阅读说明：本技术 一种耐高温高回弹电磁屏蔽导电泡棉及其制备工艺 (High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof ) 是由 向涛 于 2020-07-01 设计创作，主要内容包括：本发明公开了一种耐高温高回弹电磁屏蔽导电泡棉及其制备工艺,其中,电磁屏蔽导电泡棉,包括基材层以及基材层表面包覆的镀金属聚酰亚胺薄膜层,所述的镀金属聚酰亚胺薄膜层包括内表面贴合在基材层表面的聚酰亚胺薄膜层,聚酰亚胺薄膜层的外表面复合有第一金属镀层,第一金属镀层远离聚酰亚胺薄膜层的外表面复合有铜镀层,铜镀层远离第一金属镀层的外表面设置有第二金属镀层。相比于传统电磁屏蔽器件,本发明的导电泡棉更耐高温,且弹性更好,电阻率更低,电磁屏蔽效果更好,尤其是,可通过SMT技术将其焊接到电路板或者线路板上,解决了人工贴合耗费人力的问题,降低了人力成本,提高了生产效率。(The invention discloses high-temperature-resistant high-resilience electromagnetic shielding conductive foam and a preparation process thereof, wherein the electromagnetic shielding conductive foam comprises a base material layer and a metal-plated polyimide film layer coated on the surface of the base material layer, the metal-plated polyimide film layer comprises a polyimide film layer with the inner surface attached to the surface of the base material layer, a first metal coating is compounded on the outer surface of the polyimide film layer, a copper coating is compounded on the outer surface of the first metal coating, which is far away from the polyimide film layer, and a second metal coating is arranged on the outer surface of the copper coating, which is far away from the first metal coating. Compared with the traditional electromagnetic shielding device, the conductive foam is more resistant to high temperature, better in elasticity, lower in resistivity and better in electromagnetic shielding effect, and particularly can be welded on a circuit board or a circuit board through an SMT (surface mount technology), so that the problem that manual labor is consumed in manual fitting is solved, the labor cost is reduced, and the production efficiency is improved.)

1. The utility model provides a high temperature resistant high electrically conductive bubble of electromagnetic shield that kick-backs is cotton which characterized in that: including substrate layer (100) and substrate layer (100) surface cladding's metal plating polyimide film layer (200), metal plating polyimide film layer (200) including the internal surface laminating in polyimide film layer (201) on substrate layer (100) surface, the surface complex of polyimide film layer (201) has first metal coating (202), the surface complex of polyimide film layer (201) is kept away from in first metal coating (202) has copper coating (203), the surface that first metal coating (202) were kept away from in copper coating (203) is provided with second metal coating (204).

2. The high temperature resistant high resilience electromagnetic shielding conductive foam of claim 1, wherein: and a protective film (205) is attached to the inner surface of the second metal plating layer (204), and the adhesive surface of the protective film (205) is attached to the outer surface of the copper plating layer (203).

3. The high temperature resistant high resilience electromagnetic shielding conductive foam of claim 1, wherein: the base material layer (100) adopts a silicone rubber layer or a foam layer with a cavity (101) arranged inside.

4. The high temperature resistant high resilience electromagnetic shielding conductive foam of claim 1, wherein: the first metal plating layer (202) is a nickel plating layer, a nickel-cobalt alloy plating layer or a nickel-iron alloy plating layer.

5. The high temperature resistant high resilience electromagnetic shielding conductive foam of claim 1, wherein: the second metal plating layer (204) is a nickel plating layer, a tin plating layer, a gold plating layer or a silver plating layer.

6. The high temperature resistant high resilience electromagnetic shielding conductive foam of claim 1, wherein: the outer surface of the second metal plating layer (204) far away from the copper plating layer (203) is also provided with a third metal plating layer (206), the inner surface of the third metal plating layer (206) is attached with a protective film (205), and the adhesive surface of the protective film (205) is attached to the outer surface of the second metal plating layer (204).

7. The high temperature resistant high resilience electromagnetic shielding conductive foam of claim 6, wherein: the third metal plating (206) is gold plating or silver plating.

