阅读说明：本技术 胶水性能保持装置、注胶机构 (Glue performance retaining device and glue injection mechanism ) 是由 王栋梁 王强 曲东升 马成稳 李长峰 蒋波 于 2021-09-13 设计创作，主要内容包括：本发明公开了一种胶水性能保持装置,包括：壳体,壳体中部的外周面开设有环状凹槽,壳体内开设有贯穿的注胶通道,注胶通道用于输送胶水；超声组件,超声组件卡设于环状凹槽内,超声组件用于对注胶通道内的胶水进行匀化处理。本发明结构简单,通过设置超声组件,在胶水注胶前进行匀化处理,使胶水中的颗粒能够分散均匀,从而提高了胶水质量,保证了每次点胶时胶水质量的一致性,进而使得产品质量得到保障。(The invention discloses a glue-water performance maintaining device, which comprises: the glue injection device comprises a shell, wherein an annular groove is formed in the outer peripheral surface of the middle part of the shell, a penetrating glue injection channel is formed in the shell, and the glue injection channel is used for conveying glue; the ultrasonic assembly is clamped in the annular groove and used for homogenizing glue in the glue injection channel. The ultrasonic glue dispersing device is simple in structure, and the ultrasonic assembly is arranged to perform homogenization treatment before glue injection, so that particles in the glue can be uniformly dispersed, the quality of the glue is improved, the consistency of the quality of the glue during each glue injection is ensured, and the quality of a product is further ensured.)

1. A glue-ability retention device, comprising:

the glue injection device comprises a shell (21), wherein an annular groove is formed in the outer peripheral surface of the middle part of the shell (21), a penetrating glue injection channel (24) is formed in the shell (21), and the glue injection channel (24) is used for conveying glue;

the ultrasonic assembly is clamped in the annular groove and is used for homogenizing glue in the glue injection channel (24).

2. The glue property retention device of claim 1, wherein the ultrasonic assembly comprises:

the piezoelectric ceramic discs (22) are annular pieces, the piezoelectric ceramic discs (22) are sleeved in the annular grooves, and the piezoelectric ceramic discs (22) are parallel to each other;

the piezoelectric ceramic disc comprises a plurality of electrodes (23), wherein the electrodes (23) are annular pieces, the electrodes (23) are sleeved in the annular grooves, the electrodes (23) are arranged between two adjacent piezoelectric ceramic discs (22), the electrodes (23) are attached to the piezoelectric ceramic discs (22), and the electrodes (23) are connected in series or in parallel.

3. The glue property maintaining device according to claim 2, characterized in that the power of the ultrasonic assembly is 50W, and the frequency of the ultrasonic wave emitted by the ultrasonic assembly is 27.5kHz-28.5 kHz.

4. The glue property retention device of claim 3, wherein the outer diameter of the ultrasonic assembly is 40mm and the height of the ultrasonic assembly is 40mm-50 mm.

5. Glue property retention device according to claim 1, characterized in that the diameter of the glue injection channel (24) is 5 mm.

6. A glue injection mechanism comprising a glue performance maintaining means as claimed in any one of claims 1 to 5.

7. The glue injection mechanism of claim 6, further comprising:

the glue storage barrel (1) is used for storing glue, and the glue storage barrel (1) is communicated with the feeding end of the glue injection channel (24);

the amplitude transformer (3), the amplitude transformer (3) with the injecting glue passageway (24) the discharge end is linked together.

8. A glue injection mechanism according to claim 7, characterised in that the glue storage barrel (1) is connected to the housing (21) via a luer fitting, the horn (3) is connected to the housing (21) via a luer fitting, and the ultrasonic assembly transmits ultrasonic waves to the glue storage barrel (1) and the horn (3).

9. A glue injection mechanism according to claim 7, characterised in that the end of the horn (3) remote from the housing (21) is formed as a glue injection head, and that the inside of the horn (3) has a conduit for conveying glue, which conduit communicates the glue injection head with the glue injection channel (24).

Technical Field

The invention belongs to the technical field of glue injection, and particularly relates to a glue performance retaining device and a glue injection mechanism.

