阅读说明：本技术 将压纹结构转印到涂层表面的方法和包含所述涂层的复合物 (Method for transferring an embossed structure to a surface of a coating and composite comprising said coating ) 是由 J-B·库斯 S·皮昂泰克 J·埃克斯纳 J·伦茨 B·克莱恩-布莱 W·施佩尔 R·范 于 2019-03-28 设计创作，主要内容包括：本发明涉及一种使用由基材(F1)和至少部分压纹且至少部分固化的涂层(B1)组成的复合物(F1B1)将压纹结构转印到涂层(B2)的至少一部分表面上的方法,其中复合物(F1B1)的涂层(B2)和涂层(B1)具有彼此为镜像的压纹结构,其中所述方法至少包括步骤(1)和(2)以及任选的(3),涉及复合物(B2B1F1),还涉及所述复合物用于制备游离膜形式的至少部分压纹的涂层(B2)或由基材(F2)、至少一种粘合剂(K)和涂层(B2)组成的复合物(B2KF2)的用途。(The invention relates to a method for transferring an embossed structure onto at least a part of the surface of a coating (B2) using a composite (F1B1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), wherein the coating (B2) and the coating (B1) of the composite (F1B1) have embossed structures which are mirror images of one another, wherein the method comprises at least steps (1) and (2) and optionally (3), to a composite (B2B1F1), and to the use of the composite for producing an at least partially embossed coating (B2) in the form of a free film or a composite (B2KF2) consisting of a substrate (F2), at least one binder (K) and a coating (B2).)

1. A method for transferring an embossed structure to at least a part of the surface of a coating (B2) using a composite (F1B1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), wherein the coating (B2) and the coating (B1) of the composite (F1B1) have embossed structures which are mirror images of one another, and wherein the method comprises at least steps (1) and (2) and optionally (3), in particular

(1) Applying a coating composition (B2a) to at least a part of the at least partially embossed surface of a composite (B1F1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), thereby obtaining a composite (B2aB1F1), and

(2) at least partially curing the applied coating composition (B2a) to give a composite (B2B1F1) consisting of a substrate (F1), an at least partially embossed and at least partially cured coating (B1) and an at least partially cured coating (B2), and

(3) optionally, removing the coating (B2) from the composite (B2B1F1) to recover the composite (B1F1) used in step (1), wherein the coating (B2) has, on its surface previously facing the coating (B1) in the composite (B2B1F1), a mirror image of the at least partially embossed surface of the coating (B1) of the composite (B1F1) used in step (1) and recovered in this step,

wherein the coating composition (B1a) used for preparing the coating (B1) of the complex (B1F1) used in step (1) and restored in step (3) is a radiation-curable coating composition,

wherein the coating composition (B1a) comprises:

at least one component (a) in an amount of 40 to 95% by weight,

as component (b) at least one additive in an amount of 0.01 to 5% by weight,

at least one photoinitiator as component (c) in an amount of from 0.01 to 15% by weight, and

at least one component (d) in an amount of from 0 to 45% by weight, which contains at least one carbon double bond,

wherein (i) each of components (a), (B), (c), and (d) are different from each other, (ii) each of said amounts of components (a), (B), (c), and (d) is based on the total weight of coating composition (B1a), and (iii) the amounts of all components present in coating composition (B1a) add up to 100 wt.%,

and wherein component (a) comprises at least 3 structural units of formula (I), each different or at least partially identical to each other:

wherein:

radical R¹In each case independently of one another is C₂-C₈An alkylene group or a substituted alkylene group,

radical R²In each case independently of one another, H or methyl, and

the parameters m are each, independently of one another, an integer parameter of from 1 to 15, with the proviso that in at least one structural unit of the formula (I) of the component (a) the parameter m is at least 2.

2. The method of claim 1, wherein the coating (B2) in step (3) is obtained as a free film by peeling off and additionally recovering the compound (B1F1) from the compound (B2B1F 1).

3. The method as claimed in claim 1, wherein the coating (B2) is obtained in step (3) in 3 steps by steps (3a), (3B) and (3c) in the form of a composite (B2KF2), in particular by the following steps:

(3a) applying an adhesive (K) to at least a part of the surface of the side of the composite (B2B1F1) provided with the coating (B2) to obtain a composite (KB2B1F1),

(3b) applying a substrate (F2) to at least a portion of the surface of the composite (KB2B1F1) obtained after step (3a) provided with the binder (K), or vice versa, so as to obtain a composite (F2KB2B1F1), and

(3c) -stripping the composite (B1F1) from the composite (F2KB2B1F1), thereby obtaining a composite (F2KB2), wherein the coating (B2) of the composite has on its surface at least partially a mirror image of the at least partially embossed surface of the coating (B1) of the composite (B1F 1).

4. The method of claim 3, wherein the coating (B2) is obtained as a free film by peeling off from the composite (F2KB2) obtained after step (3 c).

5. The method according to any one of the preceding claims, wherein the at least partially embossed and at least partially cured coating (B1) of the composite (F1B1) used in step (1) has embossments in the micro and/or nano range.

6. The method as claimed in any of the preceding claims, wherein the composite (B1F1) used in step (1) is a composite consisting of a film web (F1) and an at least partially embossed and at least partially cured coating (B1) applied thereon.

7. The method according to any one of the preceding claims, wherein the composite (B1F1) used in step (1) and recovered after step (3) is reusable and can be reused for transferring at least one embossed structure.

8. The method according to any one of the preceding claims, wherein the composite (F1B1) used in step (1) and consisting of the substrate (F1) and the at least partially embossed and at least partially cured coating (B1) is obtainable at least by steps (4) to (7), in particular by the steps of:

(4) applying a radiation curable coating composition (B1a) to at least a portion of the surface of a substrate (F1),

(5) at least partially embossing the coating composition (B1a) applied at least partially to the surface of the substrate (F1) by means of at least one embossing tool (P1) having at least one embossing die (P1),

(6) at least partially curing the at least partially embossed coating composition (B1a) applied to at least a portion of the surface of the substrate (F1) by radiation curing, thereby obtaining a composite (F1B1) consisting of the substrate (F1) and the at least partially embossed and at least partially cured coating (B1), wherein the coating composition (B1a) is brought into contact with the at least one embossing die (P1) of the at least one embossing tool (P1) throughout the at least partial curing, and

(7) the composite (F1B1) was removed from the embossing tool (P1).

9. The process as claimed in any of the preceding claims, wherein the solids content of the coating composition (B1a) is ≥ 90% by weight, based on the total weight of the coating composition (B1 a).

10. The process as claimed in any of the preceding claims, wherein in each of the at least 3 structural units of the formula (I) of component (a) the parameter m is at least 2.

11. The process as claimed in any of the preceding claims, wherein the ether segment- [ O-R ] present in the structural unit of the formula (I) of component (a)¹]_m-a fraction of at least 35 wt. -%, based on the total weight of component (a).

12. A composite (B2B1F1) consisting of a substrate (F1), an at least partially embossed and at least partially cured coating (B1), and an at least partially cured coating (B2) applied to (B1), wherein the coating (B1) can be prepared by at least partially curing via radiation curing an at least partially embossed coating composition (B1a) applied to at least a portion of the surface of the substrate (F1), wherein the coating composition (B1a) is a radiation-curable coating composition,

wherein the coating composition (B1a) comprises:

at least one component (a) in an amount of 40 to 95% by weight,

as component (b) at least one additive in an amount of 0.01 to 5% by weight,

at least one photoinitiator as component (c) in an amount of from 0.01 to 15% by weight, and

at least one component (d) in an amount of from 0 to 45% by weight, which contains at least one carbon double bond,

wherein (i) each of components (a), (B), (c), and (d) are different from each other, (ii) each of said amounts of components (a), (B), (c), and (d) is based on the total weight of coating composition (B1a), and (iii) the amounts of all components present in coating composition (B1a) add up to 100 wt.%,

and wherein component (a) comprises at least 3 structural units of formula (I), each different or at least partially identical to each other:

wherein:

radical R¹In each case independently of one another is C₂-C₈An alkylene group or a substituted alkylene group,

radical R²In each case independently of one another, H or methyl, and

the parameters m are each, independently of one another, an integer parameter of from 1 to 15, with the proviso that the parameter m in at least one structural unit of the formula (I) in the component (a) is at least 2.

13. The complex (B2B1F1) of claim 12, wherein the complex (B1F1) in the complex is obtainable by carrying out the method steps (4) to (7) of claim 8.

14. The complex (B2B1F1) according to claim 12 or 13, wherein the complex is obtainable by carrying out the process steps (1) and (2) according to claim 1.

15. Use of the composite (B2B1F1) according to claim 12 or 13 for the preparation of a coating (B2) in the form of a free film which is at least partially embossed on one of its surfaces or for the preparation of a composite (B2KF2) consisting of a substrate (F2), at least one binder (K) and a coating (B2).

Prior Art

In many applications in industry, it is now common to provide structures on the surface of workpieces whose structural features are in the micrometer range or even in the nanometer range. The structures are also referred to as microstructures (structures with features in the micrometer range) or nanostructures (structures with features in the nanometer range). The structures are used, for example, to influence the optical, biomimetic and/or tactile quality of the material surface. This structure is also referred to as an embossing or an embossed structure.

Here, one common method is to transfer these structures into a coating. Here, the transfer of the structure to the coating material is generally effected by an embossing operation, in which a die comprising the microstructures and/or nanostructures to be formed on the embossing surface or transfer surface is brought into contact with the coating material in negative form and is embossed into the coating material. The coating is then typically cured in place in order to permanently form and hold the structure on the surface of the workpiece.

However, a disadvantage of these methods known from the prior art is that continuous methods with high shaping accuracy over a wide range of dimensions, such as roll-to-roll or roll-to-plate methods, are only suitable for embossing foils and films (metal, plastic, paper) or plates (metal, plastic, glass). Once the surface is not perfectly flat or the component is too large for the embossing machine used, the component surface cannot be structured with known methods. However, the in-mold methods known in the prior art for solving this problem, wherein the respective component material, such as liquid plastic particles, is allowed to enter the structured mold and to cure, and wherein after curing the component surface bears against the positive mold of the mold surface, are disadvantageous, because these methods are discontinuous methods involving the limitation of dies with negative-type structures, require a stripper to remove the component from the mold, and are characterized by a very low profiling accuracy, especially in case of periodic structures with an aspect ratio > 0.5.

Since the above-described direct embossing method cannot be used for large components, such as aircraft wings, wind turbine blades or architectural facing elements, it is frequently attempted here to laminate or adhesively bond the components to a film having a nano-or microstructure on its surface. However, lamination of films is accompanied by a number of disadvantages, since the films tend to yellow rapidly, greatly impairing the visual appearance of the surface; due to the use of a membrane as a carrier material, the weight of the assembly increases, which is a disadvantage especially in light structures; and the film exhibits greater barrier properties to, for example, atmospheric oxygen and liquids. The latter fact is particularly an obstacle in repair operations where certain liquids are used to clean old paint from the component. A greater barrier to atmospheric oxygen can cause the development of mold, particularly in the case of architectural trim elements.

EP1304235a1 describes a method for producing structured coatings from a carrier film and produces a layered composite consisting of a structured carrier film with release properties and a coating. DE102005017170a1 describes a transfer film comprising a carrier film and a structural layer arranged thereon. After the structural layer is cured, it may be adhered with an adhesive to the target surface to be provided with the structure. US2007/0218255a1 describes a method of making a structured film useful for decorating glass.

US2010/0279075a1 describes a method of producing a microstructured surface on a component by using a structured carrier film. However, this method has the disadvantage that the microstructured film is first covered with a release layer before the structural layer is applied. This requires an additional work step and also has a drastic negative impact on the shaping quality. An exact complementary transfer of the microstructure is not possible, since the distance between the individual structural elements of the embossing is disadvantageously reduced by the release layer.

WO2015/154866a1 relates to a method of preparing a substrate having a structured surface. In this case, a first UV-curable coating is first applied to the substrate and cured. A second UV cured coating was then applied over the cured coating as an embossing varnish, embossed to produce microstructures, and subsequently cured.

DE102007062123a1 describes a process in which an embossing varnish, such as a UV-crosslinkable embossing varnish, is applied to a carrier film, the embossing varnish is structured in the micrometer range, and the embossing varnish applied to the film is cured to give an embossed film, and the microstructure is subsequently shaped by depositing a metal on the embossed surface, in other words by metallizing the film. However, a disadvantage of such shaping by subsequent metallization is that the resulting shaping quality is undesirably reduced.