8. The preparation process of the high temperature resistant high resilience electromagnetic shielding conductive foam according to any one of claims 1 to 5, wherein the preparation process comprises the following steps: the method comprises the following steps:

s1, compounding a copper plating layer (203) on the outer surface of the first metal plating layer (202), and adhering the inner surface of the first metal plating layer (202) compounded with the copper plating layer (203) to the outer surface of the polyimide film layer (201);

s2, attaching a protective film (205) on the inner surface of the second metal plating layer (204), and attaching the adhesive surface of the protective film (205) on the outer surface of the copper plating layer (203) in the step S1 to form a metal-plated polyimide film layer (200);

s3, coating a layer of silicon rubber vulcanized glue on the non-metal layer of the metal plated polyimide film layer (200) in the step S2;

s4, wrapping the substrate layer (100) on the surface, coated with the silicon rubber vulcanized glue, of the metal-plated polyimide film layer (200) in the step S3 to form a primary finished product;

s5, placing the primary finished product obtained in the step S4 into a forming die, heating, shaping and vulcanizing at 100-200 ℃ for 1-30 seconds, and standing and cooling to obtain a finished product material;

and S6, carrying out upper plate cutting on the finished product material vulcanized and cooled in the step S4, and packaging to obtain the electromagnetic shielding conductive foam product.

9. The preparation process of the high temperature resistant high resilience electromagnetic shielding conductive foam according to any one of claims 6 to 7, wherein the preparation process comprises the following steps: the method comprises the following steps:

s1, compounding a copper plating layer (203) on the outer surface of the first metal plating layer (202), compounding a second metal plating layer (204) on the outer surface of the copper plating layer (203), and adhering the inner surface of the first metal plating layer (202) compounded with the copper plating layer (203) and the second metal plating layer (204) to the outer surface of the polyimide film layer (201);

s2, attaching a protective film (205) to the inner surface of the third metal plating layer (206), and attaching the adhesive surface of the protective film (205) to the outer surface of the second metal plating layer (204) in the step S1 to form a metal-plated polyimide film layer (200);

s3, coating a layer of silicon rubber vulcanized glue on the non-metal layer of the metal plated polyimide film layer (200) in the step S2;

s4, wrapping the substrate layer (100) on the surface, coated with the silicon rubber vulcanized glue, of the metal-plated polyimide film layer (200) in the step S3 to form a primary finished product;

s5, placing the primary finished product obtained in the step S4 into a forming die, heating, shaping and vulcanizing at 100-200 ℃ for 1-30 seconds, and standing and cooling to obtain a finished product material;

and S6, carrying out upper plate cutting on the finished product material vulcanized and cooled in the step S4, and packaging to obtain the electromagnetic shielding conductive foam product.

Technical Field

The invention relates to the technical field of conductive foam, in particular to high-temperature-resistant high-resilience electromagnetic shielding conductive foam and a preparation process thereof.

Background

In modern life, a series of electronic products such as mobile phones and computers become an indispensable part of people, and the harm of electromagnetic radiation to human bodies also becomes a focus of attention of people, so that the demand on high-energy electromagnetic shielding devices is increased.

The relevant electromagnetic shielding parts in the market at present are mainly processed by metal foils, fabric shielding materials, conductive materials and the like, and play a role in conductive shielding and shock resistance after being wrapped by foam. The metal foil is difficult to prepare, easy to wrinkle and high in density; the fabric shielding material cannot be kneaded, stretched, washed, etc.; the conductive coating is easily oxidized and easily settles during transportation and storage. After the electromagnetic shielding device is made of the materials, the materials need to be manually and independently attached to an electronic product to be applied, automatic mounting cannot be achieved, labor is consumed, and the efficiency is low.

Disclosure of Invention

The invention aims to provide high-temperature-resistant high-resilience electromagnetic shielding conductive foam and a preparation process thereof, and aims to solve the problems in the background art.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a high temperature resistant high electrically conductive bubble of electromagnetic shield that kick-backs, includes substrate layer and the cladding metal plating polyimide thin layer of substrate layer surface, metal plating polyimide thin layer include that the internal surface laminates on the polyimide thin layer of substrate layer surface, the surface complex of polyimide thin layer has first metal coating, the surface complex that polyimide thin layer was kept away from to first metal coating has copper coating, the surface that first metal coating was kept away from to copper coating is provided with second metal coating.

In a further aspect of the present invention, a protective film is attached to an inner surface of the second metal plating layer, and an adhesive surface of the protective film is attached to an outer surface of the copper plating layer.

As a further scheme of the invention, the substrate layer adopts a silicone rubber layer or a foam layer with a cavity arranged inside.

