11 is installed on a rack and used for conveying silicon wafers, the first fixing device 12 is arranged on the first conveying mechanism 11 and moves along the same direction of the conveying direction of the first conveying mechanism 11, one surface of each silicon wafer is in contact limit by the first fixing device 12 and is conveyed along with the first fixing device 12, and the first cleaning mechanism 13 is arranged on the conveying path of the first conveying mechanism 11 and used for cleaning the other surface of each silicon wafer.

In this embodiment, the first conveying mechanism 11 adopts a belt conveying manner, but may also adopt other conveying manners such as a driving roller and a chain in other embodiments; first fixing device 12 adopts the vacuum adsorption device, it includes vacuum adsorption platform 121 and the vacuum generator 122 of being connected with it, vacuum adsorption platform 121 installs on the belt, when driving motor 111 drives belt 112 and rotates, vacuum adsorption platform 121 moves thereupon, place sliced silicon chip on vacuum adsorption platform 121 surface, vacuum generator 122 (can choose the air pump for use) begins to bleed, the one side that vacuum adsorption platform 121 adsorbs the silicon chip is in order to carry out spacingly with the silicon chip, convey the silicon chip in the cleaning range of first wiper mechanism 13 under belt 112's drive.

The first cleaning mechanism 13 is arranged above the first conveying mechanism 11, specifically above the middle part of the belt 112, and the first cleaning mechanism 13 includes a first spraying structure 131, a first blowing and drying structure 132 and a first rolling brush 133; as shown in fig. 2 and 3, the second cleaning mechanism 23 further includes a second spraying structure 231, a second blowing and drying structure 232, and a second rolling brush 233.

The following embodiment is described by taking the first spraying structure 131 as an example, the first spraying structure 131 is located on the same side of the belt as the silicon wafer, the first spraying structure 131 comprises a liquid supply pipe and a spraying head arranged at the end of the liquid supply pipe, the liquid supply pipe is responsible for supplying the cleaning liquid, and the spraying head is rotatably arranged above the silicon wafer, so that when the silicon wafer passes through the first spraying structure 131, the spraying head can spray the cleaning liquid to the silicon wafer in all directions, and the surface of the silicon wafer can uniformly spray the cleaning liquid; first round brush 133 sets up between first spray structure 131 and silicon chip, it is including setting up the pivot in the middle of first round brush 133, the rotatable installation in first belt cleaning device 1's frame in both ends of pivot, a drive arrangement 134 (driving motor) has been connected in the pivot, the pivot rotates under drive arrangement's drive, be equipped with the cylinder in the outside of pivot, the outside of cylinder is equipped with the brush hair, when the silicon chip conveys to first cleaning mechanism 13, the pivot drives the cylinder and rotates, the brush hair contacts with the surface of silicon chip, it can effectively erode the silicon chip surface to cooperate first spray structure 131 again, the round brush rotates with the reversal of silicon chip direction of transfer simultaneously, make the brush hair can erode against silicon chip direction of motion, promptly: the first rolling brush 133 can rotate (move circularly) along the rotating shaft, and at the position where the first rolling brush 133 is tangent to the silicon wafer contact position on the vacuum adsorption platform transmission device 2, the rotating direction of the first rolling brush 133 is opposite to the transmission direction of the vacuum adsorption platform transmission device 2; the front and rear of the first round brush 133 are provided with spray headers at equal intervals so that the first spray structure 131 and the round brush device are effectively matched to realize efficient cleaning.

Preferably, in order to ensure that the surface of the silicon wafer can be acted by the rolling brush, the length of the rolling brush is set to be not less than the size of the silicon wafer.

The first air blowing and drying structure 132 is arranged behind the silicon wafer conveying direction of the first spraying structure 131, the first air blowing and drying structure 132 comprises an air blowing pipe and an air blowing head which are fixed on the rack, the height of the air blowing head is basically consistent with that of the spraying head, and the silicon wafers which are sprayed and cleaned by the rolling brush are dried (primarily dried) so as to be convenient for the next process.