Finally, EP2146805B1 describes a method for producing a material with a textured surface. The method includes providing a substrate having a curable coating, contacting the coating with a texturing medium for embossing, and then curing and removing the coating embossed in this manner from the texturing medium. The texturing medium comprises a surface layer comprising 20-50% of an acrylic oligomer, 15-35% of a monofunctional monomer and 20-50% of a multifunctional monomer. WO2016/090395A1 and ACS Nano Journal, 2016, 10, page 4926-4941 describe similar processes, in each case specifically teaching that, for the preparation of the surface layer of the textured medium, in each case mostly triethoxylated trimethylolpropane triacrylate (TMP (EO)₃TA) to produceA relatively hard die for raw texturing medium. Furthermore, according to WO2016/090395a1, the coating composition used for preparing the surface layer must comprise structural units having at least two thiol groups, for example trimethylolpropane tris (3-mercaptopropionate). However, the use of such thiols in corresponding coating compositions is often disadvantageous, because the compositions do not always have sufficient stability on storage, and because coatings prepared therefrom lack sufficient weathering stability. Another factor is the unpleasant smell resulting from the use of mercaptans, which is of course also undesirable.

The embossing processes known from the prior art, such as, in particular, the processes described in EP2146805B1, WO2016/090395a1 and ACSNano Journal, 2016, 10, page 4926-4941, do not always allow a sufficient transfer of the embossing, in particular in the micrometer range and/or nanometer range, i.e. the microstructures and/or nanostructures, and in particular in the case of such a transfer, do not reduce the precision of the shaping to an unacceptable degree. Furthermore, as mentioned above, the methods known from the prior art are not always suitable for providing nanostructured and/or microstructured coating films, in particular for large components and/or components having a non-planar geometry, which coating films are furthermore characterized by a sufficient weathering stability, so that their visual appearance is not adversely affected. At the same time, embossing is not always sufficiently replicated.

Therefore, a method of transferring an embossed structure without the above-described disadvantages is required.

Problem(s)

The problem addressed by the present invention is therefore to provide a method for transferring an embossed structure onto a coating, which method allows the transfer of embossed structures, such as, in particular, microstructures and/or nanostructures, with sufficient shaping accuracy and, in particular, enables the production of a largely recyclable embossing die for transferring embossed structures, and/or can be carried out using such an embossing die. It is a further object of the present invention to provide a process which makes it possible to provide even large components and/or components having a non-planar geometry with a coating comprising such an embossed structure, which is furthermore characterized by sufficient weathering stability and thus no adverse effect on its optical, biomimetic and/or tactile appearance. At the same time, the embossed structure to be transferred can be reproduced to an extremely high degree in each case without a process which is distinguished in particular by any disadvantages, such as inadequate adhesion, which are brought about by undesirable or inadequate properties on the parts of the coating and coating composition used.

Solution scheme

This problem is solved by the subject matter claimed in this patent claim and by preferred embodiments of this subject matter described in the following description.

Accordingly, a first subject of the present invention is a process for transferring an embossed structure onto at least a part of the surface of a coating (B2) using a composite (F1B1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), wherein the coating (B2) and the coating (B1) of the composite (F1B1) have embossed structures which are mirror images of one another, and wherein the process comprises at least steps (1) and (2) and optionally (3), in particular

(1) Applying a coating composition (B2a) to at least a part of the at least partially embossed surface of a composite (B1F1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), thereby obtaining a composite (B2aB1F1), and

(2) at least partially curing the applied coating composition (B2a) to give a composite (B2B1F1) consisting of a substrate (F1), an at least partially embossed and at least partially cured coating (B1) and an at least partially cured coating (B2), and

(3) optionally, removing the coating (B2) from the composite (B2B1F1) to recover the composite (B1F1) used in step (1), wherein the coating (B2) has, on its surface previously facing the coating (B1) in the composite (B2B1F1), a mirror image of said at least partially embossed surface of the coating (B1) of the composite (B1F1) used in step (1) and recovered in this step,

wherein the coating composition (B1a) used for preparing the coating (B1) of the complex (B1F1) used in step (1) and restored in step (3) is a radiation-curable coating composition,

wherein the coating composition (B1a) comprises:

at least one component (a) in an amount of 40 to 95% by weight,

as component (b) at least one additive in an amount of 0.01 to 5% by weight,

at least one photoinitiator as component (c) in an amount of from 0.01 to 15% by weight, and

at least one component (d) in an amount of from 0 to 45% by weight, which contains at least one carbon double bond,

wherein (i) each of components (a), (B), (c), and (d) are different from each other, (ii) each of said amounts of components (a), (B), (c), and (d) is based on the total weight of coating composition (B1a), and (iii) the amounts of all components present in coating composition (B1a) add up to 100 wt.%,

and wherein component (a) comprises at least 3 structural units of formula (I), each different or at least partially identical to each other:

wherein:

radical R¹In each case independently of one another is C₂-C₈An alkylene group or a substituted alkylene group,

radical R²In each case independently of one another, H or methyl, and

the parameters m are each, independently of one another, an integer parameter of from 1 to 15, with the proviso that in at least one structural unit of the formula (I) of the component (a) the parameter m is at least 2.

Preferably, the parameter m in the at least 3 structural units of the formula (I), which are each different from one another or at least partly identical in component (a) of the coating composition (B1a), is in each case at least 2.

It was surprisingly found that the method of the invention enables the transfer of embossed structures, more particularly micro-and/or nano-structures, to the coating (B2) with a very high shaping precision, such that there is no loss of modulation depth during embossing, wherein the shaping is more particularly performed with a high precision of 10nm to 1000 μm structure width and 0.1nm to 1000 μm structure depth. In this connection, it was found particularly surprisingly that the process according to the invention enables the transfer of embossed structures with a compound (F1B1) which can be obtained by applying a radiation-curable coating composition (B1a) to a substrate (F1) with a very high shaping accuracy and a high level of replication success.

It was further surprisingly found that the process of the invention can be applied so advantageously, since the coating (B1) of the compound (F1B1) used is distinguished by a high double bond conversion, which coating can be obtained by applying a radiation-curable coating composition (B1a) to a preferably moving substrate (F1). Thus, in step (3) of the method of the present invention, an effective separation can be achieved between the coating (B2) and the composite. Furthermore, it was surprisingly found that the process of the invention can be applied so advantageously, since the coating (B1) on the substrate (F1) is characterized by very good adhesion.

It was further surprisingly found that with the method according to the invention, in particular even large components with a coating comprising the embossed structure and/or components with a non-planar geometry can be provided or a coating comprising the embossed structure can be transferred onto said components. Furthermore, it was surprisingly found that the resulting coating (B2) with this embossed structure is characterized by sufficient weathering stability and therefore has no adverse effect on its optical, biomimetic and/or tactile appearance. Furthermore, the method of the present invention allows the coating (B2) having the embossed structure to be applied or bonded directly to the substrate, e.g., large components and/or components having non-planar geometries, without the need for one or more additional layers or optional coating films between the substrate and the coating.

Furthermore, it was surprisingly found that if the coating composition (B2a) used in step (1) is a radiation curable coating composition, e.g. a UV radiation curable coating composition, it is at least partially or fully cured in step (2) even at fast processing speeds, although in order to produce the cure, UV radiation has to penetrate the composite (F1B1) -which may comprise e.g. a 125 μm thick PET film (F1) and a coating (B1) of at most 150 μm thickness. It was further surprising that in step (3) of the process, the coating (B2) could be easily separated from the complex (F1B 1). It is particularly surprising that such good release effects are achieved by the specific constitution of the at least partially cured coating (B1) relative to any conventional radiation cured coating (B2).

Furthermore, it was surprisingly found that if the coating composition (B2a) used in step (1) is a physically drying, thermally and/or chemically curable coating composition, the embossed structure of the coating layer (B1) is transferred with good shaping accuracy when (B2a) is applied in step (1), although the evaporation of the solvent typically present in these cases (B2a) implies the possibility of high shrinkage, which typically leads to poor shaping accuracy. However, in the case of the present invention, this was surprisingly not found. Furthermore, in this case, it is also surprising that, in optional step (3) of the process, the coating (B2) can be easily separated from the complex (F1B 1). It is particularly surprising that such good release effects are achieved by the specific constitution of the at least partially cured coating (B1) relative to any conventional physically drying, thermally curing and/or chemically curing coating (B2).

Furthermore, it was surprisingly found that the composite (F1B1) that can be used in step (1) of the method of the invention for transferring embossed structures such as microstructures and/or nanostructures is reusable, which is economically advantageous. Furthermore, surprisingly, the complex (F1B1) can not only be reused and thus be used several times, but also be produced quickly and inexpensively on a large industrial scale.

The invention also relates to a composite (B2B1F1) consisting of a substrate (F1), an at least partially embossed and at least partially cured coating (B1) and an at least partially cured coating (B2) applied to (B1), wherein the coating (B1) can be prepared by at least partially curing an at least partially embossed coating composition (B1a) applied to at least a part of the surface of the substrate (F1) by means of radiation curing, wherein the coating composition (B1a) is a radiation-curable coating composition,

wherein the coating composition (B1a) comprises:

at least one component (a) in an amount of 40 to 95% by weight,

as component (b) at least one additive in an amount of 0.01 to 5% by weight,

at least one photoinitiator as component (c) in an amount of from 0.01 to 15% by weight, and

at least one component (d) in an amount of from 0 to 45% by weight, which contains at least one carbon double bond,

wherein (i) each of components (a), (B), (c), and (d) are different from each other, (ii) each of said amounts of components (a), (B), (c), and (d) are based on the total weight of coating composition (B1a), and (iii) the amounts of all components present in coating composition (B1a) add up to 100 wt.%,

and wherein component (a) comprises at least 3 structural units of formula (I), each different or at least partially identical to each other:

wherein:

radical R¹In each case independently of one another is C₂-C₈An alkylene group or a substituted alkylene group,

radical R²In each case independently of one another, H or methyl, and

the parameters m are each, independently of one another, an integer parameter of from 1 to 15, with the proviso that in at least one structural unit of the formula (I) of the component (a) the parameter m is at least 2.

Preferably, the complex is obtained by method steps (1) and (2).

Furthermore, another subject matter of the invention is the use of the composite (B2B1F1) according to the invention for producing a coating (B2) in the form of a free film which is at least partially embossed on one of its surfaces or for producing a composite (B2KF2) consisting of a substrate (F2), at least one binder (K) and a coating (B2). The complex (B2KF2) is preferably obtained by traversing the process steps (3a), (3B) and (3c), in particular by:

(3a) applying an adhesive (K) to at least a part of the surface of the side of the composite (B2B1F1) provided with the coating (B2) to obtain a composite (KB2B1F1),

(3b) applying a substrate (F2) to at least a portion of the surface of the composite (KB2B1F1) obtained after step (3a) provided with the binder (K), or vice versa, so as to obtain a composite (F2KB2B1F1), and

(3c) the composite (B1F1) is peeled off from the composite (F2KB2B1F1) resulting in a composite (F2KB2), wherein the coating (B2) of the composite has on its surface at least partially a mirror image of the at least partially embossed surface of the coating (B1) of the composite (B1F 1).

Description of the invention

In the sense of the present invention, the term "comprising" preferably has the definition of "consisting of … …" in the case of the coating compositions used according to the invention, for example in the case of the coating composition (B1a) and the process according to the invention and the process steps thereof. For example, for the coating composition (B1a) used according to the invention, in addition to components (a) and (B) and (c) and optionally (d), the composition may furthermore comprise one or more further components described below and optionally present in the coating composition (B1a) used according to the invention. All components may each be present in their preferred embodiments as described hereinafter. For the process of the invention, it may have further optional process steps, for example steps (3a), (3b) and (3c) and (4) to (7), in addition to steps (1) and (2) and optionally (3).

The inventive method for transferring an embossed structure comprising at least the steps (1) to (2) and optionally (3)

As mentioned above, a first subject of the present invention is a process for transferring an embossed structure onto at least a part of a coating (B2) using a composite (B1F1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), wherein the coating (B2) and the coating (B1) of the composite (B1F1) have embossed structures which are mirror images of each other, and wherein the process comprises at least steps (1) and (2) and optionally (3).

The process of the invention is preferably a continuous process.

After carrying out the process steps (1) to (3), on the one hand, the complex (B1F1) used in step (1) is recovered, i.e. recovered, and can preferably be reused, i.e. reused in the process. On the other hand, a coating (B2) was obtained and, on its surface previously facing the coating (B1) in the compound (F1B 2), it had the mirror image of the at least partially embossed surface of the coating (B1) of the compound (B1F1) used in step (1) and subsequently recovered.

According to optional step (3), (B2) may be obtained as a free film by peeling the complex (B1F1) from the coating (B2) in the complex (B2B1F1), or vice versa. This restored the complex (B1F 1).

