阅读说明：本技术 一种可剥胶及其制备方法和应用 (Peelable glue and preparation method and application thereof ) 是由 韩宜林 黄计锋 闻明 徐华斌 练志良 于 2020-07-28 设计创作，主要内容包括：本发明公开一种可剥胶及其制备方法和应用,所述可剥胶包括如下质量份的制备原料：热塑性弹性体10份、增黏树脂2～10份、溶剂10～100份、润湿剂1～10份。本发明的剥离胶具有相当优良的物理和力学性能,其具有高绝缘阻抗可提供优良的绝缘效果；其具有高达900％以上的延伸率、韧性强可提供连贯的剥离效果；并具有很强的拉伸强度和附着力。(The invention discloses a peelable glue and a preparation method and application thereof, wherein the peelable glue comprises the following preparation raw materials in parts by mass: 10 parts of thermoplastic elastomer, 2-10 parts of tackifying resin, 10-100 parts of solvent and 1-10 parts of wetting agent. The stripping glue has quite excellent physical and mechanical properties, and has high insulation resistance to provide excellent insulation effect; the elongation rate is as high as more than 900%, the toughness is strong, and a coherent stripping effect can be provided; and has strong tensile strength and adhesion.)

1. A peelable glue is characterized in that: the preparation method comprises the following raw materials in parts by mass:

the thermoplastic elastomer contains a styrene hard chain segment, the content of the styrene hard chain segment in the thermoplastic elastomer is within the range of 15-40%, and the viscosity of a 25% toluene solution of the thermoplastic elastomer at 25 ℃ is within the range of 4000-500000 cP.

2. The peelable glue of claim 1, wherein: the thermoplastic elastomer is selected from one or a mixture of SEBS, SIS, SEEPS and SEPS.

3. The peelable glue of claim 1, wherein: the softening point of the tackifying resin is within the range of 80-140 ℃, and the viscosity of the tackifying resin is within the range of 100-1000 cP at 160 ℃.

4. The peelable glue of claim 3, wherein: the tackifying resin is selected from one or a mixture of more of polymerized rosin, rosin pentaerythritol ester, terpene phenol resin, p-tert-butyl phenol formaldehyde resin, coumarone resin and C9 petroleum resin.

5. The peelable glue of claim 1, wherein: the solvent comprises a solvent A and a solvent B, wherein the solvent A is one or a mixture of more of n-hexane, cyclohexane, isohexane and methylcyclohexane, and the solvent B is one or a mixture of more of ethylcyclohexane, propylcyclohexane, n-heptane and isooctane.

6. The peelable glue of claim 5, wherein: the mass parts of the solvent A and the solvent B are both 5-50 parts.

7. The peelable glue of claim 1, wherein: the wetting agent is one or a mixture of more of 6# white electric oil, 120# white electric oil, raffinate oil, tetrahydrofuran, ethyl acetate, butyl acetate, isoamyl acetate, butanone and cyclohexanone.

8. The peelable glue of claim 1, wherein: the raw materials of the peelable glue also comprise a leveling agent, and the viscosity of the leveling agent is within the range of 10-500 cP at 25 ℃.

9. A method for preparing the peelable glue of any one of claims 1 to 8, characterized in that: the method comprises the following steps:

(1): stirring and mixing the thermoplastic elastomer, the tackifying resin and the solvent to obtain a base material;

(2): and adding a wetting agent and a flatting agent into the base material, stirring and mixing to obtain the peelable glue.

10. Use of the peelable glue of any one of claims 1 to 8 in the surface protection of electronic components.

Technical Field

The invention belongs to the technical field of adhesives, and particularly relates to a peelable adhesive and a preparation method and application thereof.

Background

When the surfaces of a printed circuit board, a touch screen or other devices are processed and manufactured, in order to prevent the devices from being damaged, peelable blue glue is generally coated on the surfaces of the devices for protection, and the peelable blue glue can be peeled off after the processing is finished. The traditional peelable blue glue is a thermosetting adhesive, needs to be cured at high temperature, and is difficult to avoid certain influence on electronic components if used for protecting a touch screen or other electronic components. For this reason, the development of peelable blue glue which can be cured at room temperature without high temperature is of great significance for the application of peelable blue glue in electronic components.

