阅读说明：本技术 一种基于平面高压开关的微芯片集成***箔*** (Microchip integrated exploding foil initiator based on plane high-voltage switch ) 是由 朱朋 徐聪 沈瑞琪 于 2019-03-18 设计创作，主要内容包括：本发明公开了一种基于平面高压开关的微芯片集成爆炸箔起爆器。该起爆器包括：陶瓷基片、金属层一、绝缘层、金属层二、光刻胶层、二极管、金属焊带和炸药柱。本发明公开的集成爆炸箔起爆器将平面高压开关与爆炸箔集成在了一起,极大地降低了平面高压开关的成本,提高了样品的一致性；通过一体化设计使得电容放电单元的结构更紧凑,极大地降低了发火能量；最后,本发明装置的尺寸控制在100mm<Sup>3</Sup>以内,符合爆炸箔起爆器小型化的发展方向,拓宽了其应用范围。(The invention discloses a microchip integrated exploding foil initiator based on a plane high-voltage switch. The initiator includes: the semiconductor device comprises a ceramic substrate, a first metal layer, an insulating layer, a second metal layer, a photoresist layer, a diode, a metal welding strip and an explosive column. The integrated exploding foil initiator disclosed by the invention integrates the plane high-voltage switch and the exploding foil, so that the cost of the plane high-voltage switch is greatly reduced, and the consistency of a sample is improved; the capacitor discharge unit is more compact in structure through integrated design, and ignition energy is greatly reduced; finally, the size of the device of the invention is controlled at 100mm 3 The explosion foil initiator meets the development direction of miniaturization of the explosion foil initiator and widens the application range of the explosion foil initiator.)

1. A microchip integrated exploding foil initiator based on a plane high-voltage switch is characterized by being divided into a foil exploding initiator part and a plane high-voltage switch part, and specifically comprising a ceramic substrate (1), a first metal layer (2), an insulating layer (3), a second metal layer (4), a photoresist layer (5), a diode (6), a metal welding strip (7) and explosive columns (8); the first metal layer (2) is arranged on the ceramic substrate (1), one side of the first metal layer (2) is arranged on the plane high-voltage switch and serves as a lower electrode (2-a), one side of the explosive foil initiator serves as an explosive foil (2-b), and a first bonding pad (2-c) and a second bonding pad (2-d) are arranged on the explosive foil (2-b); the insulating layer (3) is arranged on the first metal layer (2), arranged on one side of the planar high-voltage switch and used as an insulating material (3-a) between an upper electrode and a lower electrode, and arranged on one side of the exploding foil initiator and used as a flyer layer (3-b); a second metal layer (4) is arranged on the insulating layer (3), one side of the plane high-voltage switch is arranged to serve as an upper electrode (4-a), and one side of the exploding foil initiator is arranged to serve as a metal flying piece (4-b); the photoresist layer (5) is arranged on the second metal layer (4), is arranged on one side of the planar high-voltage switch to serve as a glue bundling groove (5-a), and is arranged on one side of the exploding foil initiator to serve as an accelerating chamber (5-b); the diode (6) is adhered on the upper electrode (4-a), and the anode of the diode faces downwards; the metal welding strip (7) plays a joint role, one end of the welding strip I (7-a) is welded on the upper electrode (4-a), the other end of the welding strip I (7-a) is welded on the welding pad I (2-c), one end of the welding strip II (7-b) is welded on the cathode of the diode (6), and the other end of the welding strip II (7-b) is welded on the welding pad II (2-d); the explosive column (8) is arranged above the accelerating chamber (5-b), and the composite flyer layer (3-b) and the metal flyer (4-b) impact at high speed to realize output to the outside.

2. The microchip integrated exploding foil initiator based on plane high voltage switch as claimed in claim 1, characterized in that the preparation of the metal layer one (2) and the metal layer two (4) adopts one of magnetron sputtering deposition, thermal evaporation or electroplating; the patterning is one of wet etching, dry etching or plasma beam etching.

3. The microchip integrated exploding foil initiator based on planar high voltage switch as claimed in claim 1, characterized in that the first metal layer (2) is composed of W-Ti/Cu film system and the second metal layer (4) is composed of W-Ti/Cu/Au film system, wherein the W-Ti alloy layer is used as both bonding layer and anti-ablation layer, or is Ni-Cr; cu is used as an electric explosion metal material or one of Au, Ag and Al.

4. The microchip integrated exploding foil initiator based on planar high voltage switch as claimed in claim 1, characterized in that the exploding foil (2-b) is configured as a metal foil layer with two wide ends and a narrow middle, and gradually shrinking shape from the two ends to the middle.

