阅读说明：本技术 温度传感器元件 (Temperature sensor element ) 是由 M·布雷福斯 S·乌费尔斯 A·欣里希 于 2019-03-05 设计创作，主要内容包括：本发明涉及一种用于连接至电子组件(17)或电子子组合件的温度传感器元件,其包含：至少一个电绝缘衬底(3)；至少一个传感器结构(7),其具有接触面(5a、5b),所述接触面用于在所述传感器结构的至少一些区域布置于所述电绝缘衬底(3)的第一侧上时供所述传感器结构(7)接触；和(i)至少一种粘着剂(12),其至少部分地预施加至所述电绝缘衬底(3)的第二侧,其中所述第一侧与所述第二侧相对地定位,或(ii)至少一个金属化层(9),其至少一些区域布置于所述电绝缘衬底(3)的所述第二侧上；和至少部分地预施加至所述金属化层(9)的至少一种烧结浆料(11)。本发明还涉及一种用于输送温度传感器元件的系统和一种用于生产温度传感器元件的方法。(The invention relates to a temperature sensor element for connection to an electronic component (17) or electronic subassembly, comprising: at least one electrically insulating substrate (3); at least one sensor structure (7) having a contact surface (5a, 5b) for contacting the sensor structure (7) when at least some regions of the sensor structure are arranged on a first side of the electrically insulating substrate (3); and (i) at least one adhesive (12) which is at least partially pre-applied to a second side of the electrically insulating substrate (3), wherein the first side is located opposite to the second side, or (ii) at least one metallization layer (9) at least some areas of which are arranged on the second side of the electrically insulating substrate (3); and at least one sintering paste (11) at least partially pre-applied to the metallization layer (9). The invention also relates to a system for transporting a temperature sensor element and to a method for producing a temperature sensor element.)