The coating (B2) in the form of a composite (B2KF2) is preferably obtained in step (3) in three steps, by steps (3a), (3B) and (3c), in particular by the following steps:

(3a) applying an adhesive (K) to at least a part of the surface of the side of the composite (B2B1F1) provided with the coating (B2) to obtain a composite (KB2B1F1),

(3b) applying a substrate (F2) to at least a portion of the surface of the composite (KB2B1F1) obtained after step (3a) provided with the binder (K), or vice versa, so as to obtain a composite (F2KB2B1F1), and

(3c) the composite (B1F1) is peeled off from the composite (F2KB2B1F1) resulting in a composite (F2KB2), wherein the coating (B2) of the composite has on its surface at least partially a mirror image of the at least partially embossed surface of the coating (B1) of the composite (B1F 1).

Then, by peeling from the complex (F2KB2) obtained after step (3c), a coating (B2) can be obtained again as a free film.

Thus, steps (1) to (3) of the process of the invention are carried out to prepare a coating (B2), optionally in the form of a complex (F2KB 2).

The desired embossed structure is transferred onto the coating composition (B2a) by applying a preferably radiation-curable coating composition (B2a) according to process step (1) onto at least a part of the at least partially embossed surface of a composite (B1F1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), or onto the coating (B2) after carrying out step (2).

The term "embossing" means at least partially finishing the coating composition (B2a) with an embossed structure on at least a part of its surface after step (1), or at least partially finishing the coating layer (B2) after step (2). In this case, at least certain regions of the coating composition (B2a) or coating (B2) are decorated with an embossed structure. Preferably, the entire surface of the coating composition (B2a) or coating (B2) is decorated with an embossed structure. For the at least partially embossed composite (B1F1) used as embossing die in step (1) and consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), which can be prepared according to steps (4) to (7) described below, similar explanations apply with respect to the term "embossing".

The embossed structure of the composites (B1F1) and (B2KF2) and of the coating (B2) is preferably and in each case independently of one another based on a repeating and/or regularly arranged pattern. In each case, the structure may be a continuous embossed structure, for example a continuous groove structure, or a plurality of preferably repeated individual embossed structures. In this case, the respective individual embossing structure can in turn preferably be based on a groove structure with more or less pronounced ridges (embossing ridges) which define the embossing height of the embossing structure. Depending on the respective geometry of the ridges of the preferably repeating individual embossed structures, the plan view may show a plurality of preferably repeating individual embossed structures, each of which is different, for example preferably a serpentine, zigzag, hexagonal, rhomboid, parallelogram, honeycomb, circular, dot-like, star, rope, net, polygonal, preferably triangular, quadrangular, more preferably rectangular and square, pentagonal, hexagonal, heptagonal and octagonal, linear, elliptical, oval and lattice-like pattern, wherein at least two patterns may also be superimposed on each other. The ridges of the individual embossed structures may also have a curvature, i.e. a convex and/or concave structure.

Each embossed structure may be described by its width (e.g. the width of the ridges), in other words by its structure width, and by its embossing height, in other words by its structure height (or structure depth). The structure width, e.g. the width of the ridges, may have a length of at most 1 cm, but preferably 10nm to 1 mm. The structure height is preferably 0.1nm to 1 mm. Preferably, however, each embossed structure represents a microstructure and/or a nanostructure. Here, a microstructure is a structure having features in the micrometer range, both in terms of structure width and structure height. Here, a nanostructure is a structure having features in the nanometer range, both in terms of structure width and structure height. Here, microstructures and nanostructures are structures having a structure width in the nanometer range and a structure height in the micrometer range, and vice versa. Here, the terms "structure height" and "structure depth" are interchangeable.

The structure width of each embossed structure is preferably from 10nm to 500 μm, more preferably from 25nm to 400 μm, very preferably from 50nm to 250 μm, more particularly from 100nm to 100 μm. The structure height of each embossed structure is preferably from 10nm to 500 μm, more preferably from 25nm to 400 μm, very preferably from 50nm to 300 μm, more particularly from 100nm to 200 μm. The same is true for the embossed structures of composite (F1B1) and composite (B2KF2) and coating (B2).

Here, the structure width and the structure height of each embossed structure are determined by mechanical scanning of the surface. In this case, the embossing height is measured at not less than 10 points in a line, which are evenly distributed over the web width of the sample, and care is taken to ensure that the scanning instrument does not compress the embossed structure. The determination of the structure height represents the determination of the shaping accuracy and is done by means of a scanning force microscope according to the method described below.

Step (1)

Step (1) of the process of the invention provides for applying a coating composition (B2a) to at least a part of the at least partially embossed surface of a composite (B1F1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1), so as to obtain a composite (B2aB1F 1).

The at least partially embossed and at least partially cured coating (B1) of the composite (F1B1) used in step (1) preferably has an embossing in the micro-and/or nano-range.

The substrate (F1) at least partially coated with (B1) represents a support material for the coating composition (B2a) or coating (B2) to be applied thereto.

The substrate (F1) or, if a coated substrate is used, the layer located on the surface of the substrate (F1) is preferably composed of at least one thermoplastic polymer, more particularly selected from the group consisting of poly (methyl (meth) acrylate, poly (butyl (meth) acrylate), polyethylene terephthalate, polybutylene terephthalate, polyvinylidene fluoride, polyvinyl chloride, polyesters, including polycarbonate and polyvinyl acetate, preferably polyesters such as PBT and PET, polyamides, polyolefins such as polyethylene, polypropylene, polystyrene and polybutadiene, polyacrylonitrile, polyacetal, polyacrylonitrile-ethylene-propylene-diene-styrene copolymer (A-EPDM), polyetherimide, phenolic resins, urea resins, melamine resins, alkyd resins, epoxy resins, polyurethanes, including TPU, polyetherketone, polyphenylene sulfide, polyethers, polyvinyl alcohol and mixtures thereof. Particularly preferred substrates or layers on their surface are polyolefins, such as PP (polypropylene), which may be isotactic, syndiotactic or atactic and may be non-oriented or oriented by mono-or biaxial stretching, SAN (styrene-acrylonitrile copolymer), PC (polycarbonate), PMMA (polymethyl methacrylate), PBT (polybutylene terephthalate), PA (polyamide), ASA (acrylonitrile-styrene-acrylate copolymer) and ABS (acrylonitrile-butadiene-styrene copolymer), and physical mixtures (blends) thereof. Particularly preferred are PP, SAN, ABS, ASA and blends of ABS or ASA with PA or PBT or PC. Particularly preferred are PET, PBT, PP, PE and Polymethylmethacrylate (PMMA) or impact modified PMMA. Particularly preferred is polyester, most preferably PET, as the material for the substrate (F1). Alternatively, the substrate (F1) itself, optionally despite the application thereon of a layer of at least one of the aforementioned polymers, may be made of a different material, such as glass, ceramic, metal, paper and/or fabric. In this case, the substrate (F1) is preferably a board and can be used, for example, in a roll-to-board embossing apparatus.

The thickness of the substrate (F1) is preferably 2 μm to 5 mm. Particularly preferred are layer thicknesses of from 25 to 1000. mu.m, more particularly from 50 to 300. mu.m.

The substrate (F1) is preferably a film, more preferably a film web, very preferably a continuous film web. In this case, the substrate (F1) may preferably be used in a roll-to-roll embossing apparatus. The thickness of the coating layer (B1) is preferably 0.1 to 500. mu.m, more preferably 1 to 300. mu.m.

In the sense of the present invention, the term "continuous film" or "continuous web" preferably refers to a film having a length of 100m to 10 km.

When step (1) is carried out (and preferably also when steps (2) and (3) of the method are carried out), the complex (F1B1) used is preferably mobile and therefore a mobile complex. During the implementation of step (1), the compound (F1B1) is preferably moved by means of a conveying device, such as a conveyor belt. Accordingly, a corresponding apparatus for carrying out step (1) preferably comprises the conveying device. The corresponding apparatus for carrying out step (1) further comprises means for applying a preferably radiation-curable coating composition (B2a) onto at least a part of the surface of the composite (F1B 1).

The desired (mirror image) embossed structure transferred from the composite (F1B1) is transferred onto the coating composition (B2a) by step (1) and, after carrying out step (2), is transferred onto the coating (B2) by applying a preferably radiation curable coating composition (B2a) onto at least a portion of the at least partially embossed surface of the composite (F1B1) consisting of the substrate (F1) and the at least partially embossed and at least partially cured coating (B1). Therefore, the composite (F1B1) was used not only as a support material for (B2a) or (B2), but also as an embossing die.

The composite (F1B1) used as embossing die in step (1) is preferably reusable and can be reused for transferring at least one embossed structure, preferably in the process of the invention. Step (1) preferably transfers the microstructures and/or nanostructures as embossed structures to the coating composition (B2a) and to the coating layer (B2) after step (2) is performed.

The composite (F1B1) preferably comprises a film web (F1) with an at least partially embossed and fully cured coating (B1). Particularly preferably, the substrate (F1) is a continuous film web having an at least partially embossed and at least partially cured coating (B1) making the composite (F1B1) a continuous embossing die.

The compound (F1B1) used as embossing die has a "negative structure" ("negative"), i.e. a mirror image of the embossed structure, which is transferred onto the coating composition (B2a) in step (1) of the process of the invention and onto the coating (B2) after carrying out step (2).

A corresponding apparatus for carrying out step (1) comprises means for applying a preferably radiation-curable coating composition (B2a) onto at least a part of the at least partially embossed surface of a composite (F1B1) consisting of a substrate (F1) and an at least partially embossed and at least partially cured coating (B1). Furthermore, the apparatus used preferably has an apparatus, such as a roller or grid roller mechanism, which comprises at least one roller for applying pressure or pressing the coating composition (B2a) thus applied onto the substrate (F1), preferably in the form of a continuous film web and at least partially coated with (B1), in other words, after application of the radiation-curable coating composition (B2a) onto the respective compound (F1B1), which apparatus is preferably located downstream of the apparatus for applying the radiation-curable coating composition (B2a) (viewed in the direction of transport of the compound (F1B 1)).

As mentioned above, a suitable device for pressing or applying pressure is a roller or a grid roller mechanism comprising at least one roller. Here, the grid roller mechanism preferably comprises a metal roller, for example a steel roller or a nickel roller, or a quartz-based roller or a roller coated with at least one plastic.

The composite (F1B1) used in step (1) and consisting of the substrate (F1) and the at least partially embossed and at least partially cured coating (B1) is hereinafter also referred to as "mother substrate" or "mother film". In the case where the substrate (F1) is a film, the corresponding mother film is referred to as "mother film". In case the substrate (F1) is a film web, the corresponding mother film is referred to as "mother film web". The coating on the master film (B1) is hereinafter also referred to as "at least partially cured master coating" and the coating composition (B1a) used to prepare the cured master coating is referred to as "master coating". Between (F1) and (B1) in the complex (F1B1), preferably no further (coating) layer is present. However, it is also possible for at least one adhesion promoter layer to be present between (F1) and (B1) of the compound (F1B1), in which case this layer is preferably transparent to UV radiation.

The composite (F1B1) used as an embossing die may optionally be pretreated with the coating composition (B2a) used before carrying out step (1). The pretreatment comprises or preferably is the wetting of the embossing die with the coating composition (B2 a).

Step (2)

Step (2) of the inventive process provides for at least partial curing of the applied coating composition (B2a), resulting in a composite (B2B1F1) consisting of a substrate (F1), an at least partially embossed and at least partially cured coating (B1) and an at least partially cured coating (B2). The composite (B2B1F1) is hereinafter also referred to as "transfer substrate". If (F1) is a film, the composite is accordingly a transfer film.

Preferably, the means used in step (1) for applying pressure or pressing the applied coating composition (B2a) onto the compound (F1B1) is in contact with the coating composition (B2a) and/or with the formed coating (B2) during the entire at least partial curing in step (2).

Therefore, steps (1) and (2) are preferably carried out simultaneously. In this case, the curing in step (2) is carried out during the implementation of step (1), preferably in situ, in particular if a radiation-curable coating composition is used as coating composition (B2 a). Alternatively and especially if the coating composition (B2a) used is a thermally and/or chemically curable coating composition, steps (1) and (2) are carried out chronologically after one another.

Accordingly, the corresponding apparatus for carrying out step (2) preferably comprises at least one radiation source for irradiating the coating composition (B2a) with curing radiation. Since the coating composition (B2a) is preferably a UV-curable coating composition, the curing radiation used is preferably UV radiation. If the coating composition (B2a) is not radiation-curable, it is preferably chemically curable. In this case, the curing in step (2) takes place thermally by using, for example, a suitable thermal radiation source. Of course, a combination of curing, i.e. thermal curing and curing by UV radiation, is also possible.

Examples of suitable radiation sources for radiation curing include low, medium and high pressure mercury emitters as well as fluorescent tubes, pulse emitters, metal halide emitters (halogen lamps), lasers, LEDs, furthermore electronic flash devices capable of radiation curing without photoinitiators, or excimer emittersA transmitter. Radiation curing occurs by exposure to high-energy radiation, i.e. UV radiation or sunlight, or by bombardment with high-energy electrons. In the case of UV curing, the radiation dose which is generally sufficient for crosslinking is from 80 to 3000mJ/cm². Of course, it is also possible to carry out the curing using two or more radiation sources, for example 2 to 4. These sources may also each emit in a different wavelength range.

