Preparation method of wave-absorbing composite material component

文档序号:1092862 发布日期:2020-09-25 浏览:20次 中文

阅读说明:本技术 一种吸波复合材料构件制备方法 (Preparation method of wave-absorbing composite material component ) 是由 郭亮 刘海 何思敏 于 2019-03-18 设计创作,主要内容包括:本申请公开一种吸波复合材料构件制备方法,先将胶粘剂制成胶粘剂胶膜,在胶粘剂胶膜表面铺上载体,形成载体胶膜,其目的是增强胶膜强度方便操作人员工艺施工;再铺上由吸波粉料和胶粘剂混合均匀制出的吸波层,制出有吸波功能的吸波胶膜,再贴附在铺叠好的复合材料构件上共同固化成形。本申请可以节省专用厂房和设备及操作人员,减少工艺过程及流程,缩短了生产周期,保护了环境,吸波胶膜固化后的强度和附着力可与复合材料构件同寿命,大幅提高了其可靠性和可维护性。(The application discloses a method for preparing a wave-absorbing composite material component, which comprises the steps of preparing an adhesive into an adhesive film, paving a carrier on the surface of the adhesive film to form a carrier adhesive film, and aiming at enhancing the strength of the adhesive film and facilitating the process construction of operators; then laying a wave-absorbing layer prepared by uniformly mixing wave-absorbing powder and adhesive to prepare a wave-absorbing adhesive film with a wave-absorbing function, and attaching the wave-absorbing adhesive film to the laid composite material member for co-curing and forming. The wave-absorbing adhesive film can save special plants, equipment and operators, reduce technological processes and procedures, shorten production period, protect environment, prolong the service life of the wave-absorbing adhesive film after being cured and the service life of the wave-absorbing adhesive film and a composite material component, and greatly improve the reliability and maintainability of the wave-absorbing adhesive film.)

1. A method for preparing a wave-absorbing composite material member is characterized by comprising the following steps:

1) mixing wave-absorbing material with adhesive to prepare a mixture;

2) uniformly coating the mixture on the surface of the first backing, and pressing the mixture on film-making equipment to form a wave-absorbing layer;

3) uniformly coating the adhesive on the surface of the second backing, and pressing the adhesive on film-making equipment to form an adhesive film layer;

4) spreading the carrier on the surface of the adhesive film and compacting to prepare a carrier adhesive film;

5) laying the carrier adhesive film and the wave-absorbing layer in opposite faces, making the back lining become an upper surface and a lower surface, and pressing the upper surface and the lower surface into the wave-absorbing adhesive film by contacting with a film-making device;

6) laying the composite material on a mould for forming;

7) removing a back lining of the wave-absorbing adhesive film, and attaching one side of an adhesive film layer of the wave-absorbing adhesive film to the surface of the composite material;

8) and packaging the composite material attached with the wave-absorbing adhesive film by using a vacuum bag, vacuumizing, heating and curing to prepare the wave-absorbing composite material member.

2. The method for preparing a wave-absorbing composite material member according to claim 1, wherein the thickness of the adhesive film layer in the step 1) is 0.06 mm-0.2 mm after being pressed, the thickness of the wave-absorbing layer in the step 4) is 0.1 mm-0.4 mm after being pressed, and the thickness of the wave-absorbing adhesive film pressed in the step 5) is 0.2 mm-0.6 mm.

3. The method for preparing a wave-absorbing composite material member according to claim 1, wherein the wave-absorbing material is ferrite powder or magnetic alloy powder.

4. The method for preparing a wave-absorbing composite material member according to claim 1, wherein the adhesive is one of epoxy resin, phenolic resin, polyurethane and bismaleimide resin.

5. The method for preparing a wave-absorbing composite member according to claim 1, wherein the backing is kraft paper or plastic film.

6. The method for preparing the wave-absorbing composite material member according to claim 1, wherein the carrier is one of a fabric, a non-woven fabric and a unidirectional fiber fabric.

Technical Field

The invention relates to the technical field of wave-absorbing materials, in particular to the technical field of wave-absorbing composite material forming.

