阅读说明：本技术 一种半导体陶瓷组装包装装置及其使用方法 (Semiconductor ceramic assembling and packaging device and using method thereof ) 是由 雷晓宏 于 2020-07-30 设计创作，主要内容包括：本发明公开了一种半导体陶瓷组装包装装置及其使用方法,涉及半导体陶瓷加工技术领域。包括浸泡外壳,浸泡外壳的上端滑动连接有烘干外壳,浸泡外壳的两端均固定有第一固定板,第一固定板的上端设置有固定框,固定框位于烘干外壳上端的位置处,第一固定板与固定框之间固定有第一光杆,第一固定板的下端且位于远离第一光杆的一端通过螺钉连接有第一电动机。本发明专利通过浸泡烘干一体结构的设计,使得装置整体体积较小,减少了占地面积的使用,使其他的操作空间更多,通过自动移送料结构设计,使得装置在加工过程中能够智能化的进行输送运料和出料,避免人力送料过程中产生的高温烫伤风险,并降低了大量的人力消耗。(The invention discloses a semiconductor ceramic assembly packaging device and a using method thereof, and relates to the technical field of semiconductor ceramic processing. Including soaking the shell, soaking the upper end sliding connection of shell and having the stoving shell, soaking the both ends of shell and all being fixed with first fixed plate, the upper end of first fixed plate is provided with fixed frame, and fixed frame is located the position department of stoving shell upper end, is fixed with first polished rod between first fixed plate and the fixed frame, and there is first motor lower extreme of first fixed plate and the one end that is located to keep away from first polished rod through the screw connection. According to the invention, through the design of the soaking and drying integrated structure, the whole volume of the device is smaller, the use of the occupied area is reduced, and other operation spaces are more.)

1. The utility model provides a semiconductor ceramic equipment packing plant, includes soaking shell (1), its characterized in that: the upper end sliding connection that soaks shell (1) has stoving shell (2), the both ends of soaking shell (1) all are fixed with first fixed plate (3), the upper end of first fixed plate (3) is provided with fixed frame (7), fixed frame (7) are located the position department of stoving shell (2) upper end, be fixed with first polished rod (5) between first fixed plate (3) and fixed frame (7), the lower extreme of first fixed plate (3) just is located the one end of keeping away from first polished rod (5) and has first motor (4) through the screw connection, the output of first motor (4) is equipped with first threaded rod (6), the other end and fixed frame (7) of first threaded rod (6) rotate to be connected, first sliding block (8) have all been cup jointed in the outside of first polished rod (5) and first threaded rod (6), the first sliding block (8) is in threaded connection with the first threaded rod (6), one side of the first sliding block (8) is fixedly connected with two ends of the drying shell (2), two ends of the drying shell (2) are fixedly provided with connecting boxes (9), the connecting boxes (9) are positioned between the two first sliding blocks (8), one side, far away from the drying shell (2), of each connecting box (9) is provided with an air guide fan (10), one side, far away from the connecting boxes (9), of each air guide fan (10) is provided with a ventilation protection plate (11), the upper end of each connecting box (9) is fixedly provided with an air guide pipe (12), the other end of each air guide pipe (12) is positioned inside the drying shell (2), the top end inside the drying shell (2) is fixedly provided with an installation box (13), and the other end of each air guide pipe (12) is fixedly connected with two ends of the installation box (13), a heating pipe (14) is assembled in the installation box (13), and an air deflector (15) is fixed at the lower end of the installation box (13);

the utility model discloses a soaking shell, including soaking shell (1), the inside sliding connection of soaking shell (1) has elevating platform (16), elevating platform (16) are inside to be seted up a plurality of water through-holes (21) of crossing, the center department of soaking shell (1) bottom is provided with electric telescopic handle (17), the bottom mounting of electric telescopic handle (17) has fixed bolster (47), the upper end at fixed bolster (47) both ends is connected fixedly with the bottom of soaking shell (1), the output of electric telescopic handle (17) is located the inside of soaking shell (1) and is connected fixedly with the bottom of aviation baffle (15).

