阅读说明：本技术 大电流组合式高温电感及其加工方法 (Large-current combined high-temperature inductor and processing method thereof ) 是由 饶金火 林伙利 王俊文 于 2020-08-04 设计创作，主要内容包括：本发明揭示了一种大电流组合式高温电感及其加工方法,电感整体由电感磁体以及电感导体粘接组合而成,电感磁体包括一块外部电感磁体以及至少一块内部电感磁体,外部电感磁体一体成型且外部电感磁体上贯穿开设有至少一个用于设置电感导体的导体收纳槽,每个导体收纳槽内均设置有一个电感导体且每个电感导体与导体收纳槽内部的剩余空间均由一块内部电感磁体完成填充。本发明实现了对电感器件的有效整合,电感的整体形状较为规整且其上的引脚均设置于电感成品的同侧外表面,不仅保证了电感器件的屏蔽性能,而且缩小了电感器件整体的体积和占用空间、为其后续安装使用提供了便利。(The invention discloses a high-current combined high-temperature inductor and a processing method thereof, wherein the inductor is integrally formed by bonding and combining an inductor magnet and an inductor conductor, the inductor magnet comprises an external inductor magnet and at least one internal inductor magnet, the external inductor magnet is integrally formed, at least one conductor accommodating groove for accommodating the inductor conductor is formed in the external inductor magnet in a penetrating manner, the inductor conductor is arranged in each conductor accommodating groove, and the inductor conductor and the residual space in the conductor accommodating groove are filled by one internal inductor magnet. The invention realizes the effective integration of the inductor, the overall shape of the inductor is more regular, and the pins on the inductor are all arranged on the outer surface of the inductor product at the same side, thereby not only ensuring the shielding performance of the inductor, but also reducing the overall volume and the occupied space of the inductor and providing convenience for the subsequent installation and use of the inductor.)

1. The utility model provides a high current combination formula high temperature inductance is formed by inductance magnet and inductance conductor (1) bonding combination, its characterized in that: the inductance magnet comprises an external inductance magnet (2) and at least one internal inductance magnet (3), the external inductance magnet (2) is integrally formed, at least one conductor accommodating groove (21) of the inductance conductor (1) is formed in the external inductance magnet (2) in a penetrating mode and is used for setting up, and each conductor accommodating groove is internally provided with one of the inductance conductor (1) and each of the inductance conductor (1) and the conductor accommodating groove (21) is formed in the residual space by one, and the internal inductance magnet (3) is filled.

2. The high-current combined high-temperature inductor according to claim 1, wherein: outside inductance magnet (2) wholly is the cuboid structure, at least one conductor has been seted up to the up end of outside inductance magnet (2) and has been accomodate groove (21), the conductor is accomodate groove (21) and has been link up from top to bottom just the conductor is accomodate both sides position department of groove (21) top notch and has all been seted up the pin and has been drawn forth the notch.

3. The high-current combined high-temperature inductor according to claim 2, wherein: a plurality of conductor accommodating grooves (21) are formed in the upper end face of the external inductance magnet (2) and are arranged in parallel at equal intervals among the conductor accommodating grooves (21).

4. The high-current combined high-temperature inductor according to claim 2, wherein: the inductance conductors (1), the conductor accommodating grooves (21) and the internal inductance magnets (3) are the same in number; the external shape of the inductance conductor (1) is matched and corresponds to the internal shape of the conductor accommodating groove (21), and the internal shape of the inductance conductor (1) is matched and corresponds to the shape of the internal inductance magnet (3).

5. The high-current combined high-temperature inductor according to claim 4, wherein: the inductance conductor (1) is bent to form an effective part and pin parts, the pin parts are positioned on two sides of the effective part, the effective part of the inductance conductor (1) is embedded in the conductor accommodating groove (21), and the internal inductance magnet (3) is embedded in a cavity formed by the effective part of the inductance conductor (1) and the conductor accommodating groove (21); the pin part of the inductance conductor (1) is exposed out of the upper end face of the external inductance magnet (2) through the pin leading-out notch; in the combined state of the inductive magnet and the inductive conductor (1), the upper end surfaces of the external inductive magnet (2), the inductive conductor (1) and the internal inductive magnet (3) are coplanar, and the lower end surfaces of the external inductive magnet (2) and the inductive conductor (1) are coplanar.