5. The microchip integrated exploding foil initiator based on planar high voltage switch according to claim 1, characterized in that the insulating layer (3) is one of Parylene series, Polyimide series or polypropylene series and is prepared by one of physical vapor deposition, chemical vapor deposition or thermal evaporation.

6. The planar high voltage switch based microchip integrated exploding foil initiator according to claim 1, characterized in that: the photoresist layer (5) is one of SU-8 series, epoxy resin series or polymethyl acrylate.

7. The planar high voltage switch based microchip integrated exploding foil initiator according to claim 1, characterized in that: the diode (6) is one of a Schottky diode or a p-n junction diode.

8. The planar high voltage switch based microchip integrated exploding foil initiator according to claim 1, characterized in that: the metal welding strip (7) is one of Au, Ag, Cu or Al.

9. The planar high voltage switch based microchip integrated exploding foil initiator according to claim 1, characterized in that: the grain (8) adopts hexanitrostilbene HNS-IV, and the charging density is the theoretical maximum density of 1.74g/cm³90% -95%.

Technical Field

The invention belongs to the technical field of miniature low-energy insensitive ignition priming devices, and particularly relates to a microchip integrated exploding foil primer based on a planar high-voltage switch.

Background

An Exploding Foil Initiator (EFI), also known as an impact detonator, consists essentially of a metal bridge Foil, a flyer layer, an acceleration bore and a passive charge. Because the explosion-proof detonating device does not contain sensitive energetic materials and the energy output carrier (flyer) is not in direct contact with the main charge, the explosion-proof detonating device has stronger anti-electromagnetic interference capability, can adapt to extreme external environments such as static electricity, radio frequency, electromagnetism and the like, and is extremely safe and reliable.

The high-voltage switch is one of key devices in the exploding foil initiator, determines the output characteristic of the initiating device, and the performance of the initiating device is directly influenced by the performance of the initiating device. When the rising edge of the pulse current of the initiation circuit is too gentle or the peak value is low, the exploding foil melts or slowly explodes due to the low energy obtained, and the exploding foil initiator cannot reliably function. The planar high-voltage switch is a novel high-voltage switch, has the characteristics of high closing speed, low trigger voltage, simple structure and easiness in processing and integration, and is a switch suitable for miniaturized EFI. However, to date, no report has been found of integrating a planar high voltage switch and an exploding foil initiator using Micro Electro Mechanical System (MEMS) technology.

Disclosure of Invention

The invention aims to provide a microchip integrated exploding foil initiator based on a planar high-voltage switch.

The technical scheme provided for realizing the purpose of the invention is as follows:

the device is divided into a foil explosion initiator and a plane high-voltage switch, and specifically comprises a ceramic substrate, a first metal layer, an insulating layer, a second metal layer, a photoresist layer, a diode, a metal welding strip and an explosive column; the first metal layer is arranged on the ceramic substrate, one side of the planar high-voltage switch is arranged on the first metal layer to serve as a lower electrode, one side of the exploding foil initiator is arranged to serve as an exploding foil, and a first bonding pad and a second bonding pad are arranged on the exploding foil; the insulating layer is arranged on the first metal layer, arranged on one side of the plane high-voltage switch and used as an insulating material between an upper electrode and a lower electrode, and arranged on one side of the exploding foil initiator and used as a flyer layer; the second metal layer is arranged on the insulating layer, one side of the second metal layer, which is provided with the plane high-voltage switch, is used as an upper electrode, and one side of the second metal layer, which is arranged on the exploding foil initiator, is used as a metal flying sheet; the photoresist layer is arranged on the second metal layer, is arranged on one side of the planar high-voltage switch and serves as a glue bundling groove, and is arranged on one side of the exploding foil initiator and serves as an accelerating chamber; the diode is adhered on the upper electrode, and the anode of the diode faces downwards; the reverse breakdown characteristic of the switch is utilized to enable the switch to resist stray current; the metal welding strips play a linking role, one end of each welding strip is welded on the upper electrode, the other end of each welding strip is welded on the first welding pad, one end of the second welding strip is welded on the cathode of the diode, and the other end of the second welding strip is welded on the second welding pad; the explosive column is arranged on the accelerating chamber, and the composite flying piece layer and the metal flying piece are collided at high speed to realize the output to the outside.

Further, the preparation of the first metal layer and the second metal layer adopts one of magnetron sputtering deposition, thermal evaporation or electroplating; the patterning is one of wet etching, dry etching or plasma beam etching.