As a further aspect of the present invention, the first metal plating layer is a nickel plating layer, a nickel-cobalt alloy plating layer, or a nickel-iron alloy plating layer.

As a further aspect of the present invention, the second metal plating layer is a nickel plating layer, a tin plating layer, a gold plating layer, or a silver plating layer.

As a further scheme of the invention, the outer surface of the second metal plating layer, which is far away from the copper plating layer, is also provided with a third metal plating layer, the inner surface of the third metal plating layer is attached with a protective film, and the adhesive surface of the protective film is attached to the outer surface of the second metal plating layer.

In a further embodiment of the present invention, the third metal plating layer is a gold plating layer or a silver plating layer.

A preparation process of high-temperature-resistant high-resilience electromagnetic shielding conductive foam comprises the following steps:

s1, compounding a copper plating layer on the outer surface of the first metal plating layer, and attaching the inner surface of the first metal plating layer compounded with the copper plating layer to the outer surface of the polyimide film layer;

s2, attaching a protective film to the inner surface of the second metal plating layer, and attaching the adhesive surface of the protective film to the outer surface of the copper plating layer in the step S1 to form a metal-plated polyimide film layer;

s3, coating a layer of silicon rubber vulcanized glue on the non-metal layer of the plated metal polyimide film layer in the step S2;

s4, wrapping the substrate layer on the surface, coated with the silicon rubber vulcanized glue, of the metal-plated polyimide film layer in the step S3 to form a primary finished product;

s5, placing the primary finished product obtained in the step S4 into a forming die, heating, shaping and vulcanizing at 100-200 ℃ for 1-30 seconds, and standing and cooling to obtain a finished product material;

and S6, carrying out upper plate cutting on the finished product material vulcanized and cooled in the step S4, and packaging to obtain the electromagnetic shielding conductive foam product.

A preparation process of high-temperature-resistant high-resilience electromagnetic shielding conductive foam comprises the following steps:

s1, compounding a copper plating layer on the outer surface of the first metal plating layer, compounding a second metal plating layer on the outer surface of the copper plating layer, and attaching the inner surface of the first metal plating layer compounded with the copper plating layer and the second metal plating layer to the outer surface of the polyimide film layer;

s2, attaching a protective film to the inner surface of the third metal plating layer, and attaching the adhesive surface of the protective film to the outer surface of the second metal plating layer in the step S1 to form a metal-plated polyimide film layer;

s3, coating a layer of silicon rubber vulcanized glue on the non-metal layer of the plated metal polyimide film layer in the step S2;

s4, wrapping the substrate layer on the surface, coated with the silicon rubber vulcanized glue, of the metal-plated polyimide film layer in the step S3 to form a primary finished product;

s5, placing the primary finished product obtained in the step S4 into a forming die, heating, shaping and vulcanizing at 100-200 ℃ for 1-30 seconds, and standing and cooling to obtain a finished product material;

and S6, carrying out upper plate cutting on the finished product material vulcanized and cooled in the step S4, and packaging to obtain the electromagnetic shielding conductive foam product.

Compared with the prior art, the invention has the beneficial effects that: compared with the traditional electromagnetic shielding device, the conductive foam is more resistant to high temperature, better in elasticity, lower in resistivity and better in electromagnetic shielding effect, and particularly can be welded on a circuit board or a circuit board through an SMT (surface mount technology), so that the problem that manual labor is consumed in manual fitting is solved, the labor cost is reduced, and the production efficiency is improved.

Drawings

Fig. 1 is a schematic cross-sectional view of a high temperature resistant high resilience electromagnetic shielding conductive foam of examples 1 to 9;

FIG. 2 is a schematic cross-sectional view of a plated polyimide film layer of a high temperature resistant high resilience electromagnetic shielding conductive foam of examples 1 to 5;

FIG. 3 is a schematic cross-sectional view of a plated polyimide film layer of a high temperature resistant high resilience electromagnetic shielding conductive foam of examples 6 to 9;

fig. 4 is a schematic cross-sectional view of the electromagnetic shielding conductive foam with high temperature resistance and high resilience in examples 10 to 12.

In the figure: 100-a substrate layer, 101-a cavity, 200-a metal-plated polyimide film layer, 201-a polyimide film layer, 202-a first metal plating layer, 203-a copper plating layer, 204-a second metal plating layer, 205-a protective film and 206-a third metal plating layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.