6. The high-current combined high-temperature inductor according to claim 5, wherein: the utility portion of inductance conductor (1) with clearance fit, there is air gap space between the two between conductor storage groove (21), the utility portion of inductance conductor (1) with clearance fit, there is air gap space between the two between inside inductance magnet (3).

7. A processing method of a high-current combined high-temperature inductor is used for processing the high-current combined high-temperature inductor as claimed in any one of claims 1 to 6, and is characterized by comprising the following steps:

s1, processing the inductance magnet, namely stirring the insulating powder, the adhesive, the lubricant and the curing agent in proportion, mixing and granulating to form inductance magnet granules, molding the inductance magnet granules through a mold, and sintering at high temperature to obtain an external inductance magnet (2) and an internal inductance magnet (3);

s2, processing the inductance conductor, selecting a conductor base material, and obtaining the inductance conductor (1) after cold press molding and bending molding;

and S3, inductor combination processing, namely superposing and splicing the external inductor magnet (2), the inductor conductor (1) and the internal inductor magnet (3) in sequence, and bonding and combining to obtain an inductor processed finished product.

8. The method for processing a high-current combined high-temperature inductor according to claim 7, wherein in S1: the insulating powder comprises any one or combination of more of iron-based powder, iron-silicon-chromium-based powder, iron-silicon-aluminum-based powder, amorphous powder and nanocrystalline powder; the adhesive is any one or combination of more of silicone resin; the lubricant comprises any one or more of stearic acid, aluminum stearate, magnesium stearate, calcium stearate and zinc stearate.

9. The method for processing a high-current combined high-temperature inductor according to claim 7, wherein in S2: the selection range of the conductor base material comprises one or more of FeSiCr, FeSiAl, FeSi, FeNi, FeSiBCr and Fe-based alloy.

10. The method for processing the high-current combined high-temperature inductor as claimed in claim 8, wherein the step S1 comprises the steps of:

s11, stirring the insulating powder, the adhesive, the lubricant and the curing agent in proportion, wherein the addition amount of the adhesive is 0.5-10%, and mixing and granulating to form an inductance magnet granule;

s12, arranging a processing die with the shape consistent with that of the part to be molded, and putting the inductance magnet particles into the processing die for internal molding to obtain semi-finished products of the external inductance magnet (2) and the internal inductance magnet (3);

s13, placing the semi-finished products of the external inductance magnet (2) and the internal inductance magnet (3) into a high-temperature sintering furnace, and sintering at the temperature of 700-1200 ℃; in the high-temperature sintering process, N is introduced into the high-temperature sintering furnace₂And protecting to finally obtain the external inductance magnet (2) and the internal inductance magnet (3).

Technical Field

The invention relates to a high-temperature inductor and a corresponding processing method thereof, in particular to a high-current combined high-temperature inductor and a processing method thereof, and belongs to the technical field of inductor processing.

Background

The inductor is one of the most common components in electronic devices and one of the important components in circuits, and is widely used in various circuits to achieve the functions of filtering, storing energy, matching and resonating.

Along with the continuous development of the fields of the internet, the internet of things and the like at present, the scientific and technical level is integrally improved, and as a hardware basis of various technologies, various intelligent electrical equipment are updated increasingly frequently. Taking the popular cloud computing technology in recent years as an example, in order to implement cloud computing service, a cloud server device is required to be used as a hardware base. In addition, the network scale is gradually enlarged and the computing demand is continuously increased nowadays, so that the design and manufacture of such cloud server devices are gradually developing towards the direction of complexity and integration in order to meet the actual application requirements. This requires that such cloud server devices fully consider the rational utilization of the internal space at the beginning of the design, and meanwhile, it is also necessary to ensure that various electrical components used in the devices have good shielding performance and do not interfere with each other on the premise that the components in the devices are closely arranged.

