阅读说明：本技术 一种键合金丝及其制备方法 (Gold bonding wire and preparation method thereof ) 是由 黄智伟 于 2020-07-09 设计创作，主要内容包括：本发明公开了一种键合金丝,所述键合金丝的材料配方重量百分比为：铜0.4％、银0.02％、铁0.001％、钙0.0015％、镁0.001、硅0.001％、锌0.0002％、铋0.001％、铍0.0008％、铈0.0008％和金99.5727％,所述的金的纯度≥99.99wt％,以及一种键合金丝的制备方法,包含以下步骤：S1备料；S2熔炼；S3拉丝；S4退火；S5绕线；S6包装。本发明与现有技术相比的优点在于：成品具有高强度、低长弧度和非常高的弧形稳定性。(The invention discloses a gold bonding wire, which comprises the following materials in percentage by weight: 0.4% of copper, 0.02% of silver, 0.001% of iron, 0.0015% of calcium, 0.001% of magnesium, 0.001% of silicon, 0.0002% of zinc, 0.001% of bismuth, 0.0008% of beryllium, 0.0008% of cerium and 99.5727% of gold, wherein the purity of the gold is more than or equal to 99.99 wt%, and a preparation method of a gold bonding wire comprises the following steps: s1, preparing materials; s2 smelting; s3 wire drawing; s4 annealing; s5 winding; and S6 packaging. Compared with the prior art, the invention has the advantages that: the finished product has high strength, low long radian and very high arc stability.)

1. The gold bonding wire is characterized by comprising the following materials in percentage by weight: 0.3-0.55% of copper, 0.01-0.03% of silver, 0.0005-0.0015% of iron, 0.001-0.002% of calcium, 0.0005-0.0015% of magnesium, 0.0005-0.0015% of silicon, 0.0001-0.0003% of zinc, 0.0005-0.0015% of bismuth, 0.0005-0.001% of beryllium and 0.0005-0.001% of cerium, wherein the purity of the gold is more than or equal to 99.99 wt%.

2. The gold bonding wire according to claim 1, wherein the gold bonding wire comprises the following materials in percentage by weight: 0.4% of copper, 0.02% of silver, 0.001% of iron, 0.0015% of calcium, 0.001% of magnesium, 0.001% of silicon, 0.0002% of zinc, 0.001% of bismuth, 0.0008% of beryllium, 0.0008% of cerium and 99.5727% of gold, wherein the purity of the gold is more than or equal to 99.99 wt%.

3. A method of producing gold bonding wire according to any one of claims 1 or 2, comprising the following sequence of process steps:

s1, preparing materials: preparing copper, silver, iron, calcium, magnesium, silicon, zinc, bismuth, beryllium, cerium and gold according to the proportion, pressing the gold into a sheet, uniformly mixing the other materials, and wrapping the sheet by the gold sheet;

s2 smelting: obtaining a wire rod with the diameter of 3-5 mm through vacuum melting and directional continuous casting processes;

s3 wire drawing: drawing the wire rod obtained in the step S2 into a product size required by a customer through a wire drawing process;

s4 annealing: annealing at the temperature of 300-600 ℃ and at the annealing speed of 0.3-1.2 m/s, and performing surface treatment after annealing to obtain a gold bonding wire;

s5 winding: winding and taking up the gold bonding wire through a take-up shaft, wherein the winding tension is 3-30g, and the winding speed is 500-750 rpm;

s6 packaging: and (5) carrying out vacuum sealing packaging on the winding shaft wound in the S5.

4. The method for preparing gold bonding wire according to claim 4, wherein: the melting power of the vacuum melting is 10kW, and the temperature is kept for refining for 10min after the vacuum melting is completed.

5. The method for preparing gold bonding wire according to claim 4, wherein: in the annealing process, nitrogen is used as an annealing environment, and the effective length of the annealing furnace is 10-15 m.

6. The method for preparing gold bonding wire according to claim 4, wherein: and carrying out surface treatment after annealing, namely spraying a layer of high molecular compound on the surface of the gold bonding wire.