The at least partial curing in step (2) is preferably accomplished by passing radiation through the composite (F1B1) used as the substrate.

Optional step (3)

An optional step (3) in the process of the invention provides for removing the coating (B2) from the composite (B2B1F1) to recover the composite (B1F1) used in step (1), wherein the coating (B2) has, on its surface previously facing the coating (B1) in the composite (B2B1F1), a mirror image of the at least partially embossed surface of the coating (B1) of the composite (B1F1) used in step (1) and recovered in this step.

The coating (B2) is preferably obtained as a free film by peeling the complex (B1F1) off the coating (B2) in the complex (B2B1F1) or vice versa. During this process, the complex (B1F1) recovered.

The coating (B2) in the form of a composite (B2KF2) is preferably obtained in step (3) in 3 steps, by steps (3a), (3B) and (3c), in particular by the following steps:

(3a) applying an adhesive (K) to at least a part of the surface of the composite (B2B1F1) on the side having the coating (B2) to obtain a composite (KB2B1F1),

(3b) applying a substrate (F2) to at least a portion of the surface of the composite (KB2B1F1) obtained after step (3a) provided with the binder (K), or vice versa, so as to obtain a composite (F2KB2B1F1), and

(3c) -stripping the composite (B1F1) from the composite (F2KB2B1F1), thereby obtaining a composite (F2KB2), wherein the coating (B2) of the composite has on its surface at least partially a mirror image of the at least partially embossed surface of the coating (B1) of the composite (B1F 1).

Then, by peeling from the composite (F2KB2) obtained after step (3c), a free film of the coating (B2) can be obtained again.

The adhesive (K) used here is preferably at least one laminating adhesive, for example a polyacrylate or polyacrylate-based adhesive. As the base material (F2), the same materials as already described above for the base material (F1) can be used. Thus, all preferred embodiments for describing the substrate (F1) are similarly valid for the substrate (F2). The substrate (F2) used is preferably a metal substrate, more particularly a component, for example a component having a non-planar geometry. The assembly may be a coated assembly having at least one coating or a plurality of coatings on at least one surface thereof, preferably on the surface to be applied to the composite (KB2B1F 1). As the adhesive (K), an adhesive which is itself a part of the multilayer structure may be used. Examples of such adhesives (K) are corresponding structures which have a polymer layer as an intermediate layer, which in turn has an adhesive layer (KS) on each of its surfaces. The adhesive layer (KS) may be a polyacrylate adhesive or a polyacrylate based adhesive, respectively. In principle, any type of polymer can be used for the preparation of the polymer layer (PS). Examples of such polymers are poly (meth) acrylates, polyesters such as PET and/or PBT, polyvinylidene fluoride, polyvinyl chloride, polyamides and/or polyolefins. In particular, polyesters such as PET may be used. The polymer layer (PS) is a liner. The layer thickness of the polymer layer can be from 5 to 55 μm, preferably from 6 to 50 μm, more preferably from 7 to 40 μm, in particular from 8 to 30 μm. Each adhesive layer (KS) may initially have a release liner, such as a silicone paper, for better handling. However, the release liner is removed prior to use as adhesive (K) in the method of the present invention.

Optional steps (4) to (7) of the process of the invention for preparing the Complex (F1B1)

The composite (B1F1) used in step (1) of the process and consisting of the substrate (F1) and the at least partially embossed and at least partially cured coating (B1) is preferably at least obtainable by steps (4) to (7) described in more detail below. Fig. 1 provides an exemplary illustration of steps (4) to (7) of the method of the present invention, as will be understood from the description of the figure below.

Step (4)

Step (4) of the inventive process provides for applying the radiation curable coating composition (B1a) to at least a portion of the surface of the substrate (F1). The substrate (F1) constitutes the support for the coating composition (B1a) or the coating (B1) applied thereto. The substrate (F1) may be coated. The substrate (F1) is preferably a film, more preferably a film web, very preferably a continuous film web. A preferred material for the substrate (F1) is polyester, more particularly PET. The thickness of the substrate (F1) is preferably 2 μm to 5 mm. Particularly preferred are layer thicknesses of from 25 to 1000. mu.m, more particularly from 50 to 300. mu.m.

During the implementation of step (4) (and preferably also during the implementation of steps (5), (6) and (7) of the process), the substrate (F1) is preferably moving, and therefore a moving substrate. During the execution of step (4), the substrate is preferably moved by means of a conveying device, such as a conveyor belt (F1). Accordingly, the corresponding apparatus for carrying out step (4) preferably comprises such a conveying device. The corresponding apparatus for carrying out step (4) further comprises means for applying the preferably radiation-curable coating composition (B1a) onto at least a part of the surface of the substrate (F1).

Step (5)

Step (5) of the process of the invention provides for at least partially embossing the coating composition (B1a) applied at least partially to the surface of the substrate (F1) by means of at least one embossing tool (P1) having at least one embossing die (P1). The at least partial embossing at least partially transfers the embossed structure to a surface of a coating composition (B1a) applied to a substrate (F1). The term "embossing" has been defined above. Thus, as far as (B1a) or (B1) is concerned, it relates to at least partially finishing with an embossed structure a coating composition (B1a) as part of a composite (F1B1 a). In this case, at least certain regions of the coating composition (B1a) are decorated with an embossed structure. Preferably, as part of the composite (F1B1a), the entire surface of the coating composition (B1a) is decorated with an embossed structure. During the execution of step (5), the embossing tool (P1) is preferably pressed or at least partially pressed onto the applied coating composition (B1 a).

Step (5) preferably transfers the microstructures and/or nanostructures as embossed structures onto the coating composition (B1 a).

Accordingly, a corresponding apparatus for carrying out step (5) comprises an apparatus for at least partially embossing a coating composition (B1a) by means of at least one embossing tool (P1), said coating composition being at least partially applied onto the surface of the substrate (F1). The apparatus used preferably further comprises, after application of the radiation-curable coating composition (B1a) to (F1), a device for pressing (P1) onto the substrate (F1), preferably used in the form of a continuous film web, which is preferably located downstream of the device for applying the radiation-curable coating composition (B1a), viewed in the transport direction of the substrate (F1).

At least partial embossing according to step (5) of the method according to the invention is carried out by means of an embossing tool (P1). (P1) may preferably be an embossing calender, which preferably comprises a grid application mechanism, more preferably a grid roller mechanism. The calender has counter-rotating or co-rotating rolls, preferably arranged one above the other at intervals in the height direction, and the composite (F1B1a) to be provided with an embossed structure is supplied to the rolls and guided through the nip formed, wherein the nip width is variably adjustable. Here, the grid roller mechanism preferably comprises a first roller, for example a metal roller, for example a steel roller or a nickel roller, a roller made of nickel mixed with a small amount of phosphorus, or a quartz-based roller or a roller coated with at least one plastic, and a second roller. Here, the first roller (embossing roller) serves as an embossing tool (P1) and comprises a positive type of embossed structure, which is to be embossed into the surface of the composite (F1B1a) and then represents a corresponding negative type structure. This in turn corresponds to the positive structure to be transferred onto the coating composition (B2a) in step (1) of the method. The embossing tool (P1) itself may have a structured coating such as a UV coating to act as an embossing die. The second roll is used as a press roll or a pressure roll. -generating a negative version of the structure to be embossed on an embossing tool (P1) according to methods conventional and known to the person skilled in the art; depending on the structure and materials, particular methods may be particularly advantageous. According to the invention, this is preferably achieved by means of an embossing roller serving as embossing tool (P1) and comprising an embossing die (P1). The compound to be embossed (F1B1a) in the form of a film web, for example at least partially coated with (B1a), is moved in the opposite direction by means of a press roll. Embossing according to step (5) is performed at a nip location formed by counter-rotating rollers arranged at a distance from each other. Here, a first roller with an embossing die (p1) is used for embossing the composite (F1B1a) guided by a second roller opposite the embossing roller, wherein the second roller presses the composite (F1B1a) to be provided with an embossed structure against the first embossing roller. If desired, step (5) may be carried out at elevated temperature, for example at 30-100 ℃ or up to 80 ℃. In this case, the composite (F1B1a) used for embossing is first passed through a heated roller mechanism, optionally followed by irradiation with infrared light, and then subjected to the actual embossing procedure described above. After embossing, the now embossed composite (F1B1a) is optionally passed through a chill roll mechanism to cool. Alternatively, step (5) may be carried out under cooling: in this case, the composite (F1B1a) used for embossing is first passed through a chill roll mechanism, and then the actual embossing process described above is performed. The embossing tool (P1) used may also be a conventional press cylinder carrying the negative of the embossing structure to be embossed into the surface of the composite (F1B1 a). The cartridge may be pressed onto the compound (F1B1a) to at least partially emboss.

The at least one embossing die (P1) of the embossing tool (P1) for at least partial embossing according to step (5) has a "positive structure" ("positive"), i.e. it has the embossed structure shown by the coating (B2) obtained after carrying out step (3) of the method of the invention. The embossing tool (P1) is preferably a metal embossing tool, more preferably made of nickel. Thus, the embossing die (p1) is preferably metallic, more preferably made of nickel, more particularly nickel containing a small amount of phosphorus. Furthermore, rolls coated with at least one plastic may be used. Alternatively, however, a soft material such as Polydimethylsiloxane (PDMS) may also be used to produce (p 1). After step (5) is carried out, the coating composition (B1a) applied on (F1) exhibits a negative of the embossed structure to be transferred, such as a micro-structure and/or a nano-structure.

The embossing die of the embossing tool used may optionally be pretreated with the coating composition (B1a) used before carrying out step (5). The pretreatment comprises or preferably is the wetting of the embossing die with the coating composition (B1 a).

Step (6)

Step (6) of the process of the invention provides for at least partial curing of the at least partially embossed coating composition (B1a) applied to at least a portion of the surface of the substrate (F1), so as to obtain a composite (F1B1) consisting of the substrate (F1) and the at least partially embossed and at least partially cured coating (B1); throughout curing, the coating composition (B1a) was in contact with at least one embossing die (P1) of at least one embossing tool (P1).

Steps (5) and (6) are preferably carried out simultaneously. In this case, the curing of step (6) is preferably carried out in situ during the implementation of step (5).

Accordingly, the respective apparatus for carrying out step (6) preferably comprises at least one radiation source for irradiating the radiation-curable coating composition (B1a) with curing radiation, preferably UV radiation.

Examples of suitable radiation sources for radiation curing include low, medium and high pressure mercury emitters as well as fluorescent tubes, pulse emitters, metal halide emitters (halogen lamps), lasers, LEDs, furthermore, electron flash devices capable of radiation curing without photoinitiators, or excimer emitters. Radiation curing occurs by exposure to high-energy radiation, i.e. UV radiation or sunlight, or by bombardment with high-energy electrons. In the case of UV curing, the radiation dose which is generally sufficient for crosslinking is from 80 to 3000mJ/cm². Of course, curing can also be carried out using two or more radiation sources, for example 2 to 4. These sources may also each emit in a different wavelength range.

The curing in step (6) is preferably carried out by radiation (F1) through the substrate. In this case, it is advantageous for the transmittance of the substrate (F1) for the radiation used to be coordinated with the at least one photoinitiator used. Thus, for example, the material PET (F1) as substrate, and therefore PET film, is transparent to radiation having a wavelength of less than 300 nm. Photoinitiators that generate free radicals from this radiation include, for example, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, ethyl 2,4, 6-trimethylbenzoylphenylphosphonate, and bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide.

Step (7)

Step (7) of the process of the invention provides for removing the composite (F1B1) from the embossing tool (P1), thereby producing the desired product, i.e. a composite (F1B1) consisting of the substrate (F1) and the at least partially embossed and at least partially cured coating (B1).

Fig. 1 schematically shows a side view of an apparatus which can be used for carrying out steps (4) to (7) of the inventive method for producing a composite (F1B1), i.e. for producing a master film, and which serves to exemplarily show the inventive method in connection with steps (4) to (7). With this apparatus, structures such as microstructures and/or nanostructures can be transferred onto a substrate (F1) coated with (B1a) with the aid of an embossing tool (P1), and after curing, a composite (F1B1) is produced, which can be used as a master film-referred to in fig. 1 as a master film web (8).

