阅读说明：本技术 一种立体电路打印装置 (Three-dimensional circuit printing device ) 是由 谢小柱 申超 王子杰 龙江游 张炜 张家发 张宇梁 于 2020-07-08 设计创作，主要内容包括：本发明涉及电子电路的技术领域,更具体地,涉及一种立体电路打印装置,包括打印喷头、用于挤出导电油墨的挤出组件以及环绕于打印喷头外周的加热组件,所述打印喷头内设有与导电油墨挤出组件连通的导管以及环绕于导管外周的冷却组件。本发明挤出组件挤出导电油墨经打印喷头内的导管流出,同时加热组件工作加热温度至导电油墨的固化温度使得导电油墨固化；导管外周设置冷却组件隔绝加热组件产生的热量,避免在打印过程中加热组件产生的高温对打印喷头产生热影响；本发明工序简单、成本低廉,可适用于大多金属油墨浆料的挤出打印,且可制备得到分辨率高的立体电路。(The invention relates to the technical field of electronic circuits, in particular to a three-dimensional circuit printing device which comprises a printing nozzle, an extrusion assembly and a heating assembly, wherein the extrusion assembly is used for extruding conductive ink, the heating assembly surrounds the periphery of the printing nozzle, and a guide pipe communicated with the conductive ink extrusion assembly and a cooling assembly surround the periphery of the guide pipe are arranged in the printing nozzle. The extrusion assembly extrudes conductive ink to flow out through a guide pipe in the printing nozzle, and simultaneously, the heating assembly is heated to the curing temperature of the conductive ink so that the conductive ink is cured; the periphery of the guide pipe is provided with the cooling assembly to isolate heat generated by the heating assembly, so that the heat influence of high temperature generated by the heating assembly on a printing nozzle in the printing process is avoided; the method has simple process and low cost, is suitable for extrusion printing of most metal ink paste, and can prepare the three-dimensional circuit with high resolution.)

1. The three-dimensional circuit printing device is characterized by comprising a printing nozzle (1), an extrusion assembly (2) for extruding conductive ink and a heating assembly (3) surrounding the periphery of the printing nozzle (1), wherein a guide pipe (11) communicated with the conductive ink extrusion assembly (2) and a cooling assembly (4) surrounding the periphery of the guide pipe (11) are arranged in the printing nozzle (1).

2. The printing device according to claim 1, wherein the heating assembly (3) comprises a heater (31) and a temperature detector (32), the heater (31) surrounds the periphery of the lower portion of the printing nozzle (1), and the detection end of the temperature detector (32) is in contact with the heater (31).

3. Three-dimensional circuit printing device according to claim 2, characterised in that said heater (31) is a circular ring-shaped structure arranged coaxially to the print head (1).

4. The stereoscopic circuitry printing apparatus according to any of claims 1 to 3, wherein the print head (1) comprises a housing filled with a heat insulating material, the conduit (11) being located at a central axis of the housing.

5. The stereoscopic circuitry printing apparatus according to claim 4, wherein the cooling module (4) comprises a hollow insulating layer (41) provided inside the housing.

6. The stereoscopic circuit printing apparatus according to claim 5, wherein the cooling assembly (4) further comprises a first spiral cooling tube (42) disposed inside the housing and surrounding the outer periphery of the conduit (11), and the first spiral cooling tube (42) has a cooling liquid flowing inside.

7. The stereoscopic circuit printing apparatus according to claim 6, wherein the cooling module (4) further comprises a second spiral cooling tube (43) disposed inside the housing and surrounding the outer periphery of the guide tube (11), the second spiral cooling tube (43) being in communication with the first spiral cooling tube (42), the second spiral cooling tube (43) being disposed between the first spiral cooling tube (42) and the hollow heat insulating layer (41).

8. The stereoscopic circuit printing apparatus according to claim 7, wherein the first spiral cooling tube (42) is connected with a liquid inlet (44), the second spiral cooling tube (43) is connected with a liquid outlet (45), and the liquid inlet (44) and the liquid outlet (45) are both located at the top of the printing nozzle (1).

9. The stereoscopic circuitry printing apparatus according to any of the claims 4 to 8, wherein a heat shield (6) is connected to the print head (1), the heat shield (6) being arranged coaxially with the print head (1).

10. Three-dimensional circuit printing device according to claim 9, characterised in that said heat shield (6) is provided with a gas inlet (62) for the admission of a protective gas.

Technical Field

The present invention relates to the field of electronic circuit technology, and more particularly, to a three-dimensional circuit printing apparatus.

