阅读说明：本技术 数据处理方法及系统 (Data processing method and system ) 是由 解为梅 于 2020-06-18 设计创作，主要内容包括：本发明公开了一种数据处理方法,其用于将Design Gauge导出CD-SEM量测数据与制程工艺和或量测图片建立对应关系,包括：从Design Gauge导出的.csv文件中提取量测点命名及量测点坐标；提取量测点的制程工艺信息重新构建量测值与晶圆对应的分布格式；从.csv文件获取原始量测图片文件名信息,将CD-SEM量测数据导出的图片文件夹中检索原始量测图片文件名,将检索到的图片按照晶圆图片格式插入到最终的输出文件。本发明还公开了一种数据处理系统。采用本发明的对Design Gauge数据进行处理,避免了人工核查能通过系自动完成需求格式转换,极大地提高了工程师的工作效率。(The invention discloses a data processing method for establishing a corresponding relation between Design Gauge derived CD-SEM measurement data and a process technology and/or a measurement picture, which comprises the following steps: extracting measuring point names and measuring point coordinates from a csv file derived from Design Gauge; extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafers; and acquiring file name information of the original measurement picture from the csv file, retrieving the file name of the original measurement picture from a picture folder exported by the CD-SEM measurement data, and inserting the retrieved picture into a final output file according to a wafer picture format. The invention also discloses a data processing system. By adopting the method and the device for processing Design Gauge data, the condition that manual checking can automatically complete required format conversion through a system is avoided, and the working efficiency of engineers is greatly improved.)

1. A data processing method is used for establishing a corresponding relation between CD-SEM measurement data derived from Design Gauge and a process technology and/or a measurement picture, and is characterized by comprising the following steps:

s1, extracting measuring point names and measuring point coordinates from the csv file derived from Design Gauge;

s2, extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafer;

s3, obtaining original measuring picture file name information from csv file, searching original measuring picture file name from picture file folder exported by CD-SEM measuring data, and inserting searched picture into final output file according to wafer picture format.

2. The data processing method of claim 1, wherein: step S3 is replaced with the following steps;

s3', constructing the file name of the superposed measuring information picture according to the process information, the measuring template information and the picture information, retrieving the file name of the original measuring picture from the picture folder exported by the CD-SEM measuring data, and inserting the retrieved picture into the final output file according to the wafer picture format.

3. The data processing method of claim 1, wherein: the data processing method can be implemented at least by Python programming.

4. A data processing system for establishing a corresponding relationship between Design Gauge derived CD-SEM measurement data and process procedures and/or measurement pictures, comprising:

the information extraction module is used for extracting a measuring point name and a measuring point coordinate from a csv file derived from Design Gauge;

the first data processing module is used for extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafers;

and the second data processing module is used for acquiring file name information of the original measurement picture from the csv file exported by Design Gauge, retrieving the file name of the original measurement picture from a picture folder exported by the CD-SEM measurement data, and inserting the retrieved picture into a final output file according to a wafer picture format.

5. The data processing system of claim 4, wherein:

and the second data processing module is used for constructing a file name of the superposed measurement information picture according to the process information, the measurement template (EPS) information and the picture information, retrieving the file name of the original measurement picture from a picture folder exported by the CD-SEM measurement data, and inserting the retrieved picture into a final output file according to a wafer picture format.

6. The data processing system of claim 4, wherein: the CD-SEM measured values derived from Design Gauge can be output to a new xlsx file according to the wafer picture format.

7. The data processing system of claim 6, wherein: the measurement picture can be output to a new xlsx file according to the wafer picture format.

8. The data processing system of claim 6, wherein: the exposure condition information can be output to the process information corresponding to the final output document.

9. The data processing system of claim 4, wherein: the measured values meeting the preset conditions can be marked on the interface.

10. The data processing system of claim 9, wherein: an acceptable range of variation of the target ADI value can be set on the interface.

11. The data processing system of claim 9, wherein: and marking the data and the picture content selected from the acceptable variation range on an interface.

12. The data processing system of claim 4, wherein: the format of the Design Gauge output CD-SEM measurement data can be converted into the txt format as the PWA software input file according to the format requirement of the PWA software output file.

13. The data processing system of any one of claims 4-12, wherein: can be implemented by Python programming.

Technical Field

The invention relates to the field of semiconductor production and manufacturing, in particular to a data processing method for establishing a corresponding relation between CD-SEM measurement data derived from Design Gauge and a process technology and/or a measurement picture. The invention also relates to a data processing system for establishing the corresponding relation between CD-SEM measurement data derived from Design Gauge and the process and/or measurement picture.