The master film transfer device (30) shown in fig. 1 operates according to the transfer principle, wherein the desired negative-type structure is embossed directly from a structured press cylinder or roller, here a master film press cylinder (17), into the not yet cured coating applied to the master film web (8B) corresponding to the compound (F1B1a), which is then at least partially cured together with the structure applied thereto, wherein the curing is carried out in situ by means of an illumination unit (3) to obtain the master film web (8) corresponding to the compound (F1B 1). In the method, a film web (8a) serving as a substrate (F1) is drawn from a film web roll (18) containing only the carrier material, in other words, the pure film without the application of a master coat, and is guided through various turning roll systems and web tensioning systems and introduced into the embossing area (1) of the apparatus. There, the film web (8a) runs into the region between the press roll (4) and the master press cylinder (17) and outside the press region, in a coating application apparatus (27), a not yet cured master coating (corresponding to coating composition B1a) is provided. The application of this coating corresponds to step (4) of the process of the invention. In an embossing region (1) in which a mother film web (8b) having a not yet cured mother coating runs along a part of the outer surface of a mother impression cylinder (17), microstructures and/or nanostructures embossed into the outer surface of the mother impression cylinder (17) are introduced as a negative image into the mother coating of the mother film web (8b) and transferred. This corresponds to step (5) of the method of the invention. The parent web (8B) comprising the uncured coating composition (B1a) is then cured according to step (6) of the method of the present invention. Here, the curing is at least partly carried out in situ by irradiation with an illumination unit (3), by means of UV radiation, for example by means of a unit consisting of UV-LEDs. Subsequently, according to step (7) of the process of the invention, the resulting mother film (8), in other words the composite (F1B1), is removed from the outer surface of the mother-pressing cylinder (17) and the thus completed mother film web (8) is wound onto a film web roll (19). The film web roll (19) then comprises a finished master film web (8) having a master coating applied thereto and having a negative image of the microstructures and/or nanostructures embossed therein. The web roll (19) can be removed and then used in an apparatus for carrying out steps (1) to (3) of the method of the invention.

Coating compositions (B1a) and (B2a) used in the present invention

Coating composition (B1a)

The coating composition (B1a) is a radiation-curable coating composition. Herein, the terms "radiation curable" and "radiation curing" are interchangeable. The term "radiation curing" preferably means free-radical polymerization of polymerizable compounds by means of electromagnetic and/or particle radiation, examples being (N) at λ ═>(N) IR light in the wavelength range 400-²Preferably 80 to 3000mJ/cm². Radiation curing using UV radiation is particularly preferred. The coating composition (B1a) can be cured by using a suitable radiation source. Therefore, (B1a) is preferably a UV radiation-curable coating composition.

The coating composition (B1a) comprises:

from 40 to 95% by weight, preferably from 45 or > 45% by weight to 90% by weight, more preferably from 50 or > 50% by weight, for example from 55 to 85% by weight, very preferably from 55 or 60 to 80% by weight, of the at least one component (a),

as component (b) in an amount of from 0.01 to 5% by weight, preferably from 0.05 to 4.5% by weight, more preferably from 0.1 to 4% by weight, very preferably from 0.2 or from 0.5 to 3% by weight,

as component (c) at least one photoinitiator in an amount of from 0.01 to 15% by weight, preferably from 0.1 to 12% by weight, more preferably from 0.5 to 10% by weight,

in an amount of from 0 to 45% by weight, preferably from 0 to 40% by weight, more preferably from 0 to 35% by weight, very preferably from 0 to 30% by weight, of at least one component (d) having at least one carbon double bond,

in each case based on the total weight of the coating composition (B1 a).

Thus, the presence of component (d) in the coating composition (B1a) used according to the invention is only optional, as can be seen from the lower limit of 0% by weight indicated above. Preferably, the coating composition (B1a) comprises component (d) in an amount of up to 30 wt. -%, based on the total weight of the coating composition (B1 a).

The components (a), (b), (c) and (d) are each different from one another. The stated amounts of components (a), (B), (c) and (d) are in each case based on the total weight of the coating composition (B1 a). The amounts of all components present in the coating composition (B1a), i.e. the amounts of components (a), (B) and (c) and optionally (d) and optionally further components present in (B1a) add up to 100% by weight.

Component (a) has at least 3 structural units of the formula (I), in each case different from one another or at least partially identical:

wherein:

radical R¹In each case independently of one another is C₂-C₈An alkylene group or a substituted alkylene group,

radical R²In each case independently of one another, H or methyl, and

the parameters m are each, independently of one another, an integer parameter from 1 to 15, preferably from 1 to 10, more preferably from 1 to 8 or from 2 to 8, very preferably from 1 to 6 or from 2 to 6, more particularly from 1 to 4 or from 2 to 4, with the proviso that in at least one structural unit of the formula (I), the parameter m is at least 2, preferably at least 3.

Component (a) preferably has at least 3 identical structural units of the formula (I).

Here, the symbols

Denotes the bond of the respective radical to the upper structure of component (a), in other words, for example, denotes the radical- [ O-R ] in the structural unit of the formula (I)¹]_m-O-C(＝O)-C(R²)＝CH₂A bond to the upper structure of component (a). The bonding is preferably via the group- [ O-R ]¹]_m-oxygen atom is bonded to a carbon atom of the upper group. Similar remarks apply to the other structural units of formula (I). It is clear that all at least 3 structural units of formula (I) are combined in a single component, component (a).

Component (a) preferably has exactly 3 structural units of the formula (I). In this case, component (a) has exactly 3 functional (meth) acrylic groups. Alternatively, the structural units of the formula (I) may also each be present more than 3 times as part of component (a). In this case, for example, component (a) may have more than 3 (meth) acrylic functional groups, for example 4, 5 or 6 (meth) acrylic groups.

The above-mentioned radical R¹Each independently of the other is C₂-C₈Alkylene, preferably C₂-C₆Alkylene, more preferably C₂-C₄Alkylene, very preferably each independently of the other, is ethylene and/or propylene, particularly preferably ethylene. In particular, all radicals R¹Is an ethylene group. In each case, suitable as propylene radicals are those having the structure-CH₂-CH₂-CH₂Or the structure-CH (CH)₃)-CH₂Or the structure-CH₂-CH(CH₃) Group R of (A)¹. However, particular preference is given in each case to the propylene structure-CH₂-CH₂-CH₂-。

The parameter m is in each case, independently of one another, an integer from 1 to 15, since the component (a) has at least 3 structural units of the formula (I) and since the parameter m is at least 2 in at least one structural unit of the formula (I), the component (a) comprises a total of at least 4 structural units of the general formula "-O-R¹- "an ether group.

Preferably, component (a) has at least 5 in totalMore preferably at least 6 of the formula "-O-R¹- "an ether group. The general formula-O-R in component (a)¹The number of ether groups of the- "is preferably from 4 to 18, more preferably from 5 to 15, very preferably from 6 to 12.

An ether segment- [ O-R ] present in the structural unit of the formula (I) of component (a)¹]_mThe fraction(s) of (a) is preferably at least 35% by weight, more preferably at least 38% by weight, very preferably at least 40% by weight, still more preferably at least 42% by weight, more particularly at least 45% by weight, in total, based in each case on the total weight of component (a).

The molecular weight (Mn) of component (a) is preferably 300-2000g/mol, more preferably 350-1500g/mol, more particularly 400-1000 g/mol.

Particularly preferred for use as component (a) is at least one compound of the general formulae (IVa) and/or (IVb):

wherein in each case independently of one another,

R¹and R²And m has the definition given above for the structural unit (I), including the preferred embodiments thereof described above, and

R³is H, C₁-C₈Alkyl, OH or O-C_1-8Alkyl, more preferably C₁-C₄Alkyl, OH or O-C_1-4Alkyl, very preferably C₁-C₄Alkyl or OH, or

R3 is a group- [ O-R ]¹]_m-O-C(＝O)-C(R²)＝CH₂Wherein R is¹、R²And m has the definitions described above for structural unit (I), including preferred embodiments thereof described above.

Very particular preference is given to using at least one compound of the formula (IVa) as component (a), in which:

radical R¹Each independently of the other is C₂-C₈An alkylene group or a substituted alkylene group,

radical R²Each independently of the other being H or methyl,

the parameter m is in each case, independently of one another, an integer parameter from 1 to 15, preferably from 1 to 10, more preferably from 1 to 8 or from 2 to 8, very preferably from 1 to 6 or from 2 to 6, more particularly from 1 to 4 or from 2 to 4, with the proviso that in at least one, preferably in all, structural units of the formula (I), the parameter m is at least 2,

R³is C₁-C₈Alkyl, OH or O-C_1-8Alkyl, more preferably C₁-C₄Alkyl, OH or O-C_1-4Alkyl, very preferably C₁-C₄Alkyl or OH.

Particularly preferred for use as component (a) are (meth) acrylates of neopentyl glycol, trimethylolpropane, trimethylolethane or pentaerythritol, wherein neopentyl glycol, trimethylolpropane, trimethylolethane or pentaerythritol is alkoxylated in total 4 to 20 times, or 4 to 12 times, for example ethoxylated, propoxylated or mixed ethoxylated and propoxylated, more particularly only ethoxylated. Most preferred are the corresponding (meth) acrylates derived from the corresponding alkoxylated trimethylolpropane. These kinds of products are commercially available and are for example known by name

SR 499 andSR502 and

SR 415 and

SR 9035 and

SR 501. In the sense of the present invention, the term "(meth) acrylic" or "(meth) acrylate" encompasses not only methacrylic but also acrylic and encompasses not only methacrylate but also acrylate.

In addition to optional component (d), the coating composition (B1a) preferably contains no components having only exactly one or only exactly two ethylenically unsaturated groups, such as (meth) acrylic groups. Thus, when (B1a) has no component (d), (B1a) preferably contains no component having only exactly one or only exactly two ethylenically unsaturated groups, such as (meth) acrylic groups.

Component (b) is an additive. The concept of additives is known to the person skilled in the art, for example from

Lexikon, "Lacke und Druckfarben", Thieme Verlag, 1998, page 13 is known. The preferred component (b) used is at least one rheological additive. The term is also known to the person skilled in the art, for example byLexikon, "Lacke und Druckfarben", Thieme Verlag, 1998, page 497. Herein, the terms "rheological additive", "rheology additive" and "rheology aid" are interchangeable. The additives used as component (b) are preferably selected from flow regulators, surface-active agents such as surfactants, wetting agents and dispersants, and also thickeners, thixotropic agents, plasticizers, lubricating and antiblocking additives, and mixtures thereof. These terms are likewise known to the person skilled in the art, for example fromLexikon, "Lacke und Druckfarben", Thieme Verlag, 1998. Flow control agents are components that aid the coating composition in forming a uniform flowing film by reducing viscosity and/or surface tension. Wetting agents and dispersants are components that lower surface tension or generally lower interfacial tension. Lubricity and antiblock additives are components that reduce mutual sticking (blocking).

Examples of commercially available additives are products

SL 3259、377、Rad 2500、Rad 2800、394、Byk-SILCLEAN 3710、A250, Novec FC 4430 and Novec FC 4432.

Preferably used as additive (B) are at least one poly (meth) acrylate and/or at least one siloxane, such as at least one oligosiloxane and/or polysiloxane and/or at least one fluoropolymer, such as a fluorine-containing, preferably aliphatic, polyester. Particularly preferred components (b) are siloxanes. Particularly preferably used are silicone (meth) acrylates.

For curing by means of (N) IR and/or UV light, the coating composition (B1a) comprises at least one photoinitiator as component (c). The photoinitiator is decomposable into free radicals by light of an irradiation wavelength, which in turn can initiate free radical polymerization. In contrast, in the case of curing with electron radiation, the presence of such a photoinitiator is not required. The coating composition (B1a) preferably comprises, as component (c), at least one photoinitiator which is decomposable by light of an irradiation wavelength into free radicals which in turn are capable of initiating free radical polymerization.

Photoinitiators, such as UV photoinitiators, are known to the person skilled in the art. Examples of those envisaged include phosphine oxides, benzophenones, alpha-hydroxyalkylarylketones, thioxanthones, anthraquinones, acetophenone ketones, benzoins and benzoin ethers, ketals, imidazoles or phenylglyoxylic acids and mixtures thereof.