Background

At present, the application of the dispensing technology in many fields is more and more extensive, and the dispensing technology plays a crucial role from the welding, coating and sealing of semiconductor packaging, integrated circuit industry, SMT/PCB assembly to general industry. The performance of glue in glue dispensing is a key factor of glue dispensing quality, so that the maintenance of the performance of the glue is an important process research. The main operation currently used for glue property maintenance is to maintain the properties of the glue by regulating and controlling the temperature. The electronic packaging has higher and higher precision requirement and efficiency on dispensing, the volume of the dispensing glue solution is smaller and smaller, in production, a tube (bottle) of glue solution can be kept still on a dispensing device for a long time, and a plurality of glue solution components are composed of particles and solvents, and due to different densities of the two, the phenomenon of uneven glue solution components can be generated when the glue solution is placed at room temperature, the phenomenon of layering can be serious even, and the product quality can be reduced when the glue solution is used.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art.

Therefore, the invention provides a glue performance maintaining device which has the advantage of homogenizing glue.

The glue performance maintaining device comprises: the glue injection device comprises a shell, wherein an annular groove is formed in the outer peripheral surface of the middle part of the shell, a penetrating glue injection channel is formed in the shell, and the glue injection channel is used for conveying glue; the ultrasonic assembly is clamped in the annular groove and used for homogenizing glue in the glue injection channel.

The ultrasonic glue dispersing device has the beneficial effects that the structure is simple, and the ultrasonic assembly is arranged to carry out homogenization treatment before glue injection, so that particles in the glue can be uniformly dispersed, the glue quality is improved, the consistency of the glue quality during each glue injection is ensured, and the product quality is further ensured.

According to one embodiment of the invention, the ultrasound assembly comprises: the piezoelectric ceramic discs are annular pieces, the piezoelectric ceramic discs are sleeved in the annular grooves, and the piezoelectric ceramic discs are parallel to each other; the electrodes are annular pieces, the electrodes are sleeved in the annular grooves and arranged between two adjacent piezoelectric ceramic discs, the electrodes are attached to the piezoelectric ceramic discs, and the electrodes are connected in series or in parallel.

According to one embodiment of the invention, the power of the ultrasonic assembly is 50W, and the frequency of the ultrasonic wave emitted by the ultrasonic assembly is 27.5kHz-28.5 kHz.

According to one embodiment of the invention, the outer diameter of the ultrasound assembly is 40mm and the height of the ultrasound assembly is 40mm-50 mm.

According to one embodiment of the invention, the diameter of the glue injection channel is 5 mm.

According to an embodiment of the invention, the glue injection mechanism comprises any one of the glue performance maintaining devices.

According to an embodiment of the present invention, the glue injection mechanism further includes: the glue storage barrel is used for storing glue, and is communicated with the feeding end of the glue injection channel; and the amplitude transformer is communicated with the discharge end of the glue injection channel.

According to one embodiment of the invention, the glue storage barrel is connected with the shell through a luer connector, the amplitude transformer is connected with the shell through a luer connector, and the ultrasonic assembly transmits ultrasonic waves to the glue storage barrel and the amplitude transformer.

According to one embodiment of the invention, one end of the amplitude transformer, which is far away from the shell, is formed into a glue injection head, a pipeline for conveying glue is arranged in the amplitude transformer, and the pipeline is communicated with the glue injection head and the glue injection channel.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural view of a glue injection mechanism according to the present invention;

FIG. 2 is a schematic view of the structure of the glue property maintaining device according to the invention;

reference numerals:

the glue storage device comprises a glue storage barrel-1, a glue performance maintaining device-2, an amplitude transformer-3, a shell-21, a piezoelectric ceramic disc-22, an electrode-23 and a glue injection channel-24.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The glue property maintaining apparatus according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 2, a glue property maintaining device according to an embodiment of the present invention includes: the ultrasonic module comprises a shell 21 and an ultrasonic assembly, wherein an annular groove is formed in the outer peripheral surface of the middle part of the shell 21, a penetrating glue injection channel 24 is formed in the shell 21, and the glue injection channel 24 is used for conveying glue; the ultrasonic assembly is clamped in the annular groove and is used for homogenizing the glue in the glue injection channel 24.

The ultrasonic glue dispersing device is simple in structure, and the ultrasonic assembly is arranged to perform homogenization treatment before glue injection, so that particles in the glue can be uniformly dispersed, the quality of the glue is improved, the consistency of the quality of the glue during each glue injection is ensured, and the quality of a product is further ensured.