Background

The OPC department needs to process a large amount of CDSEM measurement data in the processes of model building, model simulation, waak point analysis, and the like. The Design Gauge software platform provides a solution for offline CD-SEM recipe establishment and measurement data inspection based on layout, has the advantages of being capable of establishing plan recipe in batches, saving CD-SEM machine borrowing time, being a necessary tool, such as OPC department model data collection, model verification data collection, process weakness data collection and the like, for collecting a large amount of CD-SEM data, bringing great convenience to CDSEM recipe establishment and data inspection, and being an indispensable tool for a large amount of CDSEM measurement and data analysis.

However, the Design Gauge is still insufficient in data export, only one data format can be exported at present, the Design Gauge only provides a list-form data file and a single measurement image file, and cannot import an image into the data file, a corresponding relationship needs to be established with a wafer shot in a data analysis process or a data format needs to be adjusted manually when the measurement image needs to be checked, and a lot of manpower is consumed. For example, when analyzing FEM wafer data or CDU data, manual conversion into wafer format data is required. In addition, other CDSEM data analysis software such as PWA does not support the design gauge format data, and also requires manual conversion when performing process window analysis. In addition, when analyzing the measured FEM data using the PWA software, since the PWA software does not support the Design Gauge derived data format, manual conversion is also required.

Disclosure of Invention

In this summary, a series of simplified form concepts are introduced that are simplifications of the prior art in this field, which will be described in further detail in the detailed description. This summary of the invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

The technical problem to be solved by the invention is to provide a data processing method which can lead Design Gauge out CD-SEM measured data and establish corresponding relation between the process technology and/or measured pictures.

Another technical problem to be solved by the present invention is to provide a format conversion function for PWA software.

In order to solve the above technical problem, the data processing method provided by the present invention comprises the following steps:

s1, extracting measuring point names and measuring point coordinates from the csv file derived from Design Gauge;

s2, extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafer;

s3, obtaining original measuring picture file name information from csv file, searching original measuring picture file name from picture file folder exported by CD-SEM measuring data, and inserting searched picture into final output file according to wafer picture format.

Optionally, the data processing method is further improved, and the step S3 is replaced by the following steps;

s3', according to the process information, the measurement template (EPS) information and the picture information, constructing the file name of the superposed measurement information picture, searching the file name of the original measurement picture in the picture folder exported by the CD-SEM measurement data, and inserting the searched picture into the final output file according to the wafer picture format.

Optionally, the data processing method is further improved, which can be implemented at least by Python programming.

The present invention provides a data processing system comprising:

the information extraction module is used for extracting a measuring point name and a measuring point coordinate from a csv file derived from Design Gauge;

the first data processing module is used for extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafers;

and the second data processing module is used for acquiring file name information of the original measurement picture from the csv file exported by Design Gauge, retrieving the file name of the original measurement picture from a picture folder exported by the CD-SEM measurement data, and inserting the retrieved picture into a final output file according to a wafer picture format.

Optionally, the data processing system is further improved, and the second data processing module is configured to construct a file name of the superimposed measurement information picture according to the process information, the measurement template (EPS) information, and the picture information, retrieve the file name of the original measurement picture from a picture folder exported by the CD-SEM measurement data, and insert the retrieved picture into a final output file according to a wafer picture format.

Optionally, the data processing system is further improved, and the Design Gauge-derived CD-SEM metrology values can be output to a new xlsx file according to a wafer picture format.

Optionally, the data processing system is further modified to output selected metrology pictures in a wafer picture format to a new xlsx file.

Optionally, the data processing system is further improved, and the exposure condition information can be output to the process information corresponding to the final output document.

Optionally, the data processing system is further modified to mark eligible measurements on the interface.

Optionally, the data processing system is further modified to set an acceptable range of variation of the target ADI value on the interface.

Alternatively, the data processing system is further improved to display on the interface the data and the picture contents selected by the conditions set in claim 10.

Optionally, the data processing system is further improved to fit the FEM data and calculate optimal lithographic conditions, i.e. energy and focal plane position.

Optionally, the data processing system is further improved, and Design Gauge output CD-SEM measurement data can be converted according to the format requirement of the PWA software output file.

Optionally, the data processing system is further improved and can be implemented by Python programming.

The basic structure of CD-SEM measurement data derived from Design Gauge is shown in FIG. 1, and includes a txt file, a csv file with measurement data processed in a certain format, and a folder containing an original measurement picture and a picture with an overlay measurement mark, wherein the name of the original picture is consistent with that in the EP _ Image column of the csv file. The basic principle of the invention in data processing is as follows: and extracting the name of the measuring point and the coordinate of the measuring point from the csv file, and reconstructing a distribution format of the measuring value corresponding to the wafer by extracting shot information of the measuring point. And directly acquiring file name information of an original measurement image from the csv file or constructing a file name of a superposed measurement information image according to shot, a measurement template (EPS) and MP information, then retrieving a corresponding image from an exported image folder, and inserting the corresponding image into a final output file according to a wafer map format.