Further, the silicon wafer cleaning device in the application is also provided with a controller, the controller is connected with the driving device and can output signals to adjust the rotating speed of the driving device 134, and meanwhile, the transmission motor 111 is also connected with the controller, so that the controller can control the transmission speed of the belt and the rotating speed of the rolling brush, the relative speed of the silicon wafer and the rolling brush is reasonably adjusted, the contact area and the contact time of the silicon wafer and the rolling brush are adjusted, and the cleaning effect of the silicon wafer is greatly increased.

Further, the cleaning device 1 further comprises a detection system, which specifically comprises silicon wafer detection devices 14 respectively arranged at the front side and the rear side of the first cleaning mechanism 13, the silicon wafer detection devices 14 are specifically positioned at the front side and the rear side of the first cleaning mechanism 13 in the silicon wafer conveying direction, the silicon wafer detection devices 14 are also electrically connected with a controller, the controller is also electrically connected with the first cleaning mechanism 13 (comprising a first spraying structure 131, a first air blowing and drying structure 132, a first rolling brush 133 and the like), the silicon wafer detection devices 14 are also arranged on the rack, when the silicon wafer detection devices 14 positioned in front of the first cleaning mechanism 13 detect that a silicon wafer or a vacuum adsorption platform 121 is present, the first cleaning mechanism 13 is started, after the silicon wafer is cleaned for a plurality of times by the first cleaning mechanism 13 and is primarily dried by the first air blowing and drying structure 132, the silicon wafer is conveyed to the tail end of the first cleaning device 1 by the first conveying mechanism 11, and finishing the cleaning process of the surface of the silicon wafer, and closing the first cleaning mechanism 13 after the silicon wafer detection device 14 positioned behind the first cleaning mechanism 13 detects the silicon wafer or the vacuum adsorption platform 121. By arranging the silicon wafer detection device 14, unnecessary liquid medicine consumption and processing technology can be reduced, and the technology for cleaning the silicon wafer can be accurately controlled.

Preferably, the first spraying structure 131 in this embodiment is further provided with an ultrasonic device, and ultrasonic waves can be arranged on the liquid supply pipe, so that countless micro-bubbles are contained in the flowing solution, and when the flowing solution is sprayed on the surface of the silicon wafer, the cleaning effect can be improved.

As shown in fig. 2, in the first embodiment of the present invention, it comprises a first cleaning device 1 and a second cleaning device 2, the first cleaning device 1 and the second cleaning device 2 are arranged in parallel, and an auxiliary conveying device 3 is arranged between the first cleaning device 1 and the second cleaning device 2; specifically, in the present embodiment, the auxiliary conveying device includes a third conveying mechanism 31 and a flipping wheel 32, the third conveying mechanism 31 is disposed in parallel with the first conveying mechanism 11 and the second conveying mechanism 21, when the first surface of the silicon wafer is cleaned in the first cleaning device 1 and then conveyed to the third conveying mechanism 31, the silicon wafer is conveyed to the second cleaning device 2 by the third conveying mechanism 31, and the third conveying mechanism 31 includes but is not limited to a belt conveying, a roller conveying or a chain conveying manner.

The turnover wheel 32 can be arranged in the middle of the third conveying mechanism 31, and is of a circular rotating wheel structure, the rotating shaft of the turnover wheel is arranged on the same horizontal plane as the first conveying mechanism, the second conveying mechanism and the third conveying mechanism, the axial direction of the rotating shaft vertically passes through the third conveying mechanism, a plurality of slots 321 are uniformly arranged on the circumference of the turnover wheel 32, the slots 321 extend from the circumference of the turnover wheel 32 to the radial direction of the turnover wheel 32, so that when the silicon wafer is conveyed to the left side of the turnover wheel 32, the silicon wafer is correspondingly inserted into one slot 321, the turnover wheel 32 rotates, after the turnover wheel 32 rotates 180 degrees, the silicon wafer is correspondingly turned over by 180 degrees so as to turn over the silicon wafer, and after turning over, the silicon wafer continues to clean the second surface of the silicon wafer in the second cleaning device 2.