Phosphine oxides are, for example, monoacyl-or bisacylphosphine oxides, such as 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, ethyl 2,4, 6-trimethylbenzoylphenylphosphinate or bis- (2, 6-dimethoxybenzoyl) -2,4, 4-trimethylpentylphosphine oxide. Benzophenones, for example, benzophenone, 4-aminobenzophenone, 4' -bis (dimethylamino) benzophenone, 4-phenylbenzophenone, 4-chlorobenzophenone, Michler's ketone, o-methoxybenzophenone, 2,4, 6-trimethylbenzophenone, 4-methylbenzophenone, 2, 4-dimethylbenzophenone, 4-isopropyl benzophenone, 2-chlorobenzophenone, 2' -dichlorobenzophenone, 4-methoxybenzophenone, 4-propoxy benzophenone or 4-butoxy benzophenone; alpha-hydroxyalkylarylketones are, for example, 1-benzoylcyclohex-1-ol (1-hydroxycyclohexylphenylketone), 2-hydroxy-2, 2-dimethylacetophenone (2-hydroxy-2-methyl-1-phenylpropan-1-one), 1-hydroxyacetophenone, 1- [4- (2-hydroxyethoxy) phenyl ] -2-hydroxy-2-methyl-1-propan-1-one or polymers containing 2-hydroxy-2-methyl-1- (4-isopropen-2-ylphenyl) -propan-1-one in copolymerized form. Xanthones and thioxanthones are, for example, 10-thioxanthone, thioxanth-9-one, xanthen-9-one, 2, 4-dimethylthioxanthone, 2, 4-diethylthioxanthone, 2, 4-diisopropylthioxanthone, 2, 4-dichlorothioxanthone or chloroxanthone; the anthraquinones include, for example, β -methylanthraquinone, tert-butylanthraquinone, anthraquinone carboxylate, benzo [ de ] anthracen-7-one, benzo [ a ] -anthracen-7, 12-dione, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone or 2-amylanthraquinone. Acetophenone, acetyl naphthoquinone, pentanone, hexanone, alpha-phenylbenzone, p-morpholinopropiophenone, dibenzosuberone, 4-morpholinobenzophenone, p-diacetylbenzene, 4' -methoxyacetophenone, alpha-tetralone, 9-acetylphenanthrene, 2-acetylphenanthrene, 3-acetylindole, 9-fluorenone, 1-indanone, 1,3, 4-triacetylbenzene, 1-naphthalenone, 2-dimethoxy-2-phenylacetophenone, 2-diethoxy-2-phenylacetophenone, 1-dichloroacetophenone, 1-hydroxyacetophenone, 2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinoacetophenone Propan-1-one, 2-dimethoxy-1, 2-diphenylethan-2-one or 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one. Benzoins and benzoin ethers are for example 4-morpholinodeoxybenzoin, benzoin isobutyl ether, benzoin tetrahydropyranyl ether, benzoin methyl ether, benzoin ethyl ether, benzoin butyl ether, benzoin isopropyl ether or 7H-benzoin methyl ether. Ketals are, for example, acetophenone dimethyl ketal, 2-diethoxyacetophenone or benzil ketals, for example benzil dimethyl ketal. Photoinitiators which can also be used are, for example, benzaldehyde, methyl ethyl ketone, 1-naphthaldehyde, triphenylphosphine, tri-o-tolylphosphine or 2, 3-butanedione. Typical mixtures include, for example, 2-hydroxy-2-methyl-1-phenylpropan-2-one and 1-hydroxycyclohexylphenyl ketone, bis (2, 6-dimethoxybenzoyl) -2,4, 4-trimethylpentylphosphine oxide and 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzophenone and 1-hydroxycyclohexylphenyl ketone, bis (2, 6-dimethoxybenzoyl) -2,4, 4-trimethylpentylphosphine oxide and 1-hydroxycyclohexylphenyl ketone, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide and 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2,4, 6-trimethylbenzophenone and 4-methylbenzophenone, or 2,4, 6-trimethylbenzophenone and 4-methylbenzophenone and 2,4, 6-trimethylbenzoyldiphenylphosphine oxide.

Preferred among these photoinitiators are 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, ethyl 2,4, 6-trimethylbenzoylphenylphosphonate, bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide, benzophenone, 1-benzoylcyclohex-1-ol, 2-hydroxy-2, 2-dimethylacetophenone and 2, 2-dimethoxy-2-phenylacetophenone. Therefore, it is preferred to use at least one such photoinitiator as component (c). Component (c) is different from components (a), (b) and (d). Commercially available photoinitiators are, for example, the products

184、500、

TPO、

TPO-L and

TPO and1173, obtained from BASF SE.

As mentioned above, the use of at least one component (d) is only optional. Component (d) has at least one, preferably terminal, carbon double bond. This is preferably a (meth) acrylic group. Component (d) preferably has 1 or 2 ethylenically unsaturated groups, for example 1 or 2 or 3 or more (meth) acrylic groups. Two or more different components (d) may also be used.

Examples of component (d) are mono-, di-and/or tri-functional (meth) acrylates, such as ethylene glycol di (meth) acrylate, 1, 2-propanediol di (meth) acrylate, 1, 3-propanediol di (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 3-butanediol di (meth) acrylate, 1, 5-pentanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, 1, 8-octanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,1-, 1,2-, 1, 3-and 1, 4-cyclohexanedimethanol di (meth) acrylate, 1,2-, 1, 3-or 1, 4-cyclohexanediol di (meth) acrylate, tricyclodecanedimethanol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, ditrimethylolpropane penta-or hexa (meth) acrylate, pentaerythritol tri-or tetra (meth) acrylate, glyceryl di-or tri (meth) acrylate, and di-and poly (meth) acrylates of sugar alcohols such as sorbitol, mannitol, diglycerol, threitol, erythritol, adonitol (ribitol), arabitol (lyxitol), xylitol, dulcitol (galactitol), maltitol or isomalt, 2-phenoxyethyl (meth) acrylate, ethyl diglycol (meth) acrylate, 4-tert-butylcyclohexyl (meth) acrylate, trimethylolpropane formal mono (meth) acrylate, isobornyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate and lauryl, stearyl, isodecyl, octyl and decyl (meth) acrylate, esters of α, β -ethylenically unsaturated carboxylic acids, preferably (meth) acrylic acid, with alcohols having 1 to 20 carbon atoms, preferably hydroxy-substituted alkanols optionally having 1 to 20 carbon atoms, for example methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate or 4-hydroxybutyl (meth) acrylate.

Particularly preferred components (d) are 1, 4-butanediol di (meth) acrylate and 1, 6-hexanediol di (meth) acrylate and tricyclodecane dimethanol di (meth) acrylate.

As component (d), additionally or alternatively, at least one polyester, polyether, carbonate, epoxide, poly (meth) acrylate and/or polyurethane (meth) acrylate and/or unsaturated polyester resin can also be used.

Polyurethane (meth) acrylates can be obtained, for example, by reacting polyisocyanates with hydroxyalkyl (meth) acrylates and optionally chain extenders such as diols, polyols, diamines, polyamines or dithiols or polythiols. Polyurethane (meth) acrylates which can be dispersed in water without the addition of emulsifiers additionally contain ionic and/or nonionic hydrophilic groups which are incorporated into the urethane by synthetic components such as hydroxycarboxylic acids. The polyurethane (meth) acrylate essentially comprises as synthesis components:

(a) at least one organic aliphatic, aromatic or cycloaliphatic di-or polyisocyanate, for example at least one polyisocyanate as described above for the two-component coating,

(b) at least one compound having at least one isocyanate-reactive group (preferably one of the hydroxyl-bearing monomers described above for the polyacrylate polyol) and at least one free-radically polymerizable unsaturated group, and

(c) optionally, at least one compound having at least two isocyanate-reactive groups, such as one of the polyols described above for the polyesterol.

The number-average molecular weight Mn of the polyurethane (meth) acrylates is preferably 200-20000g/mol, more particularly 500-10000g/mol, very preferably 600-3000g/mol (determined by gel permeation chromatography using tetrahydrofuran and polystyrene standards). The urethane (meth) acrylate preferably contains 1 to 5mol, more preferably 2 to 4mol of (meth) acrylic group per 1000g of urethane (meth) acrylate.

Epoxidized (meth) acrylates can be obtained by reacting epoxides with (meth) acrylic acid. Examples of epoxides envisaged include epoxidized olefins, aromatic glycidyl ethers or aliphatic glycidyl ethers, preferably those of aromatic or aliphatic glycidyl ethers. Examples of possible epoxidized olefins include ethylene oxide, propylene oxide, isobutylene oxide, 1-butylene oxide, 2-butylene oxide, vinyl ethylene oxide, styrene oxide or epichlorohydrin; preference is given to ethylene oxide, propylene oxide, isobutylene oxide, vinyloxirane, styrene oxide or epichlorohydrin, particular preference to ethylene oxide, propylene oxide or epichlorohydrin, particular preference to ethylene oxide and epichlorohydrin. Aromatic glycidyl ethers are, for example, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol B diglycidyl ether, bisphenol S diglycidyl ether, hydroquinone diglycidyl ether, the alkylation products of phenol/dicyclopentadiene, such as 2, 5-bis [ (2, 3-epoxypropoxy) phenyl ] octahydro-4, 7-methylene-5H-indene, tris [4- (2, 3-epoxypropoxy) phenyl ] methane isomer, phenol-based epoxy novolaks and cresol-based epoxy novolaks. Aliphatic glycidyl ethers are, for example, 1, 4-butanediol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, 1,2, 2-tetrakis [4- (2, 3-epoxypropoxy) phenyl ] ethane, the diglycidyl ether of polypropylene glycol (. alpha.,. omega. -bis (2, 3-epoxypropoxy) polyoxypropylene and the diglycidyl ether of hydrogenated bisphenol A (2, 2-bis [4- (2, 3-epoxypropoxy) cyclohexyl ] propane). the epoxidized (meth) acrylate preferably has a number-average molecular weight Mn of 200-, more preferably 2-4mol (as determined by gel permeation chromatography using polystyrene as standard and tetrahydrofuran as eluent).

The (meth) acrylated poly (meth) acrylates are the corresponding esters of α, β -ethylenically unsaturated carboxylic acids, preferably (meth) acrylic acid, more preferably acrylic acid, and polyacrylate polyols, which are obtainable by esterifying poly (meth) acrylate polyols with (meth) acrylic acid. The polyacrylate polyols can be, for example, those described above for two-component coatings.

The carbonate (meth) acrylate may have various functional groups. The number-average molecular weight Mn of the carbonate (meth) acrylates is preferably less than 3000g/mol, more preferably less than 1500g/mol, very preferably less than 800g/mol (determined by gel permeation chromatography using polystyrene as standard and tetrahydrofuran solvent). Carbonate (meth) acrylates can be obtained in a simple manner by transesterification of carbonates with polyhydric alcohols, preferably dihydric alcohols (diols, for example hexanediol) and subsequent esterification of the free OH groups with (meth) acrylic acid or transesterification with (meth) acrylates, as described, for example, in EP0092269A 1. They can also be obtained by reaction of phosgene, urea derivatives and polyols, for example diols. Also conceivable are (meth) acrylates of polycarbonate polyols, for example the reaction products of one of the diols or polyols with carbonates and also hydroxyl-containing (meth) acrylates. Examples of suitable carbonates are ethylene carbonate, 1, 2-or 1, 3-propylene carbonate, dimethyl carbonate, diethyl carbonate or dibutyl carbonate. Examples of suitable hydroxyl-containing (meth) acrylates are 2-hydroxyethyl (meth) acrylate, 2-or 3-hydroxypropyl (meth) acrylate, 1, 4-butanediol mono (meth) acrylate, neopentyl glycol mono (meth) acrylate, glyceryl mono-and di (meth) acrylates, trimethylolpropane mono-and di (meth) acrylates and pentaerythritol mono-, di-and tri (meth) acrylates. Preferably, the carbonate (meth) acrylate is an aliphatic carbonate (meth) acrylate.

The unsaturated polyester resin is preferably composed of the following components:

(a1) the maleic acid or a derivative thereof, or a salt thereof,

(a2) at least one cyclic dicarboxylic acid or a derivative thereof,

(a3) at least one aliphatic or cycloaliphatic diol.

Here, the derivatives preferably mean:

-the related anhydride in monomeric or polymeric form,

mono-or dialkyl esters, preferably mono-or di-C₁-C₄Alkyl esters, more preferably monomethyl or dimethyl esters or the corresponding monoethyl or diethyl esters,

furthermore, monovinyl and divinyl esters, and

mixed esters, preferably with different C₁-C₄Mixed esters of alkyl components, more preferably mixed methylethyl esters.

If (B1a) comprises component (d), this component is preferably at least one polyurethane (meth) acrylate.

The coating composition (B1a) may comprise at least one further component (e) which is different from components (a) to (d), for example fillers, pigments, heat-activatable initiators such as potassium peroxodisulfate, dibenzoyl peroxide, cyclohexanone peroxide, di-tert-butyl peroxide, azobisisobutyronitrile, cyclohexylsulfonylacetyl peroxide, diisopropyl percarbonate, tert-butyl peroctoate or benzopinacol, cumene hydroperoxide, dicumyl peroxide, tert-butyl perbenzoate, silylated pinacol, amine N-oxides containing hydroxyl groups such as 2,2,6, 6-tetramethylpiperidine-N-oxyl and 4-hydroxy-2, 2,6, 6-tetramethylpiperidine-N-oxyl, and organic solvents and stabilizers. However, it is preferable that the organic solvent is not included in (B1 a). Component (e) may be present in (B1a) in an amount of from 0 to 15% by weight, preferably from 0 to 12% by weight, more preferably from 0 to 10% by weight, in each case based on the total weight of the coating composition (B1 a).