2. The assembly packaging device for semiconductor ceramics according to claim 1, wherein: one side of soaking shell (1) is fixed with two first support frames (22), the upper end of first support frame (22) is fixed with second fixed plate (23), first limiting plate (25) and first assembly plate (26) are fixed with respectively at the both ends of the upper end of second fixed plate (23), one side that first limiting plate (25) were kept away from in first assembly plate (26) is equipped with second motor (27), second threaded rod (28) are equipped with admittedly to the output of second motor (27), the other end and first limiting plate (25) of second threaded rod (28) rotate to be connected, two sliding connection has second sliding block (32) between second threaded rod (28), the sliding tray has all been seted up at the both ends of second sliding block (32), second threaded rod (28) are located the sliding tray, second threaded rod (28) and second sliding block (32) are threaded connection, a second support frame (24) is further fixed on one side of the soaking shell (1) and between the two first support frames (22), a fixed block (31) is fixed at the upper end of the second support frame (24), second polish rods (29) are connected inside the fixed block (31) in a sliding mode, one ends of the second polish rods (29) are fixedly connected with one side of a second sliding block (32), and a first contact plate (30) is fixed at the other ends of the second polish rods (29);

the other side of soaking shell (1) is fixed with two third support frames (33), the upper end of two third support frames (33) has one through the screw connection and places platform (34), one side welding of placing platform (34) has connecting plate (36), the upper end of connecting plate (36) is fixed with a plurality of connecting blocks (37), a plurality of one side of connecting block (37) has one third fixed plate (38) through the screw fixation, the both ends of third fixed plate (38) opposite side are fixed with second assembly plate (39) and second limiting plate (43) respectively, be connected with third threaded rod (41) and third polished rod (42) between second assembly plate (39) and second limiting plate (43) respectively, third threaded rod (41) are located one side of third polished rod (42) and third threaded rod (41) are located the one side of being close to third fixed plate (38), the opposite side of second assembly plate (39) is passed through the fix with screw and is had third motor (40), third threaded rod (41) is connected fixedly with the output of third motor (40), the other end and second limiting plate (43) of third threaded rod (41) are connected for rotating, the outside sliding connection of third threaded rod (41) and third polished rod (42) has second contact board (44), two through-holes have been seted up to the one end of second contact board (44), one of them the through-hole is threaded connection with third threaded rod (41), another the through-hole is sliding connection with third polished rod (42), place the upper end of platform (34) and placed frame (46), the other end of second contact board (44) is located the position department of placing frame (46) one side.

3. The assembly packaging device for semiconductor ceramics according to claim 2, wherein: the upper surface of the placing table (34) is provided with a positioning groove (35), and the placing frame (46) is positioned at the upper end of the positioning groove (35).

4. The assembly packaging device for semiconductor ceramics according to claim 1, wherein: the lower extreme of soaking shell (1) is fixed with four foundation columns (45), the lower extreme of foundation column (45) all is fixed with anti-skidding gasket.

5. The assembly package of semiconductor ceramics according to claim 1, wherein: the ventilating fan (10) is fixedly connected with the ventilating protection plate (11) through screws, the air guide plate (15) is fixedly connected with the installation box (13) through screws, and a plurality of strip-shaped through holes are formed in the ventilating protection plate (11) and the air guide plate (15).

6. The assembly packaging device for semiconductor ceramics according to claim 1, wherein: dovetail grooves (20) are formed in two ends of the lifting platform (16), sliding rails (19) are fixed at two ends of the inner side of the soaking shell (1), the sliding rails (19) are located inside the dovetail grooves (20), and the sliding rails (19) are in clearance fit with the dovetail grooves (20).

7. The assembly packaging device for semiconductor ceramics according to claim 1, wherein: one side of the soaking shell (1) is provided with a drain pipe (18), and the drain pipe (18) is positioned at the positions of the two first support frames (22) and the lower ends of the second support frames (24).

8. The assembly packaging device for semiconductor ceramics according to claim 1, wherein: first fixed plate (3) all are fixed through welded connection with soaking shell (1), connecting box (9) all are fixed through welded connection with stoving shell (2), first sliding block (8) all are fixed through welded connection with stoving shell (2).

9. A method for using a semiconductor ceramic assembly package, which is used for the semiconductor ceramic assembly package according to any one of claims 1 to 8, and is characterized by comprising the following steps:

s1: the materials are placed in the placing frame (46), the third threaded rod (41) is controlled to complete the forming of the pushing force, and the placing frame (46) is pushed to complete the feeding of the materials by being matched with the second contact plate (44):

s2: the electric telescopic rod (17) is controlled to complete the thrust formation, and the soaking operation is carried out by matching with the lifting platform (16);

s3: the first threaded rod (6) is controlled to complete the formation of thrust, the first sliding block (8) is matched to complete the descending of the drying shell (2), so that the drying shell (2) and the soaking shell (1) form a drying space, the heating pipe (14) is controlled to be opened, the temperature in the drying space is set to be one hundred to one hundred and ten ℃, and the drying treatment after soaking is carried out;

s4: after the drying treatment is finished, the first threaded rod (6) is controlled to finish the formation of thrust, the first sliding block (8) is matched to finish the rising of the drying shell (2), so that the materials in the drying shell are naturally cooled, and the cooling process is accelerated by controlling the air guiding fan (10);

s5: the forming of thrust is completed by controlling the first threaded rod (6), the lifting of the drying shell (2) is completed by matching with the first sliding block (8), the thrust forming is completed by the second threaded rod (28) after the drying treatment, and the delivery of the dried materials is completed by matching with the second sliding block (32), the second polished rod (29) and the first contact plate (30).

