阅读说明：本技术 一种金刚线切割用分区域非等硬度衬板及其制备方法 (Regional unequal-hardness lining plate for diamond wire cutting and preparation method thereof ) 是由 宋功品 刘雪高 夏泉清 于 2020-05-21 设计创作，主要内容包括：本发明实施例公开了一种金刚线切割用分区域非等硬度衬板及其制备方法,所述衬板沿长度方向上均匀分布有多个通孔,所述衬板包括中部和设置在中部两侧的端部,所述中部包括B面层和设置在B面层上部的A面层,所述B面层沿长度方向上均匀分布有多个凹槽B,所述A面层上均匀分布有多个与凹槽B相对应的凹槽A,凹槽B与凹槽A结合形成所述的通孔；所述B面层与两侧的端部一体成型。本发明提供的金刚线切割用分区域非等硬度衬板创新性采用双材质包覆共挤结构,实现板材工作面A面板材边缘比中心硬度高,切割线弓小,避免硅晶片出现崩边,A片率下降的现象。此外,A面层被包覆,要求更低,纯ABS树脂可直接用,无需造粒改性,节省了造粒费用。(The embodiment of the invention discloses a regional unequal-hardness lining plate for diamond wire cutting and a preparation method thereof, wherein a plurality of through holes are uniformly distributed on the lining plate along the length direction, the lining plate comprises a middle part and end parts arranged at two sides of the middle part, the middle part comprises a surface B layer and a surface A layer arranged at the upper part of the surface B layer, a plurality of grooves B are uniformly distributed on the surface B layer along the length direction, a plurality of grooves A corresponding to the grooves B are uniformly distributed on the surface A layer, and the grooves B and the grooves A are combined to form the through holes; the surface layer B and the end parts on the two sides are integrally formed. The regional unequal-hardness lining plate for diamond wire cutting provided by the invention is innovatively in a double-material coating co-extrusion structure, so that the edge of the plate on the A surface of the working surface of the plate has higher hardness than the center, the cutting wire bow is small, and the phenomena of edge breakage and reduction of the A piece rate of a silicon wafer are avoided. In addition, the surface layer A is coated, the requirement is lower, pure ABS resin can be directly used, granulation modification is not needed, and granulation cost is saved.)

1. The utility model provides a buddha's warrior attendant wire-electrode cutting is with dividing regional inequality hardness welt which characterized in that: the lining plate is uniformly provided with a plurality of through holes along the length direction, the lining plate comprises a middle part and end parts arranged at two sides of the middle part, the middle part comprises a surface B layer and a surface A layer arranged at the upper part of the surface B layer, the surface B layer is uniformly provided with a plurality of grooves B along the length direction, the surface A layer is uniformly provided with a plurality of grooves A corresponding to the grooves B, and the grooves B and the grooves A are combined to form the through holes; the surface layer B and the end parts on the two sides are integrally formed.

2. The non-uniform hardness lining plate with different areas for diamond wire cutting according to claim 1, wherein: the width of the end part is 10-15mm, and the Shore hardness is greater than 82 degrees.

3. The non-uniform hardness lining plate with different areas for diamond wire cutting according to claim 1, wherein: the raw material for preparing the surface layer A comprises pure styrene-acrylonitrile-butadiene copolymer resin; the raw materials for preparing the B surface layer comprise the following components in percentage by mass: 80-90 wt% of styrene-acrylonitrile-butadiene copolymer resin, 4-9 wt% of hardness adjusting resin, 5-9 wt% of adhesion adjusting component, 0.3-0.6 wt% of antioxidant and 0.2-0.4 wt% of lubricant.

4. The non-uniform hardness lining plate with different areas for diamond wire cutting according to claim 1, wherein: the content of the rubber in the styrene-acrylonitrile-butadiene copolymer resin is 8-13 wt%, wherein the acrylonitrile is ABS with medium molecular weight.

5. The non-uniform hardness lining plate with divided regions for diamond wire cutting according to claim 3, wherein: the hardness adjusting resin is polycarbonate or polyethylene terephthalate.

6. The non-uniform hardness lining plate with divided regions for diamond wire cutting according to claim 3, wherein: the bonding adjusting component is mineral powder or metal powder, and comprises any one or combination of more than two of calcium carbonate, talcum powder, aluminum powder and iron powder.

7. The non-uniform hardness lining plate with divided regions for diamond wire cutting according to claim 3, wherein: the antioxidant is a compound of an antioxidant 1076 and an antioxidant 168, and the mass ratio of the antioxidant 1076 to the antioxidant 168 is 1: 1.

8. The non-uniform hardness lining plate with divided regions for diamond wire cutting according to claim 3, wherein: the lubricant is calcium stearate.

9. A method for preparing the zone unequal-hardness lining plate for cutting the diamond wires according to any one of claims 1 to 8, which is characterized by comprising the following steps:

(1) mixing and granulating raw materials: mixing pure styrene-acrylonitrile-butadiene copolymer resin, hardness adjusting resin, bonding adjusting component, antioxidant and lubricant according to a formula, and granulating in a double screw at a granulation processing temperature of 240-;

(2) extrusion molding of sheet: carrying out double-color coating co-extrusion on pure styrene-acrylonitrile-butadiene copolymer resin and B particles on a profile extruder, cooling and shaping, and cutting at a fixed length;

(3) plate post-treatment: and (3) grinding the two sides of the hollow blank plate to be flat to meet the precision requirement of flatness of 0.2mm, and cleaning and packaging to obtain a finished lining plate with regional unequal hardness.