As such, the requirements for the power type inductor used in such cloud server devices are also becoming more stringent, including high frequency, large current, high temperature resistance, low DCR (direct current resistance), low EMI (electromagnetic interference), and so on, and under the constraint of the above requirements, various defects of the existing inductor begin to emerge.

Firstly, most of inductance devices in the prior art are single-winding and independent structures, the overall structure is loose and irregular in shape, the occupancy rate of the inductance to the space is overhigh due to the structural design, and the overall layout of a circuit is severely restricted and the simplified design of the circuit is influenced due to the overlarge volume and the overhigh space occupancy rate under the development trend of miniaturization and intensification of electronic devices.

Secondly, in consideration of processing cost and process difficulty, many magnetic core/shell parts of the inductance device in the prior art are bonded into a whole by using split structural design and adhesives such as glue. In the subsequent practical use process, the problems of reduced bonding effect and part separation caused by the aging of the adhesive are easy to occur. Meanwhile, when the inductance device is in a high-frequency environment when a large current is introduced, internal elements of the device are easy to shake, and then serious noise is generated.

Thirdly, in order to realize the adjustment of the magnetic circuit and the resistance, an air gap is additionally arranged in the inductance device in the prior art, and in the existing processing mode, the air gap structure of the part needs to be accurately polished moderately after the magnetic core and the magnet are molded, so that the manufacturing difficulty of the whole device is increased, the production cost is also increased, and the automatic production is not convenient.

In summary, based on the above technical defects, how to provide a novel high-current combined high-temperature inductor and a corresponding processing method thereof based on various prior arts, which can not only ensure the reliability of the application thereof, but also further simplify the production process of the device, is a problem to be solved by those skilled in the art.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a high-current combined high-temperature inductor and a method for manufacturing the same, as follows.

The utility model provides a high current combination formula high temperature inductance is formed by inductance magnet and inductance conductor bonding combination, the inductance magnet includes an outside inductance magnet and an at least inside inductance magnet, outside inductance magnet integrated into one piece just run through on the outside inductance magnet and seted up at least one and be used for setting up the groove is accomodate to the conductor of inductance conductor, every the conductor is accomodate the inslot and all is provided with one inductance conductor and every the inductance conductor with the conductor is accomodate the inside residual space of inslot and is by one inside inductance magnet accomplishes the packing.

Preferably, the whole cuboid structure that is of outside inductance magnet, at least one conductor accommodating groove has been seted up to the up end of outside inductance magnet, the conductor accommodating groove link up from top to bottom just the pin notch of drawing forth has all been seted up to the both sides position department of conductor accommodating groove top notch.

Preferably, a plurality of conductor accommodating grooves are formed in the upper end face of the external inductance magnet, and the conductor accommodating grooves are arranged in parallel at equal intervals.

Preferably, the number of the inductance conductors, the conductor receiving grooves and the internal inductance magnets is the same; the external shape of the inductance conductor is matched and corresponds to the internal shape of the conductor accommodating groove, and the internal shape of the inductance conductor is matched and corresponds to the shape of the internal inductance magnet.

Preferably, the inductance conductor is bent to form an effective part and pin parts, the pin parts are located on two sides of the effective part, the effective part of the inductance conductor is embedded in the conductor accommodating groove, and the internal inductance magnet is embedded in a cavity formed by the effective part of the inductance conductor and the conductor accommodating groove; the pin part of the inductance conductor is exposed out of the upper end face of the external inductance magnet through the pin leading-out notch; in the combined state of the inductor magnet and the inductor conductor, the upper end surfaces of the external inductor magnet, the inductor conductor and the internal inductor magnet are coplanar, and the lower end surfaces of the external inductor magnet and the inductor conductor are coplanar.