Technical Field

The invention relates to the technical field of gold bonding wires, in particular to a gold bonding wire and a preparation method thereof.

Background

Gold bonding wires are the critical lead material for the connection of integrated circuit or transistor chip dies to lead frames. In recent years, with the rapid development of the semiconductor industry, the integration degree of an integrated circuit is higher and higher, the thickness of a circuit board is smaller and smaller, the number of electrodes on a device is higher and higher, the electrode spacing is narrower and narrower, the packaging density is correspondingly smaller and smaller, and a gold bonding wire serving as a lead is objectively required to have the performances of high strength, low long radian, very high arc stability and the like.

Disclosure of Invention

The invention aims to overcome the technical defects and provide a gold bonding wire with high strength and stable arc shape and a preparation method thereof.

In order to solve the technical problems, the technical scheme provided by the invention is as follows: a bonding gold wire comprises the following materials in percentage by weight: 0.3-0.55% of copper, 0.01-0.03% of silver, 0.0005-0.0015% of iron, 0.001-0.002% of calcium, 0.0005-0.0015% of magnesium, 0.0005-0.0015% of silicon, 0.0001-0.0003% of zinc, 0.0005-0.0015% of bismuth, 0.0005-0.001% of beryllium and 0.0005-0.001% of cerium, wherein the purity of the gold is more than or equal to 99.99 wt%.

As an improvement, the bonding gold wire comprises the following materials in percentage by weight: 0.4% of copper, 0.02% of silver, 0.001% of iron, 0.0015% of calcium, 0.001% of magnesium, 0.001% of silicon, 0.0002% of zinc, 0.001% of bismuth, 0.0008% of beryllium, 0.0008% of cerium and 99.5727% of gold, wherein the purity of the gold is more than or equal to 99.99 wt%.

As an improvement, the seasonings comprise a mixture of ginger, salt, sesame oil, caraway, soy sauce, vinegar, shallot and vegetable oil in any proportion.

A method of producing gold bonding wire according to any one of claims 1 or 2, comprising the following sequence of process steps:

s1, preparing materials: preparing copper, silver, iron, calcium, magnesium, silicon, zinc, bismuth, beryllium, cerium and gold according to the proportion, pressing the gold into a sheet, uniformly mixing the other materials, and wrapping the sheet by the gold sheet;

s2 smelting: obtaining a wire rod with the diameter of 3-5 mm through vacuum melting and directional continuous casting processes;

s3 wire drawing: drawing the wire rod obtained in the step S2 into a product size required by a customer through a wire drawing process;

s4 annealing: annealing at the temperature of 300-600 ℃ and at the annealing speed of 0.3-1.2 m/s, and performing surface treatment after annealing to obtain a gold bonding wire;

s5 winding: winding and taking up the gold bonding wire through a take-up shaft, wherein the winding tension is 3-30g, and the winding speed is 500-750 rpm;

s6 packaging: and (5) carrying out vacuum sealing packaging on the winding shaft wound in the S5.

As an improvement, the melting power of the vacuum melting is 10kW, and the vacuum melting is carried out for 10min after the vacuum melting is completely carried out.

As an improvement, nitrogen is used as an annealing environment in the annealing process, and the effective length of the annealing furnace is 10-15 m.

As an improvement, surface treatment is carried out after annealing, and a layer of macromolecular compound is sprayed on the surface of the gold bonding wire.

Compared with the prior art, the invention has the advantages that: by adding a plurality of trace elements and matching with the gold alloy in proportion, the metal strength is improved, the high-temperature strength of the material is improved, and the radian of the bonding gold wire is reduced.

In addition, in the preparation method of the gold bonding wire, nitrogen is used as an annealing environment in the annealing process, the effective length of the annealing furnace is 10-15m, the toughness of the finished gold bonding wire product is effectively ensured, and the high molecular compound sprayed on the surface of the annealed gold bonding wire can reduce the viscosity of the gold bonding wire, so that the gold bonding wire can be wound and packaged better.

Detailed Description