Technical Field

The invention relates to the technical field of semiconductor ceramic processing, in particular to a semiconductor ceramic assembling and packaging device and a using method thereof.

Background

The semiconductor ceramic is ceramic with semiconductor characteristics and the conductivity is about 10 < -6 > to 15S/m, the conductivity of the semiconductor ceramic is remarkably changed due to the change of external conditions (temperature, illumination, an electric field, atmosphere, temperature and the like), so that the physical quantity change of the external environment can be converted into electric signals to manufacture sensitive elements with various purposes.

SUMMARY OF THE PATENT FOR INVENTION

The invention aims to provide a semiconductor ceramic assembling and packaging device and a using method thereof, which aim to solve the existing problems: the existing device has overlarge volume and larger occupied area, which causes space occupation.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor ceramic equipment packing plant, includes and soaks the shell, the upper end sliding connection who soaks the shell has the stoving shell, the both ends that soak the shell all are fixed with first fixed plate, the upper end of first fixed plate is provided with fixed frame, fixed frame is located the position department of stoving shell upper end, be fixed with first polished rod between first fixed plate and the fixed frame, the lower extreme of first fixed plate and the one end that is located away from first polished rod have a first motor through screw connection, first motor is located the one end of keeping away from first polished rod, the output of first motor is equipped with first threaded rod, the other end of first threaded rod is connected with fixed frame rotation, first sliding block has all been cup jointed with the first sliding block in the outside of first polished rod and first threaded rod, first sliding block is threaded connection with first threaded rod, one side of first sliding block is connected fixedly with the both ends of stoving shell, the drying device comprises a drying shell, a connecting box, a ventilation protection plate, an air guide pipe, a heating pipe and an air guide plate, wherein the connecting box is fixed at two ends of the drying shell and is positioned between two first sliding blocks;

the improved air-conditioner is characterized in that a lifting platform is slidably connected inside the soaking shell, a plurality of water passing through holes are formed in the lifting platform, an electric telescopic rod is arranged at the center of the bottom end of the soaking shell, a fixed support is fixed to the bottom end of the electric telescopic rod, the upper ends of the two ends of the fixed support are fixedly connected with the bottom end of the soaking shell, and the output end of the electric telescopic rod is located inside the soaking shell and fixedly connected with the bottom end of the air deflector.

Preferably, two first support frames are fixed on one side of the soaking shell, a second fixed plate is fixed on the upper end of each first support frame, a first limiting plate and a first assembling plate are respectively fixed on two ends of the upper end of the second fixed plate, a second motor is assembled on one side, away from the first limiting plate, of the first assembling plate, a second threaded rod is fixedly assembled at the output end of the second motor, the other end of the second threaded rod is rotatably connected with the first limiting plate, a second sliding block is slidably connected between the two second threaded rods, sliding grooves are formed in two ends of the second sliding block, the second threaded rod is located in the sliding grooves, the second threaded rod is in threaded connection with the second sliding block, a second support frame is further fixed on one side of the soaking shell and located between the two first support frames, and a fixed block is fixed on the upper end of the second support frame, the inner parts of the fixed blocks are connected with second polished rods in a sliding manner, one ends of the two second polished rods are fixedly connected with one sides of second sliding blocks, and a first contact plate is fixed at the other ends of the two second polished rods;

the other side of the soaking shell is fixedly provided with two third supporting frames, the upper ends of the two third supporting frames are connected with a placing table through screws, one side of the placing table is welded with a connecting plate, the upper end of the connecting plate is fixedly provided with a plurality of connecting blocks, one side of the connecting blocks is fixedly provided with a third fixing plate through screws, the two ends of the other side of the third fixing plate are respectively fixedly provided with a second assembling plate and a second limiting plate, a third threaded rod and a third polished rod are respectively connected between the second assembling plate and the second limiting plate, the third threaded rod is positioned at one side of the third polished rod and positioned at one side close to the third fixing plate, the other side of the second assembling plate is fixedly provided with a third motor through screws, the third threaded rod is fixedly connected with the output end of the third motor, and the other end of the third threaded rod is rotatably connected with the second limiting plate, the outer sides of the third threaded rod and the third polished rod are slidably connected with a second contact plate, one end of the second contact plate is provided with two through holes, one of the through holes is in threaded connection with the third threaded rod, the other through hole is in slidable connection with the third polished rod, a placing frame is placed at the upper end of the placing table, and the other end of the second contact plate is located at the position on one side of the placing frame.