Preferably, the effective portion of the inductor conductor is in clearance fit with the conductor receiving groove, an air gap space exists between the effective portion of the inductor conductor and the conductor receiving groove, and an air gap space exists between the effective portion of the inductor conductor and the internal inductor magnet.

A processing method of a high-current combined high-temperature inductor is used for processing the high-current combined high-temperature inductor and comprises the following steps:

s1, processing the inductance magnet, namely stirring the insulating powder, the adhesive, the lubricant and the curing agent in proportion, mixing and granulating to form inductance magnet granules, molding the inductance magnet granules through a mold, and sintering at high temperature to obtain an external inductance magnet and an internal inductance magnet;

s2, processing the inductor conductor, selecting a conductor base material, and obtaining the inductor conductor after cold press molding and bending molding;

and S3, inductor combination processing, namely superposing and splicing the external inductor magnet, the inductor conductor and the internal inductor magnet in sequence, and bonding and combining to obtain an inductor processed finished product.

Preferably, in S1: the insulating powder comprises any one or combination of more of iron-based powder, iron-silicon-chromium-based powder, iron-silicon-aluminum-based powder, amorphous powder and nanocrystalline powder; the adhesive is any one or combination of more of silicone resin; the lubricant comprises any one or more of stearic acid, aluminum stearate, magnesium stearate, calcium stearate and zinc stearate.

Preferably, in S2: the selection range of the conductor base material comprises one or more of FeSiCr, FeSiAl, FeSi, FeNi, FeSiBCr and Fe-based alloy.

Preferably, S1 includes the steps of:

s11, stirring the insulating powder, the adhesive, the lubricant and the curing agent in proportion, wherein the addition amount of the adhesive is 0.5-10%, and mixing and granulating to form an inductance magnet granule;

s12, arranging a processing die with the shape consistent with that of the part to be molded, and putting the inductance magnet particles into the processing die for internal molding to obtain semi-finished products of the external inductance magnet and the internal inductance magnet;

s13, placing the external inductance magnet and the semi-finished product of the internal inductance magnet into a high-temperature sintering furnace, and sintering at the temperature of 700-1200 ℃; in the high-temperature sintering process, N is introduced into the high-temperature sintering furnace₂And protecting to finally obtain the external inductance magnet and the internal inductance magnet.

The advantages of the invention are mainly embodied in the following aspects:

the high-current combined high-temperature inductor adopts a combined structure, so that the inductor device is effectively integrated, the overall shape of the inductor is regular, and the pins on the inductor device are arranged on the outer surface of the inductor finished product on the same side, so that the shielding performance of the inductor device is ensured, the overall volume and the occupied space of the inductor device are reduced, the flexibility of arrangement of the inductor device in various circuit structures is ensured, and convenience is brought to subsequent installation and use.

Meanwhile, in the structure of the high-current combined high-temperature inductor, the external inductor magnet is of an integrally formed structure, so that the stability of an inductor device in use is remarkably improved, the jitter of the device is reduced as much as possible, and the noise phenomenon is avoided.

In addition, the processing method of the high-current combined high-temperature inductor has the advantages of quick processing process and low processing difficulty, and is suitable for large-scale application. In the inductor structure, an air gap structure is formed inside the sintered and molded inductor magnet, and a standard air gap space is preset between the inductor conductor and the inductor magnet in the molding stage, so that the high-current combined high-temperature inductor processed by the method has the same magnetic circuit and resistance value as those of the conventional inductor, the processing method is greatly simplified, the process difficulty is reduced, the processing efficiency is improved, and conditions are provided for subsequent large-scale production.

Finally, the invention also provides reference basis for other related schemes in the same field, so that the extension can be carried out, and the structure and the method are applied to the technical schemes of other inductance devices, thereby having very wide application prospect.

The following detailed description of the embodiments of the present invention is provided in connection with the accompanying drawings for the purpose of facilitating understanding and understanding of the technical solutions of the present invention.