It has been reported that the peelable blue gel can be rapidly cured at normal temperature by modifying the thermoplastic elastomer used for the peelable blue gel, but the process for preparing the modified thermoplastic elastomer is complicated, and a large amount of organic solvents with pungent odor, such as toluene, xylene and butanone, are used, so that the peelable blue gel has great harm to human bodies and the environment. Research is also carried out on adding chloroprene rubber into a peelable blue glue raw material, using an environment-friendly solvent to prepare a self-drying peelable blue glue, and spraying the self-drying peelable blue glue on the surface of a protected object, but the addition of a cross-linking agent can possibly corrode other electronic components near a screen. Meanwhile, the peelable blue glue needs to be peeled after the device is processed, so that the phenomenon of breakage is easily caused, and peeling is not easily caused.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the first purpose of the invention is to provide a peelable glue which has high tensile strength and high elongation, and strong toughness which can provide a consistent peeling effect.

In order to achieve the purpose, the invention adopts the technical scheme that:

the peelable glue comprises the following raw materials in parts by mass:

the thermoplastic elastomer contains a styrene hard chain segment, the content of the styrene hard chain segment in the thermoplastic elastomer is within the range of 15-40%, and the viscosity of a 25% toluene solution of the thermoplastic elastomer at 25 ℃ is within the range of 4000-500000 cP.

The raw material of the peelable glue also comprises 0.01-0.1 part of a flatting agent.

The peelable glue comprises the following raw materials in parts by mass:

the thermoplastic elastomer is selected from one or a mixture of SEBS, SIS, SEEPS and SEPS.

The softening point of the tackifying resin is within the range of 80-140 ℃, and the viscosity of the tackifying resin at 160 ℃ is within the range of 100-1000 cP.

The tackifying resin is selected from one or a mixture of more of polymerized rosin, rosin pentaerythritol ester, terpene phenol resin, p-tert-butyl phenol formaldehyde resin, coumarone resin and C9 petroleum resin.

The solvent comprises a solvent A and a solvent B, and the mass parts of the solvent A and the solvent B are both 5-50 parts. The solvent A is one or a mixture of more of n-hexane, cyclohexane, isohexane and methylcyclohexane. The solvent B is one or a mixture of several of ethyl cyclohexane, propyl cyclohexane, n-heptane and isooctane.

The wetting agent is one or a mixture of more of 6# white electric oil, 120# white electric oil, raffinate oil, tetrahydrofuran, ethyl acetate, butyl acetate, isoamyl acetate, butanone and cyclohexanone. By adding the wetting agent, the surface energy of the thermoplastic elastomer can be effectively reduced, and the spreading performance of the peelable blue gel is improved.

The leveling agent is methyl silicone oil with viscosity within the range of 10-500 cP at 25 ℃.

The second purpose of the invention is to provide a preparation method of the peelable glue, which comprises the following steps:

(1): stirring and mixing the thermoplastic elastomer, the tackifying resin and the solvent to obtain a base material;

(2): and adding a wetting agent and a flatting agent into the base material, stirring and mixing to obtain the peelable glue.

In the step (2), the stirring speed is 200-500 r/min.

And (2) adding a wetting agent and a flatting agent, stirring and mixing, standing, settling, filtering to separate undissolved substances, bottling, and performing centrifugal defoaming to obtain a final product.

The third purpose of the invention is to provide the application of the peelable glue in the surface protection of electronic components.

Compared with the prior art, the invention has the following beneficial effects:

(1) the invention takes the thermoplastic elasticity which contains more styrene hard chain segments and has high molecular weight (generally, the higher viscosity means the higher molecular weight) as the base glue of the peelable glue, can effectively improve the tensile strength of the peelable glue, ensures that the peelable glue is not easy to break in the peeling process, can also ensure that the peelable glue generates larger deformation, improves the breaking elongation of the peelable glue and provides a coherent peeling effect.

(2) The invention adopts proper tackifying resin to improve the adhesive property of the peelable blue glue to the base material, so that the peelable blue glue has excellent adhesive force.

(3) The peelable glue also has high impedance and good insulating property.

Detailed Description

The following further describes the embodiments of the present invention. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.