By adopting the method and the device for processing the Design Gauge data, the CD-SEM measurement data derived from the Design Gauge can be in a corresponding relationship with the process technology and/or the measurement picture through format conversion (such as a script realized through python), and when the data is converted into a format corresponding to the wafer shot, the exposure condition, the measurement picture and the like can be selected and output, so that the manual check can be avoided, and the working efficiency of an engineer can be greatly improved. Txt format files can also be used for PWA window analysis.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention, are incorporated in and constitute a part of this specification. The drawings are not necessarily to scale, however, and may not be intended to accurately reflect the precise structural or performance characteristics of any given embodiment, and should not be construed as limiting or restricting the scope of values or properties encompassed by exemplary embodiments in accordance with the invention. The invention will be described in further detail with reference to the following detailed description and accompanying drawings:

FIG. 1 is a schematic diagram of the basic principle of extracting information from the basic structure of Design Gauge derived data according to the present invention.

FIG. 2 is a flowchart illustrating a data processing method according to a first embodiment of the present invention.

FIG. 3 is a flowchart illustrating a data processing method according to a second embodiment of the present invention.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and technical effects of the present invention will be fully apparent to those skilled in the art from the disclosure in the specification. The invention is capable of other embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the general spirit of the invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. The following exemplary embodiments of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the technical solutions of these exemplary embodiments to those skilled in the art.

In a first embodiment, as shown in fig. 2, a data processing method provided by the present invention includes the following steps:

s1, extracting measuring point names and measuring point coordinates from the csv file derived from Design Gauge;

s2, extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafer;

s3, obtaining original measuring picture file name information from csv file, searching original measuring picture file name from picture file folder exported by CD-SEM measuring data, and inserting searched picture into final output file according to wafer picture format.

In a second embodiment, as shown in fig. 3, a data processing method provided by the present invention includes the following steps:

s1, extracting measuring point names and measuring point coordinates from the csv file derived from Design Gauge;

s2, extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafer;

s3', according to the process information, the measurement template (EPS) information and the picture information, constructing the file name of the superposed measurement information picture, searching the file name of the original measurement picture in the picture folder exported by the CD-SEM measurement data, and inserting the searched picture into the final output file according to the wafer picture format.

The data processing method in the first embodiment or the second embodiment can be implemented by at least a computer programming technology, such as Python programming.

In a third embodiment, the present invention provides a data processing system, including:

the information extraction module is used for extracting a measuring point name and a measuring point coordinate from a csv file derived from Design Gauge;

the first data processing module is used for extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafers;

and the second data processing module is used for acquiring file name information of the original measurement picture from the csv file exported by Design Gauge, retrieving the file name of the original measurement picture from a picture folder exported by the CD-SEM measurement data, and inserting the retrieved picture into a final output file according to a wafer picture format.

In a fourth embodiment, the present invention provides a data processing system, including:

the information extraction module is used for extracting a measuring point name and a measuring point coordinate from a csv file derived from Design Gauge;

the first data processing module is used for extracting the process information of the measuring points to reconstruct the distribution format of the measuring values corresponding to the wafers;

and the second data processing module is used for constructing a file name of the superposed measurement information picture according to the process information, the measurement template (EPS) information and the picture information, retrieving the file name of the original measurement picture from a picture folder exported by the CD-SEM measurement data, and inserting the retrieved picture into a final output file according to a wafer picture format.

The data processing system of either the third embodiment or the fourth embodiment can implement the following functions by changing the corresponding format correspondence;

the CD-SEM measured values derived from Design Gauge can be output to a new xlsx file according to the wafer picture format.

The data processing system can output the selected metrology picture to the new xlsx file according to the wafer picture format.

The data processing system can output the exposure condition information to the process information corresponding to the final output document.

The data processing system can mark the eligible measurements on the interface.

The data processing system can set an acceptable range of variation of the target ADI value on the interface.

The data processing system is capable of highlighting on the interface the data and the picture content selected by the conditions set out in claim 10.

The data processing system can perform fitting processing on the FEM data and calculate optimal lithography conditions, i.e., energy and focal plane position.

The data processing system can convert Design Gauge output CD-SEM measurement data into txt format as PWA software input file according to the format requirement of the PWA software output file.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The present invention has been described in detail with reference to the specific embodiments and examples, but these are not intended to limit the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.