Drawings

FIG. 1 is a disassembled schematic view of an embodiment of the present invention;

FIG. 2 is a schematic overall structure diagram of the embodiment shown in FIG. 1;

FIG. 3 is a disassembled schematic view of another embodiment of the present invention;

FIG. 4 is a schematic overall structure diagram of the embodiment shown in FIG. 3;

wherein: 1. an inductance conductor; 2. an external inductive magnet; 21. a conductor receiving groove; 3. an internal inductive magnet.

Detailed Description

The invention provides a high-current combined high-temperature inductor and a processing method thereof, and particularly provides the following steps.

As shown in the figure, the invention discloses a high-current combined high-temperature inductor which is formed by bonding and combining an inductor magnet and an inductor conductor 1, wherein the inductor magnet comprises an external inductor magnet 2 and at least one internal inductor magnet 3, the external inductor magnet 2 is integrally formed, at least one conductor accommodating groove 21 for accommodating the inductor conductor 1 is formed in the external inductor magnet 2 in a penetrating manner, one inductor conductor 1 is arranged in each conductor accommodating groove, and the residual space inside each inductor conductor 1 and the conductor accommodating groove 21 is filled by one internal inductor magnet 3.

The whole cuboid structure that is of outside inductance magnet 2, at least one conductor accommodating groove 21 has been seted up to the up end of outside inductance magnet 2, the conductor accommodating groove 21 link up from top to bottom just the both sides position department of conductor accommodating groove 21 top notch has all seted up the pin and has drawn the notch.

It should be added that, in the technical solution of the present invention, the large-current combined high-temperature inductor may have a plurality of arrangement forms, one embodiment of which is a stand-alone structure as shown in fig. 1 to 2, and the other embodiment of which is a whole-row combined structure as shown in fig. 3 to 4. When the large-current combined high-temperature inductor is of a whole-row combined structure, the upper end face of the external inductor magnet 2 is provided with a plurality of conductor accommodating grooves 21, and the conductor accommodating grooves 21 are arranged in parallel at equal intervals.

The number of the inductance conductors 1, the conductor receiving grooves 21, and the internal inductance magnets 3 is the same; the inductance conductor 1 has an outer shape corresponding to the inner shape of the conductor receiving groove 21, and the inductance conductor 1 has an inner shape corresponding to the inner shape of the internal inductance magnet 3.

The inductance conductor 1 is bent to form an effective part and pin parts, the pin parts are positioned on two sides of the effective part, the effective part of the inductance conductor 1 is embedded in the conductor accommodating groove 21, and the internal inductance magnet 3 is embedded in a cavity formed by the effective part of the inductance conductor 1 and the conductor accommodating groove 21; the pin part of the inductance conductor 1 is exposed out of the upper end surface of the external inductance magnet 2 through the pin leading-out notch; in the combined state of the inductor magnet and the inductor conductor 1, the upper end surfaces of the external inductor magnet 2, the inductor conductor 1, and the internal inductor magnet 3 are coplanar, and the lower end surfaces of the external inductor magnet 2 and the inductor conductor 1 are coplanar.

The utility part of inductance conductor 1 with clearance fit, there is air gap space between the two between conductor receiving groove 21, the utility part of inductance conductor 1 with clearance fit, there is air gap space between the two between inside inductance magnet 3. The effect of the air gap being provided here is to reduce the permeability, so that the properties of the inductive conductor 1 are less dependent on the initial permeability of the conductor material. And the air gap can avoid the magnetic saturation phenomenon under the condition of alternating current large signals or direct current bias, so that the inductance can be better controlled.

In summary, the high-current combined high-temperature inductor of the present invention adopts a combined structure, so as to achieve effective integration of the inductor device, the overall shape of the inductor is more regular, and the pins thereon are all disposed on the same side of the outer surface of the inductor finished product, thereby not only ensuring the shielding performance of the inductor device, but also reducing the overall volume and the occupied space of the inductor device, ensuring the flexibility of the inductor device in various circuit structures, and providing convenience for subsequent installation and use.