According to one embodiment of the invention, an ultrasound assembly comprises: the piezoelectric ceramic discs 22 are annular pieces, the piezoelectric ceramic discs 22 are sleeved in the annular grooves, and the piezoelectric ceramic discs 22 are parallel to each other; the electrodes 23 are ring-shaped elements, the electrodes 23 are sleeved in the annular grooves, the electrodes 23 are arranged between two adjacent piezoelectric ceramic discs 22, the electrodes 23 are attached to the piezoelectric ceramic discs 22, and the electrodes 23 are connected in series or in parallel. The piezo ceramic disc 22 and the electrodes 23 interact and, upon application of an electrical signal, ultrasound is emitted as a result of the flexural vibrations. Piezoelectric ceramic dish 22 and electrode 23 are the ring structure, can send the ultrasonic wave simultaneously around the injecting glue passageway 24 for glue can receive whole circumferencial direction's vibrations, is convenient for improve the glue homogenization effect.

Further, the power of the ultrasonic assembly is 50W, and the frequency of ultrasonic waves emitted by the ultrasonic assembly is 27.5kHz-28.5 kHz. Further, the outer diameter of the ultrasonic assembly is 40mm, and the height of the ultrasonic assembly is 40mm-50 mm. When standing waves are formed in an ultrasonic fluid medium, tiny particles suspended in the fluid are aggregated at nodes due to the action of mechanical force, and periodic accumulation is formed in space, so that emulsification of liquid, liquefaction of gel and dispersion of solid are promoted. Meanwhile, when ultrasonic waves act on liquid, a large number of small bubbles can be generated, one reason is that a negative pressure is formed due to the fact that tensile stress locally appears in the liquid, and the pressure is reduced, so that the original gas dissolved in the liquid is supersaturated and escapes from the liquid to form the small bubbles; another reason is that strong tensile stress "tears" the liquid into a cavity, called cavitation, in which small bubbles formed by cavitation are broken after growing up, and the surrounding liquid suddenly rushes into the bubbles to generate high pressure and shock wave. Therefore, the glue can be kept in a uniform state by setting the proper ultrasonic frequency, so that the glue can keep good performance during glue dispensing, and the device can be damaged due to overlarge surface vibration frequency.

According to one embodiment of the invention, the glue injection channel 24 has a diameter of 5 mm. Glue flows to the injecting glue head during injecting glue, and glue dwell time is short in injecting glue passageway 24, and when the diameter was 5mm, can ensure that in glue time of carrying out from injecting glue passageway 24, the supersound subassembly can transmit vibrations to glue inside.

The invention also provides a glue injection mechanism which comprises the glue performance maintaining device.

According to an embodiment of the present invention, the glue injection mechanism further includes: the glue storage barrel 1 is communicated with the feeding end of the glue injection channel 24; the amplitude transformer 3 is communicated with the discharging end of the glue injection channel 24.

Preferably, the glue storage barrel 1 is connected with the shell 21 through a luer connector, the amplitude transformer 3 is connected with the shell 21 through a luer connector, and the ultrasonic assembly transmits ultrasonic waves to the glue storage barrel 1 and the amplitude transformer 3. Luer connector is a trace non-seepage connector, connects conveniently, can transmit the vibrations of supersound subassembly for whole injecting glue mechanism simultaneously, ensures that glue keeps certain homogeneity from storing up gluey bucket 1 to the whole flow process of amplitude transformer 3.

According to one embodiment of the present invention, one end of the amplitude transformer 3 away from the housing 21 is formed as a glue injection head, and a pipeline for delivering glue is arranged inside the amplitude transformer 3, and the pipeline is communicated with the glue injection head and the glue injection channel 24. Through setting up amplitude transformer 3, glue is from amplitude transformer 3 inside flows, guaranteed that whole glue all is carrying out homogenization treatment at the flow in-process, make ultrasonic vibrations assemble in injecting glue head department, the injecting glue head is after injecting a quantitative glue like this, glue can be with the first quick separation of injecting glue under ultrasonic effect, avoid glue to take place to bond or the wire drawing phenomenon when breaking away from the injecting glue head, make injecting glue volume keep unanimous at every turn, glue can not remain in injecting glue head department, this condition emergence of also having avoided the first jam of injecting glue.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.