10. The method of claim 9, wherein: in the step (2), the pressure of the coating layer extrusion host is controlled to be 2 times of that of the central layer extrusion host, the extrusion temperature is 200 ℃ and 240 ℃, and the traction speed is 0.7-0.8 m/min.

Technical Field

The invention relates to the technical field of silicon wafer cutting, in particular to a regional unequal hardness lining plate for diamond wire cutting and a preparation method thereof.

Background

The cutting of the photovoltaic silicon wafer is an important production link in the field of photovoltaic solar energy production, the cutting of the silicon wafer is firstly carried out by cutting a wafer and then cutting a sand wire, the cutting is developed into the cutting of a gold steel wire in the year, the wire diameter of the used gold steel wire is thinner and thinner, and the current photovoltaic industry uses the gold steel wire with the specification of 50-60 mu m as a main cutting wire.

The thinner the cutting wire, the higher the requirement for cutting the lining board, and the earlier unsaturated resin plate can not meet the requirement for the wire cutting work of the gold steel. The plastic plate is easy to cut, does not damage wires, can save gold steel wires, is accepted and used by the photovoltaic silicon wafer industry, is easy to cut and is uniform in material, when the plastic plate is used for cutting the gold steel wires, the diamond wires cut into the plastic plate at the edge of the plastic plate faster than the middle of the plastic plate, so that the arch of the gold steel wires is large, if the wire cutting process is not right, the silicon wafers are easy to break, and the A wafer rate (yield) is reduced.

Disclosure of Invention

Therefore, the embodiment of the invention provides a regional unequal hardness lining plate for diamond wire cutting and a preparation method thereof, and aims to solve the problems that a gold steel wire has a large wire bow, and if a wire cutting process is not correct, a silicon wafer is easy to have edge breakage, and the A piece rate is reduced.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:

according to a first aspect of the embodiment of the invention, a regional unequal hardness lining plate for diamond wire cutting is provided, a plurality of through holes are uniformly distributed on the lining plate along the length direction, the lining plate comprises a middle part and end parts arranged on two sides of the middle part, the middle part comprises a surface layer B and a surface layer A arranged on the upper part of the surface layer B, a plurality of grooves B are uniformly distributed on the surface layer B along the length direction, a plurality of grooves A corresponding to the grooves B are uniformly distributed on the surface layer A, and the grooves B and the grooves A are combined to form the through holes; the surface layer B and the end parts on the two sides are integrally formed.

Further, the width of the end part is 10-15mm, and the Shore hardness is greater than 82 degrees.

Further, raw materials for preparing the surface layer A comprise pure styrene-acrylonitrile-butadiene copolymer resin; the raw materials for preparing the B surface layer comprise the following components in percentage by mass: 80-90 wt% of styrene-acrylonitrile-butadiene copolymer resin, 4-9 wt% of hardness adjusting resin, 5-9 wt% of adhesion adjusting component, 0.3-0.6 wt% of antioxidant and 0.2-0.4 wt% of lubricant.

Further, the gel content of the styrene-acrylonitrile-butadiene copolymer resin is 8-13 wt%, wherein acrylonitrile is ABS with medium molecular weight.

Further, the hardness adjusting resin is polycarbonate or polyethylene terephthalate.

Further, the bonding adjusting component is mineral powder or metal powder, and the bonding adjusting component comprises any one or a combination of more than two of calcium carbonate, talcum powder, aluminum powder and iron powder.

Further, the antioxidant is a compound of an antioxidant 1076 and an antioxidant 168, and the mass ratio of the antioxidant 1076 to the antioxidant 168 is 1: 1.

Further, the lubricant is calcium stearate.

According to a first aspect of the embodiments of the present invention, there is provided a method for preparing a lining plate with unequal hardness in different regions for diamond wire cutting, comprising the following steps:

(1) mixing and granulating raw materials: mixing pure styrene-acrylonitrile-butadiene copolymer resin, hardness adjusting resin, bonding adjusting component, antioxidant and lubricant according to a formula, and granulating in a double screw at a granulation processing temperature of 240-;

(2) extrusion molding of sheet: carrying out double-color coating co-extrusion on pure styrene-acrylonitrile-butadiene copolymer resin and B particles on a profile extruder, cooling and shaping, and cutting at a fixed length;

(3) plate post-treatment: and (3) grinding the two sides of the hollow blank plate to be flat to meet the precision requirement of flatness of 0.2mm, and cleaning and packaging to obtain a finished lining plate with regional unequal hardness.

Further, in the step (2), the pressure of the extrusion host machine of the coating layer is controlled to be 2 times of the pressure of the extrusion host machine of the central layer, the extrusion temperature is 200 ℃ and 240 ℃, and the traction speed is 0.7-0.8 m/min.

The embodiment of the invention has the following advantages: the embodiment of the invention provides a regional unequal hardness lining plate for diamond wire cutting and a preparation method thereof. In addition, the surface layer A is coated, the requirement is lower, pure ABS resin can be directly used, granulation modification is not needed, and granulation cost is saved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope of the present invention.

Fig. 1 is a schematic structural diagram of a partitioned unequal-hardness lining plate for diamond wire cutting according to embodiment 1 of the present invention;

in the figure: 1-B surface layer; 2-A surface layer; 3-a through hole; 4-end.

Detailed Description

The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that unless otherwise specified, technical terms or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention pertains, and experimental materials in the following examples are commercially available unless otherwise specified, and the experimental methods described are general experimental methods unless otherwise specified.

In view of the deficiencies in the prior art, the inventor of the present invention has made extensive studies and extensive practices to propose the technical solution of the present invention, and further explains the technical solution, the implementation process and the principle thereof, etc.