Meanwhile, in the structure of the high-current combined high-temperature inductor, the external inductor magnet is of an integrally formed structure, so that the stability of an inductor device in use is remarkably improved, the jitter of the device is reduced as much as possible, and the noise phenomenon is avoided.

The invention also discloses a processing method of the high-current combined high-temperature inductor, which is used for processing the high-current combined high-temperature inductor and comprises the following steps:

s1, processing the inductance magnet, namely stirring the insulating powder, the adhesive, the lubricant and the curing agent in proportion, mixing and granulating to form inductance magnet granules, molding the inductance magnet granules through a mold, and sintering at high temperature to obtain the external inductance magnet 2 and the internal inductance magnet 3.

At S1, the insulating powder includes any one or a combination of a plurality of iron-based powder, iron-silicon-chromium-based powder, iron-silicon-aluminum-based powder, amorphous powder, and nanocrystalline powder; the adhesive is any one or combination of more of silicone resin, in the embodiment, the adhesive is preferably high-temperature silicone resin; the lubricant comprises any one or more of stearic acid, aluminum stearate, magnesium stearate, calcium stearate and zinc stearate.

Further, S1 specifically includes the following operations:

s11, stirring the insulating powder, the adhesive, the lubricant and the curing agent in proportion, wherein the addition amount of the adhesive is 0.5-10%, and mixing and granulating to form an inductance magnet granule;

s12, arranging a processing die with the shape consistent with that of the part to be molded, and putting the inductance magnet particles into the processing die for internal molding to obtain semi-finished products of the external inductance magnet 2 and the internal inductance magnet 3;

s13, placing the semi-finished products of the external inductance magnet 2 and the internal inductance magnet 3 into a high-temperature sintering furnace, and sintering at the temperature of 700-1200 ℃; in the high-temperature sintering process, N is introduced into the high-temperature sintering furnace₂And protecting to finally obtain the external inductance magnet 2 and the internal inductance magnet 3.

It should be added that, after the external inductance magnet 2 and the internal inductance magnet 3 are processed by high-temperature sintering, not only the overall strength is more reliable, the stability of material performance is higher, and the external inductance magnet 2 and the internal inductance magnet 3 can bear large current and high-temperature environment, but also after the high-temperature sintering, resin parts inside the external inductance magnet 2 and the internal inductance magnet 3 are extracted, and numerous compact gaps can be formed inside the external inductance magnet 2 and the internal inductance magnet 3, and these gaps can also function as air gaps, so as to realize adjustment of the overall magnetic circuit and resistance of the inductor.

And S2, processing the inductance conductor, selecting a conductor base material, and obtaining the inductance conductor 1 after cold press molding and bending molding.

In S2, the selection range of the conductor substrate includes any one or more of fesicricr, fesai, FeSi, FeNi, FeSiBCr, and Fe-based alloy.

And S3, inductor combination processing, namely superposing and splicing the external inductor magnet 2, the inductor conductor 1 and the internal inductor magnet 3 in sequence, and bonding and combining to obtain an inductor processed finished product.

The processing method of the high-current combined high-temperature inductor has the advantages of quick processing process and low processing difficulty, and is suitable for large-scale application. In the inductor structure, an air gap structure is formed inside the sintered and molded inductor magnet, and a standard air gap space is preset between the inductor conductor and the inductor magnet in the molding stage, so that the high-current combined high-temperature inductor processed by the method has the same magnetic circuit and resistance value as those of the conventional inductor, the processing method is greatly simplified, the process difficulty is reduced, the processing efficiency is improved, and conditions are provided for subsequent large-scale production.

Finally, the invention also provides reference basis for other related schemes in the same field, so that the extension can be carried out, and the structure and the method are applied to the technical schemes of other inductance devices, thereby having very wide application prospect.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should take the description as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments understood by those skilled in the art.