Further, the first metal layer is composed of a W-Ti/Cu film system, the second metal layer is composed of a W-Ti/Cu/Au film system, wherein the W-Ti alloy layer is used as a bonding layer and an anti-ablation layer or is Ni-Cr; cu is used as an electric explosion metal material or one of Au, Ag and Al.

Further, the exploding foil is provided with a metal foil layer which is wide at two ends and narrow in the middle and gradually shrinks from the two ends to the middle.

Further, the insulating layer is one of Parylene series, Polyimide series or polypropylene series, and the preparation method is one of physical vapor deposition, chemical vapor deposition or thermal evaporation.

Further, the photoresist layer is one of SU-8 series, epoxy resin series or polymethyl acrylate.

Further, the diode is one of a schottky diode or a p-n junction diode.

Further, the metal solder strip is one of Au, Ag, Cu or Al.

Furthermore, the powder column adopts HNS-IV, the charging density is the theoretical maximum density of 1.74g/cm³90% -95%.

Compared with the prior art, the invention has the following remarkable advantages: (1) the plane high-voltage switch and the exploding foil exploder are integrated, so that the volume of the capacitor discharge unit is reduced, and meanwhile, the ignition energy is also reduced; (2) the detonator adopts an MEMS (micro-electromechanical systems) preparation process, so that the cost is reduced, and standardized mass production can be realized; (3) the size of the initiator is controlled to be 100mm³The application range of the small-sized weapon ammunition is widened, and the small-sized weapon ammunition can be applied.

Drawings

Figure 1 is a perspective view of a microchip exploding foil initiator based on a planar high voltage switch.

Figure 2 is an exploded view of a microchip exploding foil initiator based on a planar high voltage switch.

Fig. 3 is a flow chart of the manufacturing process of a microchip exploding foil initiator based on a planar high voltage switch.

Fig. 4 is a schematic diagram of the circuit connections of the EFI chip unit of the present invention.

Figure 5 is a sample view of a microchip exploding foil initiator.

Fig. 6 is a pictorial view of an exploded assay block.

Detailed Description

The invention is described in further detail below with reference to the figures and the detailed description.

Referring to fig. 1, 2 and 3, the chip includes a ceramic substrate 1, a first metal layer 2, an insulating layer 3, a second metal layer 4, a photoresist layer 5, a diode 6, a metal solder strip 7 and a explosive column 8. Preparing a first metal layer 2 by adopting a magnetron sputtering deposition process and combining an ultraviolet lithography technology, wherein the film system of the first metal layer 2 is a W-Ti/Cu layer, the thickness of the first metal layer is 20 nm-500 nm/1 mu m-6 mu m, the first metal layer 2 is arranged on a ceramic substrate 1, one side of a plane high-voltage switch is used as a lower electrode 2-a, one side of an explosive foil initiator is used as an explosive foil 2-b, the size of the explosive foil is 100 mu m-1000 mu m multiplied by 100 mu m-1000 mu m, and the other two 'islands' are used as a first bonding pad 2-c and a second bonding pad 2-d; preparing an insulating layer 3 with the thickness of 10-90 microns by a chemical vapor deposition method, placing the insulating layer 3 on a first metal layer 2, wherein the insulating layer serves as an insulating material 3-a between an upper electrode and a lower electrode on one side of a planar high-voltage switch and serves as a flyer layer 3-b on one side of an exploding foil initiator; the preparation method of the second metal layer 4 is the same as that of the first metal layer 2, the second metal layer is placed on the insulating layer 3, one side of the plane high-voltage switch is used as an upper electrode 4-a, and one side of the exploding foil initiator is used as a metal flying piece 4-b; the photoresist layer 5 is arranged on the second metal layer 4 through a series of processes of spin coating, prebaking, exposure, postbaking, development, hardening and the like by using an ultraviolet lithography technology, wherein one side of the photoresist layer is used as a photoresist bundling groove 5-a and one side of the exploding foil initiator is used as an accelerating chamber 5-b; the diode 6 is adhered on the upper electrode 4-a, the anode of the diode faces downwards, and the reverse breakdown characteristic of the diode is utilized to enable the switch to resist stray current; the metal welding strip 7 plays a connecting role, one end of the first welding strip 7-a is welded on the upper electrode 4-a, the other end of the first welding strip is welded on the first welding pad 2-c, one end of the second welding strip 7-b is welded on the cathode of the diode 6, and the other end of the second welding strip is welded on the second welding pad 2-d; the explosive column 8 is formed by pressing through a die, is arranged on the accelerating chamber 5-b, is detonated through high-speed impact of the composite flying pieces 3-b and 4-b, and realizes output to the outside.