Background

Daily-used electronic products are continuously developed towards small-size integration, the utilization rate of a traditional two-dimensional circuit to space is not high, and the development requirements of electronic circuits with higher integration level and complexity are difficult to adapt. Compared with a conventional two-dimensional circuit, the three-dimensional circuit has the advantages of higher space utilization rate, stronger designability and wide application prospect in the fields of integrated electronics, flexible wearable electronics and sensors. At present, the material for manufacturing the three-dimensional circuit is mainly ink paste, such as conductive silver paste, conductive copper paste, liquid metal or metal compound paste. The ink is prepared by technical methods such as laser direct writing, ink direct writing, meniscus electrodeposition and the like, wherein the ink direct writing method is widely applied due to simplicity, reliability and low cost, and can carry out any configuration on a circuit in space. However, the ink paste is generally cured by using the self-characteristics of the ink or the assistance of the external environment, on one hand, the self-curing requirement of the ink is high, and on the other hand, the external assistance of the curing and forming of the ink paste is complicated in general process or high in cost. At present, the preparation technology of the three-dimensional circuit is rarely considered from the perspective of a printing head, and the problems of difficulty in improving the preparation process of the three-dimensional circuit and maintaining the shape are solved. The method for improving the preparation efficiency and the forming quality of the three-dimensional circuit and perfecting the preparation method of the three-dimensional circuit is a field worth of continuous deep study.

Chinese patent CN110901067A discloses a coaxial 3D printing extrusion device and a method for forming a spatial three-dimensional circuit, which respectively use two extrusion mechanisms on the inner and outer layers to simultaneously extrude two different materials, use the inner extrusion mechanism to extrude conductive materials, use the outer extrusion mechanism to extrude insulating materials by heating and melting, wrap the conductive materials inside, and then cool and solidify the thermoplastic materials outside to form a spatial three-dimensional circuit. Although the above method can rapidly manufacture the three-dimensional circuit, the method directly encapsulates the conductive material inside the insulator, which requires that the conductive material must be capable of directly conducting electricity, such as liquid metal ink, which is generally expensive; in addition, the resolution ratio of the three-dimensional circuit prepared by the wrapping device and the wrapping method is poor, and the cross section of the three-dimensional circuit is large.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a three-dimensional circuit printing device which is simple in process, low in cost, suitable for extrusion printing of most metal ink paste and capable of preparing a three-dimensional circuit with high resolution.

In order to solve the technical problems, the invention adopts the technical scheme that:

the utility model provides a three-dimensional circuit printing device, including printing the shower nozzle, be used for extruding the subassembly of extruding of electrically conductive printing ink and encircle in the heating element who prints the shower nozzle periphery, be equipped with in the printing shower nozzle with electrically conductive printing ink extrude the pipe of subassembly intercommunication and encircle in the cooling element of pipe periphery.

According to the three-dimensional circuit printing device, the extrusion assembly extrudes the conductive ink to flow out through the guide pipe in the printing nozzle, and meanwhile, the heating assembly works to heat the conductive ink to the curing temperature of the conductive ink so that the conductive ink is cured; the periphery of the guide pipe is provided with the cooling assembly to isolate heat generated by the heating assembly, so that the heat influence of high temperature generated by the heating assembly on a printing nozzle in the printing process is avoided; the method has simple process and low cost, is suitable for extrusion printing of most metal ink paste, and can prepare the three-dimensional circuit with high resolution.

Further, the heating assembly comprises a heater and a temperature detector, the heater surrounds the periphery of the lower portion of the printing nozzle, and the detection end of the temperature detector is in contact with the heater.

Further, the heater is of a circular ring structure which is coaxial with the printing nozzle.

Further, the printing nozzle comprises a shell, the shell is filled with heat insulation materials, and the guide pipe is located on the central axis of the shell.

Further, the cooling assembly includes a hollow insulating layer disposed inside the housing.

Furthermore, the cooling assembly also comprises a first spiral cooling pipe which is arranged inside the shell and surrounds the periphery of the guide pipe, and cooling liquid flows inside the first spiral cooling pipe.

Further, the cooling assembly further comprises a second spiral cooling pipe arranged inside the shell and surrounding the periphery of the guide pipe, the second spiral cooling pipe is communicated with the first spiral cooling pipe, and the second spiral cooling pipe is arranged between the first spiral cooling pipe and the hollow heat insulation layer.

Further, first spiral cooling tube is connected with the inlet, second spiral cooling tube is connected with the liquid outlet, inlet, liquid outlet all are located and print the shower nozzle top.

Further, the printing nozzle is connected with a heat shield, and the heat shield and the printing nozzle are coaxially arranged.

Further, the heat shield is provided with a gas inlet for introducing a protective gas.

Compared with the prior art, the invention has the beneficial effects that:

the conductive ink can be cured while being printed, and the thermal influence of curing heat on the conductive ink in the conduit can be effectively avoided; the invention has simple process and low cost, is applicable to various conductive printing inks, and can prepare the three-dimensional circuit with high resolution.

Drawings

FIG. 1 is a schematic structural diagram of a three-dimensional circuit printing apparatus according to the present invention;

FIG. 2 is a schematic structural diagram of a print head of the three-dimensional circuit printing apparatus;

in the drawings: 1-printing a spray head; 11-a catheter; 12-a mounting portion; 13-a connecting part; 14-an extrusion section; 2-extruding the assembly; 3-a heating assembly; 31-a heater; 32-a temperature detector; 4-a cooling assembly; 41-hollow heat insulation layer; 42-a first helical cooling tube; 43-a second spiral cooling tube; 44-liquid inlet; 45-a liquid outlet; 5, mounting a plate; 6-heat shield; 61-bolt; 62-a gas inlet; 7-a working platform; 8-conductive ink.

Detailed Description

The present invention will be further described with reference to the following embodiments. Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms may be understood by those skilled in the art according to specific circumstances.