The solids content of the coating composition (B1a) is preferably 80% by weight or more, more preferably 90% by weight or more, very preferably 95% by weight or more, more particularly 98% by weight or 99% by weight or more, most preferably 100% by weight, based in each case on the total weight of the coating composition (B1 a). Here, the solid content was measured by the following method.

The coating composition (B1a) is preferably free of mercaptans, in particular free of trimethylolpropane tris (3-mercaptopropionate).

The conversion of double bonds of the at least partially cured coating (B1) obtained from (B1a) is preferably at least 70%, more preferably at least 75%, still more preferably at least 80%, very preferably at least 85%, more particularly at least 90%.

Coating composition (B2a)

Any kind of coating composition may be used as the coating composition (B2a) in step (1) of the process of the present invention. The coating composition (B2a) may be a physically drying, thermally curable, chemically curable and/or radiation curable coating composition (B2 a). Preferably, the coating composition (B2a) is a chemically curable, thermally curable and/or radiation curable coating composition, more preferably a radiation curable coating composition. Thus, the at least partial curing of step (3) is preferably carried out by radiation curing. The coating composition (B2a) may be the same as the coating composition (B1 a). However, it is preferable that (B2a) is different from (B1 a). (B2a) is preferably composed of identical but different components (a) to (e) which are also used for the preparation of (B1a), although the quantitative restrictions with respect to (B1a) do not necessarily apply to (B2 a).

Here, physical drying preferably means simply evaporating the solvent to form a coating layer (B2). Here, thermal curing preferably requires a curing mechanism attributable to a temperature (>23 ℃) higher than room temperature. This may for example be the formation of free radicals or ions, preferably free radicals from initiators which decompose at elevated temperatures and thus initiate free radical or ionic polymerization. Examples of such heat-activatable initiators are those having a half-life of less than 100 hours at 80 ℃. Chemical curing preferably means a reaction of at least two different and mutually complementary reactive functional groups, for example a polycondensation reaction, for example a reaction of-OH groups with-COOH groups, or an polyaddition reaction (reaction of NCO groups with-OH or amino groups).

If the coating composition (B2a) is a physically drying, thermally and/or chemically curable coating composition, it is prepared using at least one conventional polymer known to the person skilled in the art as binder. In this case, the binder preferably has a crosslinkable functional group. Any conventional crosslinkable functional group known to those skilled in the art is suitable for use in the present invention. More particularly, the crosslinkable functional group is selected from the group consisting of a hydroxyl group, an amino group, a carboxylic acid group, an isocyanate group, a polyisocyanate group and an epoxy group. The polymers are preferably curable or crosslinkable exothermically or endothermically, preferably in the temperature range from-20 ℃ to 250 ℃ or 18-200 ℃. Particularly suitable as polymers are at least one polymer selected from the group consisting of polyurethanes, polyethers, polyesters, polyamides, polyureas, polyvinyl chlorides, polystyrenes, polycarbonates, poly (meth) acrylates, epoxy resins, phenolic resins, melamine-formaldehyde resins. In particular, these polymers may be OH-functional. In this case, they may be covered by the general term "polyols". The polyol may for example be a polyacrylate polyol, a polyester polyol, a polyether polyol, a polyurethane polyol, a polyurea polyol, a polyester-polyacrylate polyol, a polyester-polyurethane polyol, a polyurethane-polyacrylate polyol, a polyurethane modified alkyd, a fatty acid modified polyester-polyurethane polyol, and mixtures of said polyols. Preference is given to polyacrylate polyols, polyester polyols and polyether polyols.

Here, use may be made of at least one polymer which cures in the presence of isocyanate and/or oligoisocyanate groups, very preferably of at least one corresponding polyurethane and/or at least one corresponding polyurea (for example, the so-called "polyaspartic acid binders"). Polyaspartic acid binders are components converted by the reaction of amino-functional compounds, especially secondary amines, with isocyanates. Particularly suitable, if at least one polyurethane is used, are those polyurethane-based resins which can be prepared by polyaddition reactions between hydroxyl-containing components, such as polyols, and at least one polyisocyanate (aromatic and aliphatic isocyanates, di-, tri-and/or polyisocyanates). Generally, a stoichiometric reaction of the OH groups in the polyol with the NCO groups in the polyisocyanate is required here. However, the stoichiometric ratio used may also vary, as the polyisocyanate may be added to the polyol component in an amount such that "over-crosslinking" or "under-crosslinking" may be present. If an epoxy resin, i.e., an epoxy-based resin, is used, suitable ones are preferably epoxy-based resins prepared from glycidyl ethers, which have terminal epoxy groups and have hydroxyl groups as functional groups within the molecule. These are preferably reaction products of bisphenol A with epichlorohydrin and/or bisphenol F with epichlorohydrin, and mixtures thereof, which are also used in the presence of a reactive diluent. Curing or crosslinking of such epoxy-based resins is usually achieved by polymerization of the epoxy groups of the epoxy ring, by polyaddition in the form of a stoichiometric addition reaction of other reactive compounds (as hardeners) with the epoxy groups, in which case it is therefore necessary to have one active hydrogen equivalent per epoxy group (i.e. one H active equivalent per epoxy equivalent curing), or by polycondensation of epoxy and hydroxyl groups. Examples of suitable hardeners are polyamines, especially (hetero) aliphatic, (hetero) aromatic and (hetero) cycloaliphatic polyamines, polyamidoamines, polyaminoamides, and also polycarboxylic acids and their anhydrides.

The concept of "radiation curing" has been described above with respect to coating composition (B1 a). The coating composition (B2a) can be cured by using a radiation source, preferably by using UV radiation. Therefore, (B2a) is preferably a UV radiation curable coating composition.

Therefore, (B2a) preferably has an unsaturated carbon double bond, and more preferably a (meth) acrylic group. To this end, coating composition (B2) may comprise any of the components described above in connection with (B1a) and which may be classified under components (a) and (d) of (B1a), such as, in particular, polyesters, polyethers, carbonates, epoxides, poly (meth) acrylates and/or polyurethane (meth) acrylates and/or at least one unsaturated polyester resin and/or mono-, di-and/or tri-functional (meth) acrylates.

When curing by means of (N) IR and/or UV light, the coating composition (B2a) preferably comprises at least one photoinitiator which is capable of being decomposed into radicals by light of the radiation wavelength, which radicals are then capable of initiating radical polymerization. In contrast, in the case of curing with electron radiation, the presence of such photoinitiators is not necessary. As photoinitiator, the same components can be used in the same amounts as described above for component (c) of coating composition (B1 a).

Furthermore, the coating composition (B2a) may comprise at least one further additive. In this case, the same components may be used in the same amounts as described above for components (B) and (e) of coating composition (B1 a).

More preferably, the coating composition used as the coating composition (B2a) is a coating composition having a (meth) acrylic group. Preferably, the coating composition (B2a) comprises at least one polyurethane (meth) acrylate. Furthermore, preferably, it comprises at least one photoinitiator.

Complexes of the invention (B2B1F1)

Furthermore, a further subject matter of the present invention is a composite (B2B1F1) consisting of a substrate (F1), an at least partially embossed and at least partially cured coating (B1) and an at least partially cured coating (B2) applied to (B1), wherein the coating (B1) can be prepared by at least partially curing by means of radiation curing a coating composition (B1a) applied to at least a part of the surface of the substrate (F1) and at least partially embossed, wherein the coating composition (B1a) is a radiation-curable coating composition,

wherein the coating composition (B1a) comprises:

at least one component (a) in an amount of 40 to 95% by weight,

as component (b) at least one additive in an amount of 0.01 to 5% by weight,

at least one photoinitiator as component (c) in an amount of from 0.01 to 15% by weight, and

at least one component (d) containing at least one carbon double bond in an amount of from 0 to 45% by weight,

wherein (i) each of components (a), (B), (c), and (d) are different from each other, (ii) each of said amounts of components (a), (B), (c), and (d) is based on the total weight of coating composition (B1a), and (iii) the amounts of all components present in coating composition (B1a) add up to 100 wt.%,

and wherein component (a) comprises at least 3 structural units of formula (I), each of which is different from or at least partially identical to each other:

wherein:

radical R¹In each case independently of one another is C₂-C₈An alkylene group or a substituted alkylene group,

radical R²In each case independently of one another, H or methyl, and

the parameters m are each, independently of one another, an integer parameter of from 1 to 15, with the proviso that the parameter m in at least one structural unit of the formula (I) in the component (a) is at least 2.

All of the preferred embodiments described above for the process according to the invention, in particular for the coating compositions (B1a) and (B2a) and also the substrates (F1) and coatings (B1) and (B2) used therein, are also preferred embodiments for the composites (B2B1F1) according to the invention.

The complex (B1F1) of the complex (B2B1F1) is preferably obtainable by carrying out the above-described method steps (4) to (7).

The complex (B2B1F1) is preferably obtainable by carrying out the above-described process steps (1) and (2).

The substrate (F1) is preferably a film web, more preferably a continuous film web.

Use of

The invention also relates to the use of the composite (B2B1F1) according to the invention for producing a coating (B2) in the form of a free film which is at least partially embossed on one of its surfaces or for producing a composite (B2KF2) consisting of a substrate (F2), at least one binder (K) and a coating (B2). The complex (B2KF2) is preferably obtained by traversing the process steps (3a), (3B) and (3c), in particular by:

(3a) applying an adhesive (K) to at least a part of the surface of the side of the composite (B2B1F1) provided with the coating (B2) to obtain a composite (KB2B1F1),

(3b) applying a substrate (F2) to at least a portion of the surface of the composite (KB2B1F1) obtained after step (3a) provided with the binder (K), or vice versa, so as to obtain a composite (F2KB2B1F1), and

(3c) the composite (B1F1) was peeled off from the composite (F2KB2B1F1) to obtain a composite (F2KB2), wherein the coating (B2) of the composite has on its surface at least partially a mirror image of the at least partially embossed surface of the coating (B1) of the composite (B1F 1).

All of the preferred embodiments described above in connection with the method of the invention and the complexes of the invention (F1B1) and (B2B1F1) are also preferred embodiments in connection with the above-described uses.

Here, the coating composition (B2a) is preferably a radiation-curable coating composition.

Measurement method

1.Determination of non-volatile Components

The nonvolatile content (solids or solids content) was determined in accordance with DIN EN ISO 3251 (date: 6.2008). The method comprises weighing 1g of the sample into an aluminium pan which has been previously dried, drying the sample in a drying cabinet at 125 ℃ for 60 minutes, cooling it in a desiccator and then weighing it again. The residue corresponds to the non-volatile fraction relative to the total amount of sample used.

2.Determination of moulding accuracy

The shaping accuracy was determined by a commercially available Atomic Force Microscope (AFM) and using a commercially available cantilever. Thus, with AFM, it is possible to compare the surface topography with a defined lattice structure (e.g., the surface topography of the embossing tool P1 with a depth of, for example, 140nm and a period of, for example, 430 nm) with the surface topography of the master film after embossing (B1F 1). In this case, the embossing tool is deliberately damaged at a specific location in order to define the reference point. By means of this reference point, the same regions of the reference and the replica can be investigated and compared with one another. The shaping accuracy defines how high the precision with which a particular reference structure can be transferred, for example from the embossing tool P1 to the master film (B1F 1). For example, if the investigation region of the embossing tool P1 is characterized by a lattice-like structure with a depth of 140nm, this reference depth is compared to the corresponding height of the structure determined on the mother film (B1F 1). Here, the percentage change corresponding to the shaping precision is defined as:

here,. DELTA.h corresponds to the percentage change, h_mCorresponding to the height of the structure in the investigation region of the mother film, and h_rCorresponding to the respective depths of the structures of the investigation region of the embossing tool. The percentage change, in other words, the shaping accuracy,also known as "shrinkage". The smaller the value of Δ h, the better the shaping accuracy.

3.Determination of flow time

The flow time is determined in accordance with DIN EN ISO 2431 (date: 3 months 2012). The method comprises measuring the flow time at room temperature (20 ℃) with the aid of a 4mm flow cup (number 4).

4.Determination of double bond conversion

After curing the sample in question, the double bond conversion (DB conversion) was determined by ATR-IR spectroscopy. By means of the ATR-IR spectroscopy technique, an IR spectrum is recorded at the contact position of the circular reflective crystal with the substrate. The contact locations have a diameter of about 200 μm and the reflective crystal used is a germanium crystal.

The starting materials used to calculate the double bond conversion include the corresponding wet samples of the samples. Through 810cm^-1The decrease in band intensity to calculate the DB conversion ratio. The band used for normalization was 1730cm^-1The percentage of double bond conversion is calculated by the following formula:

here, I_810cm-1The solidified layer is 810cm^-1Normalized intensity of (A), I_{Reference-810 cm-1}Is a corresponding wet sample at 810cm^-1The normalized intensity of (c). A double bond conversion of > 90% was classified as sufficient.

