阅读说明：本技术 光伏组件及其制作方法 (Photovoltaic module and manufacturing method thereof ) 是由 汪浩楠 曹明杰 桑燕 侯宏兵 于 2020-08-11 设计创作，主要内容包括：本发明提供了一种光伏组件及其制作方法。该光伏组件包括层叠设置的第一透明基板、第一封装胶层、电池片层、第二封装胶层和第二透明基板,第一封装胶层和/或第二封装胶层包括：基材层,基材层的一侧表面具有多个凹坑；导电层,一一对应地设置于凹坑中,且导电层与电池片层接触。本发明的上述光伏组件通过使密封胶层的基材层具有凹坑,并使导电材料设置于凹坑中并与电池片层接触,能够省去现有技术中的上述互联条(和/或汇流条),从而降低了光伏组件的种类。并且,本发明上述光伏组件中导电层的设置无需焊接工艺,从而不仅降低了光伏组件的生产成本,还减少了光伏组件生产过程中人工人力消耗。(The invention provides a photovoltaic module and a manufacturing method thereof. This photovoltaic module is including the first transparent substrate, first encapsulation glue film, battery piece layer, second encapsulation glue film and the second transparent substrate of range upon range of setting, and first encapsulation glue film and/or second encapsulation glue film include: the surface of one side of the substrate layer is provided with a plurality of pits; and the conductive layers are arranged in the pits in a one-to-one correspondence manner and are in contact with the battery sheet layers. According to the photovoltaic module, the substrate layer of the sealant layer is provided with the pits, and the conductive material is arranged in the pits and is in contact with the cell sheet layer, so that the interconnection bars (and/or bus bars) in the prior art can be omitted, and the types of the photovoltaic module are reduced. In addition, the conducting layer in the photovoltaic module is arranged without a welding process, so that the production cost of the photovoltaic module is reduced, and the labor consumption in the production process of the photovoltaic module is reduced.)

1. A photovoltaic module comprising a first transparent substrate (10), a first encapsulating glue layer (20), a cell sheet layer (30), a second encapsulating glue layer (40) and a second transparent substrate (50) arranged in a stack, wherein the first encapsulating glue layer (20) and/or the second encapsulating glue layer (40) comprises:

the liquid crystal display panel comprises a substrate layer (110), wherein one side surface of the substrate layer (110) is provided with a plurality of pits;

and the conductive layers (120) are arranged in the pits in a one-to-one correspondence manner, and the conductive layers (120) are in contact with the cell layers (30).

2. The photovoltaic module of claim 1, wherein the depth of the pits is 30-300 μm.

3. The photovoltaic module according to claim 1, wherein the thickness of the conductive layer (120) is 20-650 μm.

4. The photovoltaic module of claim 1, wherein the conductive layer (120) is formed of a conductive material selected from any one or more of copper foil, aluminum foil, conductive organic matter, and conductive inorganic compound.

5. The photovoltaic module according to any one of claims 1 to 4, wherein the thickness of the substrate layer (110) is 290 to 800 μm.

6. Photovoltaic module according to any one of claims 1 to 4, characterized in that the adhesive film material forming the substrate layer (110) is EVA and/or POE.

7. Photovoltaic module according to any one of claims 1 to 4, characterized in that said cell sheet (30) comprises a plurality of cell sheets (301), at least part of said conductive layer (120) connecting each of said cell sheets (301).

8. The photovoltaic module according to any of claims 1 to 4, wherein the cell sheet layer (30) comprises a plurality of cell strings, each cell string comprising a plurality of cell sheets (301), the cell sheets (301) in each cell string being connected by an interconnecting strip, at least part of the conductive layer (120) connecting each interconnecting strip.

9. The photovoltaic module according to any one of claims 1 to 4, wherein the cell sheet layer (30) comprises a plurality of cell strings, each cell string comprising a plurality of cell sheets (301), the conductive layer (120) comprises a first conductive portion and a second conductive portion, at least part of the first conductive portion connects the cell sheets (301) in each cell string, and at least part of the second conductive portion connects each first conductive portion.

10. A method of manufacturing a photovoltaic module according to any one of claims 1 to 9, comprising a step of preparing the first and/or second encapsulating glue layer (20, 40) and a step of laminating a first transparent substrate (10), a first encapsulating glue layer (20), a cell sheet layer (30), a second encapsulating glue layer (40) and a second transparent substrate (50), characterized in that the step of preparing the first and/or second encapsulating glue layer (20, 40) comprises:

a plurality of pits are formed in one surface of the base material layer (110), and the conductive layer (120) is disposed in the pits.

11. The method of claim 10, wherein a conductive material is applied to a surface of a patterned roller, the surface of the patterned roller having a first adhesion to the conductive material, the depressions are formed in a surface of the substrate layer (110) using the patterned roller, and the conductive layer (120) is formed by adhering at least a portion of the conductive material in the depressions while the depressions are formed, the substrate layer (110) having a second adhesion to the conductive material, the second adhesion being greater than the first adhesion.

12. The method of claim 10, wherein a conductive material is adsorbed onto a surface of a patterned roller by a first adsorption force, the depressions are formed on a surface of the substrate layer (110) by the patterned roller, and adsorption of the conductive material is released to transfer the conductive material into the depressions while the depressions are formed, or the conductive material is adsorbed onto a side of the substrate layer (110) away from the patterned roller by a second adsorption force, the second adsorption force being greater than the first adsorption force, to transfer the conductive material into the depressions.

13. The production method according to any one of claims 10 to 12, further comprising a step of subjecting the substrate layer (110) to a pre-crosslinking treatment after the step of forming the pits and before the step of disposing the conductive layer (120) in the pits.