Background

At present, the known wave-absorbing coating is generally prepared by mixing micro-particle powder and a high-molecular adhesive through a special process to prepare a liquid coating with a certain consistency, and when the wave-absorbing coating is used, the liquid coating is coated on the outer surface of a required object (composite material), and a solid film is formed and attached to the surface of the used object (composite material) after a period of curing. However, in construction: 1) special plants and equipment and trained operators are required; 2) the process is complicated, such as: the surface of an object (composite material) to be coated needs roughening treatment, coating a treating agent, coating a wave-absorbing coating, coating a fabric, and curing to form a solid film; 3) during the surface roughening treatment, the generated dust pollutes the environment and damages the health of operators; 4) during burdening, the coating is prepared by blending a plurality of components, and a proper amount of diluent is required to be added to reach proper viscosity for construction; 5) after the wave-absorbing coating is coated, the adhesive force on the surface of an object (composite material) is limited, and the wave-absorbing coating is easy to fall off in the using process and needs to be maintained by personnel.

Disclosure of Invention

The problems that the existing wave-absorbing coating needs special requirements on environment, equipment, personnel, construction process and the like, and has low adhesive force, maintenance and the like are solved; the application provides a preparation method of a wave-absorbing composite material member, which can solve the problems of wave-absorbing coatings.

The technical scheme adopted by the application for solving the technical problem is as follows:

a method for preparing a wave-absorbing composite material member comprises the following steps,

1) mixing wave-absorbing material with adhesive to prepare a mixture;

2) uniformly coating the mixture on the surface of the first backing, and pressing the mixture on film-making equipment to form a wave-absorbing layer;

3) uniformly coating the adhesive on the surface of the second backing, and pressing the adhesive on film-making equipment to form an adhesive film;

4) spreading the carrier on the surface of the adhesive film and compacting to prepare a carrier adhesive film;

5) laying the carrier adhesive film and the wave-absorbing layer in opposite faces, making the back lining become an upper surface and a lower surface, and pressing the upper surface and the lower surface into the wave-absorbing adhesive film by contacting with a film-making device;

6) laying the composite material on a mould for forming;

7) removing a back lining of the wave-absorbing adhesive film, and attaching the wave-absorbing adhesive film to the surface of the composite material;

8) and packaging the composite material attached with the wave-absorbing adhesive film by using a vacuum bag, vacuumizing, heating and curing to prepare the wave-absorbing composite material member.

The thickness of the glue film in the step 1) is 0.06 mm-0.2 mm after being pressed.

The thickness of the wave absorbing layer in the step 4) is 0.1 mm-0.4 mm after being pressed.

The thickness of the wave-absorbing adhesive film pressed in the step 5) is 0.2 mm-0.6 mm.

The wave-absorbing material is ferrite powder or magnetic alloy powder.

The adhesive is one of epoxy resin, phenolic resin, polyurethane and bismaleimide resin.

The backing is kraft paper or plastic film. The backing is used for manufacturing the adhesive film and plays a role of protecting the adhesive film.

The carrier is one of a fabric, a non-woven fabric and a unidirectional fiber fabric.

The invention firstly prepares the adhesive into an adhesive film, and lays a carrier (fabric or non-woven cloth or unidirectional fiber cloth) on the surface of the adhesive film to form a carrier adhesive film, so as to enhance the strength of the adhesive film and facilitate the process construction of operators; then laying a wave-absorbing layer prepared by uniformly mixing wave-absorbing powder and adhesive to prepare a wave-absorbing adhesive film with a wave-absorbing function, and attaching the wave-absorbing adhesive film to the laid composite material member for co-curing and forming.

The invention has the advantages of saving workshop, equipment and operators for spraying, reducing process flow, shortening production period, protecting environment, prolonging the service life of the cured wave-absorbing adhesive film and the composite material, and improving the reliability of the member.

Drawings

FIG. 1 is a schematic view of an adhesive film.

FIG. 2 is a schematic view of an adhesive pressed onto the surface of a backing to form an adhesive film.

Fig. 3 is a schematic view of the pressing of the carrier adhesive film.

Figure 4 is a schematic view of a pressed wave-absorbing adhesive film.

Figure 5 is a schematic view of a wave-absorbing adhesive film with a backing.

Figure 6 is a schematic view of a wave absorbing composite member.

Detailed Description

For further illustration and not limitation of the described embodiments of the invention, reference is made to the following description of the invention taken in conjunction with the accompanying drawings and embodiments, but not intended to limit the invention thereto. All such concepts are intended to be within the scope of the present disclosure and the present invention.

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