5.Determination of the adhesion

The adhesion was determined by a cross-hatch test according to DIN EN ISO 2409 (date: 6 months 2013). In this test, the adhesion of the coating in question to the substrate was checked in two measurements. A cross-hatch tester with a 2mm hatch spacing of Byk Gardner was used manually. Subsequently, Tesa tape 4651 was pressed onto the damaged area and peeled off to remove the delaminated area. Evaluation was performed based on characteristic values of 0 (minimum delamination) to 5 (very high delamination). An average value of at least 3.5 was classified as sufficient.

6.Determining a copy success rate

The success rate of replication was determined visually, where the percentage fraction of successful replication area was determined. Here, the range is 0-100% of the area of successful replication. If 100% of the area is not replicated, this means that the corresponding area fraction cannot be removed from the embossing die, in other words the coating B1 remains partially adhered to the embossing tool P1 in the form of B1F1, or the coating B2 remains partially adhered to the master film B1F 1.

Inventive and comparative examples

The following examples of the invention and comparative examples are intended to illustrate the invention but should not be construed as imposing any limitation thereon.

Unless otherwise indicated, amounts in parts are parts by weight, amounts in percentages are percentages by weight in each case.

1.Ingredients and materials therefor

GN-a commercially available PET film with a layer thickness of 125. mu.m.

UA 9033(L UA 9033) -aliphatic urethane acrylates from BASF SE, may be used as component (d).

Hexanediol diacrylate (HDDA) -may be used as component (d).

395(SR 395) -isodecyl acrylate, available from Sartomer, is useful as component (d).

502(SR 502) -9-fold ethoxylated TMPTA (trimethylolpropane triacrylate) obtained from Sartomer502 may be used as component (a).

499(SR 499) -6-fold ethoxylated TMPTA (trimethylolpropane triacrylate) obtained from Sartomer can be used as component (a).

454(SR 454) -3-fold ethoxylated TMPTA (trimethylolpropane triacrylate) obtained from Sartomer, may be used as comparative component (a).

TMPTA (trimethylolpropane triacrylate) -may be used as comparative component (a).

GPTA (glyceryl propoxy triacrylate) -3-fold propoxylated glyceryl triacrylate may be used as comparative component (a).

184(I-184) -a commercially available photoinitiator from BASF SE, may be used as component (c).

TPO-L (I-TPO-L) -a commercially available photoinitiator available from BASF SE, can be used as component (c).

Rad 2500(TR 2500) -lubricating and antiblocking additive (silicone acrylate) from Evonik, useful as component (b).

Byk-SILCLEAN 3710(BS 3710) -surface additive (polyether modified acrylic functional polydimethylsiloxane) available from BYK Chemie GmbH can be used as component (b).

2. Examples of the embodiments

2.1 preparation of the coating composition (B1a) and of the corresponding comparative coating composition

Coating compositions were prepared according to tables 1a and 1b below. Coating compositions E1a to E3a and E4a to E6a are of the invention. Coating compositions V1a to V5a are comparative coating compositions. In the case of preparations E1a to E3a and V1a to V5a, the flow times determined at room temperature (20 ℃) were from 26 to 172 seconds.

Table 1 a:

table 1 b:

2.2 preparation of mother membranes (B1F1) Using E1a to E3a and V1a to V5a and E4a to E6a

A number of different master films were prepared using a roll-to-plate embossing apparatus with a nickel embossing tool P1 carrying the desired positive structure. For this, each of the above coating compositions E1a to E3a and V1a to V5a and E4a to E6a was applied onto P1, and a PET film (F1) was applied thereon (F1) ((GN). The resulting stack of film and the respective coating composition is then passed under a press roller and the coating composition is at least partially cured by means of a UV-LED lamp, while still the embossing device is in contact with the respective stack of coating composition. In this case, the lamp used was a 365nm, 6W UV-LED lamp (100% lamp power, 2 m/min, 2 passes) from Easytec. Subsequently, the at least partially cured coating is separated together with the film from the embossing device (having a negative-type structure compared to P1) to give a structured film (master film). The master film was then post-exposed with a UVA lamp (Panacol-Elosal UV F-900).

Further, a mother film was prepared by using a roll-to-roll embossing apparatus having an embossing tool P1 made of nickel with a desired positive type structure. For this purpose, the above-mentioned coating composition E1a was applied to a PET film (F1) (F1)GN) and passed by means of a press roller through embossing tool P1. Even when the embossing apparatus and the coating material are usedUpon contact of the composition, at least partial curing of the coating composition is also achieved by a UV-LED lamp. A365 nm, 6W UV-LED lamp (100% lamp power, 5 m/min) from Easytec was used. Subsequently, the at least partially cured coating is separated together with the film from the embossing device (having a negative-type structure compared to P1) to give a structured film (master film). The master film was then post-exposed with a UVA lamp (Panacol-Elosal UV F-900).

2.3 mother film obtained

In the manner described in section 2.2, sets of mother films (E1F1 to E3F1 and V1F1 to V5F1 and E4F1 to E6F1) were obtained, which were additionally embossed differently depending on the characteristics of the positive type structure. In this case, nickel embossing devices with different positive structures are used, which have in particular:

● nanostructures (lattice-like structure with a period of 430nm and a depth of 140 nm; corresponding coating compositions applied in a layer thickness of 5-10 μm to the PET film used),

● micrometer structures M1 (two-dimensional triangular structures with a width and height of 33 μ M and a spacing between the structures of 35 μ M; the corresponding coating compositions were applied to the PET film used in a layer thickness of 20 μ M),

● micrometers structure A (continuous two-dimensional triangular structure with a width of 45 μm and a height of 13 μm, the corresponding coating composition being applied to the PET film used in a layer thickness of 20 μm), or

● micrometers structures B (two-dimensional triangular structures with a height of 80 μm and a spacing between the structures of 115 μm, the corresponding coating compositions being applied to the PET film used in a layer thickness of 110 μm).

The master film with nanostructures was used to determine the shaping accuracy, double bond conversion and adhesion. The master film with microstructures M1 was used to determine the replication success-see point 2.4-and also for the preparation of transfer films (as described in points 2.5-2.7 below). A master film with microstructures a or B was used to prepare a transfer film (as described in section 2.8 below). To prepare these parent films, the coating composition E1a was used in each case and accordingly a parent film E1F1 with a microstructure a or B was obtained.

2.4 study of mother Membrane

Table 2 below summarizes the studies performed. The study was carried out according to each of the above methods. The symbol "-" in the table indicates that no specific study was performed.

Table 2:

mother film	DB conversion (%)	Adhesion property	Success rate of replication (%)	Moulding precision (Δ h,%)
					E1F1	92	3.5	100	4
E2F1	90	0.5	100	4
					E3F1	95	2.5	-	4
V1F1	93	5	100	3
					V2F1	85	1.5	85	2
V3F1	89	5	85	5
					V4F1	92	5	100	4
V5F1	87	5	85	29

The data indicate that adequate DB conversion was not achieved with V2F1, V3F1, and V5F1 (DB conversion < 90). When the DB conversion is too low, problems may occur in the embossing of the coating composition (B1a) and the subsequent coating composition (B2 a). In contrast, the parent films E1F1, E2F1 and E3F1 showed DB conversion of at least 90%.

In the case of V1F1 and V4F1, the DB conversion was indeed > 90%, but the adhesion obtained with these parent films, just as with V3F1 and V5F1, was insufficient (cross-hatch test evaluated on a scale of 5). If the adhesion of the mother coat on the PET film is insufficient, problems may occur in the embossing of the coating composition (B1a) and the subsequent coating composition (B2 a). In contrast, the mother films E1F1, E2F1, and E3F1 all showed good to sufficient adhesion.

Furthermore, the data also show that in the case of V2F1, V3F1 and V5F1, only a value of 85% was obtained in the evaluation of the replication success rate, since 15% of the respective coatings V2, V3 and V5 could not be removed from the embossing tool. In contrast, the studied mother films E1F1 and E2F1 showed 100% replication success rate.

With the exception of V5F1, all of the parent films studied showed sufficient shaping accuracy because very low shrinkage values were consistently obtained. Only in the case of V5F 1a shrinkage of 29% was obtained, which is not acceptable.

In summary, it can be said that only the mother films E1F1, E2F1 and E3F1 provided good results in terms of all the properties studied (DB conversion, adhesion, shaping accuracy and replication success rate).

2.5 preparation of transfer film:

the separately obtained mother films having a microstructure were then each used in a roll-to-plate embossing apparatus, and the coating composition (B2a) was applied to the structured surface of the corresponding mother film at a wet layer thickness of 20 μm. The resulting stack of the master film and coating composition (B2a) was lined with a TAC film to protect it from oxygen. Then, the obtained laminate sequentially including the mother film, the coating composition (B2a) applied thereto, and the TAC film applied thereto was passed under a pressure roller in a process simultaneously performed with at least partially curing the coating composition (B2a) with a UV-LED lamp. In this case, the lamp used was a 365nm, 6W UV-LED lamp (100% lamp power, 2 m/min, 2 passes) from Easytec. In this way, after the TAC film was removed, a composite (B2B1F1) as a transfer film laminate was obtained.

The coating composition (B2a) used is a commercially available radiation-curable coating composition comprising at least one urethane acrylate, at least one photoinitiator and commercially available additives.

2.6 preparation of adhesive composites and free structured films:

the unstructured coating side of the coating (B2) of the transfer film (B2B1F1) was then adhered to the coated steel plate by means of a laminating film (mounting laminating film S-4705WSA 120P from ATP; polyacrylate). The laminating film used consisted of an adhesive film K, in each case initially lined on either side with a silicone paper to prevent unintended adhesion. For this purpose, the silicone paper was first peeled off from one side and the adhesive film was placed with its now exposed adhesive side on the coated side of the coating (B2) of the transfer film (B2B1F1) by pressing the adhesive film onto B2 with a rubber roller parallel to the peeling direction of the silicone paper. Similarly, the silicone paper was then peeled from the other side, and the final adhesive side of the adhesive film was pressed onto the surface of a steel plate as a base material F2 using a rubber roller in parallel with the peeling direction of the silicone paper. The resulting complex (F2KB2B1F1) was first stored at 50 ℃ for 12 hours. After this storage, the corresponding mother film (B1F1) was peeled off from the above-described composite, thereby obtaining not only the mother film but also the composite (F2KB 2).

To obtain a free structured film, the coating (B2) was separated from the bonded steel plate (F2KB 2).

2.7 investigation of the bonded composites (F2KB2) or of the free structured films (B2)

Table 3 below summarizes the results of the studies on successful replication on the resulting transfer films, taking into account the specific master film used for embossing. The symbol "-" in the table indicates that no specific study was performed.

Table 3: embossed structure replication success rate

The mother film used	Success rate of replication (%)
		E1F1	100
E2F1	100
		E3F1	100
E5F1	100
		E6F1	100
V1F1	52*
		V2F1	100
V3F1	17
		V4F1	<1
V5F1	86

Mean of two determinations

The data show that replication is only insufficient with V3F1 and V4F 1. When using V1F1 and V5F1, only values of < 100% were also obtained when evaluating the replication success rate, since in these cases the partial coating B2 could not be removed from the coatings V1 and V5 of the respective parent films. In contrast, when the studied mother films E1F1 to E3F1 and E5F1 and E6F1 were used, the replication success rate reached 100%.

2.8 preparation of other transfer films:

the heat-curable coating composition (B2a) was applied in a wet layer thickness of 200 μm onto the structured surface of a corresponding master film E1F1 bearing one of the microstructures a or B. The at least partial curing of the stack of the parent film and the coating composition (B2A) thus obtained was carried out in a commercial oven from Heraeus at an oven temperature of 80 ℃ (45 minutes) after a flash time of 10 minutes at room temperature (23 ℃). Thereby, a laminate of the composite (B2B1F1) as a transfer film was obtained.

The heat-curable coating composition (B2a) used is a commercially available thermosetting 2K coating composition. The mixing ratio of the component 1 and the component 2 is 2: 1. Component 1 contains at least one polyol and commercially available additives. Component 2 contains at least one polyisocyanate and commercially available additives.

From the transfer film thus obtained, a complex (F2KB2) was obtained by the procedure described under 2.6 points.

Table 4 below summarizes the test results of successful replication on the resulting transfer films, considering each master film used for embossing.

Table 4: embossed structure replication success rate

The mother film used	Success rate of replication (%)
		E1F1 (with microstructure A)	100
E1F1 (with micron structure B)	100

The data show that with the parent film under investigation E1F1, a 100% replication success rate was obtained even with the thermosetting coating composition used as coating composition (B2 a).