In this embodiment, the first fixing device and the second fixing device may adopt other limiting devices, and the limiting device may adopt, for example, at least one set of mesh belts protruding from opposite edges or a steel belt to limit the position of the silicon wafer on the conveying mechanism.

As shown in fig. 3, in the second embodiment of the present invention, it comprises a first cleaning device 1 and a second cleaning device 2 which are arranged in parallel and spaced, wherein the first cleaning device 1 and the second cleaning device 2 are inverted with respect to each other, i.e. the first fixing device 12 and the first cleaning mechanism 13 in the first cleaning device 1 are located above the first conveying mechanism 11, and the first fixing device 22 and the second cleaning mechanism 23 in the second cleaning device 2 are located below the second conveying mechanism 21; the auxiliary conveying device 3 is arranged between the first cleaning device 1 and the second cleaning device 2, and the first fixing device and the second fixing device are both vacuum adsorption devices in the embodiment; specifically, the auxiliary conveying device 3 in the present embodiment includes only the third conveying mechanism 31, and the third conveying mechanism 31 includes, but is not limited to, a belt conveying, a roller conveying, or a chain conveying transmission manner.

The third conveying mechanism 31 is parallel to the first conveying mechanism 11 and located on the same horizontal plane, the second conveying mechanism 21 is parallel to the third conveying mechanism 31, the silicon wafer is cleaned on the first surface in the first cleaning device 1 and conveyed to the tail end, the vacuum generating device stops operating, the vacuum adsorption platform stops adsorbing the silicon wafer, the silicon wafer is conveyed to the third conveying mechanism 31, when the third conveying mechanism 31 horizontally conveys the silicon wafer to the tail end of the third conveying mechanism, the third conveying mechanism 31 extends to the position below the second conveying mechanism 21, the silicon wafer is conveyed to the position below the second conveying mechanism 21 through the third conveying mechanism 31, at the moment, the vacuum generating device is started, the vacuum adsorption device is started, and the silicon wafer is adsorbed on the second conveying mechanism 21 under the action of the vacuum adsorption platform to clean the second surface.

The silicon wafers may be transferred among the first, second, and third transfer mechanisms by transfer equipment, which may be a robot or a vacuum adsorption transfer member, and the silicon wafers may be transferred from one transfer mechanism to another transfer mechanism by gripping or adsorption.

It is added that the production process of the silicon wafer specifically comprises: silicon wafers obtained by slicing silicon rods (the surfaces of the silicon wafers usually contain various impurities, such as metal particles abraded by cutting wires and silicon wafers, residues of cutting fluid, dust and fingerprints in the process of transportation); after being cleaned by the silicon wafer cleaning device, the silicon wafer also needs to be washed and dried, for example, the silicon wafer cleaning process comprises the following steps: the cleaning method comprises the steps of sequentially passing through a first cleaning device (for cleaning the first surface of the silicon wafer), a second cleaning device (for cleaning the second surface), a washing device (for washing the silicon wafer) and a drying device (for drying the silicon wafer).

Of course, different processes can be added according to the needs in the actual production process, for example, another silicon wafer cleaning process is: the cleaning method comprises the steps of sequentially cleaning a first surface of a silicon wafer, a second surface of the silicon wafer, a washing device (washing the silicon wafer), an alkaline device (washing the silicon wafer with alkali), a washing device (washing the silicon wafer with water), a drying device (drying the silicon wafer) and the like.

It is emphasized that the process steps that can be added further include: the alkali polishing process is used for removing a damaged layer on the surface, and is convenient for the subsequent silicon wafer texturing treatment; a pure water spraying process for increasing the cleaning effect; and the drying procedure is used for drying the surface of the silicon wafer after the cleaning is finished, and the like, and in addition, working sections can be reasonably and repeatedly increased according to the reality so as to realize the cleaning effect.

Through using the silicon chip belt cleaning device who provides in this application, promoted the abluent degree of automation of silicon chip for in the industry to the cleaning efficiency of silicon chip increase at double or several times, greatly increased production efficiency, alleviateed the cost of labor.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.