Preferably, the upper surface of the placing table is provided with a positioning groove, and the placing frame is positioned at the upper end of the positioning groove.

Preferably, the lower end of the soaking shell is fixed with four bottom columns, and the lower ends of the bottom columns are fixed with anti-skid gaskets.

Preferably, the air guide fan and the ventilation protection plate are fixedly connected through screws, the air guide plate and the installation box are fixedly connected through screws, and a plurality of strip-shaped through holes are formed in the ventilation protection plate and the air guide plate.

Preferably, dovetail grooves are formed in two ends of the lifting platform, sliding rails are fixed at two ends of the inner side of the soaking shell, the sliding rails are located inside the dovetail grooves, and the sliding rails are in clearance fit with the dovetail grooves.

Preferably, one side of the soaking shell is provided with a drain pipe, and the drain pipe is positioned at the lower ends of the two first support frames and the second support frame.

Preferably, first fixed plate all is fixed through welded connection with soaking the shell, the connecting box all is fixed through welded connection with the stoving shell, first sliding block all is fixed through welded connection with the stoving shell.

A method for using a semiconductor ceramic assembly packaging device comprises the following steps:

s1: put into the material and place the frame in, accomplish the formation of thrust through controlling the third threaded rod, cooperation second contact plate promotes and places sending into of frame completion material:

s2: the electric telescopic rod is controlled to complete the thrust forming, and the soaking operation is carried out by matching with the lifting platform;

s3: the first threaded rod is controlled to finish the formation of thrust, the first sliding block is matched to finish the descending of the drying shell, so that the drying shell and the soaking shell form a drying space, the temperature in the drying space is set to be one hundred to one hundred and ten ℃ by controlling the opening of the heating pipe, and the drying treatment after the soaking is finished is carried out;

s4: after the drying treatment is finished, the first threaded rod is controlled to finish the formation of thrust, the first sliding block is matched to finish the rising of the drying shell, so that the materials in the drying shell are naturally cooled, and the cooling process is accelerated by controlling the air guide fan;

s5: the formation of thrust is accomplished through controlling first threaded rod, and the rising of stoving shell is accomplished to the first sliding block of cooperation, through in the stoving processing back, accomplishes thrust formation through the second threaded rod, and cooperation second sliding block, second polished rod and first contact plate are accomplished and are seen off after the stoving.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention has the advantages that through the design of the soaking and drying integrated structure, the whole volume of the device is smaller, the occupied area is reduced, and other operation spaces are more;

2. according to the automatic material conveying device, due to the automatic material conveying structural design, conveying and discharging can be intelligently carried out in the machining process, the risk of high-temperature scalding generated in the manual feeding process is avoided, and a large amount of labor consumption is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention patent, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural view of the present invention as a whole;

FIG. 2 is a rear elevational view of the invention as a whole;

FIG. 3 is a schematic structural view of an integrated soaking and drying apparatus according to the present invention;

FIG. 4 is an exploded view of a partial structure of the soaking and drying integrated machine of the present invention;

FIG. 5 is a sectional view of a partial structure of the soaking and drying integrated machine of the present invention;

FIG. 6 is a bottom view of the automatic feeding assembly of the present invention;

FIG. 7 is a front view of the automatic feeding assembly of the present invention;

fig. 8 is a rear view showing the structure of the automatic transfer feeder of the present invention.

In the figure: 1. soaking the shell; 2. drying the shell; 3. a first fixing plate; 4. a first motor; 5. a first polish rod; 6. a first threaded rod; 7. a fixing frame; 8. a first slider; 9. a connecting box; 10. an air guide fan; 11. a ventilation protection plate; 12. an air duct; 13. installing a box; 14. heating a tube; 15. an air deflector; 16. a lifting platform; 17. an electric telescopic rod; 18. a drain pipe; 19. a slide rail; 20. a dovetail groove; 21. a water passing through hole; 22. a first support frame; 23. a second fixing plate; 24. a second support frame; 25. a first limit plate; 26. a first fitting plate; 27. a second motor; 28. a second threaded rod; 29. a second polish rod; 30. a first contact plate; 31. a fixed block; 32. a second slider; 33. a third support frame; 34. a placing table; 35. positioning a groove; 36. a connecting plate; 37. connecting blocks; 38. a third fixing plate; 39. a second fitting plate; 40. a third motor; 41. a third threaded rod; 42. a third polish rod; 43. a second limiting plate; 44. a second contact plate; 45. a bottom pillar; 46. placing the frame; 47. and fixing the bracket.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.