阅读说明：本技术 温度传感器元件 (Temperature sensor element ) 是由 M·布雷福斯 S·乌费尔斯 A·欣里希 于 2019-03-05 设计创作，主要内容包括：本发明涉及一种用于连接至电子组件(17)或电子子组合件的温度传感器元件,其包含：至少一个电绝缘衬底(3)；至少一个传感器结构(7),其具有接触面(5a、5b),所述接触面用于在所述传感器结构的至少一些区域布置于所述电绝缘衬底(3)的第一侧上时供所述传感器结构(7)接触；和(i)至少一种粘着剂(12),其至少部分地预施加至所述电绝缘衬底(3)的第二侧,其中所述第一侧与所述第二侧相对地定位,或(ii)至少一个金属化层(9),其至少一些区域布置于所述电绝缘衬底(3)的所述第二侧上；和至少部分地预施加至所述金属化层(9)的至少一种烧结浆料(11)。本发明还涉及一种用于输送温度传感器元件的系统和一种用于生产温度传感器元件的方法。(The invention relates to a temperature sensor element for connection to an electronic component (17) or electronic subassembly, comprising: at least one electrically insulating substrate (3); at least one sensor structure (7) having a contact surface (5a, 5b) for contacting the sensor structure (7) when at least some regions of the sensor structure are arranged on a first side of the electrically insulating substrate (3); and (i) at least one adhesive (12) which is at least partially pre-applied to a second side of the electrically insulating substrate (3), wherein the first side is located opposite to the second side, or (ii) at least one metallization layer (9) at least some areas of which are arranged on the second side of the electrically insulating substrate (3); and at least one sintering paste (11) at least partially pre-applied to the metallization layer (9). The invention also relates to a system for transporting a temperature sensor element and to a method for producing a temperature sensor element.)

1. A temperature sensor element for connection to an electronic component (17) or electronic subassembly, comprising:

at least one electrically insulating substrate (3);

at least one sensor structure (7) having a contact surface (5a, 5b) for contacting the sensor structure (7) when at least some regions of the sensor structure are arranged on a first side of the electrically insulating substrate (3); and

(i) at least one adhesive (12) at least partially pre-applied to a second side of the electrically insulating substrate (3), wherein the first side is located opposite the second side, or

(ii) At least one metallization layer (9) at least some areas of which are arranged on the second side of the electrically insulating substrate (3); and at least one sintering paste (11) at least partially pre-applied to the metallization layer (9).

2. The temperature sensor element according to claim 1, wherein the contact faces (5a, 5b) for electrical contacting are connected to the sensor structure (7) and arranged on the first side of the electrically insulating substrate (3).

3. The temperature sensor element of claim 1 or 2, comprising:

at least one passivation layer, at least some regions of which are arranged on the sensor structure (7), preferably the entire surface thereof being arranged on the first side of the substrate (3).

4. The temperature sensor element according to claim 3, wherein the passivation layer comprises at least one polyimide material, one glass material, one ceramic material and/or one glass-ceramic material.

5. The temperature sensor element according to any of the preceding claims, wherein the sintering paste (11) comprises a silver sintering paste and the sintering paste (11) is pre-applied to the metallization layer (9) by stencil printing, screen printing, jet printing, dispensing or transfer printing.

6. The temperature sensor element according to any of the preceding claims, wherein the adhesive (12) comprises a "B-stage" or "pre-dry" adhesive, and wherein the adhesive (12) is pre-applied to the second side of the electrically insulating substrate (3) by stencil printing, screen printing, jet printing, dispensing or transfer printing.

7. The temperature sensor element according to one of the preceding claims, wherein the substrate (3) comprises at least one ceramic insulating material, in particular aluminum oxide, aluminum nitride or silicon carbide, a glass interlayer material or a printed circuit board material.

8. The temperature sensor element according to any of the preceding claims, wherein the metallization layer (9) comprises at least one gold material, one silver material or one metal alloy.

9. The temperature sensor element according to any of the preceding claims, wherein the sensor structure (7) comprises at least one resistor element, wherein the resistor element is provided by a thin film made of platinum or a platinum alloy.

10. A system for transporting a temperature sensor element, comprising:

at least one temperature sensor element for connection to an electronic component (17) or electronic subassembly, comprising:

at least one electrically insulating substrate (3);

at least one sensor structure (7) having a contact surface (5a, 5b) for contacting the sensor structure (7) when at least some regions of the sensor structure are arranged on a first side of the electrically insulating substrate (3); and

(i) at least one adhesive (12) at least partially pre-applied to a second side of the electrically insulating substrate (3), wherein the first side is located opposite the second side, or

(ii) At least one metallization layer (9) at least some areas of which are arranged on the second side of the electrically insulating substrate (3); and at least one sintering paste (11) at least partially pre-applied to the metallization layer (9); and

at least one support element (15), wherein the support element (15) at least partially contacts the pre-applied binder (12) or the pre-applied sintering paste (11).

11. The system of claim 10, comprising:

a plurality of temperature sensor elements, wherein the support element (15) is at least partially arranged on the pre-applied binder (12) or the pre-applied sintering paste (11).

12. System according to claim 10 or 11, wherein the support element (15) comprises at least one transfer film or one wafer frame.

13. A method of producing a temperature sensor element for connection to an electronic component (17) or electronic subassembly, comprising:

providing at least one electrically insulating substrate (3);

arranging at least some regions of at least one sensor structure (7) on a first side of the electrically insulating substrate (3), the at least one sensor structure having a contact surface (5a, 5b) for the sensor structure (7) to contact; and

(i) pre-applying at least one adhesive (12) at least partially pre-applied to a second side of the electrically insulating substrate (3), wherein the first side is located opposite to the second side, or

(ii) -arranging at least some regions of at least one metallization layer (9) on the second side of the electrically insulating substrate (3); and

at least one sintering paste (11) is at least partially pre-applied on the metallization layer (9).

14. The method of claim 13, comprising:

arranging the temperature sensor element on at least one support element (15), wherein the support element (15) at least partially contacts the pre-applied binder (12) or